CN104010453A - Vacuum press-fit structure for metal base plate resin hole plugging and resin hole plugging technology of vacuum press-fit structure - Google Patents
Vacuum press-fit structure for metal base plate resin hole plugging and resin hole plugging technology of vacuum press-fit structure Download PDFInfo
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- CN104010453A CN104010453A CN201410244435.0A CN201410244435A CN104010453A CN 104010453 A CN104010453 A CN 104010453A CN 201410244435 A CN201410244435 A CN 201410244435A CN 104010453 A CN104010453 A CN 104010453A
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Abstract
Disclosed are a vacuum press-fit structure for metal base plate resin hole plugging and a resin hole plugging technology of the vacuum press-fit structure. The vacuum press-fit structure sequentially comprises a polyimide resin cover film, a metal base plate, a polyimide resin adhesive film and an epoxy resin prepreg from bottom to top. Resin-plugged holes and pre-drilled holes are respectively formed in the polyimide resin cover film, the metal base plate and the polyimide resin adhesive film, wherein the diameter of the resin-plugged holes is the same as the diameter of the pre-drilled holes and the resin-plugged holes are arranged to be flush with the pre-drilled holes. During resin hole plugging, epoxy resin in the pregpreg slowly and gradually flows into the holes in molten and flowing states under the effects of the vacuum environment and the conditions of high temperature and high pressure, meanwhile, due to the effect of certain pressure, the resin in the holes has high compactness and good stability; due to the fact that the diameter of the pre-drilled holes is the same as the diameter of the resin plugged holes, the situations that too much gum overflows from the resin, later transitional processing of the metal base plate is affected and defects are generated are avoided. Thus, the problems that bubbles appear in the resin in the holes, the resin is not full and sinks, the resin cracks and the resin is separated from the walls of the holes are solved.
Description
Technical field
The present invention relates to metal substrate and make field, be specifically related to a kind of vacuum pressing-combining structure of metal substrate filling holes with resin and the technique of filling holes with resin thereof.
Background technology
Filling holes with resin is that often use during metal substrate is made a kind of meets the manufacture craft that product requirement or process capability require.
The filling holes with resin that industry generally adopts is at present mainly used in half-finished filling perforation of epoxy resin circuit board; for the protection to hole wall exposed copper layer; method is; use consent aluminium flake half tone by silk-screen mode by direct resin silk-screen to requiring in the hole of filling holes with resin, the method filling holes with resin is prone in hole resin has the not full depression of bubble, resin, resin cracks, resin the quality defect such as to separate with hole wall.Metal substrate carries out resin filling perforation after metal substrate boring, then boring makes circuit, higher to process for filling hole, filling perforation quality requirement.
Summary of the invention
In prior art, in filling holes with resin technique, to be prone to resin in hole and to have bubble in order to solve, resin is not full, the shortcoming of resin and the defect such as hole wall separates, and the invention provides a kind of have higher compactness and the vacuum pressing-combining structure of the metal substrate filling holes with resin of stability and the technique of filling holes with resin thereof preferably.
The technical solution that the present invention adopts is: a kind of vacuum pressing-combining structure of metal substrate filling holes with resin, described vacuum pressing-combining structure is disposed with polyimide resin coverlay, metal substrate, polyimide resin adhesive film, epoxy resin prepreg, polyimide resin coverlay from top to bottom, described metal substrate is provided with plug resin hole, described polyimide resin adhesive film is provided with prebored hole, and the align setting identical with prebored hole diameter of described plug resin hole.
A technique for metal substrate filling holes with resin, comprises the following steps:
(1) cut metal substrate, burrs on edges processing;
(2) with hot paste machine by polyimide resin film adhesive film hot paste in metallic substrate surfaces, and roll extrusion laminating is closely;
(3) respectively pad upper padding plate at metal substrate upper and lower sides, then on metal substrate, get out plug resin hole with rig:
(4) will hole after metal substrate alkali lye high-pressure wash hole wall, then clean residual alkali lye by clean water, then flood neutralisation treatment with rare weak acid, then clean residual weak acid liquid by clean water, then metal substrate is added, put into oven drying;
(5) select suitable thickness and corresponding resin content epoxy resin prepreg, cut into the size with metal substrate formed objects;
(6) on the carrier of vacuum press, place brown paper, polyimide resin coverlay is laid on mirror steel plate, metal substrate after treatment boring is placed on polyimide resin coverlay, on metal substrate, stack again the epoxy resin prepreg after cutting, on the epoxy resin prepreg stacking, put again a polyimide resin coverlay, on polyimide resin coverlay, put again a mirror steel plate, on this layer of mirror steel plate, place brown paper, cover cover plate, carrier is sent into vacuum press and carry out vacuum pressing-combining;
(7) after vacuum pressing-combining, remove cover plate, brown paper, the mirror steel plate on carrier, pull down the metal substrate with epoxy resin prepreg and polyimide resin adhesive film, manually tear epoxy resin prepreg and polyimide resin adhesive film simultaneously, obtain having filled in the metal substrate in hole;
(8) metal substrate of having filled in hole is carried out obtain after grinding process described filling holes with resin metal substrate.
The technique of described metal substrate filling holes with resin, the hot paste temperature of described step (2) is 70 DEG C, when hot paste, pressure is 5kg～10kg.
The technique of described metal substrate filling holes with resin, described step (5) epoxy resin prepreg used is that resin content is one or more in the 1080 epoxy resin prepregs of 60%-70% and the 2116 epoxy resin prepregs of 50-57%.
The technique of described metal substrate filling holes with resin, in described step (6), vacuum pressing-combining temperature is 200 DEG C～220 DEG C, pressure is 400-600PSI.
The technique of described metal substrate filling holes with resin, the epoxy resin prepreg stacking on metal substrate in described step (6) is at least two, and the epoxy resin prepreg that described resin content is higher is close to metal substrate and is placed.
The invention has the beneficial effects as follows: the invention provides a kind of vacuum pressing-combining structure of the metal substrate filling holes with resin with higher compactness and good stability and the technique of filling holes with resin thereof, be disposed with from top to bottom polyimide resin coverlay, metal substrate, polyimide resin adhesive film, epoxy resin prepreg, polyimide resin coverlay, metal substrate with on polyimide resin adhesive film, be respectively equipped with diameter identical and alignment arrange plug resin hole and prebored hole, in the time of the filling holes with resin carrying out, because the epoxy resin in prepreg is under the conditioning of vacuum environment and HTHP, in the time of melting and flow regime slowly and progressively in ostium, accepted certain pressure-acting simultaneously, in hole, resin has higher compactness and good stability, diameter by prebored hole is identical with the diameter in plug resin hole, avoid the excessive glue of resin many, impact is to metal substrate later stage excess processes, produce defect.Solve the quality problem that in hole, the not full depression of resin bubble, resin, resin cracks, resin separate with hole wall.
Brief description of the drawings
Fig. 1 is the schematic diagram of structure of the present invention.
1-metal substrate in figure, 2-polyimide resin adhesive film, 3-epoxy resin prepreg, 4-polyimide resin coverlay, 5-fills in resin hole, 6-prebored hole.
Embodiment
Below in conjunction with accompanying drawing, embodiments of the present invention is further illustrated:
As shown in Figure 1: a kind of vacuum pressing-combining structure of metal substrate filling holes with resin, described vacuum pressing-combining structure is disposed with polyimide resin coverlay 4, metal substrate 1, polyimide resin adhesive film 2, epoxy resin prepreg 3, polyimide resin coverlay from top to bottom, described metal substrate is provided with plug resin hole 5, described polyimide resin adhesive film is provided with prebored hole 6, and the align setting identical with prebored hole diameter of described plug resin hole, avoid the excessive glue of resin many, impact, to metal substrate later stage excess processes, produces defect.
A technique for metal substrate filling holes with resin, comprises the following steps:
(1) cut metal substrate, burrs on edges processing;
(2) with hot paste machine by polyimide resin film adhesive film hot paste in metallic substrate surfaces, and roll extrusion laminating is closely;
(3) at the thick 0.15mm aluminum slice of the each pad of metal substrate upper and lower sides, then on metal substrate, get out plug resin hole with numerically controlled drill:
(4) will hole after metal substrate alkali lye high-pressure wash hole wall, then clean residual alkali lye by clean water, then flood neutralisation treatment with rare weak acid, then clean residual weak acid liquid by clean water, then metal substrate is added, put into oven drying;
(5) select suitable thickness and corresponding resin content epoxy resin prepreg, cut into the size with metal substrate formed objects;
(6) on the carrier of vacuum press, place 10 brown paper, polyimide resin coverlay is laid on the mirror steel plate after Roller for sticking dust cleans, metal substrate after treatment boring is placed on polyimide resin coverlay, on metal substrate, stack again the epoxy resin prepreg after cutting, the epoxy resin prepreg that resin content is high is close to metal substrate and is placed, on the epoxy resin prepreg stacking, put again a surrounding size than the large 10mm polyimide resin of epoxy resin prepreg coverlay, on polyimide resin coverlay, put again one with the clean mirror steel plate of Roller for sticking dust, on this layer of mirror steel plate, place 10 brown paper, cover cover plate, carrier is sent into vacuum press and carry out vacuum pressing-combining,
(7) after vacuum pressing-combining, remove cover plate, brown paper, the mirror steel plate on carrier, pull down the metal substrate with epoxy resin prepreg and polyimide resin adhesive film, manually tear epoxy resin prepreg and polyimide resin adhesive film simultaneously, obtain having filled in the metal substrate in hole;
(8) metal substrate of having filled in hole is carried out obtain after grinding process described filling holes with resin metal substrate.
The hot paste temperature of described step (2) is 70 DEG C, and when hot paste, pressure is 5kg～10kg.
Described step (5) epoxy resin prepreg used is that resin content is one or more in the 1080 epoxy resin prepregs of 60%-70% and the 2116 epoxy resin prepregs of 50-57%.
In described step (6), vacuum pressing-combining temperature is 200 DEG C～220 DEG C, and pressure is 400-600PSI.
The epoxy resin prepreg stacking on metal substrate in described step (6) is at least two, and the epoxy resin prepreg that described resin content is higher is close to metal substrate and is placed.
Metal substrate hole wall and resin carry out combination under hot conditions, so it has higher adhesion, so resin and hole wall are not easily separated.
In the time that plug socket resin metal substrate is many, can by step (6), again place successively polyimide resin coverlay at upper strata mirror steel plate, metal substrate epoxy resin prepreg, polyimide resin coverlay and mirror steel plate.Cover cover plate, carrier is sent into vacuum press and carry out vacuum pressing-combining.
Make resin in epoxy resin prepreg in melting and flow regime by the high temperature of vacuum press, the negative pressure that vacuum produces simultaneously, and high-pressure is compressed into the resin of this state in the hole of metal substrate.Melting and flow regime resin have stronger levelability, compactness and fillibility, and resin is in vacuum condition current downflow and filling simultaneously, so resin can not exist bubble to be not easy cracking yet in hole; Because being enough to ensure to fill up hole, the resin content in epoxy resin prepreg there is not depression again; In addition, because metal substrate hole wall and resin carry out combination under vacuum high-temperature condition, there is higher compactness, so resin and hole wall are not easily separated.
Compared with the technology of silk-screen mode filling holes with resin in the past, the present invention has eliminated in filling holes with resin process, resin bubble, depression, resin cracks, the resin existing such as separates at the quality defect with hole wall, improve production quality, avoid doing over again and customer complaint, reduce production cost, improved client's degree of belief, ensured the interests of company.
Claims (6)
1. the vacuum pressing-combining structure of a metal substrate filling holes with resin, it is characterized in that, described vacuum pressing-combining structure is disposed with polyimide resin coverlay, metal substrate, polyimide resin adhesive film, epoxy resin prepreg, polyimide resin coverlay from top to bottom, described metal substrate is provided with plug resin hole, described polyimide resin adhesive film is provided with prebored hole, and the align setting identical with prebored hole diameter of described plug resin hole.
2. a technique for metal substrate filling holes with resin, is characterized in that, comprises the following steps:
(1) cut metal substrate, burrs on edges processing;
(2) with hot paste machine by polyimide resin film adhesive film hot paste in metallic substrate surfaces, and roll extrusion laminating is closely;
(3) respectively pad upper padding plate at metal substrate upper and lower sides, then on metal substrate, get out plug resin hole with rig:
(4) will hole after metal substrate alkali lye high-pressure wash hole wall, then clean residual alkali lye by clean water, then flood neutralisation treatment with rare weak acid, then clean residual weak acid liquid by clean water, then metal substrate is added, put into oven drying;
(5) select suitable thickness and corresponding resin content epoxy resin prepreg, cut into the size with metal substrate formed objects;
(6) on the carrier of vacuum press, place brown paper, polyimide resin coverlay is laid on mirror steel plate, metal substrate after treatment boring is placed on polyimide resin coverlay, on metal substrate, stack again the epoxy resin prepreg after cutting, on the epoxy resin prepreg stacking, put again a polyimide resin coverlay, on polyimide resin coverlay, put again a mirror steel plate, on this layer of mirror steel plate, place brown paper, cover cover plate, carrier is sent into vacuum press and carry out vacuum pressing-combining;
(7) after vacuum pressing-combining, remove cover plate, brown paper, the mirror steel plate on carrier, pull down the metal substrate with epoxy resin prepreg and polyimide resin adhesive film, manually tear epoxy resin prepreg and polyimide resin adhesive film simultaneously, obtain having filled in the metal substrate in hole;
(8) metal substrate of having filled in hole is carried out obtain after grinding process described filling holes with resin metal substrate.
3. the technique of metal substrate filling holes with resin according to claim 2, is characterized in that, the hot paste temperature of described step (2) is 70 DEG C, and when hot paste, pressure is 5kg～10kg.
4. the technique of metal substrate filling holes with resin according to claim 2, it is characterized in that, described step (5) epoxy resin prepreg used is that resin content is one or more in the 1080 epoxy resin prepregs of 60%-70% and the 2116 epoxy resin prepregs of 50-57%.
5. the technique of metal substrate filling holes with resin according to claim 2, is characterized in that, in described step (6), vacuum pressing-combining temperature is 200 DEG C～220 DEG C, and pressure is 400-600PSI.
6. the technique of metal substrate filling holes with resin according to claim 2, it is characterized in that, the epoxy resin prepreg stacking on metal substrate in described step (6) is at least two, and the epoxy resin prepreg that described resin content is higher is close to metal substrate and is placed.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410244435.0A CN104010453A (en) | 2014-06-05 | 2014-06-05 | Vacuum press-fit structure for metal base plate resin hole plugging and resin hole plugging technology of vacuum press-fit structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410244435.0A CN104010453A (en) | 2014-06-05 | 2014-06-05 | Vacuum press-fit structure for metal base plate resin hole plugging and resin hole plugging technology of vacuum press-fit structure |
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| CN104010453A true CN104010453A (en) | 2014-08-27 |
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| CN201410244435.0A Pending CN104010453A (en) | 2014-06-05 | 2014-06-05 | Vacuum press-fit structure for metal base plate resin hole plugging and resin hole plugging technology of vacuum press-fit structure |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455330A (en) * | 2016-11-04 | 2017-02-22 | 深圳市深联电路有限公司 | PP (polypropylene) glue filling method for large-diameter shaped hole of metal copper substrate |
| CN107072034A (en) * | 2017-05-15 | 2017-08-18 | 广州斯邦电子科技有限公司 | LED, PCB, consent metal-based copper-clad plate and preparation method thereof |
| CN108235602A (en) * | 2017-12-29 | 2018-06-29 | 广州兴森快捷电路科技有限公司 | The processing method that second order buries copper billet circuit board |
| CN110012620A (en) * | 2019-04-09 | 2019-07-12 | 深圳市景旺电子股份有限公司 | High frequency board fabrication method |
| CN110213890A (en) * | 2019-04-17 | 2019-09-06 | 奥士康科技股份有限公司 | A kind of filling holes with resin method for 5G circuit board fabrication |
| CN111328215A (en) * | 2020-02-21 | 2020-06-23 | 竞华电子(深圳)有限公司 | Printed circuit board manufacturing method and printed circuit board |
| CN111754886A (en) * | 2019-03-28 | 2020-10-09 | 合肥精显电子科技有限公司 | Face mask structure of LCD display screen and manufacturing process thereof |
| CN113891584A (en) * | 2021-09-28 | 2022-01-04 | 深圳明阳电路科技股份有限公司 | Manufacturing method of copper block-embedded PCB |
-
2014
- 2014-06-05 CN CN201410244435.0A patent/CN104010453A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455330A (en) * | 2016-11-04 | 2017-02-22 | 深圳市深联电路有限公司 | PP (polypropylene) glue filling method for large-diameter shaped hole of metal copper substrate |
| CN107072034A (en) * | 2017-05-15 | 2017-08-18 | 广州斯邦电子科技有限公司 | LED, PCB, consent metal-based copper-clad plate and preparation method thereof |
| CN108235602A (en) * | 2017-12-29 | 2018-06-29 | 广州兴森快捷电路科技有限公司 | The processing method that second order buries copper billet circuit board |
| CN111754886A (en) * | 2019-03-28 | 2020-10-09 | 合肥精显电子科技有限公司 | Face mask structure of LCD display screen and manufacturing process thereof |
| CN110012620A (en) * | 2019-04-09 | 2019-07-12 | 深圳市景旺电子股份有限公司 | High frequency board fabrication method |
| CN110213890A (en) * | 2019-04-17 | 2019-09-06 | 奥士康科技股份有限公司 | A kind of filling holes with resin method for 5G circuit board fabrication |
| CN111328215A (en) * | 2020-02-21 | 2020-06-23 | 竞华电子(深圳)有限公司 | Printed circuit board manufacturing method and printed circuit board |
| CN113891584A (en) * | 2021-09-28 | 2022-01-04 | 深圳明阳电路科技股份有限公司 | Manufacturing method of copper block-embedded PCB |
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Application publication date: 20140827 |