CN104540320B - The preparation method of filling holes with resin in a kind of PCB - Google Patents
The preparation method of filling holes with resin in a kind of PCB Download PDFInfo
- Publication number
- CN104540320B CN104540320B CN201410751600.1A CN201410751600A CN104540320B CN 104540320 B CN104540320 B CN 104540320B CN 201410751600 A CN201410751600 A CN 201410751600A CN 104540320 B CN104540320 B CN 104540320B
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- resin
- pcb
- filling holes
- inner plating
- preparation
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The present invention relates to PCB manufacture technology fields, the preparation method of filling holes with resin in specially a kind of PCB.The present invention passes through adjusting process flow, on inner plating resin is clogged after making internal layer circuit in the buried via hole that metallizes again, inner plating rather than drying-plate solidified resin are stood after filling holes with resin, and the resin sticky removing of internal layer plate surface will be protruded with film simultaneously, the step of so as to save abrasive belt grinding, inner plating can be avoided to produce harmomegathus because of abrasive belt grinding, influence the making precision of rear process.The present invention has not only ensured PCB making precision, has also shortened Making programme, simplified production technology, reduced production cost by adjusting manufacture craft.
Description
Technical field
The present invention relates to a kind of preparation method of filling holes with resin in PCB manufacture technology fields, more particularly to PCB.
Background technology
PCB (Printed Circuit Board), Chinese is printed wiring board, abbreviation printed board, is electronics industry
One of important component, be electronic component supporter, the carrier of electrical connection.It need to generally design buried via hole in the pcb, and
PCB then needs to be filled and led up buried via hole to carry out the processes such as follow-up pressing with resin when making.The Making programme of prior art is usual
It is：Sawing sheet → core material drilling → internal layer sink copper → internal layer electric plating of whole board → filling holes with resin and baking sheet solidification → abrasive belt grinding →
Internal layer circuit → internal layer etching → internal layer AOI → brown → pressing → rear process.Existing Making programme needs after filling holes with resin
The resin that plate face is protruded after consent is removed using belt sanding, to ensure the planarization of filling holes with resin and plate face, and abrasive band is beaten
Mill can cause plank size to change, process line after the harmomegathus situation of plank can influence using mechanical external force extruding wiring board
Road, the making precision of welding resistance, so as to influence PCB quality.
The content of the invention
The present invention causes plank that harmomegathus occurs for the Making programme of existing PCB filling holes with resin because that need to carry out abrasive belt grinding,
So as to after influenceing the problem of the making precision of process, there is provided one kind can reduce harmomegathus unstability caused by belt sanding, and can
Shorten the preparation method of filling holes with resin in the PCB of technological process.
To achieve the above object, the present invention use following technical scheme, the preparation method of filling holes with resin in a kind of PCB, wraps
Include following steps：
S1, drilled on inner plating, hole metallization is then made by heavy copper and electric plating of whole board, obtains metallization buried via hole；It is described
Inner plating includes at least one piece of core plate.
S2, internal layer circuit is made on inner plating, brown processing then is carried out to inner plating.
S3, resin is clogged in the buried via hole that metallizes, and stand 25-35min；In inner plating upper berth film and apply 0.45-
0.55kgf/cm2Pressure；Then film is removed, the resin of protrusion internal layer plate surface glues by film.Preferably, time of repose
For 30min；The film is PET film.
Specifically, film is layered on inner plating with viscosity resin machine, and pressure is set to 0.5kgf/cm2, speed is set to
1m/min。
S4, baking inner plating make resin solidification.Preferably, inner plating is placed at 120 DEG C and toasts 27-33min.
Also include step S5 after step S4, brown processing is carried out to inner plating.
After step S5, inner plating and outer copper foil are pressed together by prepreg, form multi-layer sheet；Then more
Outer-layer circuit is made on laminate.
After making outer-layer circuit on multilayer boards, continue to make solder mask on multilayer boards and be surface-treated.
Compared with prior art, the beneficial effects of the invention are as follows：The present invention is made by adjusting process flow on inner plating
Make to clog resin in the buried via hole that metallizes again after internal layer circuit, and inner plating rather than drying-plate solidification tree are stood after filling holes with resin
Fat, while the resin sticky removing of internal layer plate surface will be protruded with film, the step of so as to save abrasive belt grinding, inner plating can be avoided
Harmomegathus is produced because of abrasive belt grinding, influences the making precision of rear process.The present invention is not only ensured by adjusting manufacture craft
PCB making precision, Making programme is also shortened, simplify production technology, reduce production cost.
Brief description of the drawings
Fig. 1 is the slice map for the PCB that embodiment makes (at filling holes with resin)；
Fig. 2 is slice maps of the PCB of embodiment making after the test of Reflow Soldering three times (at filling holes with resin)；
Fig. 3 is slice maps of the PCB of embodiment making after thermal shock test three times (at filling holes with resin).
Embodiment
In order to more fully understand the technology contents of the present invention, technical scheme is made with reference to specific embodiment
It is further described and illustrates.
Embodiment
The preparation method that the present embodiment provides filling holes with resin in a kind of PCB, using the PCB made by this method parameter such as
Under：
Specific make step is as follows：
(1) sawing sheet is carried out to base material first, the thickness of core plate is 1.2mm H/H, then using borehole data on core plate
The hole of metallization buried via hole need to be fabricated to by drilling out.Then copper-coating (backlight tests 10 grades) and electric plating of whole board are carried out successively to core plate
Handle (with 18ASF current density electric plating of whole board 60min, hole copper thickness is 20 μm of Min), make bored hole metallization, formed
Metallize buried via hole.
(2) internal layer circuit is made on core plate using negative film technique (or positive blade technolgy), used when making internal layer circuit entirely certainly
Dynamic exposure machine, internal layer circuit exposure is completed with 5-7 lattice exposure guide rule (21 lattice exposure guide rule).Then internal layer AOI inspections are carried out, in inspection
For sandwich circuit with the presence or absence of the defects of opening short circuit, circuit breach, circuit pin hole, flawless product enters downstream.Then it is right
Core plate carries out brown processing, increases the surface area of copper face.
(3) the metallization buried via hole on core plate is clogged with resin (IR-10-FE resins ink), and stands core plate at room temperature
30min.The pressure for setting viscosity resin machine is 0.5kgf/cm2, speed is set to 1m/min, then core plate is placed on viscosity resin machine,
When core plate passes through pressure reel, PET film paving is pressed in the upper and lower surface of core plate by viscosity resin machine, under stress PET film and protrusion core plate table
The resin in face is sticked together, and when core plate leaves pressure reel, the PET film on the upper and lower surface of core plate is removed, and protrudes the resin of core plate surface
Also core plate is departed from PET film in the lump.(in other embodiments, it is possible to use miscellaneous equipment carries out viscose glue processing to core plate, only
PET film can be taped against on core plate, and can apply certain pressure enables PET film to be bonded at protruding the resin of core plate surface
Together, then PET film can be removed.)
The operating method and step of viscosity resin machine are as follows：
Prepare before A starts：
A1, prepare the PBT films of volume two, PBT films are the carrier films of the dry film used, twice laid.
A2, by PBT films be arranged on viscosity resin machine face upper and lower material rumble on.
A3, the PBT films of last volume are passed through to pressure reel, and all protection is expert on rumble, is then rolled onto on following recovery rumble.
A4, the PBT films of upper volume are passed through into pressure reel, be then rolled onto on recovery rumble above.
B start steps：Connect main power source → opening host power switch → opening motor power switch → opening air pressure valve
The pressure of switch → adjustment air pressure valve is to 0.5kgf/cm2→ speed the method for operation for rotate forward and by speed be adjusted to 1.0M/MIN →
Put core plate.
(4) core plate is placed at 120 DEG C and toasts 27-33min, make resin solidification.
(5) brown processing is carried out to core plate, brown speed is carried out according to copper thickness HOZ bottoms copper.Then by core plate, prepreg
With outer copper foil lamination, and select appropriate lamination to be pressed according to the Tg of plate, obtain multi-layer sheet.Multiple-plate thickness
1.47mm。
(6) outer-layer circuit is made on multilayer boards
Using borehole data holes drilled through and/or blind hole on multilayer boards, after heavy copper and electric plating of whole board, make on multilayer boards
Form plated-through hole and/or metalized blind vias.Then outer-layer circuit is made in multi-layer sheet using positive blade technolgy.It is specific as follows：
(a) outer layer drills：Drilling operation is carried out using borehole data.
(b) the heavy copper of outer layer：Make hole metallization, backlight tests 10 grades.
(c) electric plating of whole board：With 18ASF current density electric plating of whole board 20min, 5 μm of hole copper thickness Min.
(d) outer graphics：Dry film is coated on multilayer boards, and with Full-automatic exposure machine, with 5-7 lattice exposure guide rule, (21 lattice expose
Chi) it is exposed, then develop, form plating resist layer.
(e) graphic plating：Electro-coppering (1.8ASD × 60min) at windowing, form copper electroplating layer；Then in copper electroplating layer
Upper electrotinning (1.2ASD × 10min), plating tin layers are formed, the thickness for electroplating tin layers is 3-5 μm.
(f) outer layer etches：Plating resist layer is removed, then etching removes the copper face for not being plated tin layers covering, then removes again
Tin layers are electroplated, the outer-layer circuit on multi-layer sheet is exposed completely and comes.
(g) outer layer AOI：Check outer-layer circuit with the presence or absence of the defects of opening short circuit, circuit breach, circuit pin hole, zero defect
Product enter downstream.
(7) in multiple-plate surface silk-screen welding resistance, character (using the solder mask in white wire mark brush TOP faces, the word in TOP faces
Symbol addition " UL marks "), make solder mask.Then heavy nickel gold surface processing is carried out to multi-layer sheet, and (the thick control 3-5UM of nickel, gold are thick
Control is in >=0.05UM).PCB is made.
After being surface-treated, then gong profile, electrical testing and inspection eventually are carried out successively, qualified product can shipment.
Reliability testing is carried out to PCB made from above-described embodiment, test result is as shown in following table and Fig. 1-3.
Fig. 1 is the slice map after core plate is pressed with outer copper foil by prepreg, as seen from Figure 1, filling holes with resin effect
Good, no cavity, making filling holes with resin in the pcb using the inventive method will not cause filling holes with resin empty.Fig. 2 is PCB through three
Slice map after secondary Reflow Soldering test, Fig. 3 is slice maps of the PCB after thermal shock test three times, without plate bursting phenomenon.By upper table
And Fig. 2-3 understands that reliability testing can meet to require.
In other embodiments, the core plate in above-described embodiment could alternatively be inner plating, i.e. polylith has made internal layer
The core plate of circuit presses together the inner plating to be formed by prepreg.Then being drilled out using borehole data on inner plating is needed
It is fabricated to the hole of metallization buried via hole.Then copper-coating (backlight tests 10 grades) and electric plating of whole board processing are carried out successively to inner plating
(with 18ASF current density electric plating of whole board 60min, hole copper thickness is 20 μm of Min), make bored hole metallization, form metal
Change buried via hole.Process is as described in the step 2-7 in above-mentioned embodiment afterwards.
In other embodiments, the time of repose after resin is clogged in the buried via hole that metallizes and can also be 25-35min,
On inner plating upper berth, the after-applied pressure of film can also be 0.45-0.55kgf/cm2。
The technology contents described above that the present invention is only further illustrated with embodiment, in order to which reader is easier to understand,
But embodiments of the present invention are not represented and are only limitted to this, any technology done according to the present invention extends or recreation, is sent out by this
Bright protection.
Claims (9)
1. the preparation method of filling holes with resin in a kind of PCB, it is characterised in that comprise the following steps：
S1, drilled on inner plating, hole metallization is then made by heavy copper and electric plating of whole board, obtains metallization buried via hole；The internal layer
Plate includes at least one piece of core plate；
S2, internal layer circuit is made on inner plating, brown processing then is carried out to inner plating；
S3, resin is clogged in the buried via hole that metallizes, and stand 25-35min；In inner plating upper berth film and apply 0.45-
0.55kgf/cm2Pressure；Then film is removed, the resin of protrusion internal layer plate surface glues by film；
S4, baking inner plating make resin solidification.
2. according to claim 1 in a kind of PCB filling holes with resin preparation method, it is characterised in that also include after step S4
Step S5, brown processing is carried out to inner plating.
3. according to claim 2 in a kind of PCB filling holes with resin preparation method, it is characterised in that after step S5, pass through half
Cured sheets press together inner plating and outer copper foil, form multi-layer sheet；Then outer-layer circuit is made on multilayer boards.
4. according to claim 3 in a kind of PCB filling holes with resin preparation method, it is characterised in that make on multilayer boards
After outer-layer circuit, continue to make solder mask on multilayer boards and be surface-treated.
5. according to claim 1 in a kind of PCB filling holes with resin preparation method, it is characterised in that the step S4 be will
Inner plating is placed at 120 DEG C and toasts 27-33min.
6. according to claim 1 in a kind of PCB filling holes with resin preparation method, it is characterised in that in the step S3
Time of repose is 30min.
7. according to claim 1 in a kind of PCB filling holes with resin preparation method, it is characterised in that in the step S3, use
Film is layered on inner plating by viscosity resin machine, and pressure is set into 0.5kgf/cm2。
8. according to claim 7 in a kind of PCB filling holes with resin preparation method, it is characterised in that the viscosity resin machine
Speed is set to 1m/min.
9. according to claim 8 in a kind of PCB filling holes with resin preparation method, it is characterised in that the film is PET
Film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410751600.1A CN104540320B (en) | 2014-12-09 | 2014-12-09 | The preparation method of filling holes with resin in a kind of PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410751600.1A CN104540320B (en) | 2014-12-09 | 2014-12-09 | The preparation method of filling holes with resin in a kind of PCB |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104540320A CN104540320A (en) | 2015-04-22 |
| CN104540320B true CN104540320B (en) | 2018-02-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410751600.1A Active CN104540320B (en) | 2014-12-09 | 2014-12-09 | The preparation method of filling holes with resin in a kind of PCB |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105430939A (en) * | 2015-10-30 | 2016-03-23 | 江苏博敏电子有限公司 | Printed circuit board buried hole resin plugging method |
| CN107623998A (en) * | 2017-10-31 | 2018-01-23 | 东莞翔国光电科技有限公司 | A kind of pcb board method for plugging of anti-foaming |
| CN108040427A (en) * | 2017-11-22 | 2018-05-15 | 江门崇达电路技术有限公司 | One kind solves the undesirable method of Rigid Flex filling holes with resin nog plate |
| CN110337183A (en) * | 2019-03-25 | 2019-10-15 | 大连崇达电子有限公司 | A kind of method for manufacturing circuit board for preventing ink excessive |
| CN111093330A (en) * | 2020-01-06 | 2020-05-01 | 东莞市五株电子科技有限公司 | Method for plugging buried hole with resin in circuit board |
| CN111935908A (en) * | 2020-07-02 | 2020-11-13 | 深圳市博敏电子有限公司 | Method for plugging thin core plate with resin |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE69112119T2 (en) * | 1990-05-09 | 1996-02-01 | Matsushita Electric Ind Co Ltd | Composite board and method of manufacturing a ceramic circuit board using the former. |
| JP3738536B2 (en) * | 1997-08-28 | 2006-01-25 | 松下電器産業株式会社 | Method for manufacturing printed wiring board |
| CN101854778B (en) * | 2010-04-30 | 2011-10-26 | 深圳崇达多层线路板有限公司 | Manufacturing process for plugging conductive holes of circuit board with resin |
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| CN104540320A (en) | 2015-04-22 |
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