CN110337183A - A kind of method for manufacturing circuit board for preventing ink excessive - Google Patents
A kind of method for manufacturing circuit board for preventing ink excessive Download PDFInfo
- Publication number
- CN110337183A CN110337183A CN201910226496.7A CN201910226496A CN110337183A CN 110337183 A CN110337183 A CN 110337183A CN 201910226496 A CN201910226496 A CN 201910226496A CN 110337183 A CN110337183 A CN 110337183A
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- China
- Prior art keywords
- production
- plate
- circuit board
- excessive
- ink
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
- H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a kind of method for manufacturing circuit board for preventing ink excessive, to the production twist drill through-hole after early period presses；Then via metal is made by heavy copper and electric plating of whole board process；Brownification processing is carried out to production plate；Resin ink is clogged in through-hole after metallization；Then pass through the viscous resin ink for going to protrude from plate face of film；Production plate is toasted, the resin ink solidification in through-hole is made.The method of the present invention passes through optimized production process, abrasive belt grinding process therein is eliminated, avoids that wiring board harmomegathus caused by abrasive belt grinding is excessive, the even problem of copper thickness ununiformity, and under the premise of guaranteeing wiring board quality, process is effectively shortened, working hour has been saved and reduces production cost.
Description
Technical field
The present invention relates to printed wiring board manufacture technology fields, and in particular to a kind of wiring board production for preventing ink excessive
Method.
Background technique
For the buried via hole inside assist side, it is typically necessary and carries out filling holes with resin processing, i.e., filled up with " resin ink "
On the one hand buried via hole plays heat spreading function, the internal layer daughter board after pressing for the first time is on the other hand more importantly made to become one
" entirety " does not have porose presence, when preventing subsequent pressing, causes gas in plate face recess or the hole at corresponding internal layer buried via hole position
The problems such as plate bursting caused by body expands is layered.
The goods batch of general production filling holes with resin is as follows at present: preceding process → pressing → drilling → internal layer electric plating of whole board →
Filling holes with resin → solidification baking sheet → abrasive belt grinding → inner figure → brownification → pressing → rear process.
Printed wiring panel products increasingly refine development at present, need the per unit area density of filling holes with resin increasingly
Height, hole is more and more finer, and also continues occur the problem that using above-mentioned filling holes with resin method
1, consent position resin ink plug oil is excessive, overflows the resin settling off of plate face, and subsequent abrasive belt grinding is caused to remove
It is unclean, it be easy to cause rear process chart shape to make open circuit, poor short circuit occur；
2, the impact of abrasive belt grinding stress is big, easily causes punching shear, causes rear process harmomegathus abnormal, is unfavorable for figure etc.
Process production；
3, abrasive belt grinding unbalance stress, the copper thickness ununiformity after causing nog plate are unfavorable for the etching of respective graphical layer fine-line
Etc. processes production；
4, abrasive belt grinding is needed using the tools such as abrasive band, nonwoven fabric, higher cost.
Summary of the invention
It is an object of the invention to provide a kind of wiring board production for preventing ink excessive to overcome existing technological deficiency
Method, this method eliminate abrasive belt grinding process therein, avoid route caused by abrasive belt grinding by optimized production process
Plate harmomegathus is excessive, the even problem of copper thickness ununiformity, and under the premise of guaranteeing wiring board quality, effectively shortens process, saved work
When and reduce production cost.
In order to solve the above-mentioned technical problems, the present invention provides a kind of method for manufacturing circuit board for preventing ink excessive, packets
Include following steps:
S1, to the production twist drill through-hole after early period presses；
S2, via metal then made by heavy copper and electric plating of whole board process；
S3, brownification processing is carried out to production plate；
Resin ink is clogged in S4, through-hole after metallization；
S5, then pass through the viscous resin ink for going to protrude from plate face of film；
S6, production plate is toasted, makes the resin ink solidification in through-hole.
Further, before step S3, internal layer circuit first is made on production plate.
Further, in step S4, when clogging resin ink in through-holes, consent pressure is 6~8kg/cm2。
Further, in step S5, using the viscous resin ink for going to protrude from plate face of antistatic film.
Further, in step S5, pressure when sticky removing resin ink is 0.4~1.0kg/cm2。
Further, in step S5, using viscosity resin machine sticky removing resin ink, the viscosity resin machine includes symmetrical above and below sets
The upper pressing roller and down-pressure roller set are formed with logical for producing the flowing that plate passes through between the upper pressing roller and down-pressure roller
Road is equipped with winding material swing roller and unreeling material swing roller at left and right sides of the upper pressing roller and down-pressure roller, described
Unreeling material swing roller is for installing the coiled strip for being wound and being formed by antistatic film, and the movable end of the coiled strip is around corresponding side
The winding material swing roller is fixed on after upper pressing roller/down-pressure roller, the winding material swing roller is for being tensioned and winding
Coiled strip.
Further, in step S6, when baking, production plate toasts 25~35min at 120 DEG C.
Further, in step S1, the production plate is one to be pressed core material and outer copper foil by prepreg
The internal layer daughter board of body.
Further, after step S6, the internal layer daughter board and outer copper foil are pressed into multi-layer board by prepreg, and
Multi-layer board is successively by drilling, heavy copper, electric plating of whole board, production outer-layer circuit, production solder mask, surface treatment and molding procedure afterwards
Wiring board is made afterwards.
Compared with prior art, the invention has the following beneficial effects:
The present invention first makes internal layer circuit before clogging resin, avoids internal layer by optimization technique production procedure, production plate
There is the problem of open circuit, poor short circuit after route production；Also by first carrying out brownification processing to production plate before clogging resin, from
And the roughness of hole wall is increased, when such later period clogs resin ink in hole, under same consent pressure, due to hole wall ratio
Rougher, the ink for making hole both ends overflow plate face is less, the part that the later period can be overflowed by film sticky removing, so as to cancel abrasive band
Nog plate process, avoids that wiring board harmomegathus caused by abrasive belt grinding is excessive, the even problem of copper thickness ununiformity, and using the side of film sticky removing
Formula effectively reduces the production cost of wiring board with respect to abrasive belt grinding；The method of the present invention under the premise of guaranteeing wiring board quality,
Process is effectively shortened, working hour has been saved.
Detailed description of the invention
Fig. 1 is the schematic diagram of viscosity resin machine employed in embodiment.
Specific embodiment
In order to more fully understand technology contents of the invention, below in conjunction with specific embodiment to technical side of the invention
Case is described further and illustrates.
Embodiment
The present embodiment provides a kind of method for manufacturing circuit board for preventing ink excessive, the specific process is as follows:
(1), sawing sheet: outputing core plate by jigsaw size 520mm × 620mm, core thickness 0.8mm, outer copper foil with a thickness of
1OZ。
(2) internal layer circuit production (negative film technique): inner figure transfer is coated on core plate photosensitive with vertical application machine
Film, 8 μm of the film thickness monitoring of light-sensitive surface are completed on core plate using Full-automatic exposure machine with 5-6 lattice exposure guide rule (21 lattice exposure guide rule)
Internal layer circuit exposure, it is developed, inner line figure is formed on core plate；Internal layer etching, the core plate after exposure development is etched
Internal layer circuit out, it is 3mil that internal layer line width, which measures,；Internal layer AOI, then check internal layer circuit opens short circuit, route notch, route
The defects of pin hole, defective to scrap processing, flawless product goes out to downstream.
(3), press: core plate crosses vertical blackening process, and core plate and outer copper foil are then superimposed on one with prepreg in advance
(specific plate-laying sequence is copper foil, prepreg, core plate, prepreg, copper foil from top to bottom) is played, is then selected according to plate Tg
Lamination appropriate presses superimposed sheet, forms production plate (internal layer daughter board).
(4), it drills: according to borehole data, using the mode of machine drilling, the holes drilled through on production plate.
(5), heavy copper: one layer of thin copper is deposited by way of chemical reaction on hole wall, is provided for subsequent electric plating of whole board
Basis, backlight test 10 grades, and the heavy copper thickness in hole is 0.5 μm.
(6), according to the principle of electrochemical reaction, upper one layer of copper electric plating of whole board: is electroplated on the basis of heavy copper.
(7), internal layer circuit production (negative film technique): inner figure transfer is coated on production plate with vertical application machine and is felt
Light film, 8 μm of the film thickness monitoring of light-sensitive surface, using Full-automatic exposure machine, with 5-6 lattice exposure guide rule (21 lattice exposure guide rule) on production plate
Internal layer circuit exposure is completed, it is developed, inner line figure is formed on production plate；Internal layer etching, by the life after exposure development
It produces plate and etches internal layer circuit, it is 3mil that internal layer line width, which measures,；Then internal layer AOI checks that the short-circuit, route of opening of internal layer circuit lacks
The defects of mouth, route pin hole, defective to scrap processing, flawless product goes out to downstream.
(8), brownification: brownification processing is carried out to production plate, to increase the roughness of hole wall.
(9), filling holes with resin: consent pressure when clogging resin ink in through-holes, and controlling consent is 6~8kg/cm2,
At this pressure, sufficiently through-hole can be filled it is full, and the resin ink that can avoid through-hole both ends overflow it is excessive.
(10), viscosity resin: using the viscous resin ink for going to protrude from production plate plate face of antistatic film, make the plate for producing plate
Face is smooth, and pressure when by sticky removing resin ink is controlled in 0.4~1.0kg/cm2, ensuring that sticky removing completely protrudes plate face
While resin ink, the excessive problem for causing to produce that plate harmomegathus is excessive, copper thickness ununiformity is even of pressure can avoid.
Among the above, using viscosity resin machine sticky removing resin ink, as shown in Figure 1, viscosity resin machine includes setting symmetrical above and below
Upper pressing roller 1 and down-pressure roller 2 are formed with the flow channel passed through for producing plate 3 between upper pressing roller 1 and down-pressure roller 2,
The left and right sides of upper pressing roller 1 and down-pressure roller 2 is equipped with winding material swing roller 4 and unreeling material swing roller 5, thus viscous
It include two groups of winding material swing rollers 4 and unreeling material swing roller 5 in resin machine, unreeling material swing roller 5 is for installing by resisting
The coiled strip that the winding of electrostatic film 6 is formed, the movable end of coiled strip is around being fixed on receipts after 1/ down-pressure roller 2 of upper pressing roller of corresponding side
On coiled strip swing roller 4, winding material swing roller 4 is for being tensioned and winding coiled strip；Specifically, wherein one group of winding material rotation rolling
Wheel 4 and unreeling material swing roller 5 are respectively placed in the top two sides of pressing roller 1, the coiled strip on group winding material swing roller 4 around
It is fixed on winding material swing roller 4 after crossing the lower end of pressing roller, another group of winding material swing roller 4 and unreeling material rotation rolling
Wheel 5 is respectively placed in the lower section two sides of down-pressure roller 1, and the coiled strip on group winding material swing roller 4 bypasses the upper end of down-pressure roller
After be fixed on winding material swing roller 4 on；When producing plate by viscosity resin machine, the control winding material rotation of swing roller 4 is to volume
Material is wound, so that sticky removing is protruded during winding by the antistatic film around upper pressing roller 1 and down-pressure roller 2
In the resin ink of plate face.
(11), solidify: production plate being toasted into 25~35min at 120 DEG C, makes the resin ink solidification in through-hole.
(12), press: production plate crosses vertical blackening process, then overlaps production plate and outer copper foil in advance with prepreg
(specific plate-laying sequence is copper foil, prepreg, core plate, prepreg, copper foil from top to bottom) together, then according to plate Tg
It selects lamination appropriate to press superimposed sheet, forms multi-layer board.
(13), it drills: being drilled on multilayer boards according to borehole data using the mode of machine drilling.
(14), heavy copper: one layer of thin copper is deposited by way of chemical reaction on hole wall, is provided for subsequent electric plating of whole board
Basis, backlight test 10 grades, and the heavy copper thickness in hole is 0.5 μm.
(15), according to the principle of electrochemical reaction, upper one layer of copper electric plating of whole board: is electroplated on the basis of heavy copper.
(16), outer-layer circuit (positive blade technolgy) is made: outer graphics transfer, it is luxuriant and rich with fragrance using Full-automatic exposure machine and positive route
Woods completes outer-layer circuit exposure with 5-7 lattice exposure guide rule (21 lattice exposure guide rule) on multilayer boards, developed, is formed on multilayer boards
Outer-layer circuit figure；Outer graphics plating, then distinguishes copper facing and tin plating, copper facing is the electricity with 1.0-2.2ASD on multilayer boards
Face copper thickness is plated to 1OZ by current density electric plating of whole board 150min, and tin plating is that 10min is electroplated with the current density of 1.2ASD, and tin is thick
3-5μm；Then film is successively moved back again, etches and move back tin, etches outer-layer circuit on multilayer boards；Outer layer AOI, uses automated optical
Detection system detects whether outer-layer circuit has the defects of open circuit, notch, not clean, short-circuit etching by the comparison with CAM data.
(17), welding resistance, silk-screen character: after multiple-plate surface silk-screen solder mask, and successively by precuring, exposure
Light, development and heat cure processing, make solder mask be solidified into solder mask；Specifically, using the white face wire mark brush TOP solder mask,
The face TOP character adds " UL label ", so that one layer of coating prevents from producing between route when welding on the route and substrate for being not required to welding
Raw bridge joint provides the protective layer of permanent electric circumstance and resist chemical, while playing aesthetic appeal.
(18), surface treatment (heavy nickel gold): principle is learned in pad copper face Tonghua of welding resistance windowing position, and uniform deposition centainly requires
The nickel layer and layer gold of thickness, nickel layer thickness are as follows: 3-5 μm；Layer gold thickness are as follows: 0.05-0.1 μm.
(19), electrical testing: testing the electrically conducting performance of production board, this plate uses test method are as follows: flying probe.
(20), it forms: according to the prior art and pressing design requirement gong shape, route is made in the +/- 0.05mm of external form tolerance
Plate.
(21), FQC: according to customs inspection standard and our company test stone, checking wiring board appearance, such as defective
It repairs in time, guarantees to provide excellent quality control for client.
(22), FQA: appearance, hole copper thickness, thickness of dielectric layers, green oil thickness, internal layer copper thickness of wiring board etc. are taken a sample test again
Whether the requirement of client is met.
(23), it packs: according to the manner of packing and packaging quantity of customer requirement, packaging being sealed to wiring board, and
It is allowed to dry drying prescription and humidity card, then shipment.
In other embodiments of the invention, viscosity resin machine is equipped with the motor of driving winding material swing roller rotation, and
In adjusting between pressing roller and down-pressure roller distance regulating mechanism, to adjust the height of flow channel, by being pressed on adjusting
The distance between idler wheel and down-pressure roller are come the pressure of application required when adapting to different plate thickness requirement and adjusting viscosity resin ink.
It is provided for the embodiments of the invention technical solution above to be described in detail, specific case used herein
The principle and embodiment of the embodiment of the present invention are expounded, the explanation of above embodiments is only applicable to help to understand this
The principle of inventive embodiments；At the same time, for those skilled in the art, according to an embodiment of the present invention, in specific embodiment party
There will be changes in formula and application range, in conclusion the contents of this specification are not to be construed as limiting the invention.
Claims (9)
1. a kind of method for manufacturing circuit board for preventing ink excessive, which comprises the following steps:
S1, to the production twist drill through-hole after early period presses；
S2, via metal then made by heavy copper and electric plating of whole board process；
S3, brownification processing is carried out to production plate；
Resin ink is clogged in S4, through-hole after metallization；
S5, then pass through the viscous resin ink for going to protrude from plate face of film；
S6, production plate is toasted, makes the resin ink solidification in through-hole.
2. the method for manufacturing circuit board according to claim 1 for preventing ink excessive, which is characterized in that before step S3,
First internal layer circuit is made on production plate.
3. the method for manufacturing circuit board according to claim 1 for preventing ink excessive, which is characterized in that in step S4,
When clogging resin ink in through-hole, consent pressure is 6~8kg/cm2。
4. the method for manufacturing circuit board according to claim 1 for preventing ink excessive, which is characterized in that in step S5, adopt
With the viscous resin ink for going to protrude from plate face of antistatic film.
5. the method for manufacturing circuit board according to claim 4 for preventing ink excessive, which is characterized in that in step S5, glue
Pressure when except resin ink is 0.4~1.0kg/cm2。
6. the method for manufacturing circuit board according to claim 5 for preventing ink excessive, which is characterized in that in step S5, adopt
With viscosity resin machine sticky removing resin ink, the viscosity resin machine includes the upper pressing roller and down-pressure roller of setting symmetrical above and below, described
It is formed with the flow channel passed through for producing plate between upper pressing roller and down-pressure roller, the upper pressing roller and down-pressure roller
The left and right sides is equipped with winding material swing roller and unreeling material swing roller, and the unreeling material swing roller is quiet by resisting for installing
Conductive film winds the coiled strip to be formed, and the movable end of the coiled strip is around being fixed on institute after upper pressing roller/down-pressure roller of corresponding side
Winding material swing roller is stated, the winding material swing roller is for being tensioned and winding coiled strip.
7. the method for manufacturing circuit board according to claim 1 for preventing ink excessive, which is characterized in that in step S6, dry
When roasting, production plate toasts 25~35min at 120 DEG C.
8. the method for manufacturing circuit board according to claim 1 for preventing ink excessive, which is characterized in that in step S1, institute
Stating production plate is the internal layer daughter board for being press-fitted together as one core material and outer copper foil by prepreg.
9. the method for manufacturing circuit board according to claim 8 for preventing ink excessive, which is characterized in that, will after step S6
The internal layer daughter board and outer copper foil are pressed into multi-layer board by prepreg, and then multi-layer board is successively by drilling, heavy copper, complete
Wiring board is made after plate plating, production outer-layer circuit, production solder mask, surface treatment and molding procedure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910226496.7A CN110337183A (en) | 2019-03-25 | 2019-03-25 | A kind of method for manufacturing circuit board for preventing ink excessive |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910226496.7A CN110337183A (en) | 2019-03-25 | 2019-03-25 | A kind of method for manufacturing circuit board for preventing ink excessive |
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| CN110337183A true CN110337183A (en) | 2019-10-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910226496.7A Pending CN110337183A (en) | 2019-03-25 | 2019-03-25 | A kind of method for manufacturing circuit board for preventing ink excessive |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111093330A (en) * | 2020-01-06 | 2020-05-01 | 东莞市五株电子科技有限公司 | Method for plugging buried hole with resin in circuit board |
| CN111687094A (en) * | 2020-07-04 | 2020-09-22 | 惠州市贝斯特膜业有限公司 | Double-sided oil scraping type ink scraping machine |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104540320A (en) * | 2014-12-09 | 2015-04-22 | 江门崇达电路技术有限公司 | Manufacturing method for resin plug hole in PCB |
-
2019
- 2019-03-25 CN CN201910226496.7A patent/CN110337183A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104540320A (en) * | 2014-12-09 | 2015-04-22 | 江门崇达电路技术有限公司 | Manufacturing method for resin plug hole in PCB |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111093330A (en) * | 2020-01-06 | 2020-05-01 | 东莞市五株电子科技有限公司 | Method for plugging buried hole with resin in circuit board |
| CN111687094A (en) * | 2020-07-04 | 2020-09-22 | 惠州市贝斯特膜业有限公司 | Double-sided oil scraping type ink scraping machine |
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Application publication date: 20191015 |