CN108990317A - A method of improving Rigid Flex level to level alignment degree - Google Patents
A method of improving Rigid Flex level to level alignment degree Download PDFInfo
- Publication number
- CN108990317A CN108990317A CN201810771289.5A CN201810771289A CN108990317A CN 108990317 A CN108990317 A CN 108990317A CN 201810771289 A CN201810771289 A CN 201810771289A CN 108990317 A CN108990317 A CN 108990317A
- Authority
- CN
- China
- Prior art keywords
- soft board
- core plate
- level
- rigid flex
- hardboard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
Abstract
The invention discloses a kind of methods for improving Rigid Flex level to level alignment degree, comprising the following steps: makes internal layer circuit on soft board core plate；In finished product Rigid Flex, soft board core plate includes soft board region and soft or hard bond area；Soft board region contraposition pressing cover film on soft board core plate, then measures the harmomegathus coefficient of soft board core plate；Internal layer circuit is made on hardboard core plate, and compensation is exposed according to the harmomegathus coefficient of soft board core plate when making internal layer circuit；Using same OPE perforating press, rivet hole is bored at the position that corresponds to riveted on soft board core plate and hardboard core plate respectively；Soft board core plate and hardboard core plate pass through closing-up after being superimposed together in advance with not gummosis PP, are then pressed into production plate.It solves the problems, such as that caused pressing registration holes are inclined when pressing cover film using the method for the present invention, improves Rigid Flex pressing quality, reduce the inclined scrappage of Rigid Flex layer.
Description
Technical field
The present invention relates to printed wiring board manufacture technology fields, and in particular to a kind of raising Rigid Flex level to level alignment degree
Method.
Background technique
In Rigid Flex manufacturing process, need to carry out the pressing of hardboard and soft board, the tradition of soft board part before pressing
Production process are as follows: sawing sheet-inner figure-OPE punching-internal layer AOI- brownification-pastes epiphragma-rear process of quick pressing-brownification-；
Wherein, the purpose of OPE punching is to go out the rivet hole of edges of boards and slot, and the pressing positioning for hardboard and soft board in rear process makes
With to control accurate contraposition between layers.
According to above-mentioned traditional process way, OPE punching is first carried out, in this way during subsequent cover film quick pressing,
Harmomegathus can occur at high temperature for soft board, inclined so as to cause OPE punching hole, and then inclined there are layer after causing soft board and hardboard to press
Problem, and separate while making when soft board and hardboard production internal layer circuit, it also can be because being pressed caused by the existing harmomegathus of soft board before pressing
Layer is inclined after conjunction, in turn results in Rigid Flex and scraps.
Summary of the invention
It is an object of the invention to provide a kind of raising Rigid Flex level to level alignment degree to overcome existing technological deficiency
Method, using this method solve pressing cover film when the inclined problem of caused pressing registration holes, improve Rigid Flex pressure
Quality is closed, the inclined scrappage of Rigid Flex layer is reduced.
In order to solve the above-mentioned technical problems, the present invention provides it is a kind of improve Rigid Flex level to level alignment degree method,
The following steps are included:
S1, internal layer circuit is made on soft board core plate；In finished product Rigid Flex, the soft board core plate includes flexible board area
Domain and soft or hard bond area；
S2, the soft board region contraposition pressing cover film on soft board core plate, then measure the harmomegathus coefficient of soft board core plate；
S3, internal layer circuit is made on hardboard core plate, and when making internal layer circuit according to the harmomegathus coefficient of soft board core plate
It is exposed compensation；
S4, using same OPE perforating press, rivet is bored at the position that corresponds to riveted on soft board core plate and hardboard core plate respectively
Hole；
S5, soft board core plate, hardboard core plate and after gummosis PP is not superimposed together in advance by closing-up, be then pressed into life
Produce plate.
Preferably, in step S2, the cover film is unilateral 1mm bigger than the soft board region.
Preferably, in step S2, cover film and soft board core plate are bonded completely by way of quick pressing, then to soft
Plate core plate is toasted, and cover film is solidified.
Preferably, in step S3, the parameter of quick pressing are as follows: 180 DEG C of temperature, pressure 80KG, pressing time 60s.
Preferably, in step S5, brownification processing is carried out together to soft board core plate and hardboard core plate before riveted.
Preferably, it in step S5, before riveted, corresponds on not gummosis PP and opens a window at the soft board region, carried out after windowing
Cleaning treatment.
Preferably, in step S3, the windowing it is unilateral 0-0.35mm bigger than the soft board region.
Preferably, further comprising the steps of after step S5:
The process that S6, production plate successively pass through outer layer drilling, heavy copper and electric plating of whole board；
S7, outer-layer circuit and solder mask are successively made on production plate, is then surface-treated；
It is deep that control is carried out by the way of laser cutting or gong slot at S8, the position for corresponding to soft board region surrounding on production plate
Cutting removes the part that the soft board region is corresponded on hardboard core plate after taking off lid, and Rigid Flex is made.
Preferably, in step S8, after taking off lid, dispensing is carried out in the soft board edges of regions of exposing and the junction of hardboard core plate
Processing.
Compared with prior art, the invention has the following beneficial effects:
The present invention is by first measuring the harmomegathus coefficient of soft board core plate, then making after soft board region presses cover film
Compensation is exposed according to the harmomegathus coefficient when internal layer circuit of hardboard core plate, it is ensured that the interlayer pair of soft board core plate and hardboard core plate
Accuracy drills out rivet hole using same OPE perforating press in the corresponding position of soft board core plate and hardboard core plate respectively, makes the riveting bored
Nail hole unification improves the precision of rivet hole contraposition on two plates, solves the problems, such as that the caused hole OPE is inclined when pressing cover film,
And the punching together simultaneously of soft board core plate and hardboard core plate, it has ensured the Aligning degree of rivet hole, has improved Rigid Flex and press quality,
Reduce the inclined scrappage of Rigid Flex layer；And after being drilled rivet hole, soft board core plate and hardboard core plate further play carry out brownification
Processing carries out brownification processing simultaneously that is, under the same terms environment, further increases the level to level alignment degree between two plates, prevents point
It drives the processing of row brownification into and the inclined problem of layer occurs.
Specific embodiment
In order to more fully understand technology contents of the invention, below in conjunction with specific embodiment to technical side of the invention
Case is described further and illustrates.
Embodiment
The present embodiment provides a kind of production methods of Rigid Flex, including raising Rigid Flex level to level alignment degree
Method, the specific process is as follows:
(1), soft board core plate and hardboard core plate, soft board core thickness sawing sheet: are outputed by jigsaw size 520mm × 620mm
0.1mm, outer copper foil include soft board region and soft or hard bond area with a thickness of 0.5OZ, the soft board core plate；Hardboard core thickness
0.18mm, outer copper foil is with a thickness of 0.5OZ.
(2), internal layer circuit production (negative film technique): inner figure transfer is coated on soft board core plate with vertical application machine
Light-sensitive surface, 8 μm of the film thickness monitoring of light-sensitive surface, using Full-automatic exposure machine, with 5-6 lattice exposure guide rule (21 lattice exposure guide rule) in soft board core
Internal layer circuit exposure is completed on plate；Internal layer etching, etches internal layer circuit, internal layer line width amount for the soft board core plate after exposure development
Surveying is 3mil；Then internal layer AOI checks the defects of opening short circuit, route notch, route pin hole of internal layer circuit, defective to scrap
Processing, flawless product go out to downstream.
(3), brownification: by way of chemical reaction, in a kind of brown oxidation layer of soft board core plate layers of copper Surface Creation, make copper
The roughness in face becomes larger, enhancing pressing when and cover film binding force.
(4), paste epiphragma: the contraposition of soft board region on soft board core plate fits over film, and cover film is unilateral compares soft board
The big 1mm in region；The cover film is polyimides (PI material).
Wherein, it before fitting, according to the shape in soft board region, is corresponded on the cover film of size identical as soft board core plate soft or hard
Bond area carries out windowing processing.
(5), quick pressing: by way of high temperature and pressure, in the short time by the glue-line (epoxy resin) of cover film with it is soft
The soft board region of plate core plate bonds completely, achievees the effect that protect soft board region；The parameter of quick pressing are as follows: 180 DEG C of temperature, pressure
Power 80KG, pressing time 60s.
(6), baking sheet: soft board core plate toasts 1h at 150 DEG C, and cover film is fully cured.
(7), internal layer circuit production (negative film technique): the harmomegathus coefficient of soft board core plate is first measured, is existed with vertical application machine
Light-sensitive surface is coated on hardboard core plate, 8 μm of the film thickness monitoring of light-sensitive surface is exposed compensation according to the harmomegathus coefficient of soft board core plate,
Using Full-automatic exposure machine, internal layer circuit exposure is completed on hardboard core plate with 5-6 lattice exposure guide rule (21 lattice exposure guide rule)；Internal layer erosion
It carves, the hardboard core plate after exposure development is etched into internal layer circuit, it is 3mil that internal layer line width, which measures,；Internal layer AOI, then in inspection
The defects of opening short circuit, route notch, route pin hole of sandwich circuit, defective to scrap processing, flawless product goes out to lower one stream
Journey.
(8), OPE punching: same OPE perforating press is used, corresponds to the position of riveted on soft board core plate and hardboard core plate respectively
The rivet hole of pressing positioning is gone out at the place of setting.
(9), open a window: preferred dimension is the not gummosis PP of 520mm × 620mm, is corresponded at soft board region on not gummosis PP
Windowing, the window size is unilateral 0-0.35mm bigger than soft board region, and while opening a window removes at corresponding rivet hole not gummosis PP together.
(10), it cleans: cleaning treatment is carried out to the not gummosis PP after windowing, remove dirty, the guarantee on the not surface gummosis PP
Binding force when later period presses.
(11), brownification: soft board core plate and hardboard core plate carry out brownification processing together under identical conditions and environment, pass through
The mode of chemical reaction makes the roughness of copper face in soft board core plate and a kind of brown oxidation layer of hardboard core plate layers of copper Surface Creation
Become larger, binding force when enhancing pressing with not gummosis PP.
Among the above, by first measuring the harmomegathus coefficient of soft board core plate, then making after soft board region presses cover film
Compensation is exposed according to the harmomegathus coefficient when internal layer circuit of hardboard core plate, it is ensured that the interlayer pair of soft board core plate and hardboard core plate
The two is carried out drilling out rivet hole again together after accuracy, soft board core plate and hardboard core plate contraposition overlapping, solves pressing cover film
When the caused inclined problem in the hole OPE, and soft board core plate and the punching together simultaneously of hardboard core plate have ensured the Aligning degree of rivet hole, have changed
Kind Rigid Flex presses quality, reduces the inclined scrappage of Rigid Flex layer；And after being drilled rivet hole, soft board core plate and hard
Plate core plate carries out brownification processing simultaneously under identical environment, that is, further increases the level to level alignment degree between two plates, prevents from separating
It carries out brownification processing and the inclined problem of layer occurs.
(12), press: after soft board core plate and hardboard core plate are superimposed together in advance with not gummosis PP (specific plate-laying sequentially by
Top to bottm is hardboard core plate, not gummosis PP, soft board core plate, not gummosis PP, hardboard core plate), it is first carried out by rivet hole with rivet
Then riveted selects lamination appropriate to press superimposed sheet according to plate Tg, form production plate.
Among the above, corresponded in hardboard core plate soft board region part before pressing without windowing handle, but the later period at
It is cut by laser after type process or the mode of gong slot removes, soft board region can be effectively protected and erosion and mechanical mill are not stung by liquid medicine
Damage wipes flower.
Among the above, the side of cover film after pressing is made by the dimensional fits of window size and cover film on not gummosis PP
Edge is pushed down by not gummosis PP, and cover film is broken away together when the later period being further prevented to take off lid, and is pressed using not gummosis PP,
Gummosis is not had at windowing, and later period control is facilitated profoundly to cut and take off lid.
(13), outer layer drills: being drilled on production plate according to borehole data using the mode of machine drilling.
(14), heavy copper: one layer of thin copper is deposited by way of chemical reaction on hole wall, is provided for subsequent electric plating of whole board
Basis, backlight test 10 grades, and the heavy copper thickness in hole is 0.5 μm.
(15), electric plating of whole board --- according to the mechanism of electrochemical reaction, upper one layer of copper is electroplated on the basis of heavy copper, guarantees
Hole copper thickness reaches product requirement, sets electroplating parameter according to hole copper thickness is completed.
(16), outer-layer circuit (positive blade technolgy) is made: outer graphics transfer, it is luxuriant and rich with fragrance using Full-automatic exposure machine and positive route
Woods completes outer-layer circuit exposure with 5-7 lattice exposure guide rule (21 lattice exposure guide rule), developed, forms outer-layer circuit figure on production plate
Shape；Outer graphics plating, the then copper facing and tin plating respectively on production plate, sets electroplating parameter according to desired completion copper thickness,
Copper facing is the current density electric plating of whole board 60min with 1.8ASD, and tin plating is that 10min is electroplated with the current density of 1.2ASD, and tin is thick
3-5μm；Then film is successively moved back again, etches and move back tin, etches outer-layer circuit on production plate；Outer layer AOI, uses automated optical
Detection system detects whether outer-layer circuit has the defects of open circuit, notch, not clean, short-circuit etching by the comparison with CAM data.
(17), welding resistance, silk-screen character: by making green oil layer and silk-screen character, green oil thickness in production plate outer layer are as follows:
10-50 μm, so as to so that production plate can reduce influence of the environmental change to it in the subsequent use process.
(18), surface treatment (heavy nickel gold): principle is learned in pad copper face Tonghua of welding resistance windowing position, and uniform deposition centainly requires
The nickel layer and layer gold of thickness, nickel layer thickness are as follows: 3-5 μm；Layer gold thickness are as follows: 0.05-0.1 μm.
(19), it forms: according to the prior art and pressing design requirement gong shape, the +/- 0.05mm of external form tolerance.
(20), it is cut by laser (gong platform): using laser cutting at the position for corresponding to soft board region surrounding on production plate
Mode control and profoundly cut, will then be produced by taking off lid and correspond to the waste material in soft board region on plate and removed from product and (take off lid
Remove the part that the soft board region is corresponded on hardboard core plate afterwards), expose internal soft board region part, form platform, is made
Rigid Flex.
Among the above, laser cutting method is suitable for 2-6 laminate, and the hardboard core thickness adjacent with soft board core plate exists
The production of 0.2mm Rigid Flex below；Because of no gummosis at the windowing on not gummosis PP, there is no laser burns gummosis from
And the mode for causing the quality of production plate to go wrong, therefore laser cutting can be used control and is profoundly cut, and is cut by laser
The mode cut, which can guarantee, will not generate burr on the edge in the platform taken off and formed after lid, guarantee that neat in edge is round and smooth, improve at
The quality of product plate, and the opposite mode for controlling deep gong blind slot, can effectively improve the efficiency of cutting, and then improve the life of Rigid Flex
Produce efficiency.
(21), dispensing: dispensing processing is carried out (i.e. to the soft board core plate of platform edges in the junction of the platform edges of exposing
With glue on the junction point of hardboard core plate), enhance the intensity of junction, prevents the junction when bending or pullling from splitting
The phenomenon that.
(22), electrical testing: testing the electrically conducting performance of production board, this plate uses test method are as follows: flying probe.
(23), FQC: appearance, hole copper thickness, thickness of dielectric layers, green oil thickness, internal layer copper thickness of production board etc. are checked whether
Meet the requirement of client.
(24), it packs: according to the manner of packing and packaging quantity of customer requirement, packaging being sealed to production board, and
It is allowed to dry drying prescription and humidity card, then shipment.
It is provided for the embodiments of the invention technical solution above to be described in detail, specific case used herein
The principle and embodiment of the embodiment of the present invention are expounded, the explanation of above embodiments is only applicable to help to understand this
The principle of inventive embodiments；At the same time, for those skilled in the art, according to an embodiment of the present invention, in specific embodiment party
There will be changes in formula and application range, in conclusion the contents of this specification are not to be construed as limiting the invention.
Claims (9)
1. a kind of method for improving Rigid Flex level to level alignment degree, which comprises the following steps:
S1, internal layer circuit is made on soft board core plate；In finished product Rigid Flex, the soft board core plate include soft board region and
Soft or hard bond area；
S2, the soft board region contraposition pressing cover film on soft board core plate, then measure the harmomegathus coefficient of soft board core plate；
S3, internal layer circuit is made on hardboard core plate, and carried out when making internal layer circuit according to the harmomegathus coefficient of soft board core plate
Exposure compensating；
S4, using same OPE perforating press, rivet hole is bored at the position that corresponds to riveted on soft board core plate and hardboard core plate respectively；
S5, soft board core plate, hardboard core plate and after gummosis PP is not superimposed together in advance by closing-up, be then pressed into production
Plate.
2. the method according to claim 1 for improving Rigid Flex level to level alignment degree, which is characterized in that in step S2,
The cover film is unilateral 1mm bigger than the soft board region.
3. the method according to claim 1 for improving Rigid Flex level to level alignment degree, which is characterized in that in step S2,
Cover film and soft board core plate are bonded completely by way of quick pressing, then soft board core plate is toasted, makes cover film
Solidification.
4. the method according to claim 3 for improving Rigid Flex level to level alignment degree, which is characterized in that in step S3,
The parameter of quick pressing are as follows: 180 DEG C of temperature, pressure 80KG, pressing time 60s.
5. the method according to claim 1 for improving Rigid Flex level to level alignment degree, which is characterized in that in step S5,
Brownification processing is carried out together to soft board core plate and hardboard core plate before riveted.
6. the method according to claim 1 for improving Rigid Flex level to level alignment degree, which is characterized in that in step S5,
Before riveted, corresponds on not gummosis PP and open a window at the soft board region, carry out cleaning treatment after windowing.
7. the method according to claim 1 for improving Rigid Flex level to level alignment degree, which is characterized in that in step S3,
The windowing it is unilateral 0-0.35mm bigger than the soft board region.
8. the method according to claim 1 for improving Rigid Flex level to level alignment degree, which is characterized in that after step S5 also
The following steps are included:
The process that S6, production plate successively pass through outer layer drilling, heavy copper and electric plating of whole board；
S7, outer-layer circuit and solder mask are successively made on production plate, is then surface-treated；
It carries out controlling profoundly by the way of laser cutting or gong slot at S8, the position for corresponding to soft board region surrounding on production plate
It cuts, removes the part for corresponding to the soft board region on hardboard core plate after taking off lid, Rigid Flex is made.
9. the method according to claim 8 for improving Rigid Flex level to level alignment degree, which is characterized in that in step S8,
After taking off lid, dispensing processing is carried out in the soft board edges of regions of exposing and the junction of hardboard core plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810771289.5A CN108990317B (en) | 2018-07-13 | 2018-07-13 | Method for improving interlayer alignment degree of rigid-flex board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810771289.5A CN108990317B (en) | 2018-07-13 | 2018-07-13 | Method for improving interlayer alignment degree of rigid-flex board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108990317A true CN108990317A (en) | 2018-12-11 |
| CN108990317B CN108990317B (en) | 2021-05-28 |
Family
ID=64537420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810771289.5A Active CN108990317B (en) | 2018-07-13 | 2018-07-13 | Method for improving interlayer alignment degree of rigid-flex board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108990317B (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109905976A (en) * | 2019-04-11 | 2019-06-18 | 信丰迅捷兴电路科技有限公司 | A kind of local laminating type of Rigid Flex cover film |
| CN110139505A (en) * | 2019-04-10 | 2019-08-16 | 江门崇达电路技术有限公司 | A kind of production method of the Rigid Flex with the layering of local soft board |
| CN110708874A (en) * | 2019-09-24 | 2020-01-17 | 珠海崇达电路技术有限公司 | Method for rapidly judging hole deviation of OPE (optical connection edge) of HDI (high Density interconnect) plate |
| CN110708894A (en) * | 2019-10-18 | 2020-01-17 | 生益电子股份有限公司 | Manufacturing method of HDI board |
| CN110708896A (en) * | 2019-10-18 | 2020-01-17 | 生益电子股份有限公司 | PIN hole machining method and HDI board manufacturing method |
| CN110933839A (en) * | 2019-12-03 | 2020-03-27 | 欣强电子（清远）有限公司 | Method for opening cover by mechanically forming soft and hard plates |
| CN111836485A (en) * | 2020-08-24 | 2020-10-27 | 大连崇达电子有限公司 | Manufacturing process of twice stepped plate |
| CN112040657A (en) * | 2020-09-22 | 2020-12-04 | 深圳崇达多层线路板有限公司 | Manufacturing method of special-shaped step plate |
| CN112839453A (en) * | 2021-01-20 | 2021-05-25 | 福立旺精密机电（中国）股份有限公司 | Rigid-flexible combined circuit board and preparation method thereof |
| CN113179595A (en) * | 2021-03-25 | 2021-07-27 | 红板（江西）有限公司 | One-time plate milling and forming processing technology for soft and hard combined plate |
| CN114630509A (en) * | 2020-12-08 | 2022-06-14 | 深南电路股份有限公司 | Rigid-flex board and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102711392A (en) * | 2012-06-25 | 2012-10-03 | 广州美维电子有限公司 | Manufacturing method of flexible-rigid circuit board |
| CN102970828A (en) * | 2012-11-30 | 2013-03-13 | 成都航天通信设备有限责任公司 | Method for manufacturing rigidity-flexibility combined printing circuit board |
| CN104135823A (en) * | 2014-07-14 | 2014-11-05 | 东莞市五株电子科技有限公司 | Fabrication method for rigid-flex printed combination board of covering membrane window |
| CN106851975A (en) * | 2017-03-22 | 2017-06-13 | 深圳市景旺电子股份有限公司 | A kind of rigid-flex combined board and preparation method thereof |
-
2018
- 2018-07-13 CN CN201810771289.5A patent/CN108990317B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102711392A (en) * | 2012-06-25 | 2012-10-03 | 广州美维电子有限公司 | Manufacturing method of flexible-rigid circuit board |
| CN102970828A (en) * | 2012-11-30 | 2013-03-13 | 成都航天通信设备有限责任公司 | Method for manufacturing rigidity-flexibility combined printing circuit board |
| CN104135823A (en) * | 2014-07-14 | 2014-11-05 | 东莞市五株电子科技有限公司 | Fabrication method for rigid-flex printed combination board of covering membrane window |
| CN106851975A (en) * | 2017-03-22 | 2017-06-13 | 深圳市景旺电子股份有限公司 | A kind of rigid-flex combined board and preparation method thereof |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110139505A (en) * | 2019-04-10 | 2019-08-16 | 江门崇达电路技术有限公司 | A kind of production method of the Rigid Flex with the layering of local soft board |
| CN110139505B (en) * | 2019-04-10 | 2021-06-25 | 江门崇达电路技术有限公司 | Manufacturing method of rigid-flex board with local flexible board layering |
| CN109905976A (en) * | 2019-04-11 | 2019-06-18 | 信丰迅捷兴电路科技有限公司 | A kind of local laminating type of Rigid Flex cover film |
| CN110708874B (en) * | 2019-09-24 | 2021-06-04 | 珠海崇达电路技术有限公司 | Method for rapidly judging hole deviation of OPE (optical connection edge) of HDI (high Density interconnect) plate |
| CN110708874A (en) * | 2019-09-24 | 2020-01-17 | 珠海崇达电路技术有限公司 | Method for rapidly judging hole deviation of OPE (optical connection edge) of HDI (high Density interconnect) plate |
| CN110708894A (en) * | 2019-10-18 | 2020-01-17 | 生益电子股份有限公司 | Manufacturing method of HDI board |
| CN110708896A (en) * | 2019-10-18 | 2020-01-17 | 生益电子股份有限公司 | PIN hole machining method and HDI board manufacturing method |
| CN110933839A (en) * | 2019-12-03 | 2020-03-27 | 欣强电子（清远）有限公司 | Method for opening cover by mechanically forming soft and hard plates |
| CN111836485A (en) * | 2020-08-24 | 2020-10-27 | 大连崇达电子有限公司 | Manufacturing process of twice stepped plate |
| CN112040657A (en) * | 2020-09-22 | 2020-12-04 | 深圳崇达多层线路板有限公司 | Manufacturing method of special-shaped step plate |
| CN114630509A (en) * | 2020-12-08 | 2022-06-14 | 深南电路股份有限公司 | Rigid-flex board and manufacturing method thereof |
| CN112839453A (en) * | 2021-01-20 | 2021-05-25 | 福立旺精密机电（中国）股份有限公司 | Rigid-flexible combined circuit board and preparation method thereof |
| CN113179595A (en) * | 2021-03-25 | 2021-07-27 | 红板（江西）有限公司 | One-time plate milling and forming processing technology for soft and hard combined plate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108990317B (en) | 2021-05-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108990317A (en) | A method of improving Rigid Flex level to level alignment degree | |
| CN108617114A (en) | A kind of production method of laser control depth covering type Rigid Flex | |
| CN108617113A (en) | A kind of PP adds the method for Protection glue band making Rigid Flex | |
| CN110139505A (en) | A kind of production method of the Rigid Flex with the layering of local soft board | |
| CN108521723A (en) | A kind of production method of Rigid Flex | |
| CN107949190A (en) | A kind of manufacture craft of high drop ladder wiring board | |
| CN108966532A (en) | A kind of production method of three rank HDI plates of the golden finger containing ladder | |
| CN108323037A (en) | A kind of PCB processing technologys of two-sided ladder position electricity gold | |
| CN111683457A (en) | Manufacturing method of rigid-flex board | |
| CN110678011A (en) | Manufacturing method of rigid-flex printed circuit board | |
| CN107592735A (en) | Thick desired ladder board manufacturing method more than a kind of high accuracy | |
| CN109275268A (en) | A kind of PCB back drill production method being less than 0.15mm for medium thickness | |
| CN110225660A (en) | A kind of production method of high thermal conductivity thickness copper base | |
| CN108990318A (en) | A kind of method for manufacturing circuit board of loophole lamination mistake proofing | |
| CN110248473A (en) | A method of it is small to solve VIA-IN-PAD filling holes with resin PCB printed board crimping hole | |
| CN111970831B (en) | Manufacturing process of T-shaped high-rise copper-buried circuit board | |
| CN110602890A (en) | Manufacturing method of negative film circuit board with step circuit | |
| CN111182743B (en) | Manufacturing method of ceramic-based circuit board | |
| CN108966516A (en) | A kind of one step press buried capacitor technique based on supporting substrate | |
| CN109587977A (en) | A kind of improvement fusion undesirable method of position making sheet | |
| CN108289388A (en) | The undesirable PCB production methods of tin in a kind of prevention | |
| CN108124384A (en) | Small size wiring board method for processing forming without interior positioning | |
| CN109548321A (en) | A kind of production method of positive etchback PCB | |
| CN109831874A (en) | A method of solving the upper PAD of the quick-fried oil of welding resistance | |
| CN110121239A (en) | A kind of production method of mechanical blind hole half bore |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |