CN110933839A - Method for opening cover by mechanically forming soft and hard plates - Google Patents
Method for opening cover by mechanically forming soft and hard plates Download PDFInfo
- Publication number
- CN110933839A CN110933839A CN201911221841.4A CN201911221841A CN110933839A CN 110933839 A CN110933839 A CN 110933839A CN 201911221841 A CN201911221841 A CN 201911221841A CN 110933839 A CN110933839 A CN 110933839A
- Authority
- CN
- China
- Prior art keywords
- board
- soft
- hard
- image
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention relates to the technical field of uncovering of soft and hard boards, in particular to an uncovering method for mechanically forming the soft and hard boards, which solves the problems that the traditional UV ablation method is adopted to uncover the covers, the efficiency is lower, and can cause the problem of carbonization short circuit, the upper and lower surfaces of the soft board are all jointed with the hard board, and a curing piece and no-flow glue PP are arranged between the soft board and the hard board, and the depth control drag-out milling cutter is adopted to carry out depth setting positive control and the butt joint with the previous UV reverse control position to realize mechanical uncovering, the invention has simple and clear working procedure and simple operation, through UV anti-accuse earlier then use accuse deep drag for milling cutter depthkeeping positive accuse and anti-accuse position butt joint, realize that machinery takes off the lid, promote product productivity and ageing, satisfy customer's delivery demand, promote mill's delivery competitiveness, solved tradition and adopted UV ablation to uncap and can make the material carbonization, easily cause the carbonization short circuit, the quality is bad problems such as gold in the carbonization, the effectual quality that improves the product.
Description
Technical Field
The invention relates to the technical field of uncovering of soft and hard boards, in particular to a uncovering mode for mechanically forming the soft and hard boards.
Background
With the rapid development of rigid-flex boards, the market demand for in-plant production efficiency (production delivery) and quality will be higher and higher.
However, the existing soft and hard boards still adopt the traditional UV ablation method to uncover the cover, the efficiency is low, and the carbonization short circuit problem can be caused. Therefore, those skilled in the art have provided a way of opening the cover by mechanically forming a soft and hard plate to solve the above problems in the background art.
Disclosure of Invention
The invention aims to provide a cover opening mode for mechanically forming a soft and hard board so as to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: the soft and hard board comprises a soft board, wherein the upper surface and the lower surface of the soft board are respectively attached with a hard board, and a curing sheet and non-flowing PP (polypropylene) are arranged between the soft board and the hard board.
As a still further scheme of the invention: a cover opening mode for mechanically forming a soft and hard plate comprises the following steps:
s1, cutting and baking: cutting the flexible copper foil base material on a cutting machine according to the required size, placing the cut material into an oven for baking, and naturally cooling the baked material;
s2, inner layer image, etching, inspection: making an inner layer circuit by using a pattern transfer principle;
s3, browning and attaching: coarsening the copper surface and the line surface of the inner layer, then laminating by using a double-sided laminating machine, and measuring the expansion and shrinkage of the base material after lamination;
s4, drilling: drilling holes on the hard board according to the hole site requirement;
s5, hard plate inner layer image, etching and inspection: pressing a dry film on a hard board with drilled holes, transferring a required image to the dry film through a negative plate by using an exposure machine, developing, chemically etching and removing the image to form a required image circuit, and finally performing circuit maintenance by using an A.O.I (automatic optical inspection) to complete the manufacture of an inner layer circuit;
s6, brown oxidation of hard board: coarsening the copper surface and the line surface of the inner layer;
s7, UV reverse control: performing shallow depth-fixing cutting on the soft and hard connection position on the soft board;
s8, pressing: the soft board and the hard board are pressed through the non-flowing PP glue, and the edge is fished up through the conventional treatment of board stacking and pressure transmission hit target:
s9, windowing: windowing is carried out on the non-flowing glue PP corresponding to the soft area of the soft board;
s10, drilling: drilling at required places;
s11, electroplating: placing the plate subjected to drilling treatment in an electroplating bath for electroplating;
s12, outer layer image, etching, inspection: transferring the required circuit image to the surface of the plate by using an exposure machine through a negative film, developing, chemically etching and stripping the image to form a required image circuit, and finally performing circuit maintenance by using A.O.I (automatic optical inspection);
s13, solder mask: producing an image on a line by silk-screen printing ink, exposure and development;
s14, gold melting: cleaning by matching ultrasonic wave bands with ammonia water to remove metal impurities on the board surface;
s15, hot set text: printing out characters required by a customer in a board according to the customer requirement;
s16, fishing out the cover groove: arranging a fishing groove on the curing sheet of the soft board, wherein the width of the fishing groove is 1.0-1.3 mm;
s17, controlling deep fishing and uncovering: adopting a depth control drag mill to carry out depth setting and positive control to be in butt joint with the previous UV reverse control position so as to realize mechanical uncovering;
s18, soft board UV forming: carrying out UV hot-pressing molding on the rigid-flexible board;
s19, detecting and warehousing: and detecting the finished product, and packaging and warehousing after the finished product is qualified.
As a still further scheme of the invention: the soft board in the S1 adopts a soft copper foil as a base material, and the baking temperature is controlled at 90-95 ℃ for 10 minutes.
As a still further scheme of the invention: in the step S2, an exposure machine is used to transfer the required circuit image to the substrate through the negative film, and then the image is developed, chemically etched, and stripped to form the required image circuit, and finally, a.o.i. (automatic optical inspection) is used for circuit maintenance.
As a still further scheme of the invention: the hard board in the S4 adopts a Core board.
As a still further scheme of the invention: and S11, carrying out dispensing treatment on the joint of the exposed edge of the soft board area and the hard board after uncovering.
As a still further scheme of the invention: and the detection in the S19 comprises visual inspection and performance detection, wherein the performance detection utilizes ohm' S law to test and judge the conductivity and the insulativity among the networks of the rigid-flex board, and meanwhile, the open circuit and the short circuit are electrically tested, and the visual inspection is carried out aiming at the appearance detection.
Compared with the prior art, the invention has the beneficial effects that: the method has the advantages of simple process and simple operation, realizes mechanical uncovering by butting the UV reverse control and the depth control drag mill depth setting forward control and the reverse control position, improves the product productivity and timeliness, meets the delivery requirements of clients, improves the delivery competitiveness of factories, solves the problems of poor quality such as carbonization of materials, easy carbonization short circuit, gold feeding during carbonization and the like caused by traditional UV ablation uncovering, and effectively improves the product quality.
Drawings
FIG. 1 is a schematic structural diagram of a soft board and a hard board;
fig. 2 is a step diagram of a cover opening method by using a mechanically formed soft and hard plate.
In the figure: 1. controlling depth and fishing out the milling cutter; 2. a soft board; 3. hard plates; 4. and (5) controlling UV reversely.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-2, in an embodiment of the present invention, a flexible printed circuit board includes a flexible printed circuit board 2, hard printed circuit boards 3 are attached to upper and lower surfaces of the flexible printed circuit board 2, and a curing sheet and a non-flowing adhesive PP are disposed between the flexible printed circuit board 2 and the hard printed circuit boards 3.
Further, a mode of uncapping by mechanically molding a soft and hard plate comprises the following steps:
s1, cutting and baking: cutting the soft board 2 on a cutting machine according to the required size, placing the cut material into an oven for baking, and naturally cooling the baked material;
s2, inner layer image, etching, inspection: making an inner layer circuit by using a pattern transfer principle;
s3, browning and attaching: coarsening the copper surface and the line surface of the inner layer, then laminating by using a double-sided laminating machine, and measuring the expansion and shrinkage of the base material after lamination;
s4, drilling: drilling holes on the hard board 3 according to the hole position requirement;
s5, hard plate inner layer image, etching and inspection: pressing a dry film on the hard board 3 with drilled holes, transferring a required image to the dry film through a negative plate by using an exposure machine, developing, chemically etching and removing the image to form a required image circuit, and finally performing circuit maintenance by using A.O.I (automatic optical inspection) to complete the manufacture of an inner layer circuit;
s6, brown oxidation of hard board: coarsening the copper surface and the line surface of the inner layer;
s7, UV reverse control: performing shallow depth-fixing cutting on the soft and hard connection position on the soft board;
s8, pressing: the soft board 2 and the hard board 3 are pressed through the non-flowing PP glue, and the edge is fished up through the conventional treatment of board stacking and pressure transmission hit target:
s9, windowing: windowing is carried out on the non-flowing glue PP corresponding to the soft area of the soft board 2;
s10, drilling: drilling at required places;
s11, electroplating: placing the plate subjected to drilling treatment in an electroplating bath for electroplating;
s12, outer layer image, etching, inspection: transferring the required circuit image to the surface of the plate by using an exposure machine through a negative film, developing, chemically etching and stripping the image to form a required image circuit, and finally performing circuit maintenance by using A.O.I (automatic optical inspection);
s13, solder mask: producing an image on a line by silk-screen printing ink, exposure and development;
s14, gold melting: cleaning by matching ultrasonic wave bands with ammonia water to remove metal impurities on the board surface;
s15, hot set text: printing out characters required by a customer in a board according to the customer requirement;
s16, fishing out the cover groove: arranging a fishing groove on the curing sheet of the soft board, wherein the width of the fishing groove is 1.0-1.3 mm;
s17, controlling deep fishing and uncovering: the depth control drag-and-drop cutter 1 is adopted for butt joint with the position of the previous UV reverse control 4 in a depth-setting and forward control manner, so that mechanical uncovering is realized;
s18, soft board UV forming: carrying out UV hot-pressing molding on the rigid-flexible board;
s19, detecting and warehousing: and detecting the finished product, and packaging and warehousing after the finished product is qualified.
Further, in the S1, the flexible board 2 adopts flexible copper foil as a base material, and the baking temperature is controlled at 90-95 ℃ for 10 minutes.
Further, in S2, an exposure machine is used to transfer the desired circuit image to the substrate through the negative film, and then the image is developed, chemically etched, and stripped to form the desired image circuit, and finally, a.o.i. (automatic optical inspection) is used for circuit inspection.
Further, in S4, the hard sheet 3 is a Core sheet.
Further, after the cover is uncovered in S11, a dispensing process is performed at the joint of the exposed edge of the area of the flexible printed circuit board 2 and the hard printed circuit board 3.
Further, the detection in S19 includes visual inspection and performance detection, where the performance detection utilizes ohm' S law to test and determine the conductivity and insulation between the networks of the rigid-flex board, and meanwhile, electrical tests are performed on open and short circuits, and visual inspection is performed for appearance detection.
In summary, the following steps: through UV anti-accuse 4 earlier uses accuse dark fishing out milling cutter 1 depthkeeping positive accuse and anti-accuse position butt joint, realize that machinery takes off the lid, promote product productivity and ageing, satisfy customer's delivery demand, promote mill's delivery competitiveness, it can make the material carbonization to have solved tradition adoption UV ablation and uncap, easily causes the carbonization short circuit, and the effectual quality that improves the product such as gold is gone up in the carbonization problem of quality.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (7)
1. The soft and hard board is characterized by comprising a soft board, wherein the upper surface and the lower surface of the soft board are respectively attached with a hard board, and a curing sheet and non-flowing glue PP are arranged between the soft board and the hard board.
2. A cover opening method by using a mechanically formed soft and hard plate according to claim 1, characterized by comprising the following steps:
s1, cutting and baking: cutting the flexible copper foil base material on a cutting machine according to the required size, placing the cut material into an oven for baking, and naturally cooling the baked material;
s2, inner layer image, etching, inspection: making an inner layer circuit by using a pattern transfer principle;
s3, browning and attaching: coarsening the copper surface and the line surface of the inner layer, then laminating by using a double-sided laminating machine, and measuring the expansion and shrinkage of the base material after lamination;
s4, drilling: drilling holes on the hard board according to the hole site requirement;
s5, hard plate inner layer image, etching and inspection: pressing a dry film on a hard board with drilled holes, transferring a required image to the dry film through a negative plate by using an exposure machine, developing, chemically etching and removing the image to form a required image circuit, and finally performing circuit maintenance by using an A.O.I (automatic optical inspection) to complete the manufacture of an inner layer circuit;
s6, brown oxidation of hard board: coarsening the copper surface and the line surface of the inner layer;
s7, UV reverse control: performing shallow depth-fixing cutting on the soft and hard connection position on the soft board;
s8, pressing: the soft board and the hard board are pressed through the non-flowing PP glue, and the edge is fished up through the conventional treatment of board stacking and pressure transmission hit target:
s9, windowing: windowing is carried out on the non-flowing glue PP corresponding to the soft area of the soft board;
s10, drilling: drilling at required places;
s11, electroplating: placing the plate subjected to drilling treatment in an electroplating bath for electroplating;
s12, outer layer image, etching, inspection: transferring the required circuit image to the surface of the plate by using an exposure machine through a negative film, developing, chemically etching and stripping the image to form a required image circuit, and finally performing circuit maintenance by using A.O.I (automatic optical inspection);
s13, solder mask: producing an image on a line by silk-screen printing ink, exposure and development;
s14, gold melting: cleaning by matching ultrasonic wave bands with ammonia water to remove metal impurities on the board surface;
s15, hot set text: printing out characters required by a customer in a board according to the customer requirement;
s16, fishing out the cover groove: arranging a fishing groove on the curing sheet of the soft board, wherein the width of the fishing groove is 1.0-1.3 mm;
s17, controlling deep fishing and uncovering: adopting a depth control drag mill to carry out depth setting and positive control to be in butt joint with the previous UV reverse control position so as to realize mechanical uncovering;
s18, soft board UV forming: carrying out UV hot-pressing molding on the rigid-flexible board;
s19, detecting and warehousing: and detecting the finished product, and packaging and warehousing after the finished product is qualified.
3. A cover opening method by utilizing a mechanically formed soft and hard board as claimed in claim 1, wherein the soft board in S1 adopts a soft copper foil as a base material, and the baking temperature is controlled at 90-95 ℃ for 10 minutes.
4. A cover opening method for soft and hard boards by mechanical forming according to claim 1, wherein in S2, the required circuit image is transferred to the substrate through the negative film by the exposure machine, then the image is developed, chemically etched and stripped to form the required image circuit, finally the circuit is repaired by a.o.i. (automatic optical inspection).
5. A mechanically formed soft and hard board cover as claimed in claim 1, wherein the hard board of S4 is a Core board.
6. A cover opening method by using a mechanically formed soft and hard board as claimed in claim 1, wherein the glue dispensing process is performed at the joint of the exposed edge of the soft board area and the hard board after the cover is opened in S11.
7. A cover opening mode by using a mechanically formed soft and hard board as claimed in claim 1, wherein the detection in S19 includes visual inspection and performance detection, the performance detection utilizes ohm' S law to test and judge the conductivity and insulation between the networks of the soft and hard combined board, and meanwhile, the open and short circuits are electrically tested, and the visual inspection is directed at the appearance detection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911221841.4A CN110933839A (en) | 2019-12-03 | 2019-12-03 | Method for opening cover by mechanically forming soft and hard plates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911221841.4A CN110933839A (en) | 2019-12-03 | 2019-12-03 | Method for opening cover by mechanically forming soft and hard plates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110933839A true CN110933839A (en) | 2020-03-27 |
Family
ID=69847292
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911221841.4A Pending CN110933839A (en) | 2019-12-03 | 2019-12-03 | Method for opening cover by mechanically forming soft and hard plates |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110933839A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111935921A (en) * | 2020-08-19 | 2020-11-13 | 深圳市景旺电子股份有限公司 | Rigid-flex board and manufacturing method thereof |
| CN116546727A (en) * | 2023-05-04 | 2023-08-04 | 江西景旺精密电路有限公司 | Semi-rigid-flex product depth-control milling process capable of improving bending capability and depth-control precision |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108617113A (en) * | 2018-06-13 | 2018-10-02 | 深圳崇达多层线路板有限公司 | A kind of PP adds the method for Protection glue band making Rigid Flex |
| CN108990317A (en) * | 2018-07-13 | 2018-12-11 | 深圳崇达多层线路板有限公司 | A method of improving Rigid Flex level to level alignment degree |
| US20190069418A1 (en) * | 2017-08-31 | 2019-02-28 | Avary Holding (Shenzhen) Co., Limited. | Method for manufacturing rigid-flexible circuit board |
-
2019
- 2019-12-03 CN CN201911221841.4A patent/CN110933839A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20190069418A1 (en) * | 2017-08-31 | 2019-02-28 | Avary Holding (Shenzhen) Co., Limited. | Method for manufacturing rigid-flexible circuit board |
| CN108617113A (en) * | 2018-06-13 | 2018-10-02 | 深圳崇达多层线路板有限公司 | A kind of PP adds the method for Protection glue band making Rigid Flex |
| CN108990317A (en) * | 2018-07-13 | 2018-12-11 | 深圳崇达多层线路板有限公司 | A method of improving Rigid Flex level to level alignment degree |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111935921A (en) * | 2020-08-19 | 2020-11-13 | 深圳市景旺电子股份有限公司 | Rigid-flex board and manufacturing method thereof |
| CN116546727A (en) * | 2023-05-04 | 2023-08-04 | 江西景旺精密电路有限公司 | Semi-rigid-flex product depth-control milling process capable of improving bending capability and depth-control precision |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102946693B (en) | Step circuit board with gold-masking copper-plating hybrid surface process and manufacture method thereof | |
| CN109195326B (en) | Manufacturing method of flexible circuit board for wireless charging of mobile phone | |
| CN103068185A (en) | Manufacturing method of printed circuit board soft-hard combination substrate flexible area | |
| CN110933839A (en) | Method for opening cover by mechanically forming soft and hard plates | |
| CN104768335A (en) | Manufacturing method of flexible-rigid board | |
| CN104394665B (en) | The preparation method of ultra-thin printed substrate and ultra-thin printed substrate | |
| CN105163526A (en) | Manufacturing method of stepped grooves, and printed circuit board comprising stepped grooves | |
| CN106973526A (en) | A kind of PCB preparation method and PCB | |
| CN112654178B (en) | Process method of embedded pad type rigid-flex printed circuit board | |
| JP4760506B2 (en) | Manufacturing method of double-sided wiring board | |
| WO2022170953A1 (en) | Circuit board and manufacturing method therefor | |
| CN112384009A (en) | Manufacturing method of embedded cavity and PCB | |
| CN114189997A (en) | Method for opening cover of soft and hard board | |
| CN115484758A (en) | Manufacturing method of extra-thick copper PCB of new energy charging bus | |
| CN112752441B (en) | Manufacturing method of rigid-flexible board with inner layer slotted holes | |
| CN112888171B (en) | Method and device for processing blind slot of multilayer printed board | |
| CN112261800A (en) | Manufacturing method of high-heat-dissipation PCB | |
| CN103338599B (en) | A kind of Rigid Flex processing technology | |
| CN116614943A (en) | PCB and Z-direction interconnection method thereof | |
| CN109104824A (en) | A kind of production method of rigid-flexible combined circuit plate | |
| CN1665376A (en) | Production process of high precision silver slurry perforated multilayer carbon membrane surface mounting board | |
| CN214589237U (en) | FPC antenna and electroplating forming die | |
| CN111132475B (en) | Buried hole manufacturing method | |
| CN114885524A (en) | Manufacturing method of dense copper slurry hole circuit board and circuit board | |
| CN110505749B (en) | Structure for improving poor open circuit gap of FPC with Air-gap |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20200327 |
|
| WD01 | Invention patent application deemed withdrawn after publication |