CN114885524A - Manufacturing method of dense copper slurry hole circuit board and circuit board - Google Patents
Manufacturing method of dense copper slurry hole circuit board and circuit board Download PDFInfo
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- CN114885524A CN114885524A CN202210510655.8A CN202210510655A CN114885524A CN 114885524 A CN114885524 A CN 114885524A CN 202210510655 A CN202210510655 A CN 202210510655A CN 114885524 A CN114885524 A CN 114885524A
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- copper
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 124
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 120
- 239000010949 copper Substances 0.000 title claims abstract description 120
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 75
- 239000002002 slurry Substances 0.000 title abstract description 3
- 238000005553 drilling Methods 0.000 claims abstract description 29
- 238000000034 method Methods 0.000 claims abstract description 27
- 229910052782 aluminium Inorganic materials 0.000 claims description 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 15
- 238000007650 screen-printing Methods 0.000 claims description 10
- 238000003825 pressing Methods 0.000 claims description 6
- 239000011159 matrix material Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 2
- 230000007547 defect Effects 0.000 abstract description 7
- 238000005516 engineering process Methods 0.000 abstract description 7
- 238000004880 explosion Methods 0.000 abstract description 7
- 239000003292 glue Substances 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 abstract description 5
- 230000032798 delamination Effects 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 description 19
- 238000013461 design Methods 0.000 description 13
- 238000009713 electroplating Methods 0.000 description 10
- 238000000151 deposition Methods 0.000 description 8
- 238000005530 etching Methods 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000006087 Brown hydroboration reaction Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention relates to the technical field of circuit boards, and discloses a method for manufacturing a dense copper paste hole circuit board and the circuit board. The manufacturing method of the dense copper paste hole circuit board comprises the following steps: manufacturing a plurality of first metalized through holes on the inner daughter board and filling copper paste into the first metalized through holes to form a plurality of first plug holes; manufacturing a production board by using the inner-layer sub-board, drilling blind holes in the corresponding positions of the first plug holes on the production board respectively, and communicating the bottoms of the blind holes with the corresponding first plug holes; manufacturing a plurality of second metalized through holes on the production board, and filling copper in the blind holes; and filling copper paste into each second metalized through hole respectively to form a plurality of second plug holes which are alternately distributed with the first plug holes, wherein the target area is a copper block embedding area. The embodiment of the invention overcomes the problems of insufficient bonding force between the copper block and the substrate, poor heat resistance, difficult removal of glue overflow, low product percent of pass and the like in the existing copper block embedding/embedding technology, and also systematically solves the defects of hole wall copper fracture, plate explosion, delamination, short circuit and the like in dense hole copper slurry hole plugging.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a method for manufacturing a dense copper paste hole circuit board and the circuit board.
Background
Based on the development of the fields of new-generation information technology, energy-saving and new-energy automobiles, electric equipment and the like, the problem of heat dissipation is urgently solved, and particularly, the new-generation PCB focuses on the fields of 5G communication, automotive electronics, smart phones and the like, so that the PCB has high-frequency and high-speed characteristics and high heat conduction characteristics.
At present, there are many ways to solve the heat dissipation problem of the PCB, such as dense heat dissipation hole design, embedded copper block design, copper-based boss design, thick copper foil circuit, metal-based (core) plate structure, high heat conduction material, etc.
The direct embedding of the copper block in the PCB is one of effective ways for solving the problem of heat dissipation, but the existing manufacturing process has the problems of insufficient bonding force between the copper block and the substrate, poor heat resistance, difficult removal of overflow glue, low product yield and the like, and limits the application and popularization of the technical result of the PCB with the embedded copper block.
Dense heat dissipation hole design is another effective way to solve the heat dissipation problem, and is designed to be applied to the PCB. In the prior art, a conventional method for manufacturing metallized through holes is adopted to manufacture the dense heat dissipation holes: after the circuit board is manufactured by laminating and pressing, a plurality of closely adjacent through holes for realizing the heat dissipation function are drilled in sequence in the designated area of the circuit board. However, due to the fact that the space between the dense radiating holes is small, when reflow soldering is carried out on the PCB, the dense radiating holes are prone to layering, and the problems of board explosion, layering and the like of the PCB occur.
The copper paste plugging technology has excellent heat dissipation performance and can supply excessive current, so that the copper paste plugging technology is widely applied to the combination with the design of dense heat dissipation holes in recent years, namely, the copper paste is plugged into each heat dissipation hole. However, the heat dissipation holes and the signal via holes are through holes penetrating through the circuit board and are close to each other, so that the uncured copper paste in the heat dissipation holes often flows to the signal via holes, and a signal short circuit is caused.
Disclosure of Invention
The invention aims to provide a method for manufacturing a dense copper paste hole circuit board and the circuit board, which replace the conventional copper block embedding operation so as to overcome the problems of insufficient bonding force between a copper block and a substrate, poor heat resistance, difficulty in removing overflow glue, low product percent of pass and the like in the prior art, and simultaneously systematically solve the defects of hole wall copper fracture, board explosion, delamination, short circuit and the like in dense copper paste hole plugging.
In order to achieve the purpose, the invention adopts the following technical scheme:
a manufacturing method of a dense copper paste hole circuit board is used for replacing a buried/embedded copper block and comprises the following steps:
providing an inner layer sub-board, manufacturing a plurality of first metalized through holes on the inner layer sub-board, and respectively filling copper paste into each first metalized through hole to form a plurality of first plug holes;
manufacturing a production board by applying the inner-layer sub-board laminated board in a pressing mode, drilling blind holes in the corresponding positions of the first plug holes on the production board respectively, and communicating the bottom of each blind hole with the corresponding first plug hole;
manufacturing a plurality of second metalized through holes on the production board, and filling copper in the blind holes;
filling copper paste into each second metalized through hole to form a plurality of second plug holes;
the first plug holes and the second plug holes are alternately distributed in a target area of the production plate to form dense holes, and the target area is a to-be-buried/embedded copper block area.
Optionally, the aperture of each first plug hole is 0.2-0.4 mm, and the horizontal distance between every two adjacent first plug holes is 1.2-5 mm.
Optionally, the aperture of the blind hole is not smaller than the aperture of the first plug hole.
Optionally, the aperture of each second plug hole is smaller than or equal to 0.6mm, and the horizontal distance between every two adjacent second plug holes is 1.2-5 mm.
Optionally, the first plug holes and the second plug holes are uniformly arranged in a matrix, the aperture of the first plug hole is 0.2mm, the aperture of the second plug hole is 0.4mm, and the horizontal distance between two adjacent first plug holes and two adjacent second plug holes is 2.0 mm.
Optionally, the manufacturing method further includes:
manufacturing a signal through hole outside a target area of the production board;
the minimum horizontal distance between the second plug hole and the signal via hole is larger than the minimum horizontal distance between the first plug hole and the signal via hole.
Optionally, the method for obtaining the first plug hole after the first metalized through hole is plugged with the copper paste, and obtaining the second plug hole after the second metalized through hole is plugged with the copper paste includes:
providing an aluminum sheet, drilling holes corresponding to the first metalized through hole/the second metalized through hole on the aluminum sheet, and bonding the aluminum sheet with a screen frame to form an aluminum screen printing plate;
placing the aluminum screen printing plate on the inner daughter board/the production board, providing copper paste, and plugging the copper paste into the first metalized through hole/the second metalized through hole by a scraper by adopting a screen printing method to obtain a first plug hole/a second plug hole;
and baking and pre-curing the first plug hole/the second plug hole, and then heating to completely cure the copper paste in the first plug hole/the second plug hole.
A circuit board is manufactured by adopting the manufacturing method of the dense copper paste hole circuit board.
Compared with the prior art, the invention has the beneficial effects that:
(1) the embodiment of the invention adopts the dense hole design formed by alternately distributing the first plug holes and the second plug holes, realizes the functions of heat dissipation and overlarge current, can be used for replacing the conventional copper block embedding/embedding scheme, and effectively solves the problems of insufficient bonding force between the copper block and the substrate, poor heat resistance, difficult removal of overflow glue, low product percent of pass and the like in the conventional copper block embedding/embedding scheme.
(2) In the embodiment, the first plug holes and the second plug holes are distributed in an alternating mode, and the first plug holes and the second plug holes are in different manufacturing procedures, so that the design distance between two adjacent through holes with the drilling serial numbers in a drilling process can be larger than that between two adjacent through holes with the drilling serial numbers in the existing dense hole manufacturing scheme, and the probability of poor phenomena such as hole wall copper fracture, plate explosion, layering and the like is effectively reduced.
(3) The embodiment of the invention adopts a heat dissipation hole manufacturing method that 'first plug holes filled with copper paste are manufactured on an inner-layer daughter board, then the inner-layer daughter board is pressed with other core boards, blind holes are drilled at two ends of the first plug holes, and finally the blind holes are filled with copper in a copper deposition electroplating way'; on the other hand, the first plug holes filled with the copper paste are located in the inner layer, and the internal copper paste is solidified before the inner-layer sub-board is pressed with other core boards, so that the solidified copper paste cannot flow to the surrounding signal through holes through the blind holes, the signal short circuit phenomenon is avoided, and the product quality is effectively improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a flowchart of a method for manufacturing a dense copper paste plug hole circuit board according to a first embodiment of the present invention;
fig. 2 is a schematic cross-sectional view of a dense copper paste plug hole circuit board according to a first embodiment of the present invention;
fig. 3 is a schematic top view of a dense copper paste via hole circuit board according to an embodiment of the invention;
reference numerals: the device comprises a first plug hole 1, a blind hole 2, a second plug hole 3 and a signal via hole 4.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
The embodiment of the invention provides a method for manufacturing a dense copper paste hole plugging circuit board, which replaces the conventional copper block embedding/embedding operation, solves the problems of insufficient bonding force between a copper block and a substrate, poor heat resistance, difficulty in removing glue overflow, low product percent of pass and the like in the conventional copper block embedding/embedding technology, and systematically solves the defects of hole wall copper fracture, plate explosion, layering, short circuit and the like in dense hole copper paste hole plugging.
Referring to fig. 1, a method for manufacturing a dense copper paste via hole circuit board according to an embodiment of the present invention includes:
And 102, laminating the inner daughter board and other parts in sequence, and then pressing to form a production board, drilling blind holes 2 at corresponding positions of the first plug holes 1 on the production board by adopting a laser drilling mode, and then drilling through holes on the production board to form a plurality of second through holes and other through holes, wherein each second through hole is positioned in a target area and penetrates through the production board.
And 103, filling the blind holes 2 through copper deposition and electroplating processes in sequence, and metalizing the second through holes and other through holes to obtain a plurality of second metalized through holes and signal through holes 4.
It should be noted that "filling" in this step means that the concavity of the blind hole 2 meets a certain manufacturing requirement to ensure that the surface of the production board is substantially flat, and hundreds of absolute flatness is not required.
And 104, finishing copper paste hole plugging in each second metalized through hole by adopting a screen printing method to obtain a plurality of second hole plugging 3, wherein the first hole plugging 1 and the second hole plugging 3 are alternately distributed in a target area of the production plate to form dense holes.
In this embodiment, the dense holes formed by the first plug hole 1 and the second plug hole 3 plugged with copper paste can not only achieve a good heat dissipation function, but also achieve an excessive current, so that a conventional copper block embedding/embedding scheme can be replaced, and various defects existing in the conventional copper block embedding/embedding scheme can be overcome.
In the prior art, the method for manufacturing the dense holes comprises the following steps: closely adjacent through holes are drilled in a target area in sequence, but because the space between the dense heat dissipation holes is small, when reflow soldering is carried out on the PCB, the dense heat dissipation holes are easily layered, so that the problems of board explosion, layering and the like of the PCB occur.
However, in this embodiment, the first plug holes 1 and the second plug holes 3 are distributed in an alternating manner, and the first plug holes 1 and the second plug holes 3 are in different manufacturing processes (first drilling the first through holes on the inner-layer daughter board to obtain the first plug holes 1, then laminating the inner-layer daughter board with other stacked boards, and then drilling the second through holes on the production board to obtain the second plug holes 3), so even if an intensive design scheme is adopted, the design distance between two adjacent through holes (the horizontal distance between two adjacent first through holes, or the horizontal distance between two adjacent second through holes) in the drilling procedure is greater than the design distance between two adjacent through holes in the drilling procedure in the existing scheme, thereby effectively reducing the occurrence probability of undesirable phenomena such as copper fracture, board explosion, layering, and the like.
Meanwhile, different from the conventional copper paste plug hole manufacturing method, the production board is manufactured by pressing each core board/sub board, then the copper paste is filled into the through hole after the through hole is drilled on the production board, the embodiment of the invention adopts the steps of firstly manufacturing a first plug hole 1 filled with the copper paste on the inner sub board, then pressing the inner sub board and other core boards, then drilling blind holes 2 at two ends of the first plug hole 1, and finally filling the blind holes 2 with the copper in a copper-deposition electroplating mode. On one hand, because two ends of the first plug hole 1 filled with copper paste are communicated with the blind hole 2, the basic heat dissipation function and the overlarge current function can be ensured; on the other hand, because the first plug holes 1 filled with the copper paste are positioned in the inner layer, and before the inner-layer sub-board is pressed with other core boards, the internal copper paste is solidified, and the blind holes are filled with copper, the solidified copper paste cannot flow to the surrounding signal via holes 4 through the blind holes 2, so that the signal short circuit phenomenon is avoided, and the product quality is effectively improved.
Preferably, the aperture of the first plug hole 1 is 0.2-0.4 mm, the horizontal distance between two adjacent first plug holes 1 is 1.2-5 mm, and the aperture of the blind hole 2 is not smaller than that of the first plug hole 1; the aperture of the second plug hole 3 is less than or equal to 0.6mm, and the horizontal distance between two adjacent second plug holes 3 is 1.2-5 mm.
Under the condition that the dense holes are composed of the first plug holes 1 and the second plug holes 3, in order to prevent the copper paste in the second plug holes 3 from flowing to the nearby signal via holes 4, the arrangement mode of the first plug holes 1 and the second plug holes 3 in the target area can be further optimized, so that the minimum horizontal distance between the second plug holes 3 and the signal via holes 4 is greater than the minimum horizontal distance between the first plug holes 1 and the signal via holes 4, namely, the adjacent first plug holes 1 are distributed at the positions relatively close to the signal via holes 4, and the adjacent second plug holes 3 are distributed at the positions relatively far from the signal via holes 4.
For ease of understanding, referring to fig. 2 and 3, an example application will be provided, including:
(1) cutting: the core board is cut according to the size of the jointed board of 520mm multiplied by 620mm, the thickness of the core board is 1.5mm, and the thickness of the copper layers on the two surfaces of the core board is 1 oz.
(2) Mechanically drilling a first hole: according to the existing drilling technology, a target position hole is used as a positioning hole, and first through holes which are to be filled with copper paste and are distributed in a matrix mode are drilled on an inner layer daughter board according to design requirements. Wherein, the aperture of the first through hole is 0.2mm, and the horizontal distance between two adjacent first through holes is 2.0 mm.
(3) Depositing copper I: and depositing a layer of thin copper on the plate surface of the inner-layer daughter board and the wall of the first through hole by using a chemical copper plating method, and performing backlight test on the level 10.
(4) Electroplating a whole plate: and thickening the thickness of the hole copper of the first through hole and the thickness of the plate surface copper layer to obtain a first metalized through hole.
(5) Plugging a first hole with copper paste: and filling copper paste in the first metalized through hole and curing to obtain a first plug hole 1, and removing resin protruding out of the board surface through a ceramic grinding board to level the board surface and avoid the influence of copper paste residue on the board surface on the electrical conductivity.
(6) Inner layer circuit manufacturing (negative film process): transferring the inner layer pattern, coating a photosensitive film by using a vertical coating machine, completing the exposure of the inner layer circuit by using a full-automatic exposure machine, and forming the inner layer circuit pattern after development; etching the inner layer, etching the exposed and developed core board to form an inner layer circuit, wherein the minimum line width and line distance is 0.130/0.205 mm; and (4) inner layer AOI, and then, detecting defects of an inner layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, and performing defect scrapping treatment, wherein a defect-free product is discharged to the next flow.
(7) And (3) laminating: the brown oxidation speed is that brown oxidation is carried out according to the thickness of the bottom copper, the inner layer sub-board, the prepreg and the outer layer copper foil are sequentially overlapped according to requirements, and then the laminated board is pressed by selecting proper lamination conditions according to the Tg of the board material to form a production board; the specific stacking sequence is as follows: outer copper foil, prepreg, inner daughter board, prepreg and outer copper foil.
(8) Drilling out a target; and scraping the inner layer target out by using laser to serve as a positioning target for laser drilling.
(9) Laser brown oxidation: the production plate is subjected to laser browning treatment, and the copper surface formed after the laser browning treatment has an even honeycomb structure, so that the laser energy can be absorbed, and the laser drilling at the later stage is facilitated.
(10) Laser drilling: and drilling a blind hole 2 at a position corresponding to the first plug hole 1 on the circuit production board by using the secondary inner layer target as a positioning target and according to design requirements in a laser drilling mode, wherein the bottom of the blind hole 2 is the surface of the inner layer copper paste plug hole.
(11) Mechanically drilling a hole: according to the existing mechanical drilling technology, outer layer mechanical drilling processing is carried out on the production plate according to design requirements, and second through holes and other through holes distributed in a matrix are drilled. The aperture of the second through hole is 0.4mm, and the horizontal distance between two adjacent second through holes is 2.0 mm.
(12) And (2) copper deposition: and depositing a layer of thin copper on the plate surface and the hole wall by using a chemical copper plating method, and performing backlight test on 10 grades.
(13) Hole filling and electroplating: the blind holes 2 are filled through a hole-filling electroplating process.
(14) Electroplating the whole plate II: the thickness of the hole copper and the plate surface copper layer is increased.
(15) Manufacturing an outer layer circuit: transferring an outer layer pattern, completing outer layer circuit exposure by adopting a full-automatic exposure machine and a circuit film, and forming an outer layer circuit pattern on a production board through development; electroplating an outer layer pattern, then plating tin on the production plate, and setting electroplating parameters according to the required copper thickness; then sequentially removing the film, etching and removing tin, and etching an outer layer circuit on the production board, wherein the width line distance of the outer layer circuit is 0.254/0.254 mm; and the outer layer AOI detects whether the outer layer circuit has the defects of open circuit, gap, incomplete etching, short circuit and the like by using an automatic optical detection system.
(16) Printing solder resist: windowing at a target position to be processed during printing to enable a base material at the target position to be exposed;
(17) and (2) plugging a hole with copper paste: and plugging the second metalized through hole by adopting a screen printing method to obtain a second plug hole 3.
The first copper paste plug hole and the second copper paste plug hole can be realized by the following method:
providing an aluminum sheet, drilling holes corresponding to the first metalized through hole/the second metalized through hole on the aluminum sheet, and bonding the aluminum sheet with the screen frame to form an aluminum screen plate;
placing an aluminum screen printing plate on the inner daughter board/production board, providing copper paste, and plugging the copper paste into the first metalized through hole/the second metalized through hole by a scraper by adopting a screen printing method to obtain a first plug hole 1/a second plug hole 3;
the first plug hole 1/the second plug hole 3 are baked and pre-cured, and then the temperature is raised to completely cure the copper paste in the first plug hole 1/the second plug hole 3.
Example two
The embodiment of the invention provides a circuit board which is manufactured by the manufacturing method of the dense copper paste hole plugging circuit board.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (8)
1. A manufacturing method of a dense copper paste hole circuit board is used for replacing a buried/embedded copper block, and is characterized by comprising the following steps:
providing an inner layer sub-board, manufacturing a plurality of first metalized through holes on the inner layer sub-board, and respectively filling copper paste into each first metalized through hole to form a plurality of first plug holes;
manufacturing a production board by applying the inner-layer sub-board laminated board in a pressing mode, drilling blind holes in the corresponding positions of the first plug holes on the production board respectively, and communicating the bottom of each blind hole with the corresponding first plug hole;
manufacturing a plurality of second metalized through holes on the production board, and filling copper in the blind holes;
filling copper paste into each second metalized through hole to form a plurality of second plug holes;
the first plug holes and the second plug holes are alternately distributed in a target area of the production plate to form dense holes, and the target area is a to-be-buried/embedded copper block area.
2. The method for manufacturing the dense copper paste hole circuit board according to claim 1, wherein the diameter of the first plug hole is 0.2-0.4 mm, and the horizontal distance between two adjacent first plug holes is 1.2-5 mm.
3. The method according to claim 2, wherein the diameter of the blind hole is not smaller than the diameter of the first plug hole.
4. The method for manufacturing the dense copper paste hole circuit board according to claim 1, wherein the diameter of the second plug hole is less than or equal to 0.6mm, and the horizontal distance between two adjacent second plug holes is 1.2-5 mm.
5. The method for manufacturing the dense copper paste hole circuit board according to claim 1, wherein the first plug holes and the second plug holes are uniformly arranged in a matrix, the aperture of each first plug hole is 0.2mm, the aperture of each second plug hole is 0.4mm, and the horizontal distance between each two adjacent first plug holes and each two adjacent second plug holes is 2.0 mm.
6. The method of fabricating a dense cu via circuit board of claim 1, further comprising:
manufacturing signal via holes outside the target area of the production board;
the minimum horizontal distance between the second plug hole and the signal via hole is larger than the minimum horizontal distance between the first plug hole and the signal via hole.
7. The method of claim 1, wherein the step of plugging the first metalized through holes with copper paste to form first plug holes and the step of plugging the second metalized through holes with copper paste to form second plug holes comprises:
providing an aluminum sheet, drilling holes corresponding to the first metalized through hole/the second metalized through hole on the aluminum sheet, and bonding the aluminum sheet with a screen frame to form an aluminum screen printing plate;
placing the aluminum screen printing plate on the inner daughter board/the production board, providing copper paste, and plugging the copper paste into the first metalized through hole/the second metalized through hole by a scraper by adopting a screen printing method to obtain a first plug hole/a second plug hole;
and baking and pre-curing the first plug hole/the second plug hole, and then heating to completely cure the copper paste in the first plug hole/the second plug hole.
8. A wiring board produced by the method for producing a dense copper paste via wiring board according to any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210510655.8A CN114885524B (en) | 2022-05-11 | 2022-05-11 | Manufacturing method of dense copper paste hole circuit board and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210510655.8A CN114885524B (en) | 2022-05-11 | 2022-05-11 | Manufacturing method of dense copper paste hole circuit board and circuit board |
Publications (2)
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Cited By (1)
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| CN115551234A (en) * | 2022-09-29 | 2022-12-30 | 高德(江苏)电子科技股份有限公司 | Preparation method of ultrathin high-heat-dissipation circuit board |
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| CN114885524B (en) | 2024-05-07 |
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