CN115551234A - Preparation method of ultrathin high-heat-dissipation circuit board - Google Patents
Preparation method of ultrathin high-heat-dissipation circuit board Download PDFInfo
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- CN115551234A CN115551234A CN202211203901.1A CN202211203901A CN115551234A CN 115551234 A CN115551234 A CN 115551234A CN 202211203901 A CN202211203901 A CN 202211203901A CN 115551234 A CN115551234 A CN 115551234A
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- heat dissipation
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- 238000002360 preparation method Methods 0.000 title claims abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical class [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 221
- 239000011889 copper foil Substances 0.000 claims abstract description 109
- 229910052802 copper Inorganic materials 0.000 claims abstract description 69
- 239000010949 copper Substances 0.000 claims abstract description 69
- 230000017525 heat dissipation Effects 0.000 claims abstract description 47
- 238000004519 manufacturing process Methods 0.000 claims abstract description 34
- 238000000034 method Methods 0.000 claims abstract description 25
- 238000005530 etching Methods 0.000 claims abstract description 22
- 238000009713 electroplating Methods 0.000 claims abstract description 21
- 238000003825 pressing Methods 0.000 claims abstract description 13
- 229910000679 solder Inorganic materials 0.000 claims abstract description 12
- 238000005553 drilling Methods 0.000 claims abstract description 11
- 238000000465 moulding Methods 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims description 14
- 238000007639 printing Methods 0.000 claims description 6
- 230000002265 prevention Effects 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 7
- 230000007547 defect Effects 0.000 abstract description 4
- 239000000047 product Substances 0.000 description 34
- 238000003801 milling Methods 0.000 description 12
- 239000000976 ink Substances 0.000 description 9
- 238000013461 design Methods 0.000 description 8
- 235000012431 wafers Nutrition 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 229910003460 diamond Inorganic materials 0.000 description 4
- 239000010432 diamond Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 3
- 238000006087 Brown hydroboration reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
Abstract
The invention provides a preparation method of an ultrathin high-heat-dissipation circuit board, which comprises the following steps: s1, providing a basic inner core board, fishing out the heat dissipation position of the basic inner core board to form a blind fishing groove, filling the blind fishing groove, sequentially arranging a first prepreg and a first laminated copper foil on the upper surface of a first copper foil from bottom to top, and sequentially arranging a second prepreg and a second laminated copper foil on the lower surface of a second copper foil from top to bottom to form a laminated circuit board; s2, pressing the laminated circuit board into a printed circuit board sample wafer; s3, laser drilling blind holes on the printed circuit board sample wafer → hole filling electroplating → circuit etching → solder resist ink → molding, and fishing out the appearance of the product to obtain a finished product. Compared with a circuit board produced by a laser stacking mode, the ultrathin high-heat-dissipation circuit board has the advantages that the heat dissipation effect is better, the heat dissipation effect is close to that of a copper block embedding process, the defects of a heat dissipation product produced by the copper block embedding process can be completely overcome, the production cost is low, the production process is simple, and the product can be guaranteed to have better flexibility in production and assembly.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a preparation method of an ultrathin high-heat-dissipation circuit board.
Background
At present, along with the continuous development of the science and technology level, the product is more and more frivolous, lightweight and miniaturization are more and more common, the assembly space of the terminal product for the circuit board is less and less, many products are in order to save space, the mainboard is in the multilayer stack design, the board thickness and the heat dissipation of the circuit have higher requirements, because high temperature can make the aging speed of electronic components accelerate, influence the service life of equipment, and the smooth stability in the equipment operation, and the multilayer circuit board stack design can aggravate the calorific capacity in the product operation, the urgent need of the firm market invents an ultra-thin high heat dissipation circuit board, the production of the existing heat dissipation circuit board has the following two processes:
1. adopt radium-shine mode of piling up to produce, this mode production technology is convenient, can satisfy the radiating requirement of part low end, generally for cell-phone board individual layer mainboard design, does not have so high demand to the heat dissipation requirement, has sufficient space in the product design to increase other heat conduction materials.
2. The process is actually generally used for manufacturing products such as ultra-high heat dissipation optical modules, car lamps and the like, and has better heat dissipation effect, but the process has the defects of complex production process, high cost, product thickness limitation and the like, so that the limitation on product types is too large, each product needs to correspondingly customize corresponding copper blocks, the product is fished out corresponding to heat dissipation positions in the production process, the customized copper blocks need to be subjected to brown oxidation pretreatment, and the customized copper blocks are placed in corresponding fished-out areas, so that the heat dissipation areas are more, the copper blocks need to be placed in 200-300 areas when one large plate is produced, the production is extremely slow and complex, the product thickness is limited highly, the product can only be subjected to thickness of 1.0mm at the thinnest, the copper blocks can only be 0.8mm at the thinnest, the copper blocks can be too thin when the brown oxidation pretreatment is performed, and the copper blocks can not be bent at high temperature and pressure, and can not be deformed.
Disclosure of Invention
The invention aims to overcome and supplement the defects in the prior art, and provides a preparation method of an ultrathin high-heat-dissipation circuit board, which can further reduce and lighten equipment on the existing basis or meet the heat dissipation requirement in the stacking design of circuit boards under the condition of ensuring that all functions of the circuit board are not subtracted, can reduce the space occupied by the circuit boards, has more space to improve the functions of products and further increases the competitiveness of the products. The technical scheme adopted by the invention is as follows:
a preparation method of an ultrathin high-heat-dissipation circuit board comprises the following steps: the method comprises the following steps:
s1, providing a basic inner core board, wherein the basic inner core board comprises a first copper foil, a basic substrate and a second copper foil which are sequentially arranged from top to bottom, fishing out the heat dissipation position of the basic inner core board to form a blind fishing groove, and printing copper paste to fill the blind fishing groove, then sequentially arranging a first prepreg and a first pressed copper foil on the upper surface of the first copper foil from bottom to top, and sequentially arranging a second prepreg and a second pressed copper foil on the lower surface of the second copper foil from top to bottom to form a laminated circuit board;
s2, pressing the laminated circuit board into a printed circuit board sample wafer through a pressing forming machine;
and S3, performing laser drilling of blind holes on the laminated printed circuit board sample wafer → hole filling electroplating → circuit etching → solder mask ink → molding, wherein a high-precision numerical control milling machine is used for molding, the service life of a diamond milling cutter of the high-precision numerical control milling machine is adjusted to 1m, and the appearance of the product is fished out to obtain a finished product.
Preferably, the method for manufacturing the ultra-thin high heat dissipation circuit board comprises the following steps: the laser drilling of the blind hole in the step S3 specifically comprises the following steps: the laser drill penetrates through the first press-fit copper foil and the first prepreg and is connected to the copper paste to form a first laser blind hole, the laser drill penetrates through the second press-fit copper foil and the second prepreg and is connected to the copper paste to form a second laser blind hole, and the first laser blind hole corresponds to the second laser blind hole in position.
Preferably, the method for manufacturing the ultra-thin high heat dissipation circuit board comprises the following steps: the hole filling electroplating in the step S3 specifically comprises the following steps: the first laser blind hole conducts the first press-fit copper foil and the copper paste in an electroplating mode, the first laser blind hole is filled with electroplated copper, the second laser blind hole conducts the second press-fit copper foil and the copper paste in an electroplating mode, and the second laser blind hole is filled with the electroplated copper.
Preferably, the method for manufacturing the ultra-thin high heat dissipation circuit board comprises the following steps: and the first laser blind hole and the second laser blind hole are filled with electroplated copper to connect the copper paste with the contact area of the external zero device.
The copper paste is printed with corresponding volume at the position needing heat dissipation in a silk screen printing mode, and the contact area of the copper paste and an external part is connected in a laser blind hole copper filling mode, so that the heat dissipation effect on the part is achieved.
Preferably, the method for manufacturing the ultra-thin high heat dissipation circuit board comprises the following steps: the line etching in step S3 specifically includes: and transferring the first laminated copper foil and the second laminated copper foil through patterns, and then biting the unnecessary copper through an etching solution to keep a conducting circuit.
Preferably, the method for manufacturing the ultra-thin high heat dissipation circuit board comprises the following steps: the welding prevention in the step S3 specifically comprises the following steps: solder mask ink is printed on the surface of the circuit board after circuit etching, so that the effect of protecting the etched circuit is achieved.
Preferably, the method for manufacturing the ultra-thin high heat dissipation circuit board comprises the following steps: and blindly fishing the basic inner core board from the first copper foil surface corresponding to the heat dissipation position to the second copper foil to form a blindly fishing groove, and silk-screening copper paste from the first copper foil surface blindly fishing position to fill the blindly fishing groove.
Preferably, the method for manufacturing the ultra-thin high heat dissipation circuit board comprises the following steps: the foundation core board further comprises at least one layer of third prepreg, at least one layer of third press-fit copper foil, at least one layer of fourth prepreg and at least one layer of fourth press-fit copper foil, the third prepreg and the third press-fit copper foil are sequentially and alternately arranged on the upper surface of the first copper foil from bottom to top, the fourth prepreg and the fourth press-fit copper foil are sequentially and alternately arranged on the lower surface of the second copper foil from top to bottom, and the first copper foil, the foundation substrate, the second copper foil, the at least one layer of third prepreg, the at least one layer of third press-fit copper foil, the at least one layer of fourth prepreg and the at least one layer of fourth press-fit copper foil are pressed together through a press-fit press.
Preferably, the method for manufacturing the ultra-thin high heat dissipation circuit board comprises the following steps: and blindly fishing the basic inner core board from the position, corresponding to the heat dissipation position, of the third laminated copper foil surface to the fourth laminated copper foil to form a blindly fishing groove, and filling the blindly fishing groove with silk-screen copper paste from the blindly fishing position of the third laminated copper foil surface.
The invention has the advantages that:
(1) The ultrathin high-heat-dissipation circuit board can meet the requirement of heat dissipation of the plate of an ultrathin product at present, can be used for manufacturing circuit boards with four layers of 0.3mm, six layers of 0.35mm, eight layers of 0.4mm, ten layers of 0.5mm and twelve layers of 0.6mm in the prior art, and does not need to customize materials and excessive manual operation.
(2) Compared with a circuit board produced by a laser stacking mode, the ultrathin high-heat-dissipation circuit board has the advantages that the heat dissipation effect is better, the heat dissipation effect is close to that of a copper block embedding process, the defects of a heat dissipation product produced by the copper block embedding process can be completely overcome, the ultrathin high-heat-dissipation circuit board has the characteristics of lower production cost, simplicity and convenience in production process, customization of heat dissipation materials and unlimited products, and better flexibility in production and assembly of the product can be guaranteed, so that the approval degree of a factory is increased.
Drawings
Fig. 1 is a schematic structural diagram of a basic core board in embodiment 1 of the present invention.
Fig. 2 is a schematic structural diagram of a blind dredging groove formed by dredging out a base substrate in embodiment 1 of the present invention.
Fig. 3 is a schematic structural diagram of the basic core board blind fishing groove filling in embodiment 1 of the invention.
Fig. 4 is a schematic structural diagram of a printed circuit board sample in embodiment 1 of the present invention.
Fig. 5 is a schematic structural diagram of fabricating laser blind vias in corresponding copper paste regions in embodiment 1 of the present invention.
Fig. 6 is a schematic structural diagram of a finished product in embodiment 1 of the present invention.
Detailed Description
The present invention will be further described with reference to the following specific examples.
Example 1
The design standard of the ultrathin high-heat-dissipation circuit board product comprises the following steps:
s1, as shown in figures 1-3, providing a basic inner core board, wherein a basic substrate 4, a first copper foil 3 and a second copper foil 5 are 2 layers of basic inner core boards, the basic inner core board is fished from a position, corresponding to a heat dissipation position, of the first copper foil 3 to the second copper foil 5 in a blind mode, the basic substrate 4 is fished out to form a blind fished groove 8, the basic inner core board is filled with the blind fished groove 8 through silk-screen copper paste from the blind fished position of the first copper foil 3, the upper surface of the first copper foil 3 is connected with a first prepreg 2, the lower surface of the second copper foil 5 is connected with a second prepreg 6, the upper surface of the first prepreg 2 is connected with a first laminated copper foil 1, and the lower surface of the second prepreg 6 is connected with a second laminated copper foil 7, so that a laminated circuit board sequentially comprises the first laminated copper foil 1, the first prepreg 2, the first copper foil 3, the basic substrate 4, the second copper foil 5, the second prepreg 6 and the second laminated copper foil 7 from top to bottom;
s2, as shown in figure 4, pressing the laminated circuit board into a 4-layer printed circuit board sample wafer by a pressing forming machine;
s3, as shown in the figures 5-6, the pressed printed circuit board sample wafer is subjected to laser drilling blind holes → hole filling electroplating → circuit etching → solder mask ink → forming, a high-precision numerical control milling machine is used for forming, the service life of the diamond milling cutter of the high-precision numerical control milling machine is adjusted to 1m, and the shape of the product is fished out to obtain a finished product.
The laser drilling of the blind hole in the step S3 specifically comprises the following steps: and a laser drill penetrates through the first laminated copper foil 1 and the first prepreg 2 to be connected to the copper paste to form a first laser blind hole 9, the laser drill penetrates through the second laminated copper foil 7 and the second prepreg 6 to be connected to the copper paste to form a second laser blind hole 10, and the first laser blind hole 9 corresponds to the second laser blind hole 10 in position.
Wherein: the hole filling electroplating in the step S3 specifically comprises the following steps: the first laser blind hole 9 conducts the first press-fit copper foil 1 and the copper paste in an electroplating mode, the first laser blind hole 9 is filled with electroplated copper, the second laser blind hole 10 conducts the second press-fit copper foil 7 and the copper paste in an electroplating mode, and the second laser blind hole 10 is filled with the electroplated copper.
Wherein: and the first laser blind hole 9 and the second laser blind hole 10 are filled with electroplated copper to connect the copper paste with the contact area of the external device.
Wherein: the line etching in step S3 specifically includes: the first laminated copper foil 1 and the second laminated copper foil 7 are transferred by a pattern, and then unnecessary copper is bitten off by an etching solution, and a conductive circuit is reserved.
Wherein: the welding prevention in the step S3 specifically comprises the following steps: and printing solder resist ink on the surface of the circuit board after the circuit etching.
Example 2
The design standard of the ultrathin high-heat-dissipation circuit board product comprises the following steps:
s1, providing a laminated circuit board, wherein the laminated circuit board sequentially comprises a first press copper foil 1, a first semi-cured sheet 2, a third press copper foil, a third semi-cured sheet, a first copper foil 3, a base substrate 4, a second copper foil 5, a fourth semi-cured sheet, a fourth press copper foil, a second semi-cured sheet 6 and a second press copper foil 7 from top to bottom, the base substrate 4, the first copper foil 3 and the second copper foil 5 are 2 layers of base inner core boards, the 2 layers of base inner core boards are bonded with the third semi-cured sheet from the top of the outermost first copper foil 3, the third press copper foil is bonded with the upper surface of the third semi-cured sheet, the fourth copper foil is bonded with the lower surface of the second copper foil 5, and the fourth press is bonded with the lower surface of the fourth semi-cured sheet, pressing a third press-fit copper foil and a fourth press-fit copper foil together with a base substrate 4, a first copper foil 3 and a second copper foil 5 through a press-fit press to manufacture a 4-layer base core board, blindly fishing the 4-layer base core board from the third press-fit copper foil surface to the fourth press-fit copper foil at corresponding heat dissipation positions, screen-printing copper paste on the base core board from the blindly fishing position of the third press-fit copper foil surface to fill a blindly fishing groove, connecting a first prepreg 2 to the upper surface of the third press-fit copper foil, connecting a second prepreg 6 to the lower surface of the fourth press-fit copper foil, connecting a first press-fit copper foil 1 to the upper surface of the first prepreg 2, and connecting a second press-fit copper foil 7 to the lower surface of the second prepreg 6;
s2, pressing the laminated circuit board into 6 layers of printed circuit board sample wafers through a pressing forming machine;
s3, laser drilling blind holes on the pressed printed circuit board sample wafer → hole filling electroplating → circuit etching → solder mask ink → molding, wherein a high-precision numerical control milling machine is used for molding, the service life of a diamond milling cutter of the high-precision numerical control milling machine is adjusted to 1m, and the shape of the product is fished out to obtain a finished product.
The laser drilling of the blind hole in the step S3 specifically comprises the following steps: a laser drill penetrates through the first laminated copper foil 1 and the first prepreg 2 to be connected to the copper paste to form a first laser blind hole 9, the laser drill penetrates through the second laminated copper foil 7 and the second prepreg 6 to be connected to the copper paste to form a second laser blind hole 10, and the first laser blind hole 9 corresponds to the second laser blind hole 10 in position.
Wherein: the hole filling electroplating in the step S3 specifically comprises the following steps: the first laser blind hole 9 conducts the first press-fit copper foil 1 with the copper paste in an electroplating mode, the first laser blind hole 9 is filled with electroplated copper, the second laser blind hole 10 conducts the second press-fit copper foil 7 with the copper paste in an electroplating mode, and the second laser blind hole 10 is filled with the electroplated copper.
Wherein: and the first laser blind hole 9 and the second laser blind hole 10 are filled with electroplated copper to connect the copper paste with the contact area of the external device.
Wherein: the line etching in step S3 specifically includes: the first laminated copper foil 1 and the second laminated copper foil 7 are transferred by a pattern, and then unnecessary copper is bitten off by an etching solution, and a conductive circuit is reserved.
Wherein: the welding prevention in the step S3 specifically comprises the following steps: and printing solder resist ink on the surface of the circuit board after the circuit etching.
Example 3
The design standard of the ultrathin high-heat-dissipation circuit board product comprises the following steps:
s1, providing a laminated circuit board, wherein the laminated circuit board sequentially comprises a first pressed copper foil 1, a first semi-cured sheet 2, a third pressed copper foil, a third semi-cured sheet, a first copper foil 3, a base substrate 4, a second copper foil 5, a fourth semi-cured sheet, a fourth pressed copper foil, a second semi-cured sheet 6 and a second pressed copper foil 7 from top to bottom, the base substrate 4, the first copper foil 3 and the second copper foil 5 are 2 layers of base inner core boards, the 2 layers of base inner core boards are bonded with the third semi-cured sheet from the top of the first copper foil 3 on the outermost layer, the third pressed copper foil is bonded on the third semi-cured sheet, the third semi-cured sheet and the third copper foil are bonded repeatedly, and the fourth semi-cured sheet is bonded below the second copper foil 5, bonding a fourth press copper foil under a fourth prepreg, repeatedly bonding the fourth prepreg and the fourth press copper foil once, pressing the third press copper foil, the fourth press copper foil, a base substrate 4, a first copper foil 3 and a second copper foil 5 together through a press-bonding press to prepare a 6-layer base inner core board, blindly fishing the 6-layer base inner core board from the uppermost third press copper foil surface to the fourth press copper foil at a corresponding heat dissipation position, carrying out screen printing on copper paste on the base inner core board from the third press copper foil surface blindly fishing position to fill a blinding fishing groove, connecting the upper surface of the third press copper foil with a first prepreg 2, connecting the lower surface of the fourth press copper foil with a second prepreg 6, connecting the first press copper foil 1 on the upper surface of the first prepreg 2, and connecting the lower surface of the second prepreg 6 with a second press copper foil 7;
s2, pressing the laminated circuit board into an 8-layer printed circuit board sample wafer by a pressing forming machine;
and S3, performing laser drilling of blind holes on the laminated printed circuit board sample wafer → hole filling electroplating → circuit etching → solder mask ink → molding, wherein a high-precision numerical control milling machine is used for molding, the service life of a diamond milling cutter of the high-precision numerical control milling machine is adjusted to 1m, and the appearance of the product is fished out to obtain a finished product.
The laser drilling of the blind hole in the step S3 specifically comprises the following steps: a laser drill penetrates through the first laminated copper foil 1 and the first prepreg 2 to be connected to the copper paste to form a first laser blind hole 9, the laser drill penetrates through the second laminated copper foil 7 and the second prepreg 6 to be connected to the copper paste to form a second laser blind hole 10, and the first laser blind hole 9 corresponds to the second laser blind hole 10 in position.
Wherein: the hole filling electroplating in the step S3 specifically comprises the following steps: the first laser blind hole 9 conducts the first press-fit copper foil 1 and the copper paste in an electroplating mode, the first laser blind hole 9 is filled with electroplated copper, the second laser blind hole 10 conducts the second press-fit copper foil 7 and the copper paste in an electroplating mode, and the second laser blind hole 10 is filled with the electroplated copper.
Wherein: and the first laser blind hole 9 and the second laser blind hole 10 are filled with electroplated copper to connect the copper paste with the contact area of the external device.
Wherein: the line etching in step S3 specifically includes: the first laminated copper foil 1 and the second laminated copper foil 7 are transferred by a pattern, and then unnecessary copper is bitten off by an etching solution, and a conductive circuit is reserved.
Wherein: the welding prevention in the step S3 specifically comprises the following steps: and printing solder resist ink on the surface of the circuit board after the circuit etching.
The etching solutions and solder resist inks of examples 1 to 3 were those conventionally used in circuit board printing.
The ultra-thin high-heat-dissipation circuit board product has the characteristics of lower production cost, simple and convenient production process, customized heat dissipation material, unlimited product and the like, is consistently and well-commented by customers in use, can ensure better flexibility of product production and assembly, and has very considerable prospect along with the production direction of product miniaturization.
Finally, it should be noted that the above embodiments are only for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to examples, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, which should be covered by the claims of the present invention.
Claims (9)
1. A preparation method of an ultrathin high-heat-dissipation circuit board is characterized by comprising the following steps: the method comprises the following steps:
s1, providing a basic inner core board, wherein the basic inner core board comprises a first copper foil (3), a basic substrate (4) and a second copper foil (5) which are sequentially arranged from top to bottom, the heat dissipation position of the basic inner core board is fished out to form a blind fished groove (8), the blind fished groove (8) is filled with silk-screen copper paste, then a first prepreg (2) and a first laminated copper foil (1) are sequentially arranged on the upper surface of the first copper foil (3) from bottom to top, and a second prepreg (6) and a second laminated copper foil (7) are sequentially arranged on the lower surface of the second copper foil (5) from top to bottom to form a laminated circuit board;
s2, pressing the laminated circuit board into a printed circuit board sample wafer through a pressing forming machine;
s3, laser drilling blind holes on the laminated printed circuit board sample wafer → hole filling electroplating → circuit etching → solder mask ink → molding to obtain a finished product.
2. The method for manufacturing an ultra-thin high heat dissipation wiring board of claim 1, wherein: the laser drilling of the blind hole in the step S3 specifically comprises the following steps: the laser drill penetrates through the first press-fit copper foil (1) and the first prepreg (2) and is connected to the copper paste to form a first laser blind hole (9), the laser drill penetrates through the second press-fit copper foil (7) and the second prepreg (6) and is connected to the copper paste to form a second laser blind hole (10), and the first laser blind hole (9) corresponds to the second laser blind hole (10).
3. The method for manufacturing an ultra-thin high heat dissipation wiring board of claim 2, wherein: the hole filling electroplating in the step S3 specifically comprises the following steps: the first laser blind hole (9) conducts the first press-fit copper foil (1) and the copper paste in an electroplating mode, the first laser blind hole (9) is filled with electroplated copper, the second laser blind hole (10) conducts the second press-fit copper foil (7) and the copper paste in an electroplating mode, and the second laser blind hole (10) is filled with the electroplated copper.
4. The method for manufacturing an ultra-thin high heat dissipation wiring board of claim 3, wherein: and the first laser blind hole (9) and the second laser blind hole (10) are filled with electroplated copper to connect the copper paste with the contact area of an external device.
5. The method for manufacturing an ultra-thin high heat dissipation wiring board of claim 1, wherein: the line etching in step S3 specifically includes: and transferring the first laminated copper foil (1) and the second laminated copper foil (7) through patterns, and then biting unnecessary copper through an etching solution to keep a conducting circuit.
6. The method for manufacturing an ultra-thin high heat dissipation wiring board of claim 1, wherein: the welding prevention in the step S3 specifically comprises the following steps: and printing solder resist ink on the surface of the circuit board after the circuit etching.
7. The method for manufacturing an ultra-thin high heat dissipation wiring board of claim 1, wherein: and (3) blindly fishing the basic core board from the position, corresponding to the heat dissipation position, on the upper surface of the first copper foil (3) to the second copper foil (5) to form a blind fishing groove (8), and filling the blind fishing groove (8) with silk-screen copper paste from the position, corresponding to the heat dissipation position, of the upper surface of the first copper foil (3).
8. The method for manufacturing an ultra-thin high heat dissipation wiring board of claim 1, wherein: the foundation core board further comprises at least one layer of third prepreg, at least one layer of third press-fit copper foil, at least one layer of fourth prepreg and at least one layer of fourth press-fit copper foil, wherein the third prepreg and the third press-fit copper foil are sequentially and alternately arranged on the upper surface of the first copper foil (3) from bottom to top, the fourth prepreg and the fourth press-fit copper foil are sequentially and alternately arranged on the lower surface of the second copper foil (5) from top to bottom, and the first copper foil (3), the base substrate (4), the second copper foil (5), the at least one layer of third prepreg, the at least one layer of third press-fit copper foil, the at least one layer of fourth prepreg and the at least one layer of fourth press-fit copper foil are pressed together.
9. The method for manufacturing an ultra-thin high heat dissipation wiring board of claim 8, wherein: and (3) blindly dragging the basic inner core board from the upper surface of the third laminated copper foil corresponding to the heat dissipation position to the fourth laminated copper foil to form a blind dragging groove (8), and filling the blind dragging groove (8) by silk-screen copper paste from the blind dragging position of the upper surface of the third laminated copper foil.
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| CN202211203901.1A CN115551234A (en) | 2022-09-29 | 2022-09-29 | Preparation method of ultrathin high-heat-dissipation circuit board |
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| CN202211203901.1A CN115551234A (en) | 2022-09-29 | 2022-09-29 | Preparation method of ultrathin high-heat-dissipation circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115841959A (en) * | 2023-02-23 | 2023-03-24 | 广州美维电子有限公司 | Packaging structure and method of high-power chip |
| CN116828826A (en) * | 2023-08-31 | 2023-09-29 | 四川上达电子有限公司 | In-situ opposite blind hole stacking method for multilayer flexible printed circuit board |
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| CN106211560A (en) * | 2016-08-16 | 2016-12-07 | 生益电子股份有限公司 | The manufacture method of a kind of PCB and PCB |
| CN107995778A (en) * | 2017-12-28 | 2018-05-04 | 珠海杰赛科技有限公司 | A kind of preparation method of hollow built-in type blind slot heat sink |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115841959A (en) * | 2023-02-23 | 2023-03-24 | 广州美维电子有限公司 | Packaging structure and method of high-power chip |
| CN115841959B (en) * | 2023-02-23 | 2023-08-15 | 广州美维电子有限公司 | Packaging structure and method of high-power chip |
| CN116828826A (en) * | 2023-08-31 | 2023-09-29 | 四川上达电子有限公司 | In-situ opposite blind hole stacking method for multilayer flexible printed circuit board |
| CN116828826B (en) * | 2023-08-31 | 2024-01-02 | 四川上达电子有限公司 | In-situ opposite blind hole stacking method for multilayer flexible printed circuit board |
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