CN108617113A - A kind of PP adds the method for Protection glue band making Rigid Flex - Google Patents
A kind of PP adds the method for Protection glue band making Rigid Flex Download PDFInfo
- Publication number
- CN108617113A CN108617113A CN201810606883.9A CN201810606883A CN108617113A CN 108617113 A CN108617113 A CN 108617113A CN 201810606883 A CN201810606883 A CN 201810606883A CN 108617113 A CN108617113 A CN 108617113A
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- China
- Prior art keywords
- soft board
- core plate
- protection glue
- glue band
- rigid flex
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a kind of PP to add the method that Protection glue band makes Rigid Flex, includes the following steps：The internal layer circuit of soft board core plate and hardboard core plate is made respectively；The soft board core plate includes soft board region and soft or hard calmodulin binding domain CaM；Soft board region contraposition on soft board core plate fits over film；Protection glue band is pasted on cover film；The periphery controlled depth milling blind slot at the soft board region is corresponded on hardboard core plate, is retained certain remaining thickness and is used as dowel；By soft board core plate and hardboard core plate with can gummosis PP be pressed into production plate, and open a window at the soft board region that can correspond on gummosis PP；Outer-layer circuit and solder mask are made successively on production plate, are then surface-treated；Inside gong slot gong at the position of blind slot is corresponded on production plate and removes dowel, and Rigid Flex is made after taking off lid.Soft board region is effectively protected using the method for the present invention and erosion and mechanical wear wiping flower are not stung by liquid medicine, and effectively prevents the bad risk of filler of thick copper Rigid Flex.
Description
Technical field
The present invention relates to printed wiring board manufacture technology fields, and in particular to a kind of PP adds Protection glue band to make soft or hard combination
The method of plate.
Background technology
Rigid Flex is provided simultaneously with the characteristic of FPC and the characteristic of PCB, and therefore, it, which can be used for some, particular/special requirement
Products, existing certain flexure region also has certain rigid region, to saving interiors of products space, reduces finished product
Volume enhances product performance and is very helpful.The existing universal system by the way of opening window of method for making Rigid Flex
Make, i.e., by the corresponding hardboard subregion in soft board region, first directly gong presses again after falling, and soft board region can be made naked after pressing in this way
It is exposed, the problems such as machinery wipes flower, alkaline medicinal liquid stings erosion is easy tod produce in the technological process below；And Rigid Flex exists
It is generally pressed using not gummosis PP when pressing, and when the copper thickness of internal layer circuit on Rigid Flex is more than 3OZ (containing 3OZ)
When, pressing is carried out using not gummosis PP and will appear the undesirable risk of filler between internal layer circuit.
Invention content
The present invention has that nog plate is bad after being directed to existing Rigid Flex filling holes with resin, provides a kind of PP and adds protection
The method that adhesive tape makes Rigid Flex, is effectively protected soft board region using this method and does not sting erosion and mechanical wear by liquid medicine
Flower is wiped, and effectively prevents the bad risk of filler of thick copper Rigid Flex.
In order to solve the above technical problem, the present invention provides the sides that a kind of PP adds Protection glue band making Rigid Flex
Method includes the following steps：
S1, the internal layer circuit for making soft board core plate and hardboard core plate respectively；The soft board core plate includes soft board region and soft
Hard calmodulin binding domain CaM；
S2, the soft board region contraposition on soft board core plate fit over film；
S3, Protection glue band is pasted on cover film；
S4, periphery controlled depth milling blind slot at the soft board region is corresponded on hardboard core plate, made with thick more than the slot bottom of blind slot
For dowel；
S5, by soft board core plate and hardboard core plate with can gummosis PP be pressed into production plate, and can on gummosis PP it is corresponding described in
At soft board region open a window, and on hardboard core plate with blind slot one be placed on inside with can gummosis PP pieces contact；
S6, outer-layer circuit and solder mask are made successively on production plate, be then surface-treated；
S7, correspond to inside gong slot gong at the position of blind slot on production plate and removes dowel, take off and remove on hardboard core plate after covering
The part in the corresponding soft board region and Protection glue band, are made Rigid Flex.
Preferably, in step S2, the cover film is unilateral bigger 1mm than the soft board region；In step S3, the Protection glue
With unilateral smaller 1mm than the soft board region.
Preferably, further include step between step S2 and S3：
S21, cover film and soft board core plate bonded completely by way of quick pressing；
S22, soft board core plate is toasted, cover film is made to cure.
Preferably, in step S21, the parameter of quick pressing is：180 DEG C, pressure 100KG, pressing time 1-2min of temperature.
Preferably, in step S4, controlled depth milling blind slot is carried out by way of laser cutting and works as hardboard core thickness ＞ 0.5mm
When, the remaining thickness ＞ 0.25mm of controlled depth milling blind slot；When hardboard core thickness is in 0.3-0.5mm, the remaining thickness ＞ of controlled depth milling blind slot
0.15mm；When hardboard core thickness is in 0.25-0.3mm, the remaining thickness ＞ 0.1mm of controlled depth milling blind slot.
Preferably, in step S5, rivet hole is bored in the corresponding position of soft board core plate and hardboard core plate respectively before pressing, it is soft
Plate core plate and hardboard core plate are pressed after being fixed by closing-up.
Preferably, in step S5, the windowing it is unilateral bigger 0-0.35mm than the soft board region.
Preferably, in step S6, before making outer-layer circuit, production plate also passes through outer layer drilling, heavy copper and full plate successively
The process of plating.
Preferably, in step S7, after taking off lid, dispensing is carried out in the soft board edges of regions of exposing and the junction of hardboard core plate
Processing.
Preferably, in step S7, the burr taken off and generated on edge after lid is removed by way of laser cutting.
Compared with prior art, the present invention has the advantages that：
The present invention by fitting over film and Protection glue band successively in soft board region, and when making hardboard core plate, hard
Plate core plate corresponds to the periphery in the soft board region gong slot by way of controlled depth milling blind slot, retains certain thickness remaining thick as connection
Muscle, then presses together soft board core plate and hardboard core plate, the planarization of whole plate when so can ensure that pressing, two pairs
It answers the hardboard core plate part in soft board region not to be removed, soft board region can be effectively protected and erosion and mechanical wear wiping are not stung by liquid medicine
Flower, and press when using can gummosis PP pieces, effectively prevent the bad risk of filler of thick copper Rigid Flex；And side of the present invention
What method did not interfered with the later stage takes off lid, has ensured the quality of Rigid Flex.
Specific implementation mode
In order to more fully understand the technology contents of the present invention, below in conjunction with specific embodiment to the technical side of the present invention
Case is described further and illustrates.
Embodiment
For circuit copper thickness in the plank equal to or more than 3OZ, the present embodiment provides a kind of PP to add the making of Protection glue band soft
The method of scleroma plywood, concrete technology are as follows：
(1), sawing sheet：Soft board core plate and hardboard core plate, soft board core thickness are outputed by jigsaw size 520mm × 620mm
0.2mm, outer copper foil thickness are 1OZ, and the soft board core plate includes soft board region and soft or hard calmodulin binding domain CaM；Hardboard core thickness
0.7mm, outer copper foil thickness are 3OZ.
(2), internal layer circuit makes (negative film technique)：Inner figure shifts, and light-sensitive surface, light-sensitive surface are coated with vertical application machine
8 μm of film thickness monitoring, using Full-automatic exposure machine, with 5-6 lattice exposure guide rule (21 lattice exposure guide rule) respectively in soft board core plate and hardboard
Internal layer circuit exposure is completed on core plate；Internal layer etch, by after exposure imaging soft board core plate and hardboard core plate etch interior layer line
Road, it is 3mil that internal layer line width, which measures,；Then internal layer AOI checks that the open short circuit, circuit notch, circuit pin hole etc. of internal layer circuit lack
It falls into, defective to scrap processing, flawless product goes out to downstream.
(3), brown：By way of chemical reaction, in a kind of brown oxidation layer of soft board core plate layers of copper Surface Creation, make copper
The roughness in face becomes larger, enhancing pressing when and cover film binding force.
(4), epiphragma is pasted：Soft board region contraposition on soft board core plate fits over film, and cover film is unilateral compares soft board
The big 1mm in region；The cover film is polyimides (PI materials).
Wherein, it before fitting, according to the shape in soft board region, is corresponded on the cover film of size identical as soft board core plate soft or hard
Calmodulin binding domain CaM carries out windowing processing.
(5), quick pressing：By way of high temperature and pressure, in the short time by the glue-line (epoxy resin) of cover film with it is soft
The soft board region of plate core plate bonds completely, achievees the effect that protect soft board region；The parameter of quick pressing is：180 DEG C of temperature, pressure
Power 100KG, pressing time 1-2min.
(6), baking sheet：Soft board core plate toasts 1h at 150 DEG C, and cover film is made to be fully cured.
(7), Protection glue band is pasted：Protection glue band is pasted on cover film, then by Protection glue band by way of quick pressing
It is bonded on cover film, and Protection glue band is unilateral smaller 1mm than soft board region, the Protection glue band is removed when the later stage being facilitated to take off lid.
(8), OPE punchings：The rivet hole of pressing is gone out in the corresponding position of soft board core plate and hardboard core plate.
(9), controlled depth milling blind slot：The periphery at the soft board region is corresponded on hardboard core plate by way of laser cutting
Controlled depth milling blind slot, blind slot is deep-controlled in 0.15mm-0.25mm, retains certain remaining thickness as dowel (the i.e. slot of blind slot
Bottom)；First milling control depth blind slot can reduce controlled depth milling slot precision when taking off lid after later stage pressing in this way, facilitate production, after can also ensureing
Phase takes off the quality after lid.
(10), brown：By way of chemical reaction, in soft board core plate and a kind of brown of hardboard core plate layers of copper Surface Creation
Oxide layer makes the roughness of copper face become larger, enhancing pressing when and PP binding force.
(11), it presses：By soft board core plate and hardboard core plate with can gummosis PP be superimposed together in advance after (specific plate-laying sequence by
Top to bottm be hardboard core plate, can gummosis PP, soft board core plate, can gummosis PP, hardboard core plate), first carried out with rivet by rivet hole
Then riveted is pressed into production plate by way of high temperature and pressure, after pressing on hardboard core plate with blind slot one be placed in
Side with can gummosis PP contact.
Before pressing, according to the size of soft board core plate output can gummosis PP pieces, can gummosis PP on pieces correspond to the flexible board area
It opens a window at domain, the window size is unilateral bigger 0-0.35mm than the soft board region, makes pressing by the dimensional fits with cover film
Afterwards cover film edge by can gummosis PP push down, cover film is broken away together when the later stage being further prevented to take off lid, and can be reduced soft
Gummosis on plate region facilitates the later stage to take off lid.
(12), outer layer drills：It is drilled on production plate using the mode of machine drilling according to borehole data.
(13), heavy copper：One layer of thin copper is deposited by way of chemical reaction on hole wall, is provided for subsequent electric plating of whole board
Basis, backlight test 10 grades, and the heavy copper thickness in hole is 0.5 μm.
(14), electric plating of whole board --- according to the mechanism of electrochemical reaction, last layer copper is electroplated on the basis of heavy copper, ensures
Hole copper thickness reaches product requirement, and electroplating parameter is set according to hole copper thickness is completed.
(15), outer-layer circuit (positive blade technolgy) is made：Outer graphics shift, luxuriant and rich with fragrance using Full-automatic exposure machine and positive circuit
Woods completes outer-layer circuit exposure with 5-7 lattice exposure guide rule (21 lattice exposure guide rule), developed, and outer-layer circuit figure is formed on production plate
Shape；Outer graphics are electroplated, then the copper facing and tin plating respectively on production plate, and electroplating parameter is set according to desired completion copper thickness,
Copper facing is the current density electric plating of whole board 60min with 1.8ASD, and tin plating is that 10min is electroplated with the current density of 1.2ASD, and tin is thick
3-5μm；Then it moves back film successively again, etch and move back tin, outer-layer circuit is etched on production plate；Outer layer AOI, uses automated optical
Detecting system, by the comparison with CAM data, whether detection outer-layer circuit has the defects of open circuit, notch, not clean, short-circuit etching.
(16), welding resistance, silk-screen character：By making green oil layer and silk-screen character in production plate outer layer, green oil thickness is：
10-50 μm, so as to so that production plate can reduce influence of the environmental change to it during subsequent use.
(17), surface treatment (heavy nickel gold)：Principle is learned in pad copper face Tonghua of welding resistance windowing position, and uniform deposition centainly requires
The nickel layer and layer gold of thickness, nickel layer thickness are：3-5μm；Layer gold thickness is：0.05-0.1μm.
(18), it is molded：According to the prior art and press design requirement gong shape, the +/- 0.05mm of external form tolerance.
(19), gong platform：Inside gong slot gong at the position of blind slot is corresponded on production plate and removes dowel, will be given birth to by taking off lid
Production plate on correspond to soft board region waste material removed from product (take off cover after remove the portion that the soft board region is corresponded on hardboard core plate
Point), Protection glue band is removed together when taking off lid, exposes internal soft board region part, forms platform, Rigid Flex is made.
(20), it is cut by laser：The burr taken off and generated on platform inward flange after lid is removed by way of laser cutting, is protected
It is round and smooth to demonstrate,prove neat in edge, improves the quality of production board.
(21), dispensing：Dispensing processing is carried out (i.e. to the soft board core plate of platform edges in the junction of the platform edges of exposing
With glue on the junction point of hardboard core plate), enhance the intensity of junction, prevents the junction when bending or pullling from splitting
The phenomenon that.
(22), electrical testing：The electrically conducting performance of production board is tested, this plate is using test method：Flying probe.
(23)、FQC：Whether check appearance, hole copper thickness, thickness of dielectric layers, green oil thickness, internal layer copper thickness of production board etc.
Meet the requirement of client.
(24), it packs：According to the manner of packing and packaging quantity of customer requirement, packaging is sealed to production board, and
It is allowed to dry drying prescription and humidity card, then shipment.
In other embodiments of the invention, as hardboard core plate (not cupric) thickness G T.GT.GT 0.5mm, the depth of controlled depth milling blind slot
Degree control makes the remaining thickness ＞ 0.25mm at dowel in 0.15-0.25mm；When hardboard core plate (not cupric) thickness is in 0.3-
When 0.5mm, controlled depth milling blind slot it is deep-controlled in 0.1-0.15mm, make the remaining thickness ＞ 0.15mm at dowel；When hardboard core plate
(not cupric) thickness in 0.25-0.3mm, controlled depth milling blind slot it is deep-controlled in 0.08-0.15mm, make the remaining thickness at dowel
＞ 0.1mm.
It is provided for the embodiments of the invention technical solution above to be described in detail, specific case used herein
The principle and embodiment of the embodiment of the present invention are expounded, the explanation of above example is only applicable to help to understand this
The principle of inventive embodiments；Meanwhile for those of ordinary skill in the art, embodiment according to the present invention, in specific embodiment party
There will be changes in formula and application range, in conclusion the content of the present specification should not be construed as limiting the invention.
Claims (10)
1. a kind of PP adds the method that Protection glue band makes Rigid Flex, which is characterized in that include the following steps：
S1, the internal layer circuit for making soft board core plate and hardboard core plate respectively；The soft board core plate includes soft board region and soft or hard knot
Close region；
S2, the soft board region contraposition on soft board core plate fit over film；
S3, Protection glue band is pasted on cover film；
S4, periphery controlled depth milling blind slot at the soft board region is corresponded on hardboard core plate, using the slot bottom of blind slot as dowel；
S5, by soft board core plate and hardboard core plate with can gummosis PP be pressed into production plate, and the soft board can corresponded on gummosis PP
At region open a window, and on hardboard core plate with blind slot one be placed on inside with can gummosis PP pieces contact；
S6, outer-layer circuit and solder mask are made successively on production plate, be then surface-treated；
S7, correspond to inside gong slot gong at the position of blind slot on production plate and removes dowel, remove correspondence on hardboard core plate after taking off lid
Rigid Flex is made in the part in the soft board region and Protection glue band.
2. PP according to claim 1 adds the method that Protection glue band makes Rigid Flex, which is characterized in that step S2
In, the cover film is unilateral bigger 1mm than the soft board region；In step S3, the Protection glue band is unilateral than the soft board region
Small 1mm.
3. PP according to claim 1 add Protection glue band make Rigid Flex method, which is characterized in that step S2 and
It further include step between S3：
S21, cover film and soft board core plate bonded completely by way of quick pressing；
S22, soft board core plate is toasted, cover film is made to cure.
4. PP according to claim 3 adds the method that Protection glue band makes Rigid Flex, which is characterized in that step S21
In, the parameter of quick pressing is：180 DEG C, pressure 100KG, pressing time 1-2min of temperature.
5. PP according to claim 1 adds the method that Protection glue band makes Rigid Flex, which is characterized in that step S4
In, controlled depth milling blind slot is carried out by way of laser cutting as hardboard core thickness ＞ 0.5mm, the remaining thickness ＞ of controlled depth milling blind slot
0.25mm；When hardboard core thickness is in 0.3-0.5mm, the remaining thickness ＞ 0.15mm of controlled depth milling blind slot；When hardboard core thickness exists
When 0.25-0.3mm, the remaining thickness ＞ 0.1mm of controlled depth milling blind slot.
6. PP according to claim 1 adds the method that Protection glue band makes Rigid Flex, which is characterized in that step S5
In, rivet hole is bored in the corresponding position of soft board core plate and hardboard core plate respectively before pressing, soft board core plate and hardboard core plate pass through
Closing-up is pressed after fixing.
7. PP according to claim 1 adds the method that Protection glue band makes Rigid Flex, which is characterized in that step S5
In, the windowing it is unilateral bigger 0-0.35mm than the soft board region.
8. PP according to claim 1 adds the method that Protection glue band makes Rigid Flex, which is characterized in that step S6
In, before making outer-layer circuit, production plate is also successively by outer layer drilling, the process of heavy copper and electric plating of whole board.
9. PP according to claim 1 adds the method that Protection glue band makes Rigid Flex, which is characterized in that step S7
In, after taking off lid, dispensing processing is carried out in the soft board edges of regions of exposing and the junction of hardboard core plate.
10. PP according to claim 1 adds the method that Protection glue band makes Rigid Flex, which is characterized in that step S7
In, the burr taken off and generated on edge after lid is removed by way of laser cutting.
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Cited By (17)
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|---|---|---|---|---|
| CN109570674A (en) * | 2018-11-19 | 2019-04-05 | 深圳欣旺达智能科技有限公司 | Soft board welds hardboard technique |
| CN109640519A (en) * | 2018-12-28 | 2019-04-16 | 深圳市景旺电子股份有限公司 | Rigid-flex combined board and preparation method thereof |
| CN109905976A (en) * | 2019-04-11 | 2019-06-18 | 信丰迅捷兴电路科技有限公司 | A kind of local laminating type of Rigid Flex cover film |
| CN110139505A (en) * | 2019-04-10 | 2019-08-16 | 江门崇达电路技术有限公司 | A kind of production method of the Rigid Flex with the layering of local soft board |
| CN110536553A (en) * | 2019-08-12 | 2019-12-03 | 宁波华远电子科技有限公司 | A kind of laser uncovering method of circuit board |
| CN110933839A (en) * | 2019-12-03 | 2020-03-27 | 欣强电子（清远）有限公司 | Method for opening cover by mechanically forming soft and hard plates |
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| CN113038738A (en) * | 2021-01-27 | 2021-06-25 | 红板（江西）有限公司 | Thick copper soft-hard combined board glue filling process |
| CN113301736A (en) * | 2021-05-21 | 2021-08-24 | 山东英信计算机技术有限公司 | Rigid-flex board, manufacturing method thereof and electronic product |
| CN113382536A (en) * | 2021-07-27 | 2021-09-10 | 生益电子股份有限公司 | PCB preparation method and PCB |
| CN113613415A (en) * | 2021-10-11 | 2021-11-05 | 四川英创力电子科技股份有限公司 | Printed circuit board and non-metallized step groove processing technology thereof |
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