CN113301736A - Rigid-flex board, manufacturing method thereof and electronic product - Google Patents
Rigid-flex board, manufacturing method thereof and electronic product Download PDFInfo
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- CN113301736A CN113301736A CN202110559377.0A CN202110559377A CN113301736A CN 113301736 A CN113301736 A CN 113301736A CN 202110559377 A CN202110559377 A CN 202110559377A CN 113301736 A CN113301736 A CN 113301736A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
Abstract
The application discloses a soft-hard combined board and a manufacturing method thereof as well as an electronic product, wherein the method comprises the steps of respectively milling first grooves on the first surfaces of two thick core boards, wherein the depth of each first groove is smaller than the thickness of each thick core board; laminating and pressing the soft board layer, the protective film, the prepreg and the thick core board which are sequentially positioned at two sides of the soft board layer; the prepreg is provided with a through hole, and the first surface faces the protective film; respectively milling second grooves on the second surfaces of the two thick core plates corresponding to the first grooves to obtain a rigid-flex board; the sum of the depths of the first groove and the second groove is not less than the thickness of the thick core plate. Firstly, forming a first groove on the first surface of a thick core plate, forming a second groove on the second surface of the thick core plate after pressing, and opening the cover by adopting twice grooving, wherein the depth of the second groove is less than the thickness of the thick core plate, so that the damage to a protective film caused by forming the second groove is avoided; the depth of the first groove is smaller than the thickness of the thick core plate, so that damage to the protective film caused by ink and immersion liquid used in drilling and circuit printing on the second surface is avoided.
Description
Technical Field
The present disclosure relates to electronic circuit boards, and particularly to a rigid-flex board, a method for manufacturing the same, and an electronic product.
Background
With the birth and development of a Printed Circuit Board (PCB) and a Flexible Printed Circuit Board (FPC), a new product of a rigid-flex Board has been promoted.
The rigid-flexible printed circuit board is formed by combining a flexible printed circuit board and a rigid printed circuit board through processes such as pressing and the like according to relevant process requirements, and has the requirements on the rigidity of the rigid printed circuit board and the flexibility of the flexible printed circuit board. At present, when the rigid-flex board is manufactured, a thick core board, a prepreg, a protective film and a flexible board layer are laminated, drilling and printed circuit are carried out, then the thick core board is uncovered, the uncovering is mainly carried out in a laser cutting mode, when the thickness of the thick core board is smaller than 0.5mm, the laser cutting mode cannot cause adverse effects on the protective film on the flexible board layer, when the thickness of the thick core board is more than 0.5mm, the situation that the thick core board cannot be cut in place or the cutting depth is too deep to damage the protective film on the flexible board layer can occur during laser cutting.
Therefore, how to solve the above technical problems should be a great concern to those skilled in the art.
Disclosure of Invention
The application aims to provide a rigid-flex board, a manufacturing method thereof and an electronic product, so that a protective film in the rigid-flex board is prevented from being damaged.
In order to solve the above technical problem, the present application provides a method for manufacturing a rigid-flex board, including:
respectively forming first grooves on the first surfaces of the two thick core plates, wherein the depth of each first groove is smaller than the thickness of each thick core plate;
laminating and pressing a soft board layer, a protective film, a prepreg and the thick core board with the first groove, wherein the protective film and the prepreg are sequentially positioned at two sides of the soft board layer; the prepreg is provided with a through hole, and the first surface faces the protective film;
respectively forming second grooves on the second surfaces of the two thick core plates corresponding to the first grooves, wherein the depth of each second groove is smaller than the thickness of the thick core plate, so as to obtain a rigid-flexible board;
the first surface and the second surface are opposite, and the sum of the depths of the first groove and the second groove is not less than the thickness of the thick core plate.
Optionally, in the method for manufacturing the rigid-flex board, respectively forming second grooves on the second surfaces of the two thick core boards corresponding to the first grooves includes:
and respectively forming second grooves on the second surfaces of the two thick core plates corresponding to the first grooves by adopting a CNC (computerized numerical control) machining process.
Optionally, in the method for manufacturing a rigid-flex board, the depth of the second groove is H2H/2+0.1, wherein H2Is the depth of the second groove, and H is the thickness of the thick core plate.
Optionally, in the method for manufacturing a rigid-flex board, a manufacturing method of the prepreg includes:
and adopting a CNC (computer numerical control) processing technology to open the through holes on the prepreg to be processed to obtain the prepreg.
Optionally, in the method for manufacturing a rigid-flex board, the forming of the first grooves on the first surfaces of the two thick core boards respectively includes:
and respectively forming the first grooves on the first surfaces of the two thick core plates by adopting a CNC (computerized numerical control) machining process.
Optionally, in the method for manufacturing a rigid-flex board, after the rigid-flex board is obtained, the method further includes:
and carrying out defect inspection on the rigid-flexible printed circuit board, and screening out qualified rigid-flexible printed circuit boards.
Optionally, in the method for manufacturing a rigid-flex board, before stacking and pressing the flexible board layer, the protective films, the prepregs, and the thick core boards sequentially located on both sides of the flexible board layer, the method further includes:
filling a glue blocking material in the first groove;
correspondingly, after the second grooves are respectively formed on the second surfaces of the two thick core plates corresponding to the first grooves, the method further comprises the following steps:
and taking out the glue resisting material through the second groove.
Optionally, in the method for manufacturing the rigid-flex circuit board, the glue blocking material is polyimide.
The application also provides a rigid-flex board, which is prepared by the rigid-flex board manufacturing method.
The application also provides an electronic product, which comprises the rigid-flex board.
The application provides a method for manufacturing a rigid-flex board, which comprises the following steps: respectively milling first grooves on the first surfaces of the two thick core plates, wherein the depth of each first groove is smaller than the thickness of each thick core plate; laminating and pressing a soft board layer, a protective film, a prepreg and the thick core board with the first groove, wherein the protective film and the prepreg are sequentially positioned at two sides of the soft board layer; the prepreg is provided with a through hole, and the first surface faces the protective film; respectively milling second grooves on the second surfaces of the two thick core plates corresponding to the first grooves to obtain a rigid-flex board; the first surface and the second surface are opposite, and the sum of the depths of the first groove and the second groove is not less than the thickness of the thick core plate.
Therefore, when the thick core plate is treated in the application, a first groove is firstly formed in the first surface of the thick core plate, after the thick core plate, the prepreg, the protective film and the soft plate layer are laminated and pressed, a second groove is formed in the second surface of the thick core plate, the sum of the depths of the first groove and the second groove is not less than the thickness of the thick core plate, namely, the opening of the thick core plate is completed by adopting twice grooving, the depth of the second groove is less than the thickness of the thick core plate, and the protective film is prevented from being damaged when the second groove is formed; and, this application is seted up first recess earlier, can reduce the degree of depth when the second surface fluting, and in addition, the degree of depth of first recess is less than the thickness of thick core plate, can avoid the corruption injury of printing ink, the immersion fluid that uses when drilling, printed circuit on the second surface to the protection film.
In addition, this application still provides a soft or hard combination board and electronic product.
Drawings
For a clearer explanation of the embodiments or technical solutions of the prior art of the present application, the drawings needed for the description of the embodiments or prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a flowchart of a method for manufacturing a rigid-flex board according to an embodiment of the present disclosure;
fig. 2 is a flowchart of another method for manufacturing a rigid-flex circuit board according to an embodiment of the present disclosure;
fig. 3 to 13 are process flow diagrams of a method for manufacturing a rigid-flex board according to an embodiment of the present disclosure;
in the figure: 1. the novel plastic film comprises a soft board layer, 2 parts of a protective film, 3 parts of a thick core board, 4 parts of a prepreg, 5 parts of through holes, 6 parts of a first groove, 7 parts of a glue blocking material, 8 parts of a through hole and 9 parts of a second groove.
Detailed Description
In order that those skilled in the art will better understand the disclosure, the following detailed description will be given with reference to the accompanying drawings. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than those specifically described and will be readily apparent to those of ordinary skill in the art without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.
As described in the background section, currently, when manufacturing a rigid-flex board, a thick core board, a prepreg, a protective film, and a flexible board layer are laminated, drilling and circuit printing are performed, then a cover is opened for the thick core board, the cover opening is mainly performed in a laser cutting manner, when the thickness of the thick core board is less than 0.5mm, the laser cutting manner does not cause adverse effects on the protective film on the flexible board layer, and when the thickness of the thick core board is more than 0.5mm, the situation that the thick core board cannot be cut in place or the cutting depth is too deep to damage the protective film on the flexible board layer occurs during laser cutting.
The rigid-flex board is a printed circuit board which is formed by combining and processing a flexible board and a rigid board and has the characteristics of the flexible board and the rigid board.
In view of the above, the present application provides a method for manufacturing a rigid-flex board, please refer to fig. 1, where fig. 1 is a flowchart of a method for manufacturing a rigid-flex board according to an embodiment of the present application, and the method includes:
step S101: first grooves are respectively formed in the first surfaces of the two thick core plates, and the depth of each first groove is smaller than the thickness of each thick core plate.
The opening mode of the first groove is not particularly limited in the application and can be selected by oneself.
As an implementation manner, the forming the first grooves on the first surfaces of the two thick core plates respectively includes: and respectively forming first grooves on the first surfaces of the two thick core plates in a laser cutting mode.
As another practical mode, the forming the first grooves on the first surfaces of the two thick core plates respectively includes: and respectively forming the first grooves on the first surfaces of the two thick core plates by adopting a CNC (computerized numerical control) machining process. The CNC (computer numerical control) machining process is a process for numerically controlling the milling depth of the groove by a computer, namely the depth of the first groove can be accurately controlled, and the CNC machining process has low cost for milling the first groove.
The number of the plate layers in the thick core plate is not specifically limited in the application, and is determined according to the situation. For example, the number of plies in the thick core sheet may be 3 plies, 5 plies, and so forth.
It should be noted that, before the first groove is formed on the first surface of the thick core plate, the following process steps are also required to be performed: cutting, drilling a plate layer in the thick core plate, arranging an inner layer circuit and an inner layer AOI (automatic optical inspection) on the surface of the plate layer in the thick core plate; after the first surface of the thick core plate is provided with the first groove, the thick core plate is required to be subjected to brown oxidation treatment; the processes performed before and after the first recess is formed are well known to those skilled in the art and will not be described in detail herein.
The cutting refers to a process of cutting a large-piece material into small pieces of materials with required breadth specifications by using a cutting machine according to process requirements and size specifications. The inner layer circuit manufacturing process roughly comprises the following steps: cutting the copper substrate into required size; pre-treatment, namely removing impurities on the surface of the copper substrate by using a chemical means; pressing a layer of photosensitive protective film on the surface of the copper substrate to prepare for exposure; exposing, namely imaging the circuit on the negative film on the dry film by utilizing the performance of the dry film; performing spot check, wherein spot check confirmation is required in time in order to ensure the quality of the connected board in the manufacturing process; and connecting the circuit, namely developing, etching and stripping the circuit to obtain the required circuit by utilizing the dissolution characteristic and the protection effect of the unexposed dry film. AOI (automated optical inspection) is a comparison of slab images in a thick core plate with standard images, which can be obtained by optical component scanning. The brown oxidation treatment is to adopt sulfuric acid, hydrogen peroxide and brown oxidation liquid with certain concentration to react with copper, and slightly corrode the copper surface, so that the copper surface of the thick core plate becomes rough; and the bonding force between the thick core board and the prepreg is enhanced. Under normal conditions, the color of the copper surface of the core plate after browning can be changed into brownish red, and if the concentration of the liquid medicine, the reaction temperature and the like exceed the control range, the color after browning can be changed into different shades, so that the undesirable phenomenon of redness or blushing appears.
Step S102: laminating and pressing a soft board layer, a protective film, a prepreg and the thick core board with the first groove, wherein the protective film and the prepreg are sequentially positioned at two sides of the soft board layer; the prepreg has a through hole, and the first surface faces the protective film.
It can be understood that, on each side of the flexible board layer, there are a protective film, a prepreg having a through hole, and a thick core board having a first groove in sequence in a direction away from the flexible board layer, that is, after lamination, there are a thick core board having a first groove, a prepreg having a through hole, a protective film, a flexible board layer, a protective film, a prepreg having a through hole, and a thick core board having a first groove in sequence from left to right. The first surface faces to the direction of the protective film, namely the second surface of the thick core plate is positioned at the outermost side after lamination and lamination.
When the lamination is carried out, the soft board layer and the protective films positioned on two sides of the soft board layer are firstly laminated and pressed, and then the prepreg with the through hole and the thick core board with the first groove are laminated.
It should be noted that, in the present application, the number of the plies in the flexible plies is not specifically limited, as the case may be. For example, the number of plate layers in a thick core plate may be 3, 5, etc.
The manufacturing process of the soft board layer comprises the steps of cutting, electroplating, drilling the board layer in the soft board layer, arranging an inner layer circuit on the surface of the board layer in the soft board layer, carrying out Automatic Optical Inspection (AOI) on the inner layer and carrying out browning treatment. And after the browning treatment, sticking protective films on two surfaces of the soft board layer, performing quick pressing, then performing browning treatment, and then laminating the soft board layer, the prepreg with the through hole and the thick core board with the first groove.
The prepreg is also called as a PP sheet, plays a role in bonding, and mainly comprises resin and reinforcing materials, and the reinforcing materials are divided into several types such as glass fiber cloth, paper base, composite materials and the like. Most prepregs (bonding sheets) used for manufacturing the multilayer printed board adopt glass fiber cloth as a reinforcing material, the treated glass fiber cloth is soaked in resin glue solution, and the prepreg is prepared by heat treatment and pre-drying. The prepreg is provided with the through holes to avoid the difficulty in uncovering at the later stage caused by overlarge PP glue overflow. The protective film is abbreviated as CVL (cover lay) and plays a role in protecting the soft board layer.
Step S103: respectively forming second grooves on the second surfaces of the two thick core plates corresponding to the first grooves, wherein the depth of each second groove is smaller than the thickness of the thick core plate, so as to obtain a rigid-flexible board; the first surface and the second surface are opposite, and the sum of the depths of the first groove and the second groove is not less than the thickness of the thick core plate.
The reason why the depth of the second groove is smaller than the thickness of the thick core plate is that: because the first groove has been already opened to thick core board, if the degree of depth of second groove is not less than thick core board thickness, the process of seting up the recess can cause the damage to the protection film.
The depth of the first groove and the second groove is not less than the thickness of the thick core plate, so that the thick core plate is guaranteed to be uncapped, and incomplete uncapping of the thick core plate is avoided.
The opening mode of the first groove is not particularly limited in the application and can be selected by oneself.
As an implementable manner, the forming of the second grooves on the second surfaces of the two thick core plates at positions corresponding to the first grooves respectively includes: a first groove is formed in the first surface of the thick core plate in a laser cutting mode.
As another practical mode, the forming the second grooves on the second surfaces of the two thick core plates at positions corresponding to the first grooves respectively includes: and respectively forming second grooves on the second surfaces of the two thick core plates corresponding to the first grooves by adopting a CNC (computerized numerical control) machining process. The CNC (computer numerical control) machining process is a process for numerically controlling the milling groove depth by a computer, namely the depth of the second groove can be accurately controlled, and the CNC machining process has low cost for milling the second groove.
When a CNC machining process is adopted to form the second groove, the depth of the second groove is H2H/2+0.1, wherein H2Is the depth of the second groove, and H is the thickness of the thick core plate. Correspondingly, the depth of the first groove is larger than H/2.
It should be noted that, in the manufacturing process of the rigid-flex board, after the flexible board layer, the protective films, the prepregs, and the thick core boards sequentially located at two sides of the flexible board layer are stacked and pressed, before the second grooves are respectively formed at positions corresponding to the first grooves on the second surfaces of the two thick core boards, the steps of Xray detection, via hole drilling through the entire thickness of the rigid-flex board, electroplating, outer circuit arrangement, etching, outer AOI (automated optical inspection), and solder mask need to be performed, and after the second grooves are formed, the steps of surface treatment, molding, electrical measurement, and packaging need to be performed on the rigid-flex board. Wherein, the drilling of the through hole is carried out by adopting a special drilling machine.
Wherein, the manufacturing process of the outer layer circuit roughly comprises the following steps: the pretreatment utilizes strong water pressure to drive the liquid medicine, so that the liquid medicine is sprayed on the panel to remove oil stains and the like on the panel to achieve the cleaning effect; pressing a film, namely pressing a layer of photosensitive film on the copper surface for subsequent image transfer; exposing, namely using an automatic exposure machine to operate, and using ultraviolet rays to make photosensitive substances in the photosensitive film perform chemical reaction so as to fulfill the aim of image transfer; developing, after the photosensitive film receives light, respectively developing and etching the areas not receiving light and the copper layers below the areas not receiving light, wherein the developing solution can adopt a sodium carbonate solution, and then stripping the photosensitive layer; and etching, namely etching the leaked copper layer, wherein the left copper layer is the outer copper surface circuit.
The solder mask manufacturing process generally comprises: pre-treatment, namely removing oil stains, oxide layers and the like on the board surface by using any one of a brushing method, a sand blasting method and a chemical method, and roughening the copper surface to increase the adhesive force with the printing ink; printing, namely covering a layer of photosensitive solder resist ink on a layout by a screen printing mode; prebaking, baking by using an oven to remove the solvent in the ink so as to harden the surface of the ink; exposing, namely exposing the ink by using an automatic exposure machine to enable the ink to generate polymerization reaction so as to achieve the purposes of resistance welding, insulation and panel protection; developing, namely removing the ink which does not receive light by using a sodium carbonate solution; and final baking, namely baking the photosensitive ink to completely harden and crosslink the photosensitive ink so as to enhance the soldering resistance.
The anti-welding aims to reserve a via hole and an electrode of the rigid-flex board, cover all circuits and copper surfaces and prevent short circuit caused by inserting components; prevent the damage of moisture and various electrolytes from oxidizing the wires and prevent the damage of external machines so as to maintain the good insulation of the plate surface.
The thickness of the thick core plate is not specifically limited in the application, and particularly when the thickness of the thick core plate is more than 0.5 millimeter, the soft-hard combined plate obtained by the manufacturing method in the application can completely prevent the protective film from being damaged. The manufacturing method of the rigid-flex Board is suitable for designing and processing all PCBs (Printed Circuit boards) needing uncovering treatment.
When the thick core plate is processed, firstly, a first groove is formed in the first surface of the thick core plate, after the thick core plate, the prepreg, the protective film and the soft plate layer are laminated and pressed, a second groove is formed in the second surface of the thick core plate, the sum of the depths of the first groove and the second groove is not less than the thickness of the thick core plate, namely, the opening of the thick core plate is completed by adopting twice grooving, the depth of the second groove is less than the thickness of the thick core plate, and the protective film is prevented from being damaged when the second groove is formed; and, this application is seted up first recess earlier, can reduce the degree of depth when the second surface fluting, and in addition, the degree of depth of first recess is less than the thickness of thick core plate, can avoid the corruption injury of printing ink, the immersion fluid that uses when drilling, printed circuit on the second surface to the protection film.
On the basis of any one of the above embodiments, in an embodiment of the present application, a manufacturing method of the prepreg includes:
and adopting a CNC (computer numerical control) processing technology to open the through holes on the prepreg to be processed to obtain the prepreg. The through holes are manufactured by the CNC machining process, so that the manufacturing precision of the through holes can be improved, and the manufacturing cost can be reduced.
However, the method for manufacturing the prepreg through hole is not specifically limited in the present application, and in other embodiments of the present application, a laser cutting method may be used to form a through hole in the prepreg to be processed, so as to obtain the prepreg.
In order to improve the qualification rate of the rigid-flex board, after the rigid-flex board is obtained, the method further comprises the following steps:
and carrying out defect inspection on the rigid-flexible printed circuit board, and screening out qualified rigid-flexible printed circuit boards.
The defect inspection is to perform Final Quality Control (FQC) on the hard-soft combined board, and includes, but is not limited to, appearance inspection (e.g., color, gloss, roughness, burrs, scratches, etc.), performance inspection (e.g., electrical characteristics, mechanical characteristics, etc.), and packaging the hard-soft combined board that is screened to be qualified.
Referring to fig. 2, fig. 2 is a flowchart illustrating another method for manufacturing a rigid-flex board according to an embodiment of the present disclosure. On the basis of any one of the above embodiments, the method comprises:
step S201: first grooves are respectively formed in the first surfaces of the two thick core plates, and the depth of each first groove is smaller than the thickness of each thick core plate.
Step S202: and filling a glue blocking material in the first groove.
The glue blocking material is filled in the first groove, so that the situation that during pressing, glue flowing (PP) enters the first groove and is difficult to clean subsequently can be avoided.
The type of the glue blocking material is not specifically limited in the application and can be selected by self. For example, the glue-blocking material can be Polyimide (PI), which has good mechanical properties and thermal stability; the glue-resisting material can also be silica gel and the like.
Step S203: laminating and pressing a soft board layer, a protective film, a prepreg and the thick core board with the first groove, wherein the protective film and the prepreg are sequentially positioned at two sides of the soft board layer; the prepreg has a through hole, and the first surface faces the protective film.
It can be understood that the first groove of the thick core board is filled with the glue blocking material in step S203.
Step S204: and respectively forming second grooves on the second surfaces of the two thick core plates corresponding to the first grooves, wherein the depth of each second groove is smaller than the thickness of the thick core plate, the first surface and the second surface are opposite, and the depth of each first groove and the depth of each second groove are not smaller than the thickness of the thick core plate.
Step S205: and taking out the glue blocking material through the second groove to obtain the rigid-flex board.
It should be noted that steps S201, S203, and S204 refer to steps S101, S102, and S103 in the above embodiment, and detailed descriptions thereof are omitted in this embodiment.
The following explains a manufacturing process of the hard laminate in the present application in a specific case.
Step S1: the structure schematic diagram of the flexible board layer is shown in fig. 3, the number of layers of the flexible board layer 1 is 3, and the upper and lower two flexible board layers of the flexible board layer 1 are respectively called L3 and L4. And calculating the final integral lamination expansion and shrinkage proportion according to the expansion and shrinkage of the laminated protective layer from L3 to L4, so as to conveniently adjust the subsequent lamination parameters.
Step S2: and (3) sticking protective films 2 on two sides of the soft board layer 1, and performing rapid pressing and browning treatment. The soft board layer after the protective film is attached is shown in fig. 4.
Step S3: two thick core boards 3 with a thickness of 0.65 mm are obtained after the processes of cutting, inner drilling, inner layer circuit and inner layer AOI (automatic optical inspection), and for convenience of description, the two thick core boards are respectively called a first thick core board and a second thick core board, and the structural schematic diagrams of the first thick core board and the second thick core board please refer to fig. 5 and 6, the number of the first thick core board 3 and the second thick core board 3 is 3, the upper and lower board layers of the first thick core board 3 are respectively called L1 and L2, and the upper and lower board layers of the second thick core board 3 are respectively called L5 and L6.
Step S4: a first groove 6 is milled in the outer surface of the first thick core plate layer L2 by using a CNC (computer numerical control) machining process, and a first groove 6 is milled in the outer surface of the second thick core plate layer L5 by using a CNC (computer numerical control) machining process, please refer to fig. 7 and 8, and the depth of the first groove 6 is 0.35 mm.
Step S5: and performing brown oxidation treatment on the two thick core plates with the first grooves.
Step S6: and respectively performing groove milling treatment on the two prepregs to be processed in a laser cutting mode, and milling through holes 5 to obtain prepregs 4, please refer to fig. 9.
Step S7: adding a glue blocking material 7 into the first grooves 6 of the two thick core boards 3, laminating and laminating the second thick core board 3, the prepreg 4, the soft board layer 1 after the protective film 2 is attached, the prepreg 4 and the first thick core board 3 from bottom to top, and the schematic diagram after lamination is shown in fig. 10.
Step S8: the second thick core board 3, the prepreg 4, the flexible board layer 1 after the protective film 2 is attached, the prepreg 4 and the first thick core board 3 after the lamination are sequentially subjected to Xray detection, via holes 8 penetrating through the whole thickness of the rigid-flex board are drilled, electroplating, outer layer circuit arrangement, etching, outer layer AOI (automated optical inspection) and anti-welding are arranged on the outer surface of the board layer L1 in the first thick core board and the outer surface of the board layer L6 in the second thick core board, and a schematic diagram of the rigid-flex board after the via holes are drilled is shown in fig. 11.
Step S9: a second groove 9 is milled at a position where the outer surface of the slab layer L1 in the first thick core plate corresponds to the first groove in the first thick core plate by using a CNC (computer numerical control) machining process, and the second groove 9 is milled at a position where the outer surface of the slab layer L6 in the second thick core plate corresponds to the first groove in the second thick core plate by using a CNC (computer numerical control) machining process, as shown in fig. 12, the depth of the second groove is 0.425 mm.
Step S10: and taking out the glue-blocking material, and sequentially carrying out surface treatment, molding, electrical measurement, defect detection and packaging on the rigid-flexible printed circuit board to obtain the rigid-flexible printed circuit board, wherein the schematic diagram of the rigid-flexible printed circuit board is shown in fig. 13.
The application also provides a rigid-flex board, which is manufactured by the rigid-flex board manufacturing method in any one of the embodiments.
The soft-hard combined board comprises a soft board layer, and protective films, prepregs and a thick core board which are sequentially arranged on two sides of the soft board layer, wherein when the soft-hard combined board is manufactured, a first groove is formed in a first surface of the thick core board, after the thick core board, the prepregs, the protective films and the soft board layer are laminated and pressed, a second groove is formed in a second surface of the thick core board, the sum of the depths of the first groove and the second groove is not less than the thickness of the thick core board, namely, the thick core board is opened by adopting twice grooving, and the depth of the second groove is less than the thickness of the thick core board, so that the protective films are prevented from being damaged when the second groove is formed; and, this application is seted up first recess earlier, can reduce the degree of depth when the second surface fluting, and in addition, the degree of depth of first recess is less than the thickness of thick core plate, can avoid the corruption injury of printing ink, the immersion fluid that uses when drilling, printed circuit on the second surface to the protection film.
The application also provides an electronic product, which comprises the rigid-flex board in the embodiment.
It should be noted that the electronic products include, but are not limited to, mobile phones, computers, tablets, handheld game devices, media players, and the like.
In the manufacturing process of the rigid-flex board of the electronic product, when a thick core board is processed, a first groove is firstly formed in the first surface of the thick core board, after the thick core board, a prepreg, a protective film and a soft board layer are laminated and pressed, a second groove is formed in the second surface of the thick core board, the sum of the depths of the first groove and the second groove is not less than the thickness of the thick core board, namely, the opening of the thick core board is completed by adopting two-time grooving, and the depth of the second groove is less than the thickness of the thick core board, so that the protective film is prevented from being damaged when the second groove is formed; and, this application is seted up first recess earlier, can reduce the degree of depth when the second surface fluting, and in addition, the degree of depth of first recess is less than the thickness of thick core plate, can avoid the corruption injury of printing ink, the immersion fluid that uses when drilling, printed circuit on the second surface to the protection film.
The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same or similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
The rigid-flex board, the manufacturing method thereof and the electronic product provided by the application are introduced in detail above. The principles and embodiments of the present application are explained herein using specific examples, which are provided only to help understand the method and the core idea of the present application. It should be noted that, for those skilled in the art, it is possible to make several improvements and modifications to the present application without departing from the principle of the present application, and such improvements and modifications also fall within the scope of the claims of the present application.
Claims (10)
1. A manufacturing method of a rigid-flex board is characterized by comprising the following steps:
respectively forming first grooves on the first surfaces of the two thick core plates, wherein the depth of each first groove is smaller than the thickness of each thick core plate;
laminating and pressing a soft board layer, a protective film, a prepreg and the thick core board with the first groove, wherein the protective film and the prepreg are sequentially positioned at two sides of the soft board layer; the prepreg is provided with a through hole, and the first surface faces the protective film;
respectively forming second grooves on the second surfaces of the two thick core plates corresponding to the first grooves, wherein the depth of each second groove is smaller than the thickness of the thick core plate, so as to obtain a rigid-flexible board;
the first surface and the second surface are opposite, and the sum of the depths of the first groove and the second groove is not less than the thickness of the thick core plate.
2. The manufacturing method of the rigid-flex board as recited in claim 1, wherein the step of forming second grooves on the second surfaces of the two thick core boards corresponding to the first grooves respectively comprises:
and respectively forming second grooves on the second surfaces of the two thick core plates corresponding to the first grooves by adopting a CNC (computerized numerical control) machining process.
3. The method for manufacturing an rigid-flex board according to claim 2, wherein the depth of the second groove is H2H/2+0.1, wherein H2Is the depth of the second groove, and H is the thickness of the thick core plate.
4. The method for manufacturing the rigid-flex board according to claim 1, wherein the prepreg is manufactured in a manner that:
and adopting a CNC (computer numerical control) processing technology to open the through holes on the prepreg to be processed to obtain the prepreg.
5. The method for manufacturing a rigid-flex board according to claim 1, wherein the forming of the first grooves on the first surfaces of the two thick core boards respectively comprises:
and respectively forming the first grooves on the first surfaces of the two thick core plates by adopting a CNC (computerized numerical control) machining process.
6. The method for manufacturing a rigid-flex board according to claim 1, further comprising, after the rigid-flex board is obtained:
and carrying out defect inspection on the rigid-flexible printed circuit board, and screening out qualified rigid-flexible printed circuit boards.
7. The method for manufacturing a rigid-flex board according to any one of claims 1 to 6, wherein before laminating and laminating the flexible board layer, the protective films, the prepregs and the thick core boards which are sequentially positioned at two sides of the flexible board layer, the method further comprises:
filling a glue blocking material in the first groove;
correspondingly, after the second grooves are respectively formed on the second surfaces of the two thick core plates corresponding to the first grooves, the method further comprises the following steps:
and taking out the glue resisting material through the second groove.
8. The method for manufacturing a rigid-flex board according to claim 7, wherein the glue-blocking material is polyimide.
9. A rigid-flex board, characterized in that the rigid-flex board is manufactured by the rigid-flex board manufacturing method according to any one of claims 1 to 8.
10. An electronic product, characterized in that the electronic product comprises the rigid-flex board according to claim 9.
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