CN108521723A - A kind of production method of Rigid Flex - Google Patents
A kind of production method of Rigid Flex Download PDFInfo
- Publication number
- CN108521723A CN108521723A CN201810493802.9A CN201810493802A CN108521723A CN 108521723 A CN108521723 A CN 108521723A CN 201810493802 A CN201810493802 A CN 201810493802A CN 108521723 A CN108521723 A CN 108521723A
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- China
- Prior art keywords
- soft board
- core plate
- plate
- hardboard
- rigid flex
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a kind of production methods of Rigid Flex, include the following steps：The internal layer circuit of soft board core plate and hardboard core plate is made respectively；The soft board core plate includes soft board region and soft or hard calmodulin binding domain CaM；Soft board region contraposition on soft board core plate fits over film；The periphery controlled depth milling blind slot at the soft board region is corresponded on hardboard core plate, is retained certain remaining thickness and is used as dowel；Soft board core plate and hardboard core plate are pressed into production plate with not gummosis PP, and corresponds on not gummosis PP and opens a window at the soft board region, and has the one of blind slot to be placed on outside on hardboard core plate；Outer-layer circuit and solder mask are made successively on production plate, are then surface-treated；Continue inside gong slot gong on the basis of original blind slot on producing plate and remove dowel, remove the part for corresponding to the soft board region on hardboard core plate after taking off lid, Rigid Flex is made.Soft board region is effectively protected using the method for the present invention and erosion and mechanical wear wiping flower are not stung by liquid medicine.
Description
Technical field
The present invention relates to printed wiring board manufacture technology fields, and in particular to a kind of production method of Rigid Flex.
Background technology
Rigid Flex is provided simultaneously with the characteristic of FPC and the characteristic of PCB, and therefore, it, which can be used for some, particular/special requirement
Products, existing certain flexure region also has certain rigid region, to saving interiors of products space, reduces finished product
Volume enhances product performance and is very helpful.The universal system by the way of opening window of the production method of existing Rigid Flex
Make, i.e., by the corresponding hardboard subregion in soft board region, first directly gong presses again after falling, and soft board region can be made naked after pressing in this way
It is exposed, the problems such as machinery wipes flower, alkaline medicinal liquid stings erosion is easy tod produce in the technological process below
Invention content
The present invention has that nog plate is bad after being directed to existing Rigid Flex filling holes with resin, provides a kind of soft or hard combination
The production method of plate is effectively protected soft board region using this method and does not sting erosion and mechanical wear wiping flower by liquid medicine.
In order to solve the above technical problem, the present invention provides a kind of production methods of Rigid Flex, including following step
Suddenly：
S1, the internal layer circuit for making soft board core plate and hardboard core plate respectively；The soft board core plate includes soft board region and soft
Hard calmodulin binding domain CaM；
S2, the soft board region contraposition on soft board core plate fit over film；
S3, periphery controlled depth milling blind slot at the soft board region is corresponded on hardboard core plate, retain certain remaining thick conduct
Dowel；
S4, soft board core plate and hardboard core plate are pressed into production plate with not gummosis PP, and on not gummosis PP described in correspondence
It opens a window at soft board region, and has the one of blind slot to be placed on outside on hardboard core plate；
S5, outer-layer circuit and solder mask are made successively on production plate, be then surface-treated；
S6, continue inside gong slot gong on the basis of original blind slot on producing plate and remove dowel, remove hardboard core after taking off lid
The part in the soft board region is corresponded on plate, and Rigid Flex is made.
Preferably, in step S2, the cover film is unilateral bigger 1mm than the soft board region.
Preferably, further include step between step S2 and S3：
S21, cover film and soft board core plate bonded completely by way of quick pressing；
S22, soft board core plate is toasted, cover film is made to cure.
Preferably, in step S21, the parameter of quick pressing is：180 DEG C, pressure 100KG, pressing time 1-2min of temperature.
Preferably, in step S3, controlled depth milling blind slot is carried out by way of laser cutting.
Preferably, in step S3, as hardboard core thickness ＞ 0.5mm, the remaining thickness ＞ 0.25mm of controlled depth milling blind slot；When hard
Plate core plate thickness is in 0.3-0.5mm, the remaining thickness ＞ 0.15mm of controlled depth milling blind slot；When hardboard core thickness is in 0.25-0.3mm
When, the remaining thickness ＞ 0.1mm of controlled depth milling blind slot.
Preferably, in step S4, rivet hole is bored in the corresponding position of soft board core plate and hardboard core plate respectively before pressing, it is soft
Plate core plate and hardboard core plate are pressed after being fixed by closing-up.
Preferably, in step S4, the windowing it is unilateral bigger 0-0.35mm than the soft board region.
Preferably, in step S5, before making outer-layer circuit, production plate also passes through outer layer drilling, heavy copper and full plate successively
The process of plating.
Preferably, in step S6, the burr taken off and generated on edge after lid is removed by way of laser cutting.
Compared with prior art, the present invention has the advantages that：
The present invention, when making hardboard core plate, soft board is corresponded in hardboard core plate by fitting over film in soft board region
The periphery in region gong slot by way of controlled depth milling blind slot retains certain thickness remaining thickness and is used as dowel, then by soft board core
Plate and hardboard core plate press together, and have the one of blind slot to be placed on outside on hardboard core plate, so can ensure that pressing
When whole plate planarization, two are not removed to correspond to the hardboard core plate part in soft board region, can be effectively protected soft board region not
Erosion is stung by liquid medicine and mechanical wear wipes flower；And what the method for the present invention did not interfered with the later stage takes off lid, has ensured Rigid Flex
Quality.
Specific implementation mode
In order to more fully understand the technology contents of the present invention, below in conjunction with specific embodiment to the technical side of the present invention
Case is described further and illustrates.
Embodiment
The present embodiment provides a kind of method that Rigid Flex makes, concrete technology is as follows：
(1), sawing sheet：Soft board core plate and hardboard core plate, soft board core thickness are outputed by jigsaw size 520mm × 620mm
0.075mm, outer copper foil thickness are 0.5OZ, and the soft board core plate includes soft board region and soft or hard calmodulin binding domain CaM；Hardboard core plate is thick
0.36mm is spent, outer copper foil thickness is 0.5OZ.
(2), internal layer circuit makes (negative film technique)：Inner figure shifts, and light-sensitive surface, light-sensitive surface are coated with vertical application machine
8 μm of film thickness monitoring, using Full-automatic exposure machine, with 5-6 lattice exposure guide rule (21 lattice exposure guide rule) respectively in soft board core plate and hardboard
Internal layer circuit exposure is completed on core plate；Internal layer etch, by after exposure imaging soft board core plate and hardboard core plate etch interior layer line
Road, it is 3mil that internal layer line width, which measures,；Then internal layer AOI checks that the open short circuit, circuit notch, circuit pin hole etc. of internal layer circuit lack
It falls into, defective to scrap processing, flawless product goes out to downstream.
(3), brown：By way of chemical reaction, in a kind of brown oxidation layer of soft board core plate layers of copper Surface Creation, make copper
The roughness in face becomes larger, enhancing pressing when and cover film binding force.
(4), epiphragma is pasted：Soft board region contraposition on soft board core plate fits over film, and cover film is unilateral compares soft board
The big 1mm in region；The cover film is polyimides (PI materials).
Wherein, it before fitting, according to the shape in soft board region, is corresponded on the cover film of size identical as soft board core plate soft or hard
Calmodulin binding domain CaM carries out windowing processing.
(5), quick pressing：By way of high temperature and pressure, in the short time by the glue-line (epoxy resin) of cover film with it is soft
The soft board region of plate core plate bonds completely, achievees the effect that protect soft board region；The parameter of quick pressing is：180 DEG C of temperature, pressure
Power 100KG, pressing time 1-2min.
(6), baking sheet：Soft board core plate toasts 1h at 150 DEG C, and cover film is made to be fully cured.
(7), OPE punchings：The rivet hole of pressing is gone out in the corresponding position of soft board core plate and hardboard core plate.
(8), controlled depth milling blind slot：The periphery at the soft board region is corresponded on hardboard core plate by way of laser cutting
Controlled depth milling blind slot, blind slot is deep-controlled in 0.10mm-0.15mm, retains certain remaining thickness and is used as dowel.
(9), brown：By way of chemical reaction, in soft board core plate and a kind of brown of hardboard core plate layers of copper Surface Creation
Oxide layer makes the roughness of copper face become larger, enhancing pressing when and PP binding force.
(10), it presses：After soft board core plate and hardboard core plate are superimposed together in advance with not gummosis PP (specific plate-laying sequence by
Top to bottm is hardboard core plate, not gummosis PP, soft board core plate, not gummosis PP, hardboard core plate), it is first carried out with rivet by rivet hole
Then riveted is pressed into production plate by way of high temperature and pressure, have the one of blind slot to be placed on outside on hardboard core plate after pressing
Side, the side of non-groove milling are contacted with not gummosis PP.
Before pressing, not gummosis PP pieces are outputed according to the size of soft board core plate, the flexible board area is corresponded in not gummosis PP on pieces
It opens a window at domain, the window size is unilateral bigger 0-0.35mm than the soft board region, makes pressing by the dimensional fits with cover film
The edge of cover film is pushed down by not gummosis PP afterwards, and cover film is broken away together when the later stage being further prevented to take off lid.
(11), outer layer drills：It is drilled on production plate using the mode of machine drilling according to borehole data.
(12), heavy copper：One layer of thin copper is deposited by way of chemical reaction on hole wall, is provided for subsequent electric plating of whole board
Basis, backlight test 10 grades, and the heavy copper thickness in hole is 0.5 μm.
(13), electric plating of whole board --- according to the mechanism of electrochemical reaction, last layer copper is electroplated on the basis of heavy copper, ensures
Hole copper thickness reaches product requirement, and electroplating parameter is set according to hole copper thickness is completed.
(14), outer-layer circuit (positive blade technolgy) is made：Outer graphics shift, luxuriant and rich with fragrance using Full-automatic exposure machine and positive circuit
Woods completes outer-layer circuit exposure with 5-7 lattice exposure guide rule (21 lattice exposure guide rule), developed, and outer-layer circuit figure is formed on production plate
Shape；Outer graphics are electroplated, then the copper facing and tin plating respectively on production plate, and electroplating parameter is set according to desired completion copper thickness,
Copper facing is the current density electric plating of whole board 60min with 1.8ASD, and tin plating is that 10min is electroplated with the current density of 1.2ASD, and tin is thick
3-5μm；Then it moves back film successively again, etch and move back tin, outer-layer circuit is etched on production plate；Outer layer AOI, uses automated optical
Detecting system, by the comparison with CAM data, whether detection outer-layer circuit has the defects of open circuit, notch, not clean, short-circuit etching.
(15), welding resistance, silk-screen character：By making green oil layer and silk-screen character in production plate outer layer, green oil thickness is：
10-50 μm, so as to so that production plate can reduce influence of the environmental change to it during subsequent use.
(16), surface treatment (heavy nickel gold)：Principle is learned in pad copper face Tonghua of welding resistance windowing position, and uniform deposition centainly requires
The nickel layer and layer gold of thickness, nickel layer thickness are：3-5μm；Layer gold thickness is：0.05-0.1μm.
(17), it is molded：According to the prior art and press design requirement gong shape, the +/- 0.05mm of external form tolerance.
(18), gong platform：Continue inside gong slot gong on the basis of original blind slot on producing plate and remove dowel, by taking off lid
It will produce and correspond to the waste material in soft board region on plate and removed from product and (take off and remove after covering and correspond to the soft board region on hardboard core plate
Part), expose internal soft board region part, form platform, Rigid Flex is made.
(19), it is cut by laser：The burr taken off and generated on platform inward flange after lid is removed by way of laser cutting, is protected
It is round and smooth to demonstrate,prove neat in edge, improves the quality of production board.
(20), electrical testing --- the electrically conducting performance of production board is tested, this plate is using test method：Flying probe.
(21), FQC --- check appearance, hole copper thickness, thickness of dielectric layers, green oil thickness, the internal layer copper thickness etc. of production board
Whether the requirement of client is met.
(22), pack --- according to the manner of packing and packaging quantity of customer requirement, packaging is sealed to production board,
And it is allowed to dry drying prescription and humidity card, then shipment.
In other embodiments of the invention, as hardboard core plate (not cupric) thickness G T.GT.GT 0.5mm, the depth of controlled depth milling blind slot
Degree control makes the remaining thickness ＞ 0.25mm at dowel in 0.15-0.25mm；When hardboard core plate (not cupric) thickness is in 0.3-
When 0.5mm, controlled depth milling blind slot it is deep-controlled in 0.1-0.15mm, make the remaining thickness ＞ 0.15mm at dowel；When hardboard core plate
(not cupric) thickness in 0.25-0.3mm, controlled depth milling blind slot it is deep-controlled in 0.08-0.15mm, make the remaining thickness at dowel
＞ 0.1mm.
It is provided for the embodiments of the invention technical solution above to be described in detail, specific case used herein
The principle and embodiment of the embodiment of the present invention are expounded, the explanation of above example is only applicable to help to understand this
The principle of inventive embodiments；Meanwhile for those of ordinary skill in the art, embodiment according to the present invention, in specific embodiment party
There will be changes in formula and application range, in conclusion the content of the present specification should not be construed as limiting the invention.
Claims (10)
1. a kind of production method of Rigid Flex, which is characterized in that include the following steps：
S1, the internal layer circuit for making soft board core plate and hardboard core plate respectively；The soft board core plate includes soft board region and soft or hard knot
Close region；
S2, the soft board region contraposition on soft board core plate fit over film；
S3, periphery controlled depth milling blind slot at the soft board region is corresponded on hardboard core plate, retain certain remaining thick as connection
Muscle；
S4, soft board core plate and hardboard core plate are pressed into production plate with not gummosis PP, and correspond to the soft board on not gummosis PP
It opens a window at region, and has the one of blind slot to be placed on outside on hardboard core plate；
S5, outer-layer circuit and solder mask are made successively on production plate, be then surface-treated；
S6, continue inside gong slot gong on the basis of original blind slot on producing plate and remove dowel, remove on hardboard core plate after taking off lid
The part in the corresponding soft board region, is made Rigid Flex.
2. the production method of Rigid Flex according to claim 1, which is characterized in that in step S2, the cover film
It is unilateral bigger 1mm than the soft board region.
3. the production method of Rigid Flex according to claim 1, which is characterized in that further include between step S2 and S3
Step：
S21, cover film and soft board core plate bonded completely by way of quick pressing；
S22, soft board core plate is toasted, cover film is made to cure.
4. the production method of Rigid Flex according to claim 3, which is characterized in that in step S21, quick pressing
Parameter is：180 DEG C, pressure 100KG, pressing time 1-2min of temperature.
5. the production method of Rigid Flex according to claim 1, which is characterized in that in step S3, cut by laser
The mode cut carries out controlled depth milling blind slot.
6. the production method of Rigid Flex according to claim 5, which is characterized in that in step S3, when hardboard core plate
When thickness G T.GT.GT 0.5mm, the remaining thickness ＞ 0.25mm of controlled depth milling blind slot；When hardboard core thickness is in 0.3-0.5mm, controlled depth milling blind slot
Remaining thickness ＞ 0.15mm；When hardboard core thickness is in 0.25-0.3mm, the remaining thickness ＞ 0.1mm of controlled depth milling blind slot.
7. the production method of Rigid Flex according to claim 1, which is characterized in that in step S4, before pressing respectively
Rivet hole is bored in the corresponding position of soft board core plate and hardboard core plate, after soft board core plate and hardboard core plate are fixed by closing-up
It is pressed.
8. the production method of Rigid Flex according to claim 1, which is characterized in that in step S4, the windowing
It is unilateral bigger 0-0.35mm than the soft board region.
9. the production method of Rigid Flex according to claim 1, which is characterized in that in step S5, making outer layer
Before circuit, production plate is also successively by outer layer drilling, the process of heavy copper and electric plating of whole board.
10. the production method of Rigid Flex according to claim 1, which is characterized in that in step S6, cut by laser
The mode cut removes the burr taken off and generated on edge after lid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810493802.9A CN108521723A (en) | 2018-05-22 | 2018-05-22 | A kind of production method of Rigid Flex |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810493802.9A CN108521723A (en) | 2018-05-22 | 2018-05-22 | A kind of production method of Rigid Flex |
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| CN108521723A true CN108521723A (en) | 2018-09-11 |
Family
ID=63426657
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| CN201810493802.9A Pending CN108521723A (en) | 2018-05-22 | 2018-05-22 | A kind of production method of Rigid Flex |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110678011A (en) * | 2019-11-12 | 2020-01-10 | 江门崇达电路技术有限公司 | Manufacturing method of rigid-flex printed circuit board |
| CN110913586A (en) * | 2019-11-08 | 2020-03-24 | 通元科技(惠州)有限公司 | Manufacturing method of semi-flexible printed circuit board |
| CN111683457A (en) * | 2020-05-12 | 2020-09-18 | 江门崇达电路技术有限公司 | Manufacturing method of rigid-flex board |
| CN112672514A (en) * | 2020-12-30 | 2021-04-16 | 黄石西普电子科技有限公司 | Preparation method of rigid-flexible printed circuit board and rigid-flexible printed circuit board |
| CN113179595A (en) * | 2021-03-25 | 2021-07-27 | 红板（江西）有限公司 | One-time plate milling and forming processing technology for soft and hard combined plate |
| CN114786337A (en) * | 2021-12-28 | 2022-07-22 | 龙南骏亚柔性智能科技有限公司 | Novel soft-hard combined circuit board pre-control deep processing method |
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| JPH09153680A (en) * | 1995-11-30 | 1997-06-10 | Sharp Corp | Manufacture of multilayered flexible rigid printed wiring board |
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| CN106304697A (en) * | 2016-08-24 | 2017-01-04 | 江门崇达电路技术有限公司 | A kind of manufacture method of false rigid-flex combined board |
| CN106358367A (en) * | 2016-11-10 | 2017-01-25 | 安海娟 | Rigid-flex combined plate and manufacturing method thereof |
| CN108040427A (en) * | 2017-11-22 | 2018-05-15 | 江门崇达电路技术有限公司 | One kind solves the undesirable method of Rigid Flex filling holes with resin nog plate |
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| JPH09153680A (en) * | 1995-11-30 | 1997-06-10 | Sharp Corp | Manufacture of multilayered flexible rigid printed wiring board |
| CN102256438A (en) * | 2011-05-09 | 2011-11-23 | 厦门市英诺尔电子科技有限公司 | Novel rigid-flexible PCB (printed circuit board) and manufacturing method thereof |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110913586A (en) * | 2019-11-08 | 2020-03-24 | 通元科技(惠州)有限公司 | Manufacturing method of semi-flexible printed circuit board |
| CN110678011A (en) * | 2019-11-12 | 2020-01-10 | 江门崇达电路技术有限公司 | Manufacturing method of rigid-flex printed circuit board |
| CN111683457A (en) * | 2020-05-12 | 2020-09-18 | 江门崇达电路技术有限公司 | Manufacturing method of rigid-flex board |
| CN112672514A (en) * | 2020-12-30 | 2021-04-16 | 黄石西普电子科技有限公司 | Preparation method of rigid-flexible printed circuit board and rigid-flexible printed circuit board |
| CN113179595A (en) * | 2021-03-25 | 2021-07-27 | 红板（江西）有限公司 | One-time plate milling and forming processing technology for soft and hard combined plate |
| CN114786337A (en) * | 2021-12-28 | 2022-07-22 | 龙南骏亚柔性智能科技有限公司 | Novel soft-hard combined circuit board pre-control deep processing method |
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