CN108617114A - A kind of production method of laser control depth covering type Rigid Flex - Google Patents
A kind of production method of laser control depth covering type Rigid Flex Download PDFInfo
- Publication number
- CN108617114A CN108617114A CN201810663980.1A CN201810663980A CN108617114A CN 108617114 A CN108617114 A CN 108617114A CN 201810663980 A CN201810663980 A CN 201810663980A CN 108617114 A CN108617114 A CN 108617114A
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- Prior art keywords
- soft board
- core plate
- rigid flex
- plate
- laser control
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a kind of production methods of laser control depth covering type Rigid Flex, include the following steps：The internal layer circuit of soft board core plate and hardboard core plate is made respectively；The soft board core plate includes soft board region and soft or hard calmodulin binding domain CaM；Soft board region contraposition on soft board core plate fits over film；Soft board core plate and hardboard core plate are pressed into production plate with not gummosis PP, and corresponds on not gummosis PP and opens a window at the soft board region；Outer-layer circuit and solder mask are made successively on production plate, are then surface-treated；It corresponds to by the way of laser cutting control at the position of soft board region surrounding on production plate and profoundly cut, remove the part for corresponding to the soft board region on hardboard core plate after taking off lid, Rigid Flex is made.Soft board region is effectively protected using the method for the present invention and erosion and mechanical wear wiping flower are not stung by liquid medicine.
Description
Technical field
The present invention relates to printed wiring board manufacture technology fields, and in particular to a kind of laser control depth covering type Rigid Flex
Production method.
Background technology
Rigid Flex is provided simultaneously with the characteristic of FPC and the characteristic of PCB, and therefore, it, which can be used for some, particular/special requirement
Products, existing certain flexure region also has certain rigid region, to saving interiors of products space, reduces finished product
Volume enhances product performance and is very helpful.The existing universal system by the way of opening window of method for making Rigid Flex
Make, i.e., by the corresponding hardboard subregion in soft board region, first directly gong presses again after falling, and soft board region can be made naked after pressing in this way
It is exposed, the problems such as machinery wipes flower, alkaline medicinal liquid stings erosion is easy tod produce in the technological process below.
Invention content
The present invention has that nog plate is bad after being directed to existing Rigid Flex filling holes with resin, and it is deep to provide a kind of laser control
The production method of covering type Rigid Flex is effectively protected soft board region using this method and does not sting erosion and machinery mill by liquid medicine
Damage wipes flower.
In order to solve the above technical problem, the present invention provides a kind of making sides of laser control depth covering type Rigid Flex
Method includes the following steps：
S1, the internal layer circuit for making soft board core plate and hardboard core plate respectively；The soft board core plate includes soft board region and soft
Hard calmodulin binding domain CaM；
S2, the soft board region contraposition on soft board core plate fit over film；
S3, soft board core plate and hardboard core plate are pressed into production plate with not gummosis PP, and on not gummosis PP described in correspondence
It opens a window at soft board region；
S4, outer-layer circuit and solder mask are made successively on production plate, be then surface-treated；
S5, correspond to by the way of being cut by laser control at the position of soft board region surrounding on production plate and profoundly cut,
Remove the part for corresponding to the soft board region on hardboard core plate after taking off lid, Rigid Flex is made.
Preferably, in step S2, the cover film is unilateral bigger 1mm than the soft board region.
Preferably, further include step between step S2 and S3：
S21, cover film and soft board core plate bonded completely by way of quick pressing；
S22, soft board core plate is toasted, cover film is made to cure.
Preferably, in step S21, the parameter of quick pressing is：180 DEG C, pressure 100KG, pressing time 1-2min of temperature.
Preferably, in step S3, rivet hole is bored in the corresponding position of soft board core plate and hardboard core plate respectively before pressing, it is soft
Plate core plate and hardboard core plate are pressed after being fixed by closing-up.
Preferably, in step S3, do not carry out cleaning treatment after gummosis PP windowings, then with this not gummosis PP by soft board core plate
It is pressed into production plate with hardboard core plate.
Preferably, in step S3, the windowing it is unilateral bigger 0-0.35mm than the soft board region.
Preferably, in step S4, before making outer-layer circuit, production plate also passes through outer layer drilling, heavy copper and full plate successively
The process of plating.
Preferably, in step S5, after taking off lid, dispensing is carried out in the soft board edges of regions of exposing and the junction of hardboard core plate
Processing.
Compared with prior art, the present invention has the advantages that：
The present invention is corresponded on not gummosis PP and is opened a window at soft board region by fitting over film in soft board region,
Soft board region part is corresponded in hardboard core plate to handle without windowing before pressing, but passes through laser after later stage molding procedure
The mode of cutting removes, and can be effectively protected soft board region and not sting erosion and mechanical wear wiping flower by liquid medicine；And using not when pressing
Gummosis PP pieces, there is no gummosis at the not windowing of gummosis PP after pressing, facilitate the later stage that the mode being cut by laser is selected to remove
Lid is taken off after waste material and cutting, the quality of Rigid Flex has been ensured, can also have been effectively improved and be cut by the way of laser cutting
The efficiency cut, and then improve the production efficiency of Rigid Flex.
Specific implementation mode
In order to more fully understand the technology contents of the present invention, below in conjunction with specific embodiment to the technical side of the present invention
Case is described further and illustrates.
Embodiment
The present embodiment provides a kind of production method of laser control depth covering type Rigid Flex, this method is suitable for 2-6 layers
Plate, and the hardboard core thickness adjacent with soft board core plate, in the making of 0.2mm Rigid Flexs below, concrete technology is as follows：
(1), sawing sheet：Soft board core plate and hardboard core plate, soft board core thickness are outputed by jigsaw size 520mm × 620mm
0.1mm, outer copper foil thickness are 0.5OZ, and the soft board core plate includes soft board region and soft or hard calmodulin binding domain CaM；Hardboard core thickness
0.18mm, outer copper foil thickness are 0.5OZ.
(2), internal layer circuit makes (negative film technique)：Inner figure shifts, and light-sensitive surface, light-sensitive surface are coated with vertical application machine
8 μm of film thickness monitoring, using Full-automatic exposure machine, with 5-6 lattice exposure guide rule (21 lattice exposure guide rule) respectively in soft board core plate and hardboard
Internal layer circuit exposure is completed on core plate；Internal layer etch, by after exposure imaging soft board core plate and hardboard core plate etch interior layer line
Road, it is 3mil that internal layer line width, which measures,；Then internal layer AOI checks that the open short circuit, circuit notch, circuit pin hole etc. of internal layer circuit lack
It falls into, defective to scrap processing, flawless product goes out to downstream.
(3), brown：By way of chemical reaction, in a kind of brown oxidation layer of soft board core plate layers of copper Surface Creation, make copper
The roughness in face becomes larger, enhancing pressing when and cover film binding force.
(4), epiphragma is pasted：Soft board region contraposition on soft board core plate fits over film, and cover film is unilateral compares soft board
The big 1mm in region；The cover film is polyimides (PI materials).
Wherein, it before fitting, according to the shape in soft board region, is corresponded on the cover film of size identical as soft board core plate soft or hard
Calmodulin binding domain CaM carries out windowing processing.
(5), quick pressing：By way of high temperature and pressure, in the short time by the glue-line (epoxy resin) of cover film with it is soft
The soft board region of plate core plate bonds completely, achievees the effect that protect soft board region；The parameter of quick pressing is：180 DEG C of temperature, pressure
Power 100KG, pressing time 1-2min.
(6), baking sheet：Soft board core plate toasts 1h at 150 DEG C, and cover film is made to be fully cured.
(7), OPE punchings：The rivet hole of pressing is gone out in the corresponding position of soft board core plate and hardboard core plate.
(8), it opens a window：Preferred dimension is the not gummosis PP of 520mm × 620mm, is corresponded on not gummosis PP at soft board region
Windowing, the window size are unilateral bigger 0-0.35mm than soft board region.
(9), it cleans：Cleaning treatment carried out to the not gummosis PP after windowing, removal not surfaces gummosis PP it is dirty, after guarantee
Binding force when phase presses.
(10), brown：By way of chemical reaction, in soft board core plate and a kind of brown of hardboard core plate layers of copper Surface Creation
Oxide layer makes the roughness of copper face become larger, binding force when enhancing pressing with not gummosis PP.
(11), it presses：After soft board core plate and hardboard core plate are superimposed together in advance with not gummosis PP (specific plate-laying sequence by
Top to bottm is hardboard core plate, not gummosis PP, soft board core plate, not gummosis PP, hardboard core plate), it is first carried out with rivet by rivet hole
Then riveted is pressed into production plate by way of high temperature and pressure.
Among the above, the side of cover film after pressing is made by the dimensional fits of window size and cover film on not gummosis PP
Edge is pushed down by not gummosis PP, and cover film is broken away together when the later stage being further prevented to take off lid, and is pressed using not gummosis PP,
Gummosis is not had at windowing, and later stage control is facilitated profoundly to cut and take off lid.
(12), outer layer drills：It is drilled on production plate using the mode of machine drilling according to borehole data.
(13), heavy copper：One layer of thin copper is deposited by way of chemical reaction on hole wall, is provided for subsequent electric plating of whole board
Basis, backlight test 10 grades, and the heavy copper thickness in hole is 0.5 μm.
(14), electric plating of whole board --- according to the mechanism of electrochemical reaction, last layer copper is electroplated on the basis of heavy copper, ensures
Hole copper thickness reaches product requirement, and electroplating parameter is set according to hole copper thickness is completed.
(15), outer-layer circuit (positive blade technolgy) is made：Outer graphics shift, luxuriant and rich with fragrance using Full-automatic exposure machine and positive circuit
Woods completes outer-layer circuit exposure with 5-7 lattice exposure guide rule (21 lattice exposure guide rule), developed, and outer-layer circuit figure is formed on production plate
Shape；Outer graphics are electroplated, then the copper facing and tin plating respectively on production plate, and electroplating parameter is set according to desired completion copper thickness,
Copper facing is the current density electric plating of whole board 60min with 1.8ASD, and tin plating is that 10min is electroplated with the current density of 1.2ASD, and tin is thick
3-5μm；Then it moves back film successively again, etch and move back tin, outer-layer circuit is etched on production plate；Outer layer AOI, uses automated optical
Detecting system, by the comparison with CAM data, whether detection outer-layer circuit has the defects of open circuit, notch, not clean, short-circuit etching.
(16), welding resistance, silk-screen character：By making green oil layer and silk-screen character in production plate outer layer, green oil thickness is：
10-50 μm, so as to so that production plate can reduce influence of the environmental change to it during subsequent use.
(17), surface treatment (heavy nickel gold)：Principle is learned in pad copper face Tonghua of welding resistance windowing position, and uniform deposition centainly requires
The nickel layer and layer gold of thickness, nickel layer thickness are：3-5μm；Layer gold thickness is：0.05-0.1μm.
(18), it is molded：According to the prior art and press design requirement gong shape, the +/- 0.05mm of external form tolerance.
(19), it is cut by laser (gong platform)：It is corresponded on production plate at the position of soft board region surrounding using laser cutting
Mode control and profoundly cut, will then be produced by taking off lid and correspond to the waste material in soft board region on plate and removed from product and (take off lid
Remove the part that the soft board region is corresponded on hardboard core plate afterwards), expose internal soft board region part, form platform, is made
Rigid Flex.
Among the above, because of no gummosis at the windowing on not gummosis PP, there is no laser burns gummosis to cause production plate
The quality mode that goes wrong, therefore laser cutting can be used control and profoundly cut, and can be protected by way of laser cutting
Card is taken off and not will produce burr on the edge in the platform formed after lid, ensures that neat in edge is round and smooth, improves the quality of production board, and
The mode of the opposite deep gong blind slot of control, can effectively improve the efficiency of cutting, and then improve the production efficiency of Rigid Flex.
(20), dispensing：Dispensing processing is carried out (i.e. to the soft board core plate of platform edges in the junction of the platform edges of exposing
With glue on the junction point of hardboard core plate), enhance the intensity of junction, prevents the junction when bending or pullling from splitting
The phenomenon that.
(21), electrical testing：The electrically conducting performance of production board is tested, this plate is using test method：Flying probe.
(22)、FQC：Whether check appearance, hole copper thickness, thickness of dielectric layers, green oil thickness, internal layer copper thickness of production board etc.
Meet the requirement of client.
(23), it packs：According to the manner of packing and packaging quantity of customer requirement, packaging is sealed to production board, and
It is allowed to dry drying prescription and humidity card, then shipment.
It is provided for the embodiments of the invention technical solution above to be described in detail, specific case used herein
The principle and embodiment of the embodiment of the present invention are expounded, the explanation of above example is only applicable to help to understand this
The principle of inventive embodiments；Meanwhile for those of ordinary skill in the art, embodiment according to the present invention, in specific embodiment party
There will be changes in formula and application range, in conclusion the content of the present specification should not be construed as limiting the invention.
Claims (9)
1. a kind of production method of laser control depth covering type Rigid Flex, which is characterized in that include the following steps：
S1, the internal layer circuit for making soft board core plate and hardboard core plate respectively；The soft board core plate includes soft board region and soft or hard knot
Close region；
S2, the soft board region contraposition on soft board core plate fit over film；
S3, soft board core plate and hardboard core plate are pressed into production plate with not gummosis PP, and correspond to the soft board on not gummosis PP
It opens a window at region；
S4, outer-layer circuit and solder mask are made successively on production plate, be then surface-treated；
S5, correspond to by the way of being cut by laser control at the position of soft board region surrounding on production plate and profoundly cut, take off lid
Remove the part for corresponding to the soft board region on hardboard core plate afterwards, Rigid Flex is made.
2. the production method of laser control depth covering type Rigid Flex according to claim 1, which is characterized in that step S2
In, the cover film is unilateral bigger 1mm than the soft board region.
3. the production method of laser control depth covering type Rigid Flex according to claim 1, which is characterized in that step S2
Further include step between S3：
S21, cover film and soft board core plate bonded completely by way of quick pressing；
S22, soft board core plate is toasted, cover film is made to cure.
4. the production method of laser control depth covering type Rigid Flex according to claim 3, which is characterized in that step
In S21, the parameter of quick pressing is：180 DEG C, pressure 100KG, pressing time 1-2min of temperature.
5. the production method of laser control depth covering type Rigid Flex according to claim 1, which is characterized in that step S3
In, rivet hole is bored in the corresponding position of soft board core plate and hardboard core plate respectively before pressing, soft board core plate and hardboard core plate pass through
Closing-up is pressed after fixing.
6. the production method of laser control depth covering type Rigid Flex according to claim 1, which is characterized in that step S3
In, cleaning treatment is not carried out after gummosis PP windowings, then soft board core plate and hardboard core plate are not pressed into production by gummosis PP with this
Plate.
7. the production method of laser control depth covering type Rigid Flex according to claim 1, which is characterized in that step S3
In, the windowing it is unilateral bigger 0-0.35mm than the soft board region.
8. the production method of laser control depth covering type Rigid Flex according to claim 1, which is characterized in that step S4
In, before making outer-layer circuit, production plate is also successively by outer layer drilling, the process of heavy copper and electric plating of whole board.
9. the production method of laser control depth covering type Rigid Flex according to claim 1, which is characterized in that step S5
In, after taking off lid, dispensing processing is carried out in the soft board edges of regions of exposing and the junction of hardboard core plate.
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Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109640519A (en) * | 2018-12-28 | 2019-04-16 | 深圳市景旺电子股份有限公司 | Rigid-flex combined board and preparation method thereof |
| CN109905976A (en) * | 2019-04-11 | 2019-06-18 | 信丰迅捷兴电路科技有限公司 | A kind of local laminating type of Rigid Flex cover film |
| CN110324972A (en) * | 2019-07-15 | 2019-10-11 | 宁波华远电子科技有限公司 | A kind of cutting method of Rigid Flex laser grounding point |
| CN110572957A (en) * | 2019-09-18 | 2019-12-13 | 九江明阳电路科技有限公司 | Method and device for manufacturing multilayer rigid-flex printed circuit board |
| CN110678011A (en) * | 2019-11-12 | 2020-01-10 | 江门崇达电路技术有限公司 | Manufacturing method of rigid-flex printed circuit board |
| CN111556656A (en) * | 2020-04-28 | 2020-08-18 | 高德（江苏）电子科技有限公司 | Process for uncovering rigid-flex board by using common PCB board forming machine |
| CN111970858A (en) * | 2020-07-14 | 2020-11-20 | 深圳崇达多层线路板有限公司 | High-offset rigid-flex PCB and manufacturing method thereof |
| CN112040676A (en) * | 2020-11-09 | 2020-12-04 | 广东科翔电子科技股份有限公司 | PI protective film uncovering method for rigid-flex printed circuit board |
| CN112638043A (en) * | 2021-01-27 | 2021-04-09 | 东莞市若美电子科技有限公司 | Manufacturing method of rigid-flex printed circuit board with flying tail type structure |
| CN112839453A (en) * | 2021-01-20 | 2021-05-25 | 福立旺精密机电（中国）股份有限公司 | Rigid-flexible combined circuit board and preparation method thereof |
| CN113543526A (en) * | 2021-06-10 | 2021-10-22 | 景旺电子科技(龙川)有限公司 | Blind hole machining method and FPC multilayer board |
| WO2022096000A1 (en) * | 2020-11-09 | 2022-05-12 | 广东科翔电子科技股份有限公司 | Process method for asymmetric multilayer rigid-flex board having air cavity |
| CN114900967A (en) * | 2022-05-23 | 2022-08-12 | 湖南金康电路板有限公司 | Uncovering processing method of rigid-flex board |
| CN115023068A (en) * | 2022-05-25 | 2022-09-06 | 景旺电子科技(龙川)有限公司 | Method for uncovering rigid-flex board and rigid-flex board |
| CN115767912A (en) * | 2022-12-01 | 2023-03-07 | 福莱盈电子股份有限公司 | Circuit board with gap structure and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109640519A (en) * | 2018-12-28 | 2019-04-16 | 深圳市景旺电子股份有限公司 | Rigid-flex combined board and preparation method thereof |
| CN109905976A (en) * | 2019-04-11 | 2019-06-18 | 信丰迅捷兴电路科技有限公司 | A kind of local laminating type of Rigid Flex cover film |
| CN110324972A (en) * | 2019-07-15 | 2019-10-11 | 宁波华远电子科技有限公司 | A kind of cutting method of Rigid Flex laser grounding point |
| CN110572957B (en) * | 2019-09-18 | 2022-10-04 | 九江明阳电路科技有限公司 | Method and device for manufacturing multilayer rigid-flex printed circuit board |
| CN110572957A (en) * | 2019-09-18 | 2019-12-13 | 九江明阳电路科技有限公司 | Method and device for manufacturing multilayer rigid-flex printed circuit board |
| CN110678011A (en) * | 2019-11-12 | 2020-01-10 | 江门崇达电路技术有限公司 | Manufacturing method of rigid-flex printed circuit board |
| CN111556656A (en) * | 2020-04-28 | 2020-08-18 | 高德（江苏）电子科技有限公司 | Process for uncovering rigid-flex board by using common PCB board forming machine |
| CN111970858A (en) * | 2020-07-14 | 2020-11-20 | 深圳崇达多层线路板有限公司 | High-offset rigid-flex PCB and manufacturing method thereof |
| CN111970858B (en) * | 2020-07-14 | 2022-04-15 | 深圳崇达多层线路板有限公司 | High-offset rigid-flex PCB and manufacturing method thereof |
| CN112040676A (en) * | 2020-11-09 | 2020-12-04 | 广东科翔电子科技股份有限公司 | PI protective film uncovering method for rigid-flex printed circuit board |
| CN112040676B (en) * | 2020-11-09 | 2021-02-19 | 广东科翔电子科技股份有限公司 | PI protective film uncovering method for rigid-flex printed circuit board |
| WO2022096000A1 (en) * | 2020-11-09 | 2022-05-12 | 广东科翔电子科技股份有限公司 | Process method for asymmetric multilayer rigid-flex board having air cavity |
| WO2022096001A1 (en) * | 2020-11-09 | 2022-05-12 | 广东科翔电子科技股份有限公司 | Pi protective film uncovering method for rigid-flex printed circuit board |
| CN112839453A (en) * | 2021-01-20 | 2021-05-25 | 福立旺精密机电（中国）股份有限公司 | Rigid-flexible combined circuit board and preparation method thereof |
| CN112839453B (en) * | 2021-01-20 | 2022-05-31 | 福立旺精密机电（中国）股份有限公司 | Rigid-flexible combined circuit board and preparation method thereof |
| CN112638043A (en) * | 2021-01-27 | 2021-04-09 | 东莞市若美电子科技有限公司 | Manufacturing method of rigid-flex printed circuit board with flying tail type structure |
| CN113543526A (en) * | 2021-06-10 | 2021-10-22 | 景旺电子科技(龙川)有限公司 | Blind hole machining method and FPC multilayer board |
| CN113543526B (en) * | 2021-06-10 | 2022-12-06 | 景旺电子科技(龙川)有限公司 | Blind hole machining method and FPC multilayer board |
| CN114900967A (en) * | 2022-05-23 | 2022-08-12 | 湖南金康电路板有限公司 | Uncovering processing method of rigid-flex board |
| CN114900967B (en) * | 2022-05-23 | 2024-01-26 | 湖南金康电路板有限公司 | Cover opening processing method for rigid-flex board |
| CN115023068A (en) * | 2022-05-25 | 2022-09-06 | 景旺电子科技(龙川)有限公司 | Method for uncovering rigid-flex board and rigid-flex board |
| CN115023068B (en) * | 2022-05-25 | 2024-01-30 | 景旺电子科技(龙川)有限公司 | Soft and hard combined plate uncovering method and soft and hard combined plate |
| CN115767912A (en) * | 2022-12-01 | 2023-03-07 | 福莱盈电子股份有限公司 | Circuit board with gap structure and manufacturing method thereof |
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