CN110572957A - Method and device for manufacturing multilayer rigid-flex printed circuit board - Google Patents
Method and device for manufacturing multilayer rigid-flex printed circuit board Download PDFInfo
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- CN110572957A CN110572957A CN201910881122.9A CN201910881122A CN110572957A CN 110572957 A CN110572957 A CN 110572957A CN 201910881122 A CN201910881122 A CN 201910881122A CN 110572957 A CN110572957 A CN 110572957A
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- plate
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a method and a device for manufacturing a multilayer rigid-flex printed circuit board, which are suitable for the technical field of PCB processing, and the method comprises the following steps: manufacturing a single-side rigid plate; processing the surface of a double-sided flexible plate; pressing the single-side rigid plate and the double-sided flexible plate; the single-sided rigid plate is windowed at the designated exposure position of the double-sided flexible plate. The apparatus is for performing a corresponding method. In the embodiment of the invention, a single-side rigid plate is manufactured; processing the surface of a double-sided flexible plate; pressing the single-side rigid plate and the double-sided flexible plate; the window opening of the rigid plate on one side is carried out at the appointed exposure position of the double-sided flexible plate, and the production yield of the multilayer rigid-flex printed circuit board can be improved through reasonable processing steps.
Description
Technical Field
the invention relates to the technical field of PCB processing, in particular to a method and a device for manufacturing a multilayer rigid-flex printed circuit board.
background
Rigid-flex boards are circuit boards formed by selectively laminating rigid and flexible substrates together. The layers are conductively connected using metallized holes. Each panel has one or more exposed soft zones. The rigid-flexible printed board is convenient to install, can be installed in a bendable and three-dimensional mode, and effectively utilizes installation space. The rigid-flex combination mode can also replace an insert, and high reliability under vibration impact, humid and severe environments is guaranteed.
Meanwhile, due to the difference of the rigid and flexible properties, the yield is not high in the processing, and the production cost is too high.
Disclosure of Invention
Embodiments of the present invention aim to address, at least to some extent, one of the technical problems in the related art. Therefore, the invention aims to provide a method and a device for manufacturing a multilayer rigid-flex printed circuit board.
The technical scheme adopted by the invention is as follows:
In a first aspect, an embodiment of the present invention provides a method for manufacturing a multilayer rigid-flex printed circuit board, including: manufacturing a single-side rigid plate; processing the surface of a double-sided flexible plate; pressing the single-side rigid plate and the double-sided flexible plate; the single-sided rigid plate is windowed at the designated exposure position of the double-sided flexible plate.
Preferably, the making of the single-sided rigid plate comprises: sequentially pressing a copper-free side of the single-side copper-clad plate, a non-gummosis PP plate, a double-side copper-clad plate and a non-gummosis PP plate; alternatively, fabricating the one-sided rigid plate includes: and pressing the copper-free side of the single-side copper-clad plate and the no-flow glue PP plate.
Preferably, the double-sided flexible sheet surface processing comprises: and cutting the covering film by laser, and attaching the cut covering film to the surface of the double-sided flexible board.
preferably, the double-sided flexible board surface processing comprises: and adhering glue to the welding points on the surface of the double-sided flexible board and the areas around the welding points.
Preferably, the making of the single-sided rigid plate comprises: and positioning holes are formed in the edge of the copper-clad plate and used for determining the pressing position between the single-side rigid plates on different sides of the double-sided flexible plate.
Preferably, the manufacturing of the one-sided rigid plate further comprises: and windowing is carried out on the PP plate which is in contact with the double-sided flexible plate, and the windowing position corresponds to the appointed exposure position of the double-sided flexible plate.
Preferably, the single-sided copper clad laminate and the double-sided copper clad laminate include FR4 board and copper layer.
preferably, the one-sided rigid panel windowing is performed by a gong machine.
in a second aspect, an embodiment of the present invention provides a device for manufacturing a multilayer rigid-flex printed circuit board, including: the outer layer unit is used for manufacturing a single-side rigid plate; the middle layer unit is used for processing the surface of the double-sided flexible board; the pressing unit is used for pressing the single-side rigid plate and the double-sided flexible plate; and an opening unit for performing one-side rigid plate windowing at the specified exposure position of the double-sided flexible plate.
The embodiment of the invention has the beneficial effects that:
In the embodiment of the invention, a single-side rigid plate is manufactured; processing the surface of a double-sided flexible plate; pressing the single-side rigid plate and the double-sided flexible plate; the window opening of the rigid plate on one side is carried out at the appointed exposure position of the double-sided flexible plate, and the production yield of the multilayer rigid-flex printed circuit board can be improved through reasonable processing steps.
Drawings
FIG. 1 is a flow chart of one embodiment of a method of making a multi-layer rigid-flex printed circuit board;
FIG. 2 is a block diagram of an embodiment of an original block diagram of a multi-layer rigid-flex printed circuit board;
FIG. 3 is a block diagram of an embodiment of a final block diagram of a multi-layer rigid-flex board;
FIG. 4 is a drawing showing the attachment of an embodiment of a device for producing a multi-layer rigid-flex printed circuit board.
Detailed Description
it should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
example 1.
The manufacturing method of the multilayer rigid-flex printed circuit board shown in fig. 1 comprises the following steps:
S1, manufacturing a single-side rigid plate;
S2, processing the surface of the double-sided flexible board;
S3, pressing the single-side rigid plate and the double-sided flexible plate;
And S4, performing single-side rigid plate windowing at the appointed exposure position of the double-sided flexible plate.
Wherein, multilayer rigid-flex printed circuit board includes two parts at least: a flexible plate (i.e., a flexplate) and a rigid plate. The rigid plate may be present on only one side of the flexible plate or may be present on both sides of the flexible plate. The plate structure marked on the same side is a single-side rigid plate. The single-side rigid plate comprises a single-side copper-clad plate, a common PP plate (namely a PP plate except the no-flow glue PP plate), a double-side copper-clad plate and a no-flow glue PP plate. The single-side copper-clad plate is a substrate with a copper layer on one side, and the substrate is made of FR4 plate; the double-sided copper-clad plate is a substrate with copper layers on two sides, and the substrate is made of FR4 plate.
Making a single-sided rigid plate includes: sequentially pressing a copper-free side of the single-side copper-clad plate, a non-gummosis PP plate, a double-side copper-clad plate and a non-gummosis PP plate; alternatively, fabricating the one-sided rigid plate includes: and pressing the copper-free side of the single-side copper-clad plate and the no-flow glue PP plate.
one side of the single-side copper-clad plate, which has copper, is a foundation for manufacturing a circuit, the surface of the other side of the single-side copper-clad plate has no copper and can be used as a bonding surface for pressing, and the copper-free side (marked as an A surface, and the PP plate comprises an A/B surface) and the PP plate are pressed; after the pressing is finished, pressing the PP plate B surface and the double-sided copper-clad plate (marked as C surface, the double-sided copper-clad plate comprises C/D surface); and after the pressing is finished, pressing the D surface of the double-sided copper-clad plate and the no-flow glue PP plate to form a single-sided rigid plate.
Or pressing the copper-free side and the no-flow glue PP plate to form the single-side rigid plate.
The surface processing of the double-sided flexible board comprises the following steps: and cutting the covering film by laser, and attaching the cut covering film to the surface of the double-sided flexible board.
A cover film with the thickness of 37.5um (the specific thickness is not limited, and only a specific numerical value is mentioned in the embodiment for convenience of description) is attached to the double-sided flexible board, so that the purpose that the circuit of the flexible board (flexible board) is not corroded or damaged by liquid medicine or other substances is ensured, and the bending performance is improved.
The specific film coating steps include: cutting the covering film in advance, wherein the covering film is a complete film, cutting the covering film in a laser cutting mode to obtain a film with a window, and attaching the covering film to the surface of the double-sided flexible board to complete surface operation.
The surface working may further include: and adhering glue to the welding points on the surface of the double-sided flexible board and the areas around the welding points.
The surface of the double-sided flex board also includes various traces, including pads. These portions need to be able to normally perform electrical contact after the multilayer rigid-flex printed circuit board is bonded. Therefore, the method of attaching the cover film cannot be simply adopted. However, the surface of the portion must be treated to prevent damage to the wiring during a press-fitting operation or the like.
Therefore, the adhesive tape can be applied for treatment. That is, the so-called clad plate, can serve an isolation purpose by adding a layer of soft material to a designated area, and at the same time, the soft material is easy to remove, so that the circuit (mainly referring to the solder joint and the area around the solder joint, that is, the area within a certain range around the solder joint) can be exposed when the circuit is needed to be used later.
Making a single-sided rigid plate includes: and positioning holes are formed in the edge of the copper-clad plate and used for determining the pressing position between the single-side rigid plates on different sides of the double-sided flexible plate.
for the purpose of positioning, positioning holes are formed in the edge of the copper-clad plate (including a single-side copper-clad plate and a double-side copper-clad plate), and accurate alignment between the single-side rigid plates between the upper layer and the lower layer can be ensured in a riveting mode.
Making the single-sided rigid plate further comprises: and windowing is carried out on the PP plate which is in contact with the double-sided flexible plate, and the windowing position corresponds to the appointed exposure position of the double-sided flexible plate.
The purpose of the windowing on the PP sheet in contact with the double-sided flexible sheet is to prevent crushing of the cover film.
The single-sided copper clad laminate and the double-sided copper clad laminate include FR4 board and copper layer.
And carrying out single-side rigid plate windowing through a milling machine.
After the single-side rigid plate and the double-sided flexible plate are combined, the single-side rigid plate is windowed through a gong machine, and the windowing position corresponds to the area of the covering film and the glue.
the reason why the pressing is not performed after the window opening is directly performed is that if the window opening is performed before the pressing, the pressure imbalance among the plates is easily caused by the window opening, the deformation is caused, and the damage to the circuit is caused, or the pressing is not firm.
The original structure diagram of the multilayer rigid-flex printed circuit board shown in fig. 2:
The laminated copper clad laminate comprises L1-L7 layers, wherein L1 is a single-side copper clad laminate, L2 is a PP plate, L3 is a double-sided copper clad laminate, L4 is a no-flow glue PP plate, L5 is a double-sided flexible plate, L6 is a no-flow glue PP plate, and L7 is a single-side copper clad laminate.
The specific parameters include:
L1: 12 μm copper layer and FR4 board; l3: copper layers 18 μm on both sides, FR4 board; l5 is a plate made of PI material and a copper layer with 18 mu m of double surfaces; l7 is a FR4 board, 12 μm copper layer.
the cover film was 37.5 μm, and a window of PP sheet was placed over the cover film.
And no-flow adhesive PP is arranged on a part between the L4 and the L5, and the part is a welding spot and the area around the welding spot. Correspondingly, the positions of the L6 and the L7 corresponding to the welding points and the areas around the welding points do not have the single-side copper-clad plate.
The final structural drawing of the multi-layer rigid-flex printed circuit board is shown in fig. 3.
The parts of L1-L3 corresponding to the positions of the covering film are cut off, and the parts of L1-L3 corresponding to the positions of the welding spots are cut off.
The corresponding portion of L7 at the position of the cover film is cut off.
The specific processing steps comprise:
The LI layer manufacturing process comprises the following steps: cutting material, drilling holes (drilling plate edge positioning holes), and pressing.
the manufacturing flow of the L1-L3 layers is as follows: cutting (L3 layer) → inner layer etching of inner layer pattern (L3 layer pattern) → first pressing, and pressing with normal gummy PP sheet to obtain L1-L4 layers.
After laminating the L1-4 layers, the circuit on two sides of the L5 layer is manufactured, and the L1-L5 are obtained by laminating.
L7 layer manufacturing process:
cutting material, drilling (drilling plate edge positioning holes), pressing and pressing L7, L6 and L1-L5 to complete combination.
The specific process of attaching the cover film comprises the following steps: cutting a covering film, namely cutting a window by using laser to form an area which does not need to be attached with the covering film, attaching the covering film which is cut by the laser and is windowed at the position of the exposed area of the soft board (the double-sided flexible board), and then pressing and curing by adopting a rapid pressing mode.
The double-sided flexible board has surface treatment PAD (welding point), and needs to be protected before pressing, and the implementation mode is as follows: before pressing, the copper surfaces to be exposed are adhered by high-temperature glue, then pressing is carried out, and before surface treatment, the glue is removed to expose the copper surfaces, and then surface treatment is carried out.
An embodiment of the present invention provides a device for manufacturing a multilayer rigid-flex printed circuit board shown in fig. 4, including:
The outer layer unit 1 is used for manufacturing a single-side rigid plate; the middle layer unit 2 is used for processing the surface of the double-sided flexible board; the pressing unit 3 is used for pressing the single-side rigid plate and the double-sided flexible plate; and an opening unit 4 for performing one-side rigid plate windowing at a specified exposure position of the double-sided flexible plate.
While the preferred embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (9)
1. A method for manufacturing a multilayer rigid-flex printed circuit board is characterized by comprising the following steps:
manufacturing a single-side rigid plate;
Processing the surface of a double-sided flexible plate;
Pressing the single-sided rigid plate and the double-sided flexible plate;
And performing single-side rigid plate windowing at the appointed exposure position of the double-sided flexible plate.
2. The method for manufacturing a multi-layer rigid-flex printed circuit board according to claim 1, wherein the manufacturing of the single-sided rigid board comprises the following steps: sequentially pressing a copper-free side of the single-side copper-clad plate, a non-gummosis PP plate, a double-side copper-clad plate and a non-gummosis PP plate;
Alternatively, the fabricating the one-sided rigid plate includes: and pressing the copper-free side of the single-side copper-clad plate and the no-flow glue PP plate.
3. the method for manufacturing a multi-layer rigid-flex printed circuit board according to claim 1, wherein the processing of the surface of the double-sided flexible board comprises the following steps: and cutting the covering film by laser, and attaching the cut covering film to the surface of the double-sided flexible board.
4. the method for manufacturing a multi-layer rigid-flex printed circuit board according to claim 1, wherein the processing of the surface of the double-sided flexible board comprises the following steps: and adhering glue to the welding points on the surface of the double-sided flexible plate and the areas around the welding points.
5. The method for manufacturing a multi-layer rigid-flex printed circuit board according to claim 2, wherein the manufacturing of the single-sided rigid board comprises the following steps: and arranging positioning holes at the edge of the copper-clad plate, wherein the positioning holes are used for determining the pressing position between the single-side rigid plates positioned at different sides of the double-sided flexible plate.
6. the method for manufacturing a multi-layer rigid-flex printed circuit board according to claim 2, wherein the manufacturing of the single-sided rigid board further comprises: and windowing is carried out on the PP plate which is in contact with the double-sided flexible plate, and the windowing position corresponds to the appointed exposure position of the double-sided flexible plate.
7. the method for manufacturing a multilayer rigid-flex printed circuit board according to claim 2, wherein the single-sided copper-clad plate and the double-sided copper-clad plate comprise an FR4 plate and a copper layer.
8. the method for manufacturing a multilayer rigid-flex printed circuit board according to claim 2, wherein the single-sided rigid board is windowed by a gong machine.
9. The utility model provides a multilayer rigid-flex printed circuit board making devices which characterized in that includes:
the outer layer unit is used for manufacturing a single-side rigid plate;
The middle layer unit is used for processing the surface of the double-sided flexible board;
the pressing unit is used for pressing the single-side rigid plate and the double-sided flexible plate;
And an opening unit for performing one-side rigid plate windowing at the specified exposure position of the double-sided flexible plate.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910881122.9A CN110572957B (en) | 2019-09-18 | 2019-09-18 | Method and device for manufacturing multilayer rigid-flex printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910881122.9A CN110572957B (en) | 2019-09-18 | 2019-09-18 | Method and device for manufacturing multilayer rigid-flex printed circuit board |
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| CN110572957A true CN110572957A (en) | 2019-12-13 |
| CN110572957B CN110572957B (en) | 2022-10-04 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113939075A (en) * | 2021-09-24 | 2022-01-14 | 珠海杰赛科技有限公司 | Rigid-flex board for improving color change of brown oxide layer of multi-layer flexible core board and manufacturing method thereof |
| CN115087205A (en) * | 2022-07-25 | 2022-09-20 | 高德(江苏)电子科技股份有限公司 | Soft-hard combined board with different gummosis prepregs subjected to one-step mixed pressing and manufacturing method thereof |
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| CN109195360A (en) * | 2018-10-13 | 2019-01-11 | 信丰迅捷兴电路科技有限公司 | A kind of method for manufacturing circuit board improving rigid-flex combined board dynamic area recess |
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| CN113939075A (en) * | 2021-09-24 | 2022-01-14 | 珠海杰赛科技有限公司 | Rigid-flex board for improving color change of brown oxide layer of multi-layer flexible core board and manufacturing method thereof |
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| CN110572957B (en) | 2022-10-04 |
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