CN110572944A - Method and device for manufacturing exposed area of rigid-flex printed circuit board - Google Patents
Method and device for manufacturing exposed area of rigid-flex printed circuit board Download PDFInfo
- Publication number
- CN110572944A CN110572944A CN201910918257.8A CN201910918257A CN110572944A CN 110572944 A CN110572944 A CN 110572944A CN 201910918257 A CN201910918257 A CN 201910918257A CN 110572944 A CN110572944 A CN 110572944A
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- China
- Prior art keywords
- rigid
- groove
- manufacturing
- printed circuit
- circuit board
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
the invention discloses a method and a device for manufacturing an exposed area of a rigid-flex printed circuit board, wherein the method comprises the following steps: arranging a groove at a designated position of the rigid plate based on laser, wherein the surface where the groove is located is a groove surface; pressing the groove surface and the flexible board to obtain an original rigid-flex printed circuit board; the rigid plate is cut from the non-recessed surface to obtain a separation groove with a specified depth and a specified width to communicate with the recess, and the rigid plate is divided to obtain exposed regions. The apparatus is for performing a method. The embodiment of the invention arranges the groove at the appointed position of the rigid plate based on laser; pressing the groove surface and the flexible board to obtain an original rigid-flex printed circuit board; removing the rigid plate to obtain a separation groove with a specified depth and a specified width to communicate the groove, and dividing the rigid plate to obtain an exposed area; the laser ablation can reduce the strength unbalance problem of the rigid plate caused by pre-grooving to the maximum extent, and prevent the flexible plate from being accidentally injured due to over-cutting through the pre-arranged groove.
Description
Technical Field
The invention relates to the technical field of PCBs, in particular to a method and a device for manufacturing an exposed area of a rigid-flex printed circuit board.
background
Rigid-flex boards are comprised of rigid and flexible substrates that are selectively laminated together. The layers are conductively connected using metallized holes. Each panel reveals one or more soft zones. The rigid-flexible printed board is convenient to install, can be bent and installed in a three-dimensional mode, and effectively utilizes the installation space, so that the reliability is high. The combination of rigidity and flexibility can replace a press plug-in unit, and high reliability under vibration impact, humid and severe environments is guaranteed.
the flexible area of the rigid-flex printed circuit board for bending is not covered by the rigid board finally, and therefore, the removal of the rigid board with the flexibility exposed above the bending area is always an important link in the manufacturing of the rigid-flex printed circuit board. Rigid board cutting is generally performed by a blind gong machine. In production, however, it is often the case that the flexible board is damaged by excessive cutting.
Disclosure of Invention
the present invention is directed to solving, at least to some extent, one of the technical problems in the related art. Therefore, the invention aims to provide a method for manufacturing an exposed area of a rigid-flex printed circuit board.
To this end, a second object of the present invention is to provide a device for manufacturing an exposed area of a rigid-flex printed circuit board.
the technical scheme adopted by the invention is as follows:
In a first aspect, an embodiment of the present invention provides a method for manufacturing an exposed area of a rigid-flex printed circuit board, including: arranging a groove at a designated position of the rigid plate based on laser, wherein the surface where the groove is located is a groove surface; pressing the groove surface and the flexible board to obtain an original rigid-flex printed circuit board; the rigid plate is cut from the non-recessed surface to obtain a separation groove with a specified depth and a specified width to communicate with the recess, and the rigid plate is divided to obtain exposed regions.
Preferably, the separation groove is a designated depth and a designated width.
Preferably, the method for manufacturing the exposed area of the rigid-flex printed circuit board further comprises the following steps of: and cutting the rigid substrate, manufacturing a circuit and obtaining the rigid board.
Preferably, the method for manufacturing the exposed area of the rigid-flex printed circuit board further comprises the following steps of: cutting the flexible substrate, manufacturing a circuit, and attaching a cover film to obtain the flexible board.
preferably, the method for manufacturing the exposed area of the rigid-flex printed circuit board further comprises the following post-processing of the original rigid-flex printed circuit board: drilling, copper deposition, circuit image plating, circuit etching, solder resist and PCB surface treatment.
In a second aspect, an embodiment of the present invention provides a device for manufacturing an exposed area of a rigid-flex printed circuit board, including: the laser module is used for arranging a groove at the designated position of the rigid plate based on laser, and the surface where the groove is located is a groove surface; the pressing module is used for pressing the groove surface and the flexible board to obtain an original rigid-flex board; and the blind gong module is used for cutting the rigid plate from the non-groove surface to obtain a separation groove with a specified depth and a specified width so as to communicate the groove, and cutting the rigid plate to obtain an exposed area.
Preferably, the device for manufacturing the exposed area of the rigid-flex printed circuit board further comprises a rigid board manufacturing module for executing rigid substrate cutting and manufacturing a circuit to obtain the rigid board.
Preferably, the device for manufacturing the exposed area of the rigid-flex printed circuit board further comprises a flexible board manufacturing module, wherein the flexible board manufacturing module is used for cutting the flexible substrate, manufacturing a circuit and attaching a covering film to obtain the flexible board.
Preferably, the device for manufacturing the exposed area of the rigid-flex printed circuit board further comprises a post-processing module, wherein the post-processing module is used for drilling, copper deposition, circuit image electroplating, circuit etching, solder resistance and PCB surface treatment of the original rigid-flex printed circuit board.
The embodiment of the invention has the beneficial effects that:
The embodiment of the invention arranges the groove at the appointed position of the rigid plate based on laser; pressing the groove surface and the flexible board to obtain an original rigid-flex printed circuit board; removing the rigid plate to obtain a separation groove with a specified depth and a specified width to communicate the groove, and dividing the rigid plate to obtain an exposed area; the laser ablation can reduce the strength unbalance problem of the rigid plate caused by pre-grooving to the maximum extent, and prevent the flexible plate from being accidentally injured due to over-cutting through the pre-arranged groove.
Drawings
FIG. 1 is a flow chart of an embodiment of a method for fabricating an exposed area of a rigid-flex printed circuit board;
FIG. 2 is a block diagram of an embodiment of a device for forming an exposed area of a rigid-flex printed circuit board;
Fig. 3 is a structural view of an embodiment of the rigid-flex printed board.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
Example 1.
The embodiment of the invention provides a method for manufacturing an exposed area of a rigid-flex printed circuit board as shown in FIG. 1, which comprises the following steps:
S1, arranging a groove at the designated position of the rigid plate based on laser, wherein the surface where the groove is located is a groove surface;
S2, pressing the groove surface and the flexible board to obtain an original rigid-flex board;
And S3, cutting the rigid plate from the non-groove surface to obtain a separation groove with a specified depth and a specified width to communicate the groove, and dividing the rigid plate to obtain an exposed area.
the rigid plate is in a sheet shape and comprises two surfaces with the largest area, in one surface, a groove is obtained by ablation at a designated position through laser, the surface marked with the groove is the groove surface, a PP sheet, namely a prepreg is arranged on the groove surface and used as an adhesive, the groove surface is used as a contact surface, and the rigid plate and the flexible plate are pressed to obtain the original rigid-flex combined plate. Through the blind gong machine, the rigid plate is cut from the reverse side (namely the non-groove side) to obtain a separation groove with a specified depth and a specified width, so that the separation groove and the groove can be communicated, the groove is in a closed shape (closed groove), namely the groove can enclose an area, and the area is an exposed area of the rigid plate. The exposed area of the rigid plate is separated through the communication of the separation groove and the groove; and (4) enabling the exposed area of the flexible board to appear, and finishing the manufacturing of the exposed area of the rigid-flex printed circuit board. The rigid plate is removed from the non-groove surface to obtain a separation groove with a designated depth and a designated width to communicate with the groove, and the rigid plate is divided to obtain an exposed area.
The manufacturing method of the exposed area of the rigid-flex printed circuit board further comprises the following steps of: cutting the rigid substrate, manufacturing a circuit, obtaining the rigid plate, and waiting for laser ablation.
The rigid substrate may specifically comprise a phenolic paper laminate, an epoxy paper laminate, a polyester glass mat laminate, an epoxy glass cloth laminate. Cutting is to cut the substrate to obtain a rigid substrate with a proper shape, and the circuit manufacturing is to copper-plate the rigid substrate and etch the rigid substrate to obtain a corresponding circuit.
the method for manufacturing the exposed area of the rigid-flex printed circuit board further comprises the following steps of: cutting the flexible substrate, manufacturing a circuit, attaching a covering film to obtain a flexible board, and waiting for pressing.
The flexible material of the flexible plate may specifically comprise a polyimide or polyester film. The cover film may be a conventional cover film material such as CVL crystal violet lactone (crystal violet lactone). Cutting is to cut the substrate to obtain a flexible substrate with a proper shape, manufacturing the circuit is to plate copper on the flexible substrate and etch to obtain a corresponding circuit, and the purpose of the covering film comprises insulation, surface protection and toughness improvement of the flexible plate.
The manufacturing method of the exposed area of the rigid-flex printed circuit board further comprises the following post-processing of the original rigid-flex printed circuit board: drilling, copper deposition, circuit image plating, circuit etching, solder resist and PCB surface treatment. Common PCB surface treatment processes are: hot air leveling (HASL), organic coating (OSP), electroless nickel/immersion gold, immersion silver, immersion tin, and the like
The method of combining laser ablation and mechanical blind gong is adopted, the rigid plate on the flexible area is uncovered and removed by a finished product, the rigid plate on the flexible area can be completely reserved in the whole manufacturing process of the rigid-flex printed circuit board to be formed and removed, so that the rigid-flex printed circuit board can be completely integrated during pressing after being combined, poor pressing quality caused by difference of height and step can not occur, meanwhile, the rigid plate on the flexible area is reserved in the whole manufacturing process to completely protect the flexible printed circuit board from corrosion of liquid medicine and pollution of the liquid medicine, and all performances of the rigid-flex printed circuit board are more complete.
the shape forming of the rigid plate and the flexible plate can meet the size requirement of the final product, and the width of the edge cutting line (namely the groove ablated by the laser) can be 0.1mm, and the depth can be 0.15mm-0.2 mm. This very thin width and depth gives a completely smooth press fit without any risk of sagging and without any difficulty in removing the cover from the finished product. Compared with a common mechanical cutting mode, the rigid plate has small damage to the surface stress, and is beneficial to preventing the abnormity in the pressing process.
and the blind gong machine can process a separation groove at a corresponding position on the back of the groove, the width of the separation groove can be 0.8mm, and the depth is controlled to be the thickness of the rigid plate minus 0.15mm-0.2 mm. Therefore, the flexible board can be prevented from being damaged by a blind gong machine.
Example 2.
An embodiment provides a device for manufacturing an exposed area of a rigid-flex printed circuit board as shown in fig. 2, including: the laser module 1 is used for arranging a groove at a specified position of the rigid plate based on laser, and the surface where the groove is located is a groove surface; the pressing module 2 is used for pressing the groove surface and the flexible board to obtain an original rigid-flex board; and the blind gong module 3 is used for cutting the rigid plate from the non-groove surface to obtain a separation groove with a specified depth and a specified width so as to communicate the groove, and cutting the rigid plate to obtain an exposed area.
The rigid-flex printed circuit board exposure area manufacturing device further comprises a rigid board manufacturing module used for executing rigid substrate cutting, manufacturing a circuit and obtaining a rigid board.
the device for manufacturing the exposed area of the rigid-flex printed circuit board further comprises a flexible board manufacturing module used for cutting the flexible substrate, manufacturing a circuit and attaching a covering film to obtain the flexible board.
The device for manufacturing the exposed area of the rigid-flex printed circuit board further comprises a post-processing module which is used for drilling, copper deposition, circuit image electroplating, circuit etching, resistance welding and PCB surface treatment of the original rigid-flex printed circuit board.
The embodiment provides a structural view of a rigid-flex printed board as shown in fig. 3.
The rigid-flex combination board comprises a rigid board, a flexible board, a PP sheet, a groove and a separation groove machined by a blind gong machine.
While the preferred embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A method for manufacturing an exposed area of a rigid-flex printed circuit board is characterized by comprising the following steps:
Arranging a groove at a designated position of the rigid plate based on laser, wherein the surface where the groove is located is a groove surface;
Pressing the groove surface and the flexible plate to obtain an original rigid-flex printed circuit board;
And cutting the rigid plate from the non-groove surface to obtain a separation groove to communicate with the groove, and dividing the rigid plate to obtain an exposed area.
2. the method of manufacturing an exposed area of a rigid-flex printed circuit board according to claim 1, wherein the separation groove has a predetermined depth and a predetermined width.
3. The method for manufacturing the exposed area of the rigid-flex printed circuit board according to claim 1, further comprising the steps of manufacturing a rigid board:
and cutting the rigid substrate, manufacturing a circuit and obtaining the rigid board.
4. the method for manufacturing the exposed area of the rigid-flex printed circuit board according to claim 1, further comprising the steps of manufacturing a flexible board:
Cutting the flexible substrate, manufacturing a circuit, and attaching a cover film to obtain the flexible board.
5. The method for manufacturing the exposed area of the rigid-flex printed circuit board according to claim 1, further comprising the following post-processing of the original rigid-flex printed circuit board:
drilling, copper deposition, circuit image plating, circuit etching, solder resist and PCB surface treatment.
6. The utility model provides a rigid-flex printed circuit board exposes district making devices which characterized in that includes:
The laser module is used for arranging a groove at the designated position of the rigid plate based on laser, and the surface where the groove is located is a groove surface;
The pressing module is used for pressing the groove surface and the flexible board to obtain an original rigid-flex printed circuit board;
And the blind gong module is used for cutting the rigid plate from the non-groove surface to obtain a separation groove with a specified depth and a specified width so as to communicate the groove, and cutting the rigid plate to obtain an exposed area.
7. The device for forming an exposed area of a rigid-flex printed circuit board according to claim 6, wherein the separation grooves have a predetermined depth and a predetermined width.
8. The device for manufacturing the exposed area of the rigid-flex printed circuit board according to claim 6, further comprising a rigid board manufacturing module for cutting the rigid substrate and manufacturing a circuit to obtain the rigid board.
9. The device for manufacturing the exposed area of the rigid-flex printed circuit board according to claim 6, further comprising a flexible board manufacturing module for cutting the flexible substrate, manufacturing a circuit, and attaching a cover film to obtain the flexible board.
10. The device for manufacturing the exposed area of the rigid-flex printed circuit board according to claim 6, further comprising a post-processing module for drilling, copper deposition, circuit image plating, circuit etching, solder mask and PCB surface treatment of the original rigid-flex printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910918257.8A CN110572944A (en) | 2019-09-26 | 2019-09-26 | Method and device for manufacturing exposed area of rigid-flex printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910918257.8A CN110572944A (en) | 2019-09-26 | 2019-09-26 | Method and device for manufacturing exposed area of rigid-flex printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110572944A true CN110572944A (en) | 2019-12-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910918257.8A Pending CN110572944A (en) | 2019-09-26 | 2019-09-26 | Method and device for manufacturing exposed area of rigid-flex printed circuit board |
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| CN (1) | CN110572944A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114390787A (en) * | 2021-12-30 | 2022-04-22 | 安捷利电子科技（苏州）有限公司 | Manufacturing process of flexible circuit board |
| CN117641712A (en) * | 2023-12-04 | 2024-03-01 | 皆利士多层线路版(中山)有限公司 | Semi-flexible radar board process |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090242243A1 (en) * | 2008-03-28 | 2009-10-01 | Continental Automotive Gmbh | Printed circuit board and method for fabricating a printed circuit board |
| CN103648240A (en) * | 2013-12-19 | 2014-03-19 | 博敏电子股份有限公司 | Method for manufacturing symmetrical rigid-flexible printed circuit board |
| CN106535466A (en) * | 2016-11-24 | 2017-03-22 | 深圳市景旺电子股份有限公司 | Rigid-flexible combination board and manufacturing method thereof |
-
2019
- 2019-09-26 CN CN201910918257.8A patent/CN110572944A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090242243A1 (en) * | 2008-03-28 | 2009-10-01 | Continental Automotive Gmbh | Printed circuit board and method for fabricating a printed circuit board |
| CN103648240A (en) * | 2013-12-19 | 2014-03-19 | 博敏电子股份有限公司 | Method for manufacturing symmetrical rigid-flexible printed circuit board |
| CN106535466A (en) * | 2016-11-24 | 2017-03-22 | 深圳市景旺电子股份有限公司 | Rigid-flexible combination board and manufacturing method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114390787A (en) * | 2021-12-30 | 2022-04-22 | 安捷利电子科技（苏州）有限公司 | Manufacturing process of flexible circuit board |
| CN117641712A (en) * | 2023-12-04 | 2024-03-01 | 皆利士多层线路版(中山)有限公司 | Semi-flexible radar board process |
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Application publication date: 20191213 |