CN114390787A - Manufacturing process of flexible circuit board - Google Patents
Manufacturing process of flexible circuit board Download PDFInfo
- Publication number
- CN114390787A CN114390787A CN202111650272.2A CN202111650272A CN114390787A CN 114390787 A CN114390787 A CN 114390787A CN 202111650272 A CN202111650272 A CN 202111650272A CN 114390787 A CN114390787 A CN 114390787A
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- Prior art keywords
- flexible circuit
- circuit board
- layer
- laser cutting
- manufacturing process
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 47
- 238000003698 laser cutting Methods 0.000 claims abstract description 47
- 238000005520 cutting process Methods 0.000 claims abstract description 41
- 239000002699 waste material Substances 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 230000001681 protective effect Effects 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 4
- 238000004381 surface treatment Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 4
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000006229 carbon black Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011120 plywood Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a manufacturing process of a flexible circuit board, and belongs to the technical field of flexible circuit boards. According to the manufacturing process of the flexible circuit board, the laser cutting is firstly carried out on one side of the outer layer board to form the reverse cutting groove, so that the problem that the inner layer board is easily cut due to overlarge laser cutting depth is effectively solved, the flexible board is scrapped, and the production qualified rate of the flexible circuit board is improved. The reverse cutting groove is arranged in the pre-opening cover area on the flexible circuit board, and then laser cutting is carried out on the pre-opening cover area on the flexible circuit board on the other side of the outer layer board, so that waste materials are favorably cleared away, and the production efficiency of the flexible circuit board is improved.
Description
Technical Field
The invention relates to the technical field of flexible circuit boards, in particular to a manufacturing process of a flexible circuit board.
Background
At present, flexible circuit boards are mostly manufactured by using LCP (Liquid Crystal Polymer) materials as base materials. The LCP material has good heat resistance and chemical resistance and small linear expansion coefficient, so that the flexible circuit board meets the requirements of surface assembly welding technology on the dimensional stability and heat resistance of the flexible circuit board. However, the flexible flexibility of the LCP material is poor, and in order to ensure the flexible flexibility of the flexible circuit board, the flexible circuit board needs to be partially opened.
The manufacturing process of the flexible circuit board comprises the following steps: punching the adhesive in the area of the pre-opened cover on the inner-layer plate, and etching a circuit on the inner-layer plate; then laminating the outer layer plate and the inner layer plate in sequence to form a laminated plate; then etching a circuit on the outer surface of the laminated board, and sticking an outer protective film; after the surface of the laminated board attached with the outer protective film is treated, opening the cover by laser cutting; and finally, removing the waste to obtain the flexible circuit board.
However, the uncovering process in the manufacturing process of the flexible circuit board has the following defects:
firstly, because the smoothness of the outer surface of the flexible circuit board is poor, the cutting depth is not easy to control in the laser cutting process, the inner layer board is easy to cut, and the flexible circuit board is scrapped. Data show that the reject ratio of the flexible circuit board is up to more than 30% due to the difficulty in controlling the cutting depth.
And secondly, when only the uncapping area on the flexible circuit board is cut in the uncapping process, and part of the uncapping area is outside the flexible circuit board and is not effectively cut. The cutting of the part on the flexible circuit board can lead to the production waste not to be easily removed, and the production efficiency of the flexible circuit board is reduced.
Therefore, it is desirable to provide a manufacturing process of a flexible circuit board to solve the above problems.
Disclosure of Invention
The invention aims to provide a manufacturing process of a flexible circuit board, which solves the problems that the laser cutting depth of an uncapping is not easy to control and the uncapping cutting only aims at the flexible circuit board in the existing manufacturing process of the flexible circuit board, and improves the production yield and production efficiency of the flexible circuit board.
In order to realize the purpose, the following technical scheme is provided:
a manufacturing process of a flexible circuit board comprises the following steps:
s1, etching the inner layer circuit on the inner layer plate, and removing the glue layer from the pre-opening area on the inner layer plate;
s2, performing laser cutting on the pre-opening cover area on the flexible circuit board at one side of the outer layer board to form an inverse cutting groove;
s3, sequentially laminating the outer plate and the inner plate from top to bottom to form a laminated plate; and one side of the outer layer plate, which is provided with the notch of the reverse cutting groove, is contacted with the inner layer plate;
s4, etching an outer layer circuit on the outer layer plate;
s5, pressing protective films on the upper side and the lower side of the laminated plate;
s6, performing surface treatment on the windowing pad of the protective film on the outer layer plate;
s7, performing laser cutting on the pre-opening cover area which is not on the flexible circuit board at the side of the outer layer board provided with the outer layer circuit;
and S8, removing the waste materials to generate the flexible circuit board.
As an alternative of the above-mentioned flexible circuit board manufacturing process, the inner layer board and the outer layer board both include a substrate layer and locate the copper layer on one side of the substrate layer, the inner layer circuit is located on the copper layer of the inner layer board, the outer layer circuit is located on the copper layer of the outer layer board.
As an alternative to the above-mentioned flexible printed circuit board manufacturing process, the depth of the laser cutting and the number of laser cutting in step S2, and the direction of the laser cutting are determined by the thickness of the base layer of the outer layer board.
As an alternative to the above-mentioned flexible circuit board manufacturing process, step S2 further includes the following steps:
s21, when the thickness of the base material layer of the outer plate is not larger than 25 μm, performing laser cutting on the pre-opening cover area on the flexible circuit board on one side of the outer plate to form the reverse cutting groove;
s22, when the thickness of the base material layer of the outer plate is not less than 50 μm, firstly, carrying out laser cutting on the pre-opening cover area on the flexible circuit board on one side of the outer plate to form the reverse cutting groove; and laser cutting is carried out on the area of the pre-opening cover on the flexible circuit board on the other side of the outer layer board to form an orthogonal cutting groove.
As an alternative to the above-mentioned flexible circuit board manufacturing process, the method includes: the depth of the laser cutting in the step S21 is the thickness of the base material layer of the outer laminate.
As an alternative to the above-mentioned flexible circuit board manufacturing process, the depth of the two laser cuts in step S22 is half of the thickness of the base material layer of the outer laminate.
As an alternative to the above-mentioned flexible circuit board manufacturing process, step S23 is further provided before step S21: a through hole is formed in the thickness direction of the outer layer plate; and taking the through hole as a reference when the reverse cutting groove and the tangent groove are subjected to laser cutting.
As an alternative to the above-mentioned flexible circuit board manufacturing process, the laser cutting depth in step S5 is not less than the thickness of the substrate layer of the outer laminate.
As an alternative to the above-described manufacturing process of the flexible circuit board, the boundary of the photoresist-removed region of the inner layer board is outwardly expanded with respect to the boundary of the pre-open cover region.
As an alternative to the above-described manufacturing process of the flexible circuit board, the distance between the boundary of the photoresist-removed area of the inner layer board and the boundary of the pre-opening cover area is 0.15 mm.
Compared with the prior art, the invention has the beneficial effects that:
according to the manufacturing process of the flexible circuit board, the reverse cutting groove is formed by performing laser cutting on one side of the outer layer board, so that the problem that the flexible board is scrapped due to the fact that the inner layer board is easy to cut due to overlarge laser cutting depth is effectively solved, and the production yield of the flexible circuit board is improved. The reverse cutting groove is arranged in the pre-opening cover area on the flexible circuit board, and then laser cutting is carried out on the pre-opening cover area on the flexible circuit board on the other side of the outer layer board, so that waste materials are favorably cleared away, and the production efficiency of the flexible circuit board is improved.
Drawings
Fig. 1 is a flow chart of a manufacturing process of a flexible circuit board in an embodiment of the invention;
FIG. 2 is a flowchart of step S2 according to an embodiment of the present invention;
FIG. 3 is a schematic uncapping diagram illustrating an embodiment of the invention when the thickness of the substrate layer is not greater than 25 μm;
FIG. 4 is a schematic uncapping diagram illustrating a substrate with a thickness of not less than 50 μm according to an embodiment of the present invention.
Reference numerals:
1. an inner layer board; 2. an outer plate; 3. a glue layer; 4. a protective film;
21. a substrate layer; 22. a copper layer; 23. reversely cutting a groove; 24. a groove is cut in a normal way; 25. and a through hole.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that are conventionally placed when the products of the present invention are used, and are used only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements to be referred to must have specific orientations, be constructed in specific orientations, and operate, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed" and "connected" are to be interpreted broadly, e.g., as being either fixedly connected, detachably connected, or integrally connected; either mechanically or electrically. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
As shown in fig. 1 to 4, the present embodiment provides a manufacturing process of a flexible circuit board, including the following steps:
s1, etching an inner layer circuit on the inner layer plate 1, and removing the glue layer 3 from a pre-opening area on the inner layer plate 1;
s2, laser cutting the pre-opened cover area on the flexible circuit board at one side of the outer layer board 2 to form an inverse cutting groove 23;
s3, sequentially laminating the outer layer plate 2 and the inner layer plate 1 from top to bottom to form a laminated plate; and one side of the outer layer plate 2 provided with the notch of the back cutting groove 23 is contacted with the inner layer plate 1;
s4, etching an outer layer circuit on the outer layer plate 2;
s5, pressing protective films 4 on the upper side and the lower side of the laminated plate to protect the laminated plate from directly contacting with the outside;
s6, performing surface treatment on the windowing pad of the protective film 4 on the outer board 2 to ensure the solderability of the exposed pad, so that the connection of the flexible circuit board and other electrical elements is realized conveniently;
s7, laser cutting is carried out on the area of the flexible circuit board which is not covered with the cover on the side of the outer layer board 2 provided with the outer layer circuit;
and S8, removing the waste materials to generate the flexible circuit board.
According to the manufacturing process of the flexible circuit board, the laser cutting is firstly carried out on one side of the outer layer plate 2 to form the reverse cutting groove 23, so that the problem that the inner layer plate 1 is easily cut due to overlarge laser cutting depth, the flexible circuit board is scrapped is effectively solved, and the production qualified rate of the flexible circuit board is improved. The reverse cutting groove 23 is arranged in the pre-opening cover area on the flexible circuit board, and then laser cutting is carried out on the pre-opening cover area on the flexible circuit board on the other side of the outer layer board 2, so that waste materials are cleared away, and the production efficiency of the flexible circuit board is improved.
Wherein, inner plating 1 and outer plywood 2 all include the substrate layer 21 and locate the copper layer 22 of substrate layer 21 one side, and on the copper layer 22 of inner plating 1 was located to the inlayer circuit, outer circuit was located on the copper layer 22 of outer plywood 2.
Because the flexible circuit board can select different thickness according to the usage, the base material board thickness in the flexible circuit board of different thickness is different, and the degree of depth of laser cutting also needs corresponding change thereupon when uncapping. Therefore, the depth of the laser dicing, the number of times of the laser dicing, and the direction of the laser dicing in step S2 are determined by the thickness of the base material layer 21 of the outer laminate 2.
Further optionally, step S2 further includes the following steps:
s21, when the thickness of the base material layer 21 of the outer layer plate 2 is not more than 25 μm, performing laser cutting on the pre-opening cover area on the flexible circuit board at one side of the outer layer plate 2 to form an inverse cutting groove 23;
s22, when the thickness of the base material layer 21 of the outer layer plate 2 is not less than 50 μm, performing laser cutting on the pre-opening cover area on the flexible circuit board at one side of the outer layer plate 2 to form an inverse cutting groove 23; the pre-open cover area on the flexible circuit board is laser cut again on the other side of the outer laminate 2 to form the orthogonal groove 24.
The above steps propose two cutting schemes according to the difference of the thickness of the base material layer 21 of the outer plate 2. When the substrate layer 21 is thin, the reverse cutting groove 23 is cut in the outer layer board 2, so that the cutting of the pre-opening cover area on the flexible circuit board can be realized. The rejection rate of the flexible circuit board caused by difficulty in cutting depth control is completely eliminated by cutting the inverse cutting groove 23 in advance, and the production qualification rate of the flexible circuit board is improved.
When the substrate layer 21 is thick, cut out the back cut groove 23 in one side of outer plate 2, the opposite side cuts out the front cut groove 24, can not only realize the cutting in the regional of uncapping in advance on the flexible circuit board, can also improve among the prior art because the substrate layer 21 is thick, need follow same direction many times, carry out laser cutting for a long time, and lead to producing the problem of carbon black on the flexible circuit board, improved the aesthetic property of flexible circuit board. Data show that the manufacturing process of the flexible circuit board in the embodiment reduces the reject rate of the flexible circuit board caused by carbon black from 20% to 3%.
In order to improve the manufacturing quality of the flexible circuit board, it is further optional that the laser cutting depth in step S21 is the thickness of the substrate layer 21 of the outer laminate 2. Further optionally, the depth of the two laser cuts in step S22 is half of the thickness of the substrate layer 21 of the outer laminate 2. Since the thickness of the conventional substrate is only 25 μm and 50 μm, in this embodiment, the cutting depth is only controlled to be 25 μm when performing laser cutting in step S2.
In order to improve the precision of laser cutting, a reference for laser cutting needs to be set. Therefore, further optionally, step S23 is further provided before step S21: through holes 25 are formed in the outer laminate 2 in the thickness direction thereof. The through hole 25 is used as a reference for laser cutting of the reverse cutting groove 23 and the forward cutting groove 24, so that the precision of laser cutting can be improved, the reverse cutting groove 23 and the forward cutting groove 24 can be positioned on the same straight line, and the consistency of two times of cutting is ensured.
Further optionally, the laser cutting depth of step S5 is not less than the thickness of the substrate layer 21 to ensure that the outer laminate 2 can be cut completely to facilitate subsequent scrap removal.
Further optionally, the boundary of the photoresist removing area of the inner layer board 1 is expanded relative to the boundary of the pre-uncovering area, so that the cut waste materials are prevented from being adhered to the flexible circuit board and are inconvenient to remove. In the present embodiment, the boundary of the desmear region of the inner layer board 1 is outwardly expanded by 0.15mm with respect to the boundary of the pre-open lid region.
Further optionally, a punching mode is selected in step S1 to remove the photoresist, so that the photoresist removing efficiency is improved.
Further alternatively, the surface treatment in step S6 is performed by using a gold plating process or an OSP (Organic solder resist Preservatives) process.
It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments illustrated herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (10)
1. The manufacturing process of the flexible circuit board is characterized by comprising the following steps of:
s1, etching an inner layer circuit on the inner layer plate (1), and removing the glue layer (3) from a pre-opening area on the inner layer plate (1);
s2, laser cutting the pre-opening cover area on the flexible circuit board at one side of the outer layer board (2) to form a reverse cutting groove (23);
s3, sequentially laminating the outer laminate (2) and the inner laminate (1) from top to bottom to form a laminated plate; and one side of the outer layer plate (2) provided with the notch of the reverse cutting groove (23) is contacted with the inner layer plate (1);
s4, etching an outer layer circuit on the outer layer board (2);
s5, pressing protective films (4) on the upper side and the lower side of the laminated plate;
s6, performing surface treatment on the windowing pad of the protective film (4) on the outer layer plate (2);
s7, performing laser cutting on the pre-opening cover area which is not on the flexible circuit board at the side of the outer layer board (2) provided with the outer layer circuit;
and S8, removing the waste materials to generate the flexible circuit board.
2. The manufacturing process of the flexible circuit board according to claim 1, wherein the inner layer board (1) and the outer layer board (2) each comprise a base material layer (21) and a copper layer (22) provided on one side of the base material layer (21), the inner layer circuit is provided on the copper layer (22) of the inner layer board (1), and the outer layer circuit is provided on the copper layer (22) of the outer layer board (2).
3. The process for manufacturing a flexible circuit board according to claim 2, wherein the depth of the laser cutting and the number of laser cutting in step S2, and the direction of the laser cutting are determined by the thickness of the substrate layer (21) of the outer laminate (2).
4. The manufacturing process of the flexible circuit board according to claim 3, wherein the step S2 further comprises the steps of:
s21, when the thickness of the base material layer (21) of the outer plate (2) is not more than 25 μm, performing laser cutting on the pre-opening cover area on the flexible circuit board on one side of the outer plate (2) to form the reverse cutting groove (23);
s22, when the thickness of the base material layer (21) of the outer plate (2) is not less than 50 μm, firstly carrying out laser cutting on the pre-opening cover area on the flexible circuit board on one side of the outer plate (2) to form the reverse cutting groove (23); and laser cutting is carried out on the pre-opening cover area on the flexible circuit board on the other side of the outer layer board (2) to form an orthogonal cutting groove (24).
5. The manufacturing process of the flexible circuit board according to claim 4, wherein the laser cutting depth in the step S21 is the thickness of the substrate layer (21) of the outer laminate (2).
6. The manufacturing process of the flexible circuit board according to claim 4, wherein the depth of the two laser cuts in the step S22 is half of the thickness of the substrate layer (21) of the outer laminate (2).
7. The manufacturing process of the flexible circuit board according to claim 4, wherein step S23 is further provided before step S21: a through hole (25) is formed along the thickness direction of the outer layer plate (2); the through hole (25) is used as a reference when the reverse cutting groove (23) and the normal cutting groove (24) are subjected to laser cutting.
8. The manufacturing process of the flexible circuit board according to claim 1, characterized in that the depth of the laser cutting in the step S5 is not less than the thickness of the base material layer (21) of the outer laminate (2).
9. A process for manufacturing a flexible circuit board according to claim 1, wherein the boundary of the desmear region of said inner layer board (1) is flared with respect to the boundary of said pre-open cover region.
10. The manufacturing process of a flexible circuit board according to claim 9, characterized in that the distance between the boundary of the desmear area of the inner layer board (1) and the boundary of the pre-open cover area is 0.15 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111650272.2A CN114390787A (en) | 2021-12-30 | 2021-12-30 | Manufacturing process of flexible circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111650272.2A CN114390787A (en) | 2021-12-30 | 2021-12-30 | Manufacturing process of flexible circuit board |
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| Publication Number | Publication Date |
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| CN114390787A true CN114390787A (en) | 2022-04-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202111650272.2A Pending CN114390787A (en) | 2021-12-30 | 2021-12-30 | Manufacturing process of flexible circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114980549A (en) * | 2022-06-14 | 2022-08-30 | 信丰迅捷兴电路科技有限公司 | Windowing method of rigid-flex circuit board |
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| CN1816258A (en) * | 2005-02-06 | 2006-08-09 | 华通电脑股份有限公司 | Method for making hard-soft composite circuit board |
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| CN105530757A (en) * | 2014-09-29 | 2016-04-27 | 深圳崇达多层线路板有限公司 | Aluminum-based flexible circuit board manufacturing method |
| CN110572944A (en) * | 2019-09-26 | 2019-12-13 | 九江明阳电路科技有限公司 | Method and device for manufacturing exposed area of rigid-flex printed circuit board |
| CN110678011A (en) * | 2019-11-12 | 2020-01-10 | 江门崇达电路技术有限公司 | Manufacturing method of rigid-flex printed circuit board |
-
2021
- 2021-12-30 CN CN202111650272.2A patent/CN114390787A/en active Pending
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|---|---|---|---|---|
| JPH1056266A (en) * | 1996-08-12 | 1998-02-24 | Sony Corp | Production of composite wiring board |
| CN1816258A (en) * | 2005-02-06 | 2006-08-09 | 华通电脑股份有限公司 | Method for making hard-soft composite circuit board |
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