CN211531419U

CN211531419U - Circuit board

Info

Publication number: CN211531419U
Application number: CN201922414471.8U
Authority: CN
Inventors: 高德萌; 由镭; 杨之诚; 周进群; 张利华; 缪桦
Original assignee: Shennan Circuit Co Ltd
Current assignee: Shennan Circuit Co Ltd
Priority date: 2019-12-27
Filing date: 2019-12-27
Publication date: 2020-09-18
Anticipated expiration: 2029-12-27

Abstract

The application discloses circuit board, this circuit board includes: the first base plate and the second base plate of range upon range of setting, the first base plate is provided with first recess, the second base plate is provided with and exposes the second recess of first recess, the width of second recess is less than the width of first recess, first recess extends to at least one side of first base plate, the second recess extends to at least one side of second base plate, first base plate with the side of first recess intercommunication with the second base plate with the side of second recess intercommunication sets up adjacently. The application provides a circuit board with form step groove of falling T is convenient for realize the horizontal grafting of components and parts, and then can promote the convenience of components and parts installation.

Description

Circuit board

Technical Field

The application relates to the field of circuit boards, in particular to a circuit board.

Background

In recent years, with the continuous popularization and application of electronic information and communication technologies, hardware equipment matched with the information technology is rapidly developed, the requirements on the processing technology of an integrated circuit carrier plate part in the hardware equipment are higher and higher, and a step groove design matched with a component is arranged on a traditional integrated circuit carrier plate in order to conveniently mount the component on the integrated circuit carrier plate.

The inventor of the application finds that step grooves on traditional integrated circuit carrier plates are often processed into rectangles or T shapes, solder paste needs to be printed at the bottoms of the grooves when components are installed, the components are attached after reflow heating, the requirements on the thickness of the solder paste are high, and the risk of falling off exists.

SUMMERY OF THE UTILITY MODEL

The main technical problem who solves of this application provides a circuit board, is convenient for realize the horizontal grafting of components and parts, and then can promote the convenience of components and parts installation.

In order to solve the technical problem, the application adopts a technical scheme that: the circuit board comprises a first base plate and a second base plate which are arranged in a stacked mode, wherein the first base plate is provided with a first groove, the second base plate is provided with a second groove exposed out of the first groove, the width of the second groove is smaller than that of the first groove, the first groove extends to at least one side edge of the first base plate, the second groove extends to at least one side edge of the second base plate, and the first base plate is adjacent to the side edge of the first groove communication and the side edge of the second groove communication.

The beneficial effect of this application is: this application is through setting up first recess on first base plate to set up the second recess that exposes first recess and width and be less than first recess on the second base plate, first base plate and the range upon range of setting of second base plate make first recess and second recess form the step groove of a shape of falling T jointly, thereby make components and parts can transversely peg graft in this step groove that is the shape of falling T, promote the convenience of installation.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Wherein:

FIG. 1 is a schematic flow chart of one embodiment of a method for manufacturing a circuit board according to the present application;

FIG. 2 is a partial production process diagram corresponding to the production process of FIG. 1;

FIG. 3 is a diagram of a subsequent fabrication process of FIG. 2 in one embodiment;

FIG. 4 is a schematic structural diagram of an embodiment of a circuit board with components mounted thereon according to the present application;

FIG. 5 is a schematic structural diagram of an embodiment of a circuit board of the present application;

fig. 6 is a schematic structural diagram of another embodiment of the wiring board of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Referring to fig. 1, fig. 1 is a schematic flow chart of an embodiment of a method for manufacturing a circuit board according to the present application, and with reference to fig. 2 and fig. 3, the method for manufacturing a circuit board includes:

s110: a first substrate 1100 and a second substrate 1200 are provided.

The first substrate 1100 and the second substrate 1200 are basic materials for manufacturing a circuit board, and can play a role of supporting, and the specific structure thereof is not limited herein.

S120: a first groove 1410 is formed on the first substrate 1100 and an adhesive member 1300 bonded to the groove wall is disposed in the first groove 1410, the first groove 1410 extends to at least one side of the first substrate 1100, and the adhesive member 1300 loses its adhesive property when exposed to the first temperature.

The processing means of the first groove 1410 may be laser cutting grooving, milling cutter depth control grooving, high pressure water jet grooving, and the like, which is not limited herein.

The first groove 1410 extends to at least one side of the first substrate 1100, and specifically, the first groove 1410 extends to one side of the first substrate 1100, or the first groove 1410 extends to two opposite sides of the first substrate 1100. The purpose of the first groove 1410 extending to the side of the first substrate 1100 is to facilitate subsequent insertion of components from the side of the circuit board.

The adhesive member 1300 has adhesiveness at normal temperature, and when the temperature is increased or decreased to a certain degree, the adhesiveness is completely lost. In this embodiment, the adhesive member 1300 is first disposed in the first recess 1410, and then the adhesive member 1300 is taken out of the first recess 1410 when it is at the first temperature.

S130: the second substrate 1200 is stacked on the side of the first substrate 1100 on which the adhesive member 1300 is disposed, and then the first substrate 1100 and the second substrate 1200 are pressed to form an integrated structure.

S140: a second groove 1420 having a smaller width than the first groove 1410 and exposing the first groove 1410 is disposed at the second substrate 1200 corresponding to the adhesive 1300, the second groove 1420 extends to at least one side of the second substrate 1200, and a side of the first substrate 1100 communicating with the first groove 1410 and a side of the second substrate 1200 communicating with the second groove 1420 are disposed adjacent to each other.

First recess 1410 communicates with second recess 1420 to form an inverted T-shaped stepped groove.

The processing manner of the second groove 1420 is the same as that of the first groove 1410, and the details thereof are described above.

Like the first recess 1410, the second recess 1420 also needs to extend to one side of the second substrate 1200 or two opposite sides.

Meanwhile, the side edge of the first substrate 1100 communicated with the first groove 1410 and the side edge of the second substrate 1200 communicated with the second groove 1420 are adjacently arranged, so that components can be conveniently and transversely inserted into the stepped groove from the side edge of the circuit board in the following process.

S150: the adhesive member 1300 is removed after the unitary structure is subjected to the first temperature.

After the adhesive member 1300 is removed, the wiring board 1000 is obtained.

Generally, the above steps S110 to S140 are performed at a normal temperature, and then, after the integrated structure is formed, the temperature is raised or lowered to a first temperature to remove the viscosity of the adhesive member 1300, and finally, the adhesive member 1300 is removed.

The means for removing the adhesive member 1300 may be physical, chemical or various combination means, and is not limited herein.

In the prior art, in the process of machining the step groove, a gasket is generally placed in the groove for glue blocking, and the scheme has the following defects: the gasket does not have viscidity, can 'T effectively laminate with the tank bottom, hinders gluey effect poor, in addition in order to follow-up can get rid of the gasket after processing is accomplished, the shape of gasket generally is I type or T type, and such gasket can' T realize processing the type of falling T groove.

And in this embodiment, adopt viscidity piece 1300 to replace the gasket, viscidity piece 1300 can effectively laminate with the tank bottom on the one hand, and it is effectual to hinder gluey, and on the other hand is owing to be in when first temperature, viscidity of viscidity piece 1300 disappears completely, and it can be got rid of, consequently can guarantee to form the step groove of type of falling T, can be convenient for follow-up components and parts transversely peg graft in the step groove of type of falling T, improves the convenience of installation.

With continued reference to fig. 2, the first substrate 1100 includes a first core plate 1010 and a bonding layer 1140, and the second substrate 1200 includes a second core plate 1020; the step of providing the first groove 1410 on the first substrate 1100 includes: a first groove 1410 is disposed on the adhesive layer 1140.

Specifically, in this embodiment, by providing the first substrate 1100 including the adhesive layer 1140, it is ensured that the first substrate 1100 and the second substrate 1200 are integrated after being bonded.

In this embodiment, the adhesive layer 1140 is a prepreg, which is also called PP sheet, which is one of the main materials in the production of multilayer boards, and mainly comprises a resin and a reinforcing material, and is softened under heat and pressure, and then reacts and solidifies after cooling. In other embodiments, the adhesive layer 1140 may also include other materials having adhesive function, and is not limited herein.

With continuing reference to fig. 2 and fig. 3, in the present embodiment, the first core board 1010 includes a first conductive layer 1110, a first base layer 1130, and a second conductive layer 1120, which are sequentially stacked, the second core board 1020 includes a third conductive layer 1210, a second base layer 1230, and a fourth conductive layer 1220, which are sequentially stacked, and the adhesive layer 1140 is disposed adjacent to the second conductive layer 1120, wherein the step of disposing the first groove 1410 on the adhesive layer 1140 includes: a groove is formed in the adhesion layer 1140 to the bottom of the groove and reach the surface of the second conductive layer 1120, thereby forming a first groove 1410.

Specifically, the purpose of setting the bottom of the first groove 1410 to reach the surface of the second conductive layer 1120 is to enable a component subsequently placed in the first groove 1410 to directly contact with the second conductive layer 1120, and the heat dissipation speed of the component is improved by utilizing the thermal conductivity of the second conductive layer 1120.

Of course, in other embodiments, the first groove 1410 may not reach the surface of the second conductive layer 1120, for example, the first groove 1410 may only reach half of the thickness of the adhesive layer 1140, which is not limited herein.

In this embodiment, the step of providing the second recess 1420, which has a smaller width than the first recess 1410 and exposes the first recess 1410, on the second substrate 1200 corresponding to the adhesive 1300 includes: calculating the sum of the thickness of the second core plate 1020 and the thickness of the adhesive member 1300, and defining the sum as a first value; calculating the difference between the first value and a preset value, and defining the difference as a second value; the second core plate 1020 is grooved to a second depth corresponding to the adhesive 1300, thereby forming a second groove 1420.

By setting a preset value, the depth of the slot can be controlled in the process of setting the second groove 1420, so that the slot is only opened to the adhesive 1300 without touching the second conductive layer 1120, thereby preventing the second conductive layer 1120 from being damaged.

For convenience of understanding, in an application scenario, the predetermined value is Z, the thickness of the second core plate 1020 is X, the thickness of the adhesive member 1300 is Y, and the second value is X + Y-Z, i.e., the groove depth when the second grooves 1420 are disposed is X + Y-Z.

Of course, in other embodiments, the depth of the second groove 1420 may be regulated to the thickness of the second core plate 1020 in the process of providing the second groove 1420, that is, the groove is formed at the position of the second core plate 1020 corresponding to the adhesive 1300 until the groove depth is the thickness of the second core plate 1020.

With continued reference to fig. 2 and 3, the step of placing the second substrate 1200 on top of the first substrate 1100 on the side where the adhesive member 1300 is provided includes: placing the second core board 1020 on the side of the adhesive layer 1140 away from the first core board 1010, and disposing the third conductive layer 1210 adjacent to the adhesive layer 1140; the step of providing the second grooves 1420, which have a smaller width than the first grooves 1410 and expose the first grooves 1410, on the second substrate 1200 corresponding to the adhesive 1300, includes: providing a first sub-groove 1421 on the fourth conductive layer 1220 corresponding to the adhesive 1300 to expose the second substrate layer 1230; a second sub-groove 1422 is disposed at the exposed second substrate layer 1230 until the first groove 1410 is exposed, wherein the width of the first sub-groove 1421 is greater than the width of the second sub-groove 1422, and the width of the second sub-groove 1422 is less than the width of the first groove 1410.

In the above steps, the first sub-groove 1421 and the second sub-groove 1422 are provided, and the width of the first sub-groove 1421 is larger than that of the second sub-groove 1422, so as to perform step-by-step grooving on the fourth conductive layer 1220 and the second substrate layer 1230, the general size and outline range of the required second groove 1420 is determined by forming the first sub-groove 1421, and then the specific size of the required second groove 1420 is determined by forming the second sub-groove 1422 on the basis of the grooving outline of the first sub-groove 1421, thereby improving the precision and quality of the machined groove. In addition, the width of the second sub-recess 1422 is smaller than the width of the first sub-recess 1410, so that the processed recess 1400 has an inverted T shape as a whole.

Of course, in other embodiments, the fourth conductive layer 1220 may be directly grooved to the second numerical depth instead of being grooved in steps, which is not particularly limited herein.

In this embodiment, the adhesive member 1300 is a multi-layered special adhesive tape. Its viscosity disappears at a first temperature, for example: if the viscosity of the specialty adhesive tape completely disappears when the temperature reaches 180 ℃, the first temperature can be set to 180 ℃; if the tack of the specialty adhesive tape is completely lost when the temperature reaches-180 deg.C, the first temperature may be set to-180 deg.C.

In this embodiment, before the adhesive member 1300 bonded to the groove wall is placed in the first groove 1410, the method further includes: determining the number of the multilayer special adhesive tapes; wherein the step of determining the number of the multi-layer special adhesive tape comprises the following steps: acquiring the depth of the first groove 1410 and the thickness of the single-layer special adhesive tape; calculating the quotient and remainder of the depth of the first groove 1410 divided by the thickness of the single-layer specialty tape; if the remainder is larger than the third numerical value, determining the number of the special adhesive tapes as the quotient plus one; and if the remainder is smaller than the third numerical value, determining the number of the special adhesive tapes as the quotient.

For convenience of understanding, in an application scenario, the thickness of the single layer of the specialty adhesive tape is 35um, the depth of the first groove 1410 is 150um, the calculated quotient is 4, and the remainder is 10, wherein the preset third value is 15, and since the remainder 10 is less than 15, the number of the specialty adhesive tapes can be determined to be 4.

The third value can be set according to practical conditions, and is set by the principle that the multi-layer special adhesive tape fills the first groove 1410 as much as possible without exceeding too much, and is not limited specifically herein.

With reference to fig. 4, in this embodiment, the method further includes:

providing a component 1500, wherein the component 1500 comprises a first portion 1501 and a second portion 1502 which are connected with each other, the width of the first portion 1501 is equal to that of the first groove 1410, and the width of the second portion 1502 is equal to that of the second groove 1420;

component 1500 is mounted such that first portion 1501 is located in first indentation 1410 and second portion 1502 is located in second indentation 1420.

The component 1500 may be a bare chip or a packaged chip, as shown in fig. 4, the component 1500 is a bare chip inserted in the inverted T-shaped groove in a transverse direction, and is connected to the fourth conductive layer 1220 through a metal wire 1510, so that the chip is electrically connected to the circuit board 1000. If the component 1500 is a packaged chip, it can be directly and laterally plugged onto the circuit board 1000 without the need for wire bonding.

Referring to fig. 5, fig. 5 is a schematic structural diagram of an embodiment of a circuit board of the present application, where the circuit board 2000 includes a first substrate 2100 and a second substrate 2200 stacked together, the first substrate 2100 is provided with a first groove 2310, the second substrate 2200 is provided with a second groove 2320 exposing the first groove 2310, the width of the second groove 2320 is smaller than the width of the first groove 2310, the first groove 2310 extends to at least one side of the first substrate 2100, the second groove 2320 extends to at least one side of the second substrate 2200, and a side of the first substrate 2100 communicating with the first groove 2310 and a side of the second substrate 2200 communicating with the second groove 2320 are disposed adjacent to each other.

With reference to fig. 5, in the present embodiment, the first substrate 2100 of the circuit board 2000 includes a first core board 2010 and an adhesive layer 2140 stacked, the second substrate 2200 includes a second core board 2020, the adhesive layer 2140 of the first substrate 2100 has a first groove 2310, and the second core board 2020 of the second substrate 2200 has a second groove 2320.

The thickness of the first groove 2310 is the same as that of the adhesive layer 2140 in this embodiment, and the first groove 2310 exposes the surface of the first core plate 2010.

The adhesive layer 2140 includes a prepreg, which is also called a PP sheet, which is one of main materials in the production of multilayer boards, and mainly includes a resin and a reinforcing material, which softens under heat and pressure and reacts and solidifies after cooling. In other embodiments, the adhesive layer 2140 may also include other materials having adhesive effects, and is not limited herein.

In this embodiment, the first core board 2010 includes a first conductive layer 2110, a first base layer 2130 and a second conductive layer 2120 sequentially stacked, the second core board 2020 includes a third conductive layer 2210, a second base layer 2230 and a fourth conductive layer 2220 sequentially stacked, the adhesive layer 2140 is disposed adjacent to the second conductive layer 2120, and the first groove 2310 exposes a surface of the second conductive layer 2120.

In this embodiment, the second groove 2320 includes a first sub-groove 2421 and a second sub-groove 2422, the first sub-groove 2421 is disposed at a position where the fourth conductive layer 2220 corresponds to the first groove 2310, and the first sub-groove 2421 exposes a surface of the second substrate layer 2230; the second sub-grooves 2422 are disposed at the exposed second substrate layer 2230, and the second sub-grooves 2422 expose the first grooves 2310. The width of the first sub-groove 2421 is greater than or equal to the width of the second sub-groove 2422, and the width of the second sub-groove 2422 is smaller than the width of the first groove 2310.

In this embodiment, the thickness of the first sub-groove 2421 is the same as the thickness of the fourth conductive layer 2220 of the second core board 2020, and the thickness of the second sub-groove 2422 is the same as the sum of the thicknesses of the second base layer 2230 and the third conductive layer 2210 of the second core board 2020.

The circuit board 2000 in this embodiment is prepared by the preparation method in any one of the above embodiments, and the detailed preparation method can be referred to the above embodiments, and is not described herein again.

Referring to fig. 6, fig. 6 is a schematic structural diagram of another embodiment of the circuit board of the present application.

Different from the above embodiments, the component 3500 is mounted on the wiring board 3000 in this embodiment, specifically, the component 3500 includes a first portion 3501 and a second portion 3502 connected to each other, a width of the first portion 3501 is equal to a width of the first groove 3310, a width of the second portion 3502 is equal to a width of the second sub-groove 3322 in the second groove 3320, the first portion 3501 of the component 3500 is located in the first groove 3310, and the second portion 3502 of the component 3500 is located in the second groove 3320.

The thickness of the first portion 3501 of the component 3500 is equal to the thickness of the first recess 3310, and the thickness of the second portion 3502 of the component 3500 is equal to or greater than the thickness of the second recess 3320.

In summary, the invention method of the present application provides a circuit board with an inverted T-shaped step groove, and provides a component with the same inverted T shape, and the inverted T-shaped component is fixed by the groove of the inverted T-shaped step groove, which is laterally recessed, so that the lateral plugging of the component on the circuit board is realized, and the convenience and reliability of installation are improved.

The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims

1. The utility model provides a circuit board, its characterized in that, is including first base plate and the second base plate of range upon range of setting, first base plate is provided with first recess, the second base plate is provided with and exposes the second recess of first recess, the width of second recess is less than the width of first recess, first recess extends to at least one side of first base plate, the second recess extends to at least one side of second base plate, first base plate with the side of first recess intercommunication with the second base plate with the side of second recess intercommunication is adjacent to be set up.

2. The wiring board of claim 1, wherein the first substrate comprises a first core plate and a bonding layer arranged in a stack, the second substrate comprises a second core plate, the bonding layer of the first substrate is provided with the first groove, and the second core plate of the second substrate is provided with the second groove.

3. The wiring board of claim 2,

the thickness of the first groove is the same as that of the bonding layer, and the first groove exposes the surface of the first core plate.

4. The wiring board of claim 2,

the bonding layer includes a prepreg.

5. The wiring board of claim 2, wherein the first core board comprises a first conductive layer, a first base layer, and a second conductive layer sequentially stacked, the second core board comprises a third conductive layer, a second base layer, and a fourth conductive layer sequentially stacked, the adhesive layer is disposed adjacent to the second conductive layer, and the first recess exposes a surface of the second conductive layer.

6. The wiring board of claim 5,

the second groove comprises a first sub-groove and a second sub-groove, the first sub-groove is arranged at the position, corresponding to the first groove, of the fourth conducting layer, and the first sub-groove exposes the surface of the second substrate layer; the second sub-groove is disposed at the exposed second substrate layer, the second sub-groove exposing the first groove.

7. The wiring board of claim 6,

the width of the first sub-groove is larger than or equal to that of the second sub-groove, and the width of the second sub-groove is smaller than that of the first groove.

8. The wiring board of claim 6,

the thickness of the first sub-groove is the same as that of the fourth conductive layer of the second core board, and the thickness of the second sub-groove is the same as the sum of the thicknesses of the second base layer and the third conductive layer of the second core board.

9. The wiring board of claim 6, further comprising:

the component comprises a first portion and a second portion which are connected with each other, the width of the first portion is equal to that of the first groove, the width of the second portion is equal to that of the second sub-groove in the second groove, the first portion of the component is located in the first groove, and the second portion of the component is located in the second groove.

10. The wiring board of claim 9,

the thickness of the first part of the component is equal to that of the first groove, and the thickness of the second part of the component is larger than or equal to that of the second groove.