CN111565523A - Manufacturing method of second-order copper block-buried circuit board - Google Patents
Manufacturing method of second-order copper block-buried circuit board Download PDFInfo
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- CN111565523A CN111565523A CN202010408202.5A CN202010408202A CN111565523A CN 111565523 A CN111565523 A CN 111565523A CN 202010408202 A CN202010408202 A CN 202010408202A CN 111565523 A CN111565523 A CN 111565523A
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 158
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 125
- 239000010949 copper Substances 0.000 title claims abstract description 125
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 44
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 239000011889 copper foil Substances 0.000 claims abstract description 33
- 238000003825 pressing Methods 0.000 claims abstract description 29
- 238000010030 laminating Methods 0.000 claims abstract description 18
- 238000009713 electroplating Methods 0.000 claims abstract description 8
- 239000012790 adhesive layer Substances 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 19
- 230000000149 penetrating effect Effects 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 8
- 238000003801 milling Methods 0.000 claims description 7
- 239000011888 foil Substances 0.000 claims description 6
- 239000000084 colloidal system Substances 0.000 claims description 5
- 238000003475 lamination Methods 0.000 claims description 2
- 238000003672 processing method Methods 0.000 abstract description 3
- 238000007747 plating Methods 0.000 description 7
- 239000003292 glue Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000003754 machining Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000013521 mastic Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to a manufacturing method of a second-order copper block-buried circuit board. The manufacturing method of the second-order copper block-buried circuit board comprises the following steps: laminating a plurality of substrates and laminating to form an intermediate laminated plate; forming a first blind hole on the surface of the middle laminated plate, and carrying out electroplating filling on the first blind hole to form a first conductive column; a T-shaped hole is formed in the surface of the middle laminated plate; providing a T-shaped copper block with convex edges on the side wall, clamping the T-shaped copper block into a T-shaped hole, curing in a gap between the side wall of the T-shaped copper block and the inner wall of the T-shaped hole to form a flow adhesive layer, and pressing copper foils on two opposite surfaces of a middle laminated plate respectively; and electroplating and filling holes in the second blind holes on the outer surface of the copper foil to form second conductive columns, and forming lead-out circuits electrically connected with the second conductive columns on the outer surface of the copper foil. The processing method of the second-order copper block-embedded circuit board improves the production efficiency of the second-order copper block-embedded circuit board and improves the product quality.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a manufacturing method of a second-order copper block-buried circuit board.
Background
Along with the continuous promotion of people to printed circuit board heat dispersion requirement, traditional printed circuit board's intensive louvre can not satisfy high heat dispersion's requirement yet. In order to solve the above problem, a copper block is generally embedded in the printed circuit board. The second-order copper block embedded circuit board is formed by firstly pressing a copper block and a multilayer core board, then performing secondary pressing after manufacturing a circuit, drilling holes, electroplating holes, and finally performing tertiary pressing, drilling holes and electroplating holes.
However, the method needs three times of pressing, and the problems of copper block offset, loose pressing of the copper block and the like easily occur in the pressing process of the copper block, so that the production efficiency of the second-order copper block-embedded circuit board is influenced, and the product quality of the second-order copper block-embedded circuit board is also influenced.
Disclosure of Invention
Therefore, it is necessary to provide a method for processing a second-order copper block-embedded circuit board, which can improve the production efficiency and product quality, in order to solve the problems of low production efficiency and poor production quality of the conventional second-order copper block-embedded circuit board.
A manufacturing method of a second-order copper block-buried circuit board comprises the following steps:
providing a plurality of substrates, and forming an inner layer circuit on at least part of the surfaces of the plurality of substrates;
laminating the plurality of substrates and laminating the substrates to form an intermediate laminated plate;
forming a first blind hole penetrating through the substrate on the outermost layer in the middle laminated plate on the surface of the middle laminated plate, and carrying out electroplating and hole filling on the first blind hole to form a first conductive column;
forming printed circuits on two opposite surfaces of the middle laminated plate respectively;
a T-shaped hole penetrating through the middle laminated plate is formed in the surface of the middle laminated plate;
providing a T-shaped copper block, wherein the side wall of the T-shaped copper block is provided with a convex edge, the T-shaped copper block is clamped into the T-shaped hole, a colloid material is injected into a gap between the side wall of the T-shaped copper block and the inner wall of the T-shaped hole to be solidified to form a flow adhesive layer, and copper foils are respectively pressed on two opposite surfaces of the middle pressing plate;
and forming a second blind hole at the position of the outer surface of the copper foil opposite to the first conductive column, performing electroplating and hole filling on the second blind hole to form a second conductive column, and forming a lead-out circuit electrically connected with the second conductive column on the outer surface of the copper foil.
In some of these embodiments, the plurality of substrates includes a plurality of core boards, each of whose surfaces is formed with the inner layer wiring.
In some embodiments, the plurality of substrates include a plurality of core plates, each of the core plates being filled with the inner layer circuit, and a foil located outside the middle laminate plate.
In some embodiments, the step of stacking and pressing the plurality of substrates to form the intermediate laminated plate is: and placing prepregs among the substrates, and laminating and pressing the substrates and the prepregs to form the intermediate laminated plate.
In some embodiments, the step of pressing copper foils on two opposite surfaces of the intermediate laminate plate respectively comprises: and sequentially laminating a prepreg and a copper foil on two opposite surfaces of the middle laminated board respectively, and laminating.
In some embodiments, the step of forming the first blind hole penetrating through the substrate on the outermost layer in the intermediate laminate plate on the surface of the intermediate laminate plate is: forming the first blind hole penetrating through the substrate on the outermost layer in the intermediate laminated plate on the surface of the intermediate laminated plate through laser processing;
the step of forming a second blind hole at the position of the outer surface of the copper foil opposite to the first conductive column is as follows: and forming the second blind hole in the position, opposite to the first conductive column, of the outer surface of the copper foil through laser processing.
In some embodiments, the step of forming a T-shaped hole through the intermediate laminate plate on the surface of the intermediate laminate plate comprises:
forming a first hole on one side surface of the intermediate laminated plate by milling;
and forming a second hole penetrating to the surface of the middle pressing plate at the bottom of the first hole by milling, wherein the aperture of the first hole is larger than that of the second hole.
In some of these embodiments, the thickness of the T-shaped copper block is the same as the thickness of the intermediate lamination plate.
In some of these embodiments, the size of the ridge is the same as the wall thickness of the gel layer in the diameter direction of the T-shaped copper block.
In some of these embodiments, the T-shaped copper block is a copper red block.
The manufacturing method of the second-order copper block-embedded circuit board comprises the steps of firstly, laminating a plurality of substrates to form a middle laminated board; and (3) accommodating the T-shaped copper block with the convex edge on the side wall in the T-shaped hole, and respectively pressing copper foils on two opposite surfaces of the middle pressing plate so as to form a second-order copper block embedded circuit board. Compared with the traditional second-order copper block embedded circuit board processing method which needs three times of pressing, the production process of the second-order copper block embedded circuit board effectively shortens the production period of the second-order copper block embedded circuit board and improves the production efficiency of the second-order copper block embedded circuit board.
And the T-shaped copper block with the convex edge on the side wall is accommodated in the T-shaped hole, and the colloid material is injected into the gap between the side wall of the T-shaped copper block and the inner wall of the T-shaped hole to form the gummed layer, so that the convex edge is completely contacted with the gummed layer, the arrangement of the convex edge plays a role in circumferential limiting on the T-shaped copper block, and the probability of circumferential deviation of the T-shaped copper block in the pressing process is reduced. And moreover, the contact area between the side wall of the T-shaped copper block and the gummosis layer is increased due to the arrangement of the convex ribs, so that the T-shaped copper block and the gummosis layer are more firmly connected. Therefore, the manufacturing method of the second-order copper block embedded circuit board improves the production efficiency of the second-order copper block embedded circuit board and enables the second-order copper block embedded circuit board to have higher product quality.
Drawings
FIG. 1 is a schematic flow chart of a method for manufacturing a second-order buried copper block circuit board according to a preferred embodiment of the present invention;
fig. 2 is a schematic structural diagram of the second-order copper block embedded circuit board after step S20 is executed in the manufacturing method of the second-order copper block embedded circuit board shown in fig. 1;
fig. 3 is a schematic structural diagram of the second-order copper block embedded circuit board after step S50 is executed in the manufacturing method of the second-order copper block embedded circuit board shown in fig. 1;
fig. 4 is a schematic structural diagram of the second-order copper block embedded circuit board after step S70 is executed in the manufacturing method of the second-order copper block embedded circuit board shown in fig. 1;
FIG. 5 is a schematic structural diagram of a T-shaped copper block in a second-order copper block embedded circuit board manufactured by the manufacturing method of the second-order copper block embedded circuit board shown in FIG. 1;
fig. 6 is a top view of the T-shaped copper block shown in fig. 5.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
When an element is referred to as being "on" another element, it can be directly on the other element or intervening elements may also be present, unless otherwise specified. It will also be understood that when an element is referred to as being "between" two elements, it can be the only one between the two elements, or one or more intervening elements may also be present.
Where the terms "comprising," "having," and "including" are used herein, another element may be added unless an explicit limitation is used, such as "only," "consisting of … …," etc. Unless mentioned to the contrary, terms in the singular may include the plural and are not to be construed as being one in number.
Furthermore, the drawings are not 1: 1, and the relative dimensions of the various elements in the figures are drawn for illustration only and not necessarily to true scale.
Referring to fig. 1, the method for manufacturing the second-order copper block-embedded circuit board 100 according to the preferred embodiment of the invention includes steps S10 to S70:
referring to fig. 2, in step S10, a plurality of substrates 113 are provided, and an inner layer circuit is formed on at least a portion of the surfaces of the plurality of substrates 113.
The substrate 113 mainly plays a supporting role, and the substrate 113 may be a core board, a foil, or the like. Specifically, the inner layer wiring may be formed on the surface of the substrate 113 by screen printing, etching, electrolytic copper plating, or the like. The inner layer circuit is mainly used for electrical connection of the second-order buried copper block circuit board 100. The multilayer inner layer circuit is arranged in the second-order copper block-embedded circuit board 100 mainly to realize high-density connection of the second-order copper block-embedded circuit board 100.
In step S20, the plurality of substrates 113 are stacked and pressed to form the intermediate laminated board 110.
Specifically, the plurality of substrates 113 stacked one on another are laminated by a laminator to form the intermediate laminated plate 110.
In some embodiments, the step S20 is specifically: the prepreg 114 is placed between the substrates 113, and the substrates 113 and the prepreg 114 are stacked and pressed to form the intermediate laminated board 110.
Specifically, the prepreg 114 is mainly made of resin and reinforcing material. Since the prepreg 114 is softened at high temperature and high pressure, it is reacted and solidified after cooling. The prepreg 114 has good adhesion and can serve as a good adhesive for the substrates 113 during the pressing process, so that the substrates 113 can be bonded more firmly.
Further, in one embodiment, the plurality of substrates 113 includes a plurality of core boards, each having a surface on which inner layer wiring is formed. Specifically, a plurality of core boards are stacked and press-bonded to form the intermediate press-bonded panel 110. More specifically, the prepreg 114 is placed between a plurality of core boards, and the plurality of core boards and the prepreg 114 are stacked and pressed to form the intermediate laminated board 110. The structure of the intermediate laminate sheet 110 formed of the core sheets is simpler and the use of the prepreg 114 makes the bonding between the core sheets stronger.
Further, in another embodiment, the plurality of substrates 113 includes a plurality of core plates each having an inner layer circuit formed on a surface thereof, and a foil positioned outside the middle laminate plate 110.
Specifically, a plurality of core plates are stacked, and a barrier foil is stacked on the outermost side of the stacked plurality of chips, and is pressed by a laminating press.
Referring to fig. 3, in step S30, first blind holes 112 penetrating through the substrate 113 at the outermost layer of the intermediate laminated plate 110 are formed on the surface of the intermediate laminated plate 110, and the first blind holes 112 are filled with plating to form the first conductive pillars 130.
The first blind hole 112 mainly plays a role in electrical and thermal conduction. Specifically, the first blind hole 112 is a conical blind hole, and the conical blind hole makes the processing of the first blind hole 112 simpler.
In order to meet the requirement of high density and high integration of the circuit board, the first blind via 112 is filled with plating to form the first conductive pillar 130. Moreover, the electrical and thermal conductivity of the first conductive pillar 130 is better than that of the first blind via 112. Specifically, in the embodiment, the first conductive pillar 130 is a copper pillar formed by performing electrolytic copper plating on the first blind via 112, and the copper pillar has economical and practical characteristics on the premise of realizing electric conductivity and heat conductivity, so that the manufacturing cost of the second-order copper block-buried circuit board 100 can be effectively reduced.
In step S40, printed circuits are formed on the opposite surfaces of the intermediate laminate sheet 110, respectively.
Specifically, the printed wiring is formed on both surfaces of the intermediate laminate plate 110 by screen printing, etching, imprinting, or the like. The printed circuit is formed on the two surfaces of the middle laminated plate 110 by the method, so that the printed circuit is basically flush with the two surfaces of the middle laminated plate 110, and the surface of the second-order copper-embedded fast circuit board is smooth. Specifically, the printed wiring board includes a shield circuit mainly for its electrical shielding and a common circuit for electrical connection.
Referring to fig. 1 and 3 again, in step S150, a T-shaped hole 111 penetrating through the middle laminate plate 110 is formed on the surface of the middle laminate plate 110.
Specifically, in the present embodiment, the step of forming the T-shaped hole 111 penetrating through the intermediate laminated plate 110 on the surface of the intermediate laminated plate 110 includes:
a first hole 1111 is formed at one side surface of the middle laminate panel 110 by milling;
a second hole 1112 penetrating to the surface of the middle laminate board 110 is formed at the bottom of the first hole 1111 by milling, and the hole diameter of the first hole 1111 is larger than the hole diameter of the second hole 1112. Specifically, the central axis of the first hole 1111 coincides with the central axis of the second hole 1112.
Specifically, the intermediate laminated plate 110 is milled at the surface of the intermediate laminated plate 110 by a machining center to form a T-shaped hole 111. Because the automation degree of the machining center is very high, the machining speed of the T-shaped hole 111 is higher and the precision is higher by the mode of milling the machining center, and further the production efficiency of the second-order copper-embedded fast circuit board is higher.
Referring to fig. 4 to 6, in step S160, a T-shaped copper block 160 is provided, wherein a rib 161 is disposed on a side surface of the T-shaped copper block 160, the T-shaped copper block 160 is accommodated in the T-shaped hole 111, a glue material is injected into a gap between a side wall of the T-shaped copper block 160 and an inner wall of the T-shaped hole 111 to form a glue layer 170, and the copper foil 120 is pressed on two opposite surfaces of the middle laminate 110.
Specifically, the process of laminating the copper foil 120, the intermediate laminated plate 110 and the T-shaped copper block 160 is as follows: firstly, a copper foil 120 is placed on a tray of a laminating press, then the middle laminated plate 110 is stacked on the copper foil 120, then a T-shaped copper block 160 is placed in a T-shaped hole 111, and a colloid material is injected into the T-shaped hole 111; another copper foil 120 is stacked on the surface of the intermediate laminate 110 and then pressed by a laminating press to realize the pressing of the T-shaped copper block 160, the copper foil 120 and the intermediate laminate 110.
Specifically, the T-shaped copper block 160 is a red copper block. The red copper can be generally considered as pure copper approximately, has excellent thermal conductivity and electrical conductivity and better shaping, and the T-shaped copper block 160 is made of the red copper, so that the T-shaped copper block 160 has excellent electrical conductivity and thermal conductivity, and the T-shaped copper block 160 is simpler and more convenient to process.
In some embodiments, the steps of pressing the copper foils 120 on the opposite surfaces of the intermediate laminate sheet 110, respectively, are: prepregs 114 and copper foils 120 are sequentially stacked on the opposite surfaces of the intermediate laminate 110, and then laminated.
Specifically, since the prepreg 114 is softened at high temperature and high pressure and then reacts and solidifies after cooling, the copper foil 120 and the intermediate laminate 110 are bonded more effectively.
Referring to fig. 6 again, in step S170, a second blind via 121 is formed at a position of the outer surface of the copper foil 120 opposite to the first conductive pillar 130. The second blind via 121 is filled with plating to form a second conductive pillar 140, and a lead-out line electrically connected to the second conductive pillar 140 is formed on the outer surface of the copper foil 120.
The second blind via 121 mainly plays a role of electrical and thermal conduction. Specifically, the second blind hole 121 is a conical blind hole, and the conical blind hole makes the processing of the first blind hole 112 simpler.
In order to meet the requirement of high density and high integration of the circuit board, the second blind via 121 is filled with plating to form the second conductive pillar 140. Moreover, the electrical and thermal conductivity of the second conductive pillar 140 is better than that of the second blind via 121. Specifically, the second conductive pillar 140 is a copper pillar formed by performing electrolytic copper plating on the second blind via 121, and the copper pillar has economical and practical characteristics on the premise of realizing electric conductivity and heat conductivity, so that the manufacturing cost of the second-order copper-buried fast circuit board can be effectively reduced.
Since the second blind via 121 is located at a position where the outer surface of the copper foil 120 is opposite to the first conductive pillar 130, the second conductive pillar 140 and the first conductive pillar 130 are stacked, so that the lead-out circuit is electrically connected to the inner circuit located on the outermost substrate 113 in the middle laminate plate 110.
In some embodiments, the step of forming the first blind hole 112 penetrating the substrate 113 of the outermost layer in the intermediate laminate plate 110 on the surface of the intermediate laminate plate 110 is: a first blind hole 112 penetrating through the substrate 113 of the outermost layer in the intermediate laminated plate 110 is formed on the surface of the intermediate laminated plate 110 by laser processing. The step of forming the second blind via 121 at the position of the outer surface of the copper foil 120 opposite to the first conductive pillar 130 is: the second blind via 121 is formed by laser processing at a position of the outer surface of the copper foil 120 opposite to the first conductive pillar 130.
Specifically, laser machining is a process of performing machining by using a thermal effect generated when a laser beam is projected onto a surface of a material. In the laser processing process, the laser beam has high energy density and high processing speed and is processed locally. The heat affected zone of laser processing is small, so that the thermal deformation of the workpiece is small. The laser processing has a fast processing speed, so that the processing speeds of the first blind hole 112 and the second blind hole 121 are fast, and the production efficiency of the second-order copper block-buried circuit board 100 is higher.
In some embodiments, the thickness of the T-shaped copper slug 160 is the same as the thickness of the intermediate laminate sheet 110. The copper blocks with the same thickness as the middle laminated plate 110 are adopted, so that the surface of the second-order copper block embedded circuit board 100 formed by pressing is smoother.
In some embodiments, the ribs 161 are the same size as the wall thickness of the layer of mastic 170 across the diameter of the T-shaped copper block 160. Therefore, in the processing process of the second-order buried copper block circuit board 100, the T-shaped buried copper block can be fixed only by less colloid materials, so that the height of the convex edge 161 is set to be the same as the wall thickness of the glue flowing layer 170 in the diameter direction of the T-shaped buried copper block, and the second-order buried copper block circuit board 100 can be ensured to reduce the size while the heat dissipation effect is ensured.
The manufacturing method of the second-order copper block-embedded circuit board 100 is to form an intermediate laminated board 110 by laminating a plurality of substrates 113; the second-order buried copper block circuit board 100 is formed by housing a T-shaped copper block 160 having a rib 161 on the side wall thereof in the T-shaped hole 111 and pressing copper foils 120 on the opposite surfaces of the intermediate laminate sheet 110, respectively. Compared with the traditional second-order copper block embedded circuit board 100 processing method which needs three times of pressing, the production process of the second-order copper block embedded circuit board 100 effectively shortens the production period of the second-order copper block embedded circuit board 100 and improves the production efficiency of the second-order copper block embedded circuit board 100.
The T-shaped copper block 160 with the rib 161 on the side wall is accommodated in the T-shaped hole 111, and the glue material is injected into the gap between the side wall of the T-shaped copper block 160 and the inner wall of the T-shaped hole 111 to form the glue flowing layer 170, so that the rib 161 is completely contacted with the glue flowing layer 170, and the rib 161 is arranged to circumferentially limit the T-shaped copper block 160, thereby reducing the probability of circumferential deviation of the T-shaped copper block 160 in the pressing process. Moreover, the arrangement of the convex ribs 161 also increases the contact area between the side wall of the T-shaped copper block 160 and the gummosis layer 170, so that the connection between the T-shaped copper block 160 and the gummosis layer 170 is firmer. Therefore, the manufacturing method of the second-order copper block embedded circuit board 100 improves the production efficiency of the second-order copper block embedded circuit board 100 and enables the second-order copper block embedded circuit board 100 to have higher product quality.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A manufacturing method of a second-order copper block-embedded circuit board is characterized by comprising the following steps:
providing a plurality of substrates, and forming an inner layer circuit on at least part of the surfaces of the plurality of substrates;
laminating the plurality of substrates and laminating the substrates to form an intermediate laminated plate;
forming a first blind hole penetrating through the substrate on the outermost layer in the middle laminated plate on the surface of the middle laminated plate, and carrying out electroplating and hole filling on the first blind hole to form a first conductive column;
forming printed circuits on two opposite surfaces of the middle laminated plate respectively;
a T-shaped hole penetrating through the middle laminated plate is formed in the surface of the middle laminated plate;
providing a T-shaped copper block, wherein the side wall of the T-shaped copper block is provided with a convex edge, the T-shaped copper block is clamped into the T-shaped hole, a colloid material is injected into a gap between the side wall of the T-shaped copper block and the inner wall of the T-shaped hole to be solidified to form a flow adhesive layer, and copper foils are respectively pressed on two opposite surfaces of the middle pressing plate;
and forming a second blind hole at the position of the outer surface of the copper foil opposite to the first conductive column, performing electroplating and hole filling on the second blind hole to form a second conductive column, and forming a lead-out circuit electrically connected with the second conductive column on the outer surface of the copper foil.
2. The method of manufacturing a second-order buried copper block circuit board according to claim 1, wherein the plurality of substrates include a plurality of core boards, and the inner layer circuit is formed on a surface of each core board.
3. The method as claimed in claim 1, wherein the plurality of substrates include a plurality of core boards and foils, each core board is fully formed with the inner layer circuit, and the foils are located outside the middle laminate board.
4. The method for manufacturing a second-order buried copper block circuit board according to claim 1, wherein the step of stacking and pressing the plurality of substrates to form an intermediate pressing plate comprises the steps of: and placing prepregs among the substrates, and laminating and pressing the substrates and the prepregs to form the intermediate laminated plate.
5. The method for manufacturing a second-order buried copper block circuit board according to claim 1, wherein the step of pressing copper foils on two opposite surfaces of the intermediate laminate plate respectively comprises: and sequentially laminating a prepreg and a copper foil on two opposite surfaces of the middle laminated board respectively, and laminating.
6. The method for manufacturing a second-order buried copper block circuit board according to claim 1, wherein the step of forming the first blind hole penetrating through the substrate on the outermost layer of the intermediate laminate plate on the surface of the intermediate laminate plate comprises: forming the first blind hole penetrating through the substrate on the outermost layer in the intermediate laminated plate on the surface of the intermediate laminated plate through laser processing;
the step of forming a second blind hole at the position of the outer surface of the copper foil opposite to the first conductive column is as follows: and forming the second blind hole in the position, opposite to the first conductive column, of the outer surface of the copper foil through laser processing.
7. The method for manufacturing a second-order buried copper block circuit board according to claim 1, wherein the step of forming a T-shaped hole penetrating through the intermediate laminate plate on the surface of the intermediate laminate plate includes:
forming a first hole on one side surface of the intermediate laminated plate by milling;
and forming a second hole penetrating to the surface of the middle pressing plate at the bottom of the first hole by milling, wherein the aperture of the first hole is larger than that of the second hole.
8. The method of manufacturing a second-order buried copper block circuit board according to claim 1, wherein the thickness of the T-shaped copper block is the same as the thickness of the intermediate lamination plate.
9. The method of manufacturing a second-order buried copper block circuit board according to claim 1, wherein the size of the rib is the same as the wall thickness of the adhesive layer in the diameter direction of the T-shaped copper block.
10. The method of manufacturing a second-order buried copper block circuit board according to claim 1, wherein the T-shaped copper block is a red copper block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010408202.5A CN111565523A (en) | 2020-05-14 | 2020-05-14 | Manufacturing method of second-order copper block-buried circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010408202.5A CN111565523A (en) | 2020-05-14 | 2020-05-14 | Manufacturing method of second-order copper block-buried circuit board |
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| CN111565523A true CN111565523A (en) | 2020-08-21 |
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| CN202010408202.5A Withdrawn CN111565523A (en) | 2020-05-14 | 2020-05-14 | Manufacturing method of second-order copper block-buried circuit board |
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|---|---|
| CN (1) | CN111565523A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113438832A (en) * | 2021-06-25 | 2021-09-24 | 皆利士多层线路版(中山)有限公司 | Current-tolerant multilayer PCB and preparation method thereof |
| CN113453434A (en) * | 2021-07-08 | 2021-09-28 | 深圳市企鹅网络科技有限公司 | Method for manufacturing high-heat-dissipation special printed circuit board for video transmission and circuit board |
| CN114567976A (en) * | 2022-03-22 | 2022-05-31 | 上海山崎电路板有限公司 | Multilayer circuit board copper-embedding process |
| CN114599145A (en) * | 2020-12-07 | 2022-06-07 | 健鼎（无锡）电子有限公司 | Circuit board with buried copper block structure |
| CN115955771A (en) * | 2022-12-27 | 2023-04-11 | 深圳崇达多层线路板有限公司 | A method of using PP filling to make double-sided buried copper board and double-sided buried copper board |
| CN121013284A (en) * | 2025-10-27 | 2025-11-25 | 惠州市特创电子科技股份有限公司 | Circuit board and its embedded copper block manufacturing method |
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2020
- 2020-05-14 CN CN202010408202.5A patent/CN111565523A/en not_active Withdrawn
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114599145A (en) * | 2020-12-07 | 2022-06-07 | 健鼎（无锡）电子有限公司 | Circuit board with buried copper block structure |
| CN113438832A (en) * | 2021-06-25 | 2021-09-24 | 皆利士多层线路版(中山)有限公司 | Current-tolerant multilayer PCB and preparation method thereof |
| CN113453434A (en) * | 2021-07-08 | 2021-09-28 | 深圳市企鹅网络科技有限公司 | Method for manufacturing high-heat-dissipation special printed circuit board for video transmission and circuit board |
| CN114567976A (en) * | 2022-03-22 | 2022-05-31 | 上海山崎电路板有限公司 | Multilayer circuit board copper-embedding process |
| CN114567976B (en) * | 2022-03-22 | 2024-02-09 | 上海山崎电路板有限公司 | Copper burying process for multilayer circuit board |
| CN115955771A (en) * | 2022-12-27 | 2023-04-11 | 深圳崇达多层线路板有限公司 | A method of using PP filling to make double-sided buried copper board and double-sided buried copper board |
| CN121013284A (en) * | 2025-10-27 | 2025-11-25 | 惠州市特创电子科技股份有限公司 | Circuit board and its embedded copper block manufacturing method |
| CN121013284B (en) * | 2025-10-27 | 2026-01-06 | 惠州市特创电子科技股份有限公司 | Circuit board and its embedded copper block manufacturing method |
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Application publication date: 20200821 |
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| WW01 | Invention patent application withdrawn after publication |