CN105246263A - Process for protecting goldfinger and bonding pad in rigid-flex printed circuit board - Google Patents
Process for protecting goldfinger and bonding pad in rigid-flex printed circuit board Download PDFInfo
- Publication number
- CN105246263A CN105246263A CN201510656913.3A CN201510656913A CN105246263A CN 105246263 A CN105246263 A CN 105246263A CN 201510656913 A CN201510656913 A CN 201510656913A CN 105246263 A CN105246263 A CN 105246263A
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- CN
- China
- Prior art keywords
- golden finger
- rigid
- pad
- flex
- adhesive tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1383—Temporary protective insulating layer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a process for protecting a goldfinger and a bonding pad in a rigid-flex printed circuit board. The process comprises the following steps of S1, respectively carrying out board cutting; S2, carrying out a front procedure; S3, coating the surface of a flexible board with a cover film and carrying out first rapid lamination; S4, coating the goldfinger and the bonding pad of the flexible board with a high-temperature resistant adhesive tape, and carrying out second rapid lamination; S5, carrying out brownification on a copper surface of the flexible board, carrying out lamination on the flexible board, a prepreg and a rigid board, and milling an appearance; S6, removing the high-temperature resistant adhesive tape, and carrying out nickel and gold deposition treatment on a goldfinger region and a bonding pad region which are exposed; and S7, carrying out a post procedure. By coating the high-temperature resistant adhesive tape, the problem that glue residue is remained on the prepreg on the goldfinger region and the bonding region, or the goldfinger and the bonding pad are polluted by other impurities during the lamination process and are difficult to clean is solved, normal surface treatment can be carried out on the goldfinger and the bonding pad after the high-temperature resistant adhesive tape is removed, no glue residue is remained, the production rejection rate is reduced, the product quality is improved, and the production cost is saved.
Description
Technical field
The invention belongs to printed circuit board manufacture technology field, relate to a kind of manufacture craft of rigid-flex combined board, relate in particular to a kind of technique protecting rigid-flex combined board inside finger and pad.
Background technology
Along with the development of electronic technology, especially the continuous progress of Electronic Assembly Foundation, conventional rigid printed circuit board cannot meet the requirement of electronic product " light, thin, short, little " gradually, particularly the market demand of the product such as military project, Medical Devices, mobile phone, camera constantly expands, and the developmental research of rigid-flex combined board gets the attention.Rigid-flex combined board refers to and one piece of printed circuit board comprises one or more rigid region and flexible region simultaneously, by rigid plate with flex plate is laminated together in an orderly manner forms, the circuit on the circuit on rigid printed circuit boards layer and flexible printed-circuit board layer is by plated-through hole mutual conduction.The supporting role that rigid-flex combined board had not only had rigid plate but also the characteristic having flex plate flexible, flexible, also there is volume little, lightweight, can realize replacing connector and three-dimensional feature of installing, will leading force be become at the digital communication in future and computer realm.
Rigid-flex combined board internal layer is provided with golden finger or pad, the design of logical window is done at the dielectric layer in internal layer golden finger or the corresponding region of pad during production, open window by not flow prepreg at golden finger or pad corresponding region and carry out selectivity lamination, the normal lamination in other region except golden finger, welding disking area, after boring, copper facing, Graphic transitions, welding resistance, take off lid to shaping after lamination, now internal layer pad is exposed and do surface treatment.But aforementioned production method exists internal layer golden finger or pad at foreign material contaminated after lamination and prepreg cull is difficult to the problem removed, there is quality abnormal after causing internal layer pad to make surface treatment and scrap, not going up the defects such as gold as golden face stain on internal layer pad.
Summary of the invention
For this reason; technical problem to be solved by this invention is in the production process of existing rigid-flex combined board; internal layer golden finger and pad easy contaminated foreign material, prepreg cull after lamination are difficult to remove; cause internal layer pad or golden finger quality abnormal, thus propose a kind of technique protecting the inner golden finger of rigid-flex combined board and pad.
For solving the problems of the technologies described above, technical scheme of the present invention is:
The invention provides a kind of technique protecting the inner golden finger of rigid-flex combined board and pad, it comprises the steps:
S1, flex plate, rigid plate and prepreg to rigid-flex combined board carry out sawing sheet respectively;
S2, front operation;
S3, paste coverlay on described flex plate surface and carry out first time quick pressing;
S4, paste High temperature-resistanadhesive adhesive tape in described flex plate golden finger area and welding disking area, carry out second time quick pressing;
S5, carry out brown to described flex plate copper face, and carry out the pressing of flex plate, prepreg and rigid plate, then gong goes out profile;
S6, move back High temperature-resistanadhesive adhesive tape, the process of heavy nickel gold is carried out to the golden finger district of exposing and pad area;
S7, rear operation.
As preferably, described High temperature-resistanadhesive adhesive tape size large 0.5-2.0mm more monolateral than golden finger size, and be not more than the windowed regions of golden finger.
As preferably, described High temperature-resistanadhesive adhesive tape size 0.5-2.0mm larger than pad diameter, and be not more than the windowed regions of pad.
As preferably, described High temperature-resistanadhesive adhesive tape is Kapton Tape.
As preferably, described step S4 also comprised process flex plate golden finger area and welding disking area being carried out to surperficial brown before pasting High temperature-resistanadhesive adhesive tape.
As preferably, before described in described front operation, operation is for carrying out surface treatment to flex plate and rigid plate and internal layer circuit makes.
As preferably, described rear operation comprises the steps: electric golden finger, shaping, shaping rear test.
As preferably, in described step S5, after pressing, also comprise the step of boring, hole metallization and graphic plating.
Technique scheme of the present invention has the following advantages compared to existing technology:
(1) technique of the inner golden finger of protection rigid-flex combined board of the present invention and pad, High temperature-resistanadhesive adhesive tape has been pasted in golden finger area and welding disking area after flex plate surface pastes coverlay and carries out pressing, in follow-up lamination process, avoid prepreg and remain cull in golden finger area and welding disking area, or golden finger and welding disking area pollute other foreign material in lamination process, be difficult to the problem of clearing up, after stripping High temperature-resistanadhesive adhesive tape, normal surface process can be done to golden finger and pad, cull can not be left over, reduce manufacturing scrap rate, improve the quality of product, save production cost.
(2) technique of the inner golden finger of protection rigid-flex combined board of the present invention and pad; process flex plate golden finger area and welding disking area being carried out to surperficial brown was also comprised before pasting High temperature-resistanadhesive adhesive tape; add the roughness on golden finger and pad portion surface; thus improve High temperature-resistanadhesive adhesive tape and the adhesion between golden finger and pad; prevent in follow-up bonding processes, High temperature-resistanadhesive adhesive tape comes off.
Embodiment
Embodiment
The present embodiment provides a kind of technique protecting the inner golden finger of rigid-flex combined board and pad, and it comprises the steps:
S1, according to preliminary dimension, respectively sawing sheet is carried out to the flex plate of rigid-flex combined board, rigid plate and prepreg;
S2, front operation, carry out surface treatment to described flex plate, rigid plate, after carry out internal layer circuit making;
S3, paste coverlay on described flex plate surface and carry out first time quick pressing, coverlay is pressed on flex plate surface more closely;
S4, brown process is carried out to flex plate golden finger area and welding disking area, improve the roughness on surface, then polyimide high temperature-resistant adhesive tape is pasted in described flex plate golden finger area and welding disking area, and carry out second time quick pressing, described polyimide high temperature-resistant adhesive tape single side size 0.5-2mm larger than golden finger, in the present embodiment, adhesive tape size large 1mm more monolateral than golden finger size, and be not more than the windowed regions of golden finger; Described polyimide high temperature-resistant adhesive tape size 0.5-2.0mm larger than pad diameter, adhesive tape size 1mm larger than pad diameter in the present embodiment, and be not more than the windowed regions of pad;
S5, brown is carried out to the copper face of described flex plate, and carry out the pressing of flex plate, prepreg and rigid plate, then hole, hole metallization process is carried out to via, after carrying out graphic plating, gong goes out the profile of rigid-flex combined board, exposes internal layer golden finger and pad;
S6, move back High temperature-resistanadhesive adhesive tape, the High temperature-resistanadhesive adhesive tape of the internal layer golden finger exposed and bond pad surface is removed, and the process of heavy nickel gold is carried out to the golden finger district of exposing and pad area;
S7, rear operation, carry out electric golden finger, shaping, shaping rear test with common process, the qualified rear packaging shipment of final inspection.
The technique of the inner golden finger of the protection rigid-flex combined board described in the present embodiment and pad, High temperature-resistanadhesive adhesive tape has been pasted in golden finger area and welding disking area after flex plate surface pastes coverlay and carries out pressing, in follow-up lamination process, avoid prepreg and remain cull in golden finger area and welding disking area, or golden finger and welding disking area pollute other foreign material in lamination process, be difficult to the problem of clearing up, after stripping High temperature-resistanadhesive adhesive tape, normal surface process can be done to golden finger and pad, cull can not be left over, reduce manufacturing scrap rate, improve the quality of product, save production cost.
Obviously, above-described embodiment is only for clearly example being described, and the restriction not to execution mode.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all execution modes.And thus the apparent change of extending out or variation be still among the protection range of the invention.
Claims (8)
1. protect a technique for the inner golden finger of rigid-flex combined board and pad, it is characterized in that, comprise the steps:
S1, flex plate, rigid plate and prepreg to rigid-flex combined board carry out sawing sheet respectively;
S2, front operation;
S3, paste coverlay on described flex plate surface and carry out first time quick pressing;
S4, paste High temperature-resistanadhesive adhesive tape in described flex plate golden finger area and welding disking area, carry out second time quick pressing;
S5, carry out brown to described flex plate copper face, and carry out the pressing of flex plate, prepreg and rigid plate, then gong goes out profile;
S6, move back High temperature-resistanadhesive adhesive tape, the process of heavy nickel gold is carried out to the golden finger district of exposing and pad area;
S7, rear operation.
2. the technique of the inner golden finger of protection rigid-flex combined board according to claim 1 and pad, is characterized in that, described High temperature-resistanadhesive adhesive tape size large 0.5-2mm more monolateral than golden finger size, and is not more than the windowed regions of golden finger.
3. the technique of the inner golden finger of protection rigid-flex combined board according to claim 1 and 2 and pad, is characterized in that, described High temperature-resistanadhesive adhesive tape size 0.5-2.0mm larger than pad diameter, and is not more than the windowed regions of pad.
4. the technique of the inner golden finger of protection rigid-flex combined board according to claim 3 and pad, it is characterized in that, described High temperature-resistanadhesive adhesive tape is Kapton Tape.
5. the technique of the inner golden finger of protection rigid-flex combined board according to claim 4 and pad, it is characterized in that, described step S4 also comprised process flex plate golden finger area and welding disking area being carried out to surperficial brown before pasting High temperature-resistanadhesive adhesive tape.
6. the technique of the inner golden finger of protection rigid-flex combined board according to claim 5 and pad, is characterized in that, described front operation is for carrying out surface treatment and internal layer circuit making to flex plate and rigid plate.
7. the technique of the inner golden finger of protection rigid-flex combined board according to claim 6 and pad, it is characterized in that, described rear operation comprises the steps: electric golden finger, shaping and shaping rear test.
8. the technique of the inner golden finger of protection rigid-flex combined board according to claim 7 and pad, is characterized in that, in described step S5, also comprises the step of boring, hole metallization and graphic plating after pressing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510656913.3A CN105246263A (en) | 2015-10-12 | 2015-10-12 | Process for protecting goldfinger and bonding pad in rigid-flex printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510656913.3A CN105246263A (en) | 2015-10-12 | 2015-10-12 | Process for protecting goldfinger and bonding pad in rigid-flex printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105246263A true CN105246263A (en) | 2016-01-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510656913.3A Pending CN105246263A (en) | 2015-10-12 | 2015-10-12 | Process for protecting goldfinger and bonding pad in rigid-flex printed circuit board |
Country Status (1)
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| CN (1) | CN105246263A (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105758686A (en) * | 2016-04-11 | 2016-07-13 | 深圳崇达多层线路板有限公司 | Manufacturing method for bent test bar of rigid-flexible combined plate |
| CN106341944A (en) * | 2016-09-29 | 2017-01-18 | 深圳市景旺电子股份有限公司 | Rigid-flex PCB capable of protecting inner-layer pads and manufacturing method of rigid-flex PCB |
| CN107889377A (en) * | 2017-11-16 | 2018-04-06 | 江门崇达电路技术有限公司 | A kind of preparation method of ladder position golden finger |
| CN108323008A (en) * | 2018-03-06 | 2018-07-24 | 深圳崇达多层线路板有限公司 | A kind of production method of buried resistor Rigid Flex |
| WO2019085529A1 (en) * | 2017-11-02 | 2019-05-09 | 广州兴森快捷电路科技有限公司 | Method for manufacturing core board having built-in components and method for manufacturing circuit board |
| CN110139504A (en) * | 2019-05-24 | 2019-08-16 | 深圳市景旺电子股份有限公司 | Flexible and hard combined circuit board and preparation method thereof |
| CN110324980A (en) * | 2019-05-02 | 2019-10-11 | 深圳市星河电路股份有限公司 | A kind of turmeric adds the processing method of spray two kinds of different surface treatment pcb boards of tin finger |
| CN110572957A (en) * | 2019-09-18 | 2019-12-13 | 九江明阳电路科技有限公司 | Method and device for manufacturing multilayer rigid-flex printed circuit board |
| CN110933857A (en) * | 2019-11-15 | 2020-03-27 | 成都航天通信设备有限责任公司 | Method for processing rigid-flexible printed board with golden fingers on flexible part |
| CN111343804A (en) * | 2020-03-10 | 2020-06-26 | 景旺电子科技(龙川)有限公司 | Lamination method of multilayer thick copper metal-based circuit board |
| CN112543556A (en) * | 2020-11-12 | 2021-03-23 | 惠州市金百泽电路科技有限公司 | Processing method for avoiding PP powder residue of rigid-flex board finished product |
| CN112654178A (en) * | 2020-11-09 | 2021-04-13 | 广东科翔电子科技股份有限公司 | Process method of embedded pad type rigid-flex printed circuit board |
| CN113645767A (en) * | 2021-07-30 | 2021-11-12 | 高德（江苏）电子科技有限公司 | Finger fishing process for soft board area of rigid Flexible Printed Circuit (FPC) |
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| CN102427680A (en) * | 2011-11-16 | 2012-04-25 | 博罗县精汇电子科技有限公司 | Manufacturing process of single panel gold finger |
| US20130153274A1 (en) * | 2011-12-14 | 2013-06-20 | Wistron Corporation | Circuit board capable of preventing contact of a gold finger and solder |
| CN103153000A (en) * | 2013-02-01 | 2013-06-12 | 东莞生益电子有限公司 | Manufacture method for gold finger circuit board and circuit board manufactured by method |
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Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105758686A (en) * | 2016-04-11 | 2016-07-13 | 深圳崇达多层线路板有限公司 | Manufacturing method for bent test bar of rigid-flexible combined plate |
| CN106341944A (en) * | 2016-09-29 | 2017-01-18 | 深圳市景旺电子股份有限公司 | Rigid-flex PCB capable of protecting inner-layer pads and manufacturing method of rigid-flex PCB |
| CN106341944B (en) * | 2016-09-29 | 2018-09-07 | 深圳市景旺电子股份有限公司 | A kind of rigid-flex combined board and preparation method thereof for protecting internal layer pad |
| WO2019085529A1 (en) * | 2017-11-02 | 2019-05-09 | 广州兴森快捷电路科技有限公司 | Method for manufacturing core board having built-in components and method for manufacturing circuit board |
| CN107889377A (en) * | 2017-11-16 | 2018-04-06 | 江门崇达电路技术有限公司 | A kind of preparation method of ladder position golden finger |
| CN108323008B (en) * | 2018-03-06 | 2020-10-02 | 深圳崇达多层线路板有限公司 | Manufacturing method of embedded resistor rigid-flex board |
| CN108323008A (en) * | 2018-03-06 | 2018-07-24 | 深圳崇达多层线路板有限公司 | A kind of production method of buried resistor Rigid Flex |
| CN110324980B (en) * | 2019-05-02 | 2021-06-01 | 深圳市星河电路股份有限公司 | Processing method for PCB with gold immersion and tin spraying fingers through two different surface treatments |
| CN110324980A (en) * | 2019-05-02 | 2019-10-11 | 深圳市星河电路股份有限公司 | A kind of turmeric adds the processing method of spray two kinds of different surface treatment pcb boards of tin finger |
| CN110139504B (en) * | 2019-05-24 | 2020-07-10 | 深圳市景旺电子股份有限公司 | Soft and hard combined circuit board and manufacturing method thereof |
| CN110139504A (en) * | 2019-05-24 | 2019-08-16 | 深圳市景旺电子股份有限公司 | Flexible and hard combined circuit board and preparation method thereof |
| CN110572957A (en) * | 2019-09-18 | 2019-12-13 | 九江明阳电路科技有限公司 | Method and device for manufacturing multilayer rigid-flex printed circuit board |
| CN110572957B (en) * | 2019-09-18 | 2022-10-04 | 九江明阳电路科技有限公司 | Method and device for manufacturing multilayer rigid-flex printed circuit board |
| CN110933857A (en) * | 2019-11-15 | 2020-03-27 | 成都航天通信设备有限责任公司 | Method for processing rigid-flexible printed board with golden fingers on flexible part |
| CN111343804A (en) * | 2020-03-10 | 2020-06-26 | 景旺电子科技(龙川)有限公司 | Lamination method of multilayer thick copper metal-based circuit board |
| CN112654178A (en) * | 2020-11-09 | 2021-04-13 | 广东科翔电子科技股份有限公司 | Process method of embedded pad type rigid-flex printed circuit board |
| CN112543556A (en) * | 2020-11-12 | 2021-03-23 | 惠州市金百泽电路科技有限公司 | Processing method for avoiding PP powder residue of rigid-flex board finished product |
| CN113645767A (en) * | 2021-07-30 | 2021-11-12 | 高德（江苏）电子科技有限公司 | Finger fishing process for soft board area of rigid Flexible Printed Circuit (FPC) |
| CN113645767B (en) * | 2021-07-30 | 2023-02-28 | 高德(江苏)电子科技股份有限公司 | Finger fishing process for flexible printed circuit board and flexible board area |
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Application publication date: 20160113 |
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