CN112654178A - Process method of embedded pad type rigid-flex printed circuit board - Google Patents
Process method of embedded pad type rigid-flex printed circuit board Download PDFInfo
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- CN112654178A CN112654178A CN202011235677.5A CN202011235677A CN112654178A CN 112654178 A CN112654178 A CN 112654178A CN 202011235677 A CN202011235677 A CN 202011235677A CN 112654178 A CN112654178 A CN 112654178A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
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Abstract
The invention relates to a process method of an embedded pad type rigid-flex printed circuit board, which comprises the steps of firstly, respectively manufacturing a flexible substrate, pure glue, a pure PI protective film and a Core board, then respectively and sequentially stacking the pure PI protective film, the pure glue and the Core board on two sides of the manufactured flexible substrate for pressing treatment to manufacture a pressed rigid-flex printed circuit board, and then manufacturing an outer layer of the rigid-flex printed circuit board to complete the complete manufacture of the rigid-flex printed circuit board, wherein when the flexible substrate is manufactured, a circuit process synchronously etches out an embedded pad in a flexible board area; during the manufacture of the Core plate, one surface of the Core plate is designed to be full copper, the other surface of the Core plate is only subjected to copper blocking design in the flexible plate area, and the copper blocking area extends into the rigid plate; when the outer layer of the rigid-flex board is manufactured, the flexible board area is uncovered in a CO2 laser depth-control uncovering mode, and a copper blocking layer is not broken down in CO2 laser. The process method for embedding the pad type rigid-flex printed circuit board has the advantages of good quality, high efficiency and the like.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a process method of an embedded pad type rigid-flex printed circuit board.
Background
In the process of flow design and production of the rigid-flex printed circuit board with the embedded bonding pad, the problems of single-sided cover opening design of a rigid board area, surface treatment of a secondary inner layer bonding pad, copper blocking design of a CORE board and the like exist. The problems of difficult manual cover opening, pad scratching, gold surface glue residue and other product quality and appearance abnormity and the like easily occur in the process of uncovering the pad area of the rigid plate, and the production efficiency and the product yield are directly influenced. At present, no proper design scheme and production mode for the products exist in the industry.
Disclosure of Invention
The invention provides a process method of an embedded welding disc type rigid-flex printed circuit board with good product quality and high production efficiency.
In order to achieve the above purpose, the following technical solutions are provided.
A process method of an embedded pad type rigid-flex printed circuit board comprises the steps of manufacturing a flexible substrate, pure glue, a pure PI protective film and a Core board respectively, then sequentially stacking the pure PI protective film, the pure glue and the Core board on two sides of the manufactured flexible substrate respectively to perform pressing treatment to obtain a pressed rigid-flex printed circuit board, then manufacturing an outer layer of the rigid-flex printed circuit board to complete the complete manufacturing of the rigid-flex printed circuit board, wherein,
when the flexible substrate is manufactured, synchronously etching an embedded bonding pad in a flexible board area in a circuit process, then performing AOI (automated optical inspection), performing solder resist printing on an outer copper layer of the flexible substrate with the embedded bonding pad after the AOI is detected, printing solder resist ink on a copper sheet positioned on a rigid-flex boundary line, and attaching a pure PI protective film in the embedded bonding pad area after the flexible substrate is manufactured;
when the Core plate is manufactured, one surface of the Core plate is designed to be full copper, the other surface of the Core plate is only subjected to copper blocking design in a flexible plate area, a copper blocking area extends into a rigid plate, when the Core plate circuit is manufactured, only one surface which is designed with copper blocking is manufactured in the flexible plate area, and the other surface of the Core plate is protected by dry film exposure;
when the outer layer of the rigid-flex board is manufactured, the flexible board area is uncovered in a CO2 laser depth-control uncovering mode, a copper blocking layer is not broken down when CO2 laser is carried out, the copper blocking layer is etched and removed in acid etching in a post process, and uncovering of a TOP surface and an uncovering of a BOT surface are manufactured separately.
Further, the manufacturing of the flexible substrate comprises manufacturing of a flexible plate and an outer layer of the flexible plate, wherein,
the manufacturing method of the flexible board comprises the steps of sequentially stacking pure glue and a single-side copper-containing FCCL board on two sides of the double-side copper-containing FCCL board, and then carrying out first pressing treatment to obtain the flexible board without an outer layer, wherein one side, without a copper layer, of the single-side copper-containing FCCL board is attached to the pure glue layer, and the side, with the copper layer, of the single-side copper-containing FCCL board is far away from the pure glue layer;
the manufacturing method of the outer layer of the flexible board comprises the steps of etching an embedded welding pad on a flexible area on an outer copper layer of the flexible substrate by adopting an etching process when an outer layer circuit of the flexible substrate is manufactured, then carrying out AOI (automated optical inspection), carrying out solder mask printing on the outer copper layer of the flexible substrate with the embedded welding pad after the AOI inspection, and printing solder mask ink on a copper sheet positioned on a rigid-flex boundary line.
Furthermore, the outer layer process of the flexible plate further comprises the steps of target shooting, edge cutting, first browning, CO2 laser, copper deposition, hole filling and electroplating before circuit manufacturing, and the steps of post curing, plating resistance dry film pasting, gold deposition, film stripping, T hole punching, second browning, pure glue pasting, quick pressing and PET film tearing after the solder resistance printing process.
Further, the preparation of the pure glue comprises the following steps: the process is for cutting-to be equipped with the pure glue on the PET membrane and beat T hole-CNC type of cutting-to be equipped with the PET membrane, wherein, CNC type of cutting process will correspond rigidity board time inlayer pad and flexbile plate region of uncapping and drag for the sky, be formed with the pure glue of dragging for the sky region, it is after the pure glue is dragged for the sky to be equipped with the PET membrane process, the one side laminating of pure glue no PET membrane is on being equipped with the PET membrane, then take off the incomplete PET membrane of dragging for the sky back, make the pure glue one side have the PET membrane, the another side does not have the PET membrane, in the follow-up pure glue process of pasting, the one side laminating of pure glue no PET membrane is on flexible substrate.
Further, the preparation of the pure PI protective film comprises the following steps: the method comprises the following steps of cutting, perforating T holes on pure PI prepared on a PET film, carrying out ESI laser depth control cutting, and preparing the PET film, wherein the cutting step is to cut the pure PI protective film into sheets, and the sheet size of the pure PI protective film is smaller than that of a flexible board area of a rigid-flex combination board and is used for being attached to an embedded bonding pad of the flexible board area; the ESI laser depth-control cutting process is characterized in that a PET film is subjected to semi-radium treatment on a pure PI protective film in an area except for a rigid plate inner-layer bonding pad, the PET film is guaranteed not to be radium broken, then one side, without the PET film, of the fully radium-treated pure PI protective film is attached to a prepared PET film, the incomplete PET film, after the other side of the pure PI protective film is subjected to semi-radium treatment, is removed, the PET film is arranged on one side of the pure PI protective film, the PET film is arranged on the other side of the pure PI protective film, and during attaching, one side, without the PET film, of the PI protective film is attached to an embedded bonding.
Further, the Core plate is produced by: the process comprises the steps of cutting, drilling, exposing/developing, developing the copper blocking position, plating, wiring, drilling T holes and browning, and the Core plate with one surface being a full copper surface and the other surface being a bottom plate and only the copper blocking area and the other area containing copper is manufactured.
Further, keep off copper design and keep off copper extension into rigid plate 0.15mm, the Core board is single face line design, the one side that keeps off the copper design only carries out line design in keeping off the copper region, the one side that the copper was kept off in the Core board design is glued with pure and pure PI protection film laminating.
Furthermore, the outer layer manufacturing process of the rigid-flex board comprises the steps of target shooting, edge cutting, browning, CO2 laser, film pressing, exposure/development, copper precipitation, hole filling electroplating, circuit, AOI (automatic optical inspection), solder resist printing, post curing, CO2 laser controlled deep uncovering, plasma glue removal, sand blasting pretreatment, film pressing, exposure/development, acid etching, AOI, CNC (computerized numerical control) uncovering groove cutting, sand blasting pretreatment, nickel palladium gold, film pressing/exposure, CNC (computer numerical control) forming, film stripping, cutting, finished product washing, leveling and baking, and packaging.
Further, the CO2 laser depth control uncapping is characterized in that a CO2 laser path is designed in an uncapping area of the flexible plate area, and the outer edge of the CO2 laser path is overlapped with rigid-flex boundary lines on two sides.
Further, the spot size of the CO2 laser is 0.15mm, adjacent spots intersect, and the intersection overlapping area is 3/4 of the spot size.
Compared with the prior art, the process method of the embedded pad type rigid-flex printed circuit board has the following beneficial effects:
according to the process method of the rigid-flex combined board with the embedded bonding pad, when the outer layer circuit of the flexible substrate is manufactured, the bonding pad is synchronously etched at the outer layer copper layer position of the flexible substrate, which is positioned in the flexible board area, and the solder resist ink is printed on the copper sheet of the flexible substrate, which is positioned outside the rigid-flex boundary line position outside the flexible board area, so that the bonding pad forms an embedded bonding pad after the flexible substrate is pressed with a pure glue board and a Core board, and the problem that the bonding pad is positioned at the outermost layer of the board and is easy to scratch in the prior art is effectively solved; when the Core plate is manufactured, one surface is designed to be a full copper surface, and the other surface is only subjected to copper blocking design in the flexible area, so that the flexible substrate is effectively prevented from being punctured when the subsequent CO2 laser depth-control uncovering is carried out, the product quality is ensured, and the guarantee is provided for the subsequent uncovering; according to the technical scheme for removing the copper barrier layer by CO2 laser and acid etching, manual cover removal and rework are not needed in the whole process, the processing capacity is high, the efficiency is high, the product quality is effectively ensured, and the product yield is improved.
Drawings
FIG. 1 is a schematic stacked structure diagram of the whole surface lamination of the cover film in the process method of the embedded welding disc type rigid-flex printed circuit board.
Detailed Description
The following describes the process of the rigid-flex printed circuit board with embedded pads according to the present invention in further detail with reference to the following embodiments and the accompanying drawings.
Referring to fig. 1, a non-limiting embodiment of the present invention is a method for manufacturing a rigid-flex printed circuit board with an embedded pad, including steps of manufacturing a flexible substrate, pure glue, a pure PI protective film, and a Core board, sequentially stacking the pure PI protective film, the pure glue, and the Core board on two sides of the manufactured flexible substrate, respectively, and performing a pressing process to obtain a pressed rigid-flex printed circuit board, and manufacturing an outer layer of the rigid-flex printed circuit board to complete a complete manufacturing of the rigid-flex printed circuit board, wherein,
when the flexible substrate is manufactured, synchronously etching an embedded bonding pad in a flexible board area in a circuit process, then performing AOI (automated optical inspection), performing solder resist printing on an outer copper layer of the flexible substrate with the embedded bonding pad after the AOI is detected, printing solder resist ink on a copper sheet positioned on a rigid-flex boundary line, and attaching a pure PI protective film in the embedded bonding pad area after the flexible substrate is manufactured;
when the Core plate is manufactured, one surface of the Core plate is designed to be full copper, the other surface of the Core plate is only subjected to copper blocking design in a flexible plate area, a copper blocking area extends into a rigid plate, when a Core plate circuit is manufactured, only one surface designed with copper blocking is manufactured in the flexible plate area, and the other surface of the Core plate is protected by dry film exposure, wherein the surface designed to be full copper of the Core plate is an outer layer, the surface designed with copper blocking is an inner layer, and the Core plate is attached to a pure PI protective film and pure glue;
when the outer layer of the rigid-flex combination plate is manufactured, the flexible plate area is uncovered in a CO2 laser depth-control uncovering mode, a copper blocking layer is not broken down during CO2 laser, the copper blocking layer is etched and removed during acid etching in a post process, uncovering covers of the TOP surface and the BOT surface are manufactured separately, and due to the fact that the pads on the two sides of the rigid-flex combination plate are arranged differently, the uncovering covers of the TOP surface and the BOT surface are manufactured correspondingly according to the pad arrangement of each side.
According to the process method of the rigid-flex combined board with the embedded bonding pad, when the outer layer circuit of the flexible substrate is manufactured, the bonding pad is synchronously etched at the outer layer copper layer position of the flexible substrate, which is positioned in the flexible board area, and the solder resist ink is printed on the copper sheet of the flexible substrate, which is positioned outside the rigid-flex boundary line position outside the flexible board area, so that the bonding pad forms an embedded bonding pad after the flexible substrate is pressed with a pure glue board and a Core board, and the problem that the bonding pad is positioned at the outermost layer of the board and is easy to scratch in the prior art is effectively solved; when the Core plate is manufactured, one surface is designed to be a full copper surface, and the other surface is only subjected to copper blocking design in the flexible area, so that the flexible substrate is effectively prevented from being punctured when the subsequent CO2 laser depth-control uncovering is carried out, the product quality is ensured, and the guarantee is provided for the subsequent uncovering; according to the technical scheme for removing the copper blocking layer by CO2 laser acid etching, manual cover removal and rework are not needed in the whole process, the processing capacity is high, the efficiency is high, residual copper generated by the CO2 depth control laser in the front process is effectively etched by the acid etching process, the product quality is effectively ensured, and the product yield is improved.
Referring to fig. 1, in one non-limiting embodiment of the present invention, the fabrication of the flexible substrate includes the fabrication of a flexible sheet and an outer layer of the flexible sheet, wherein,
the manufacturing method of the flexible board comprises the steps of sequentially stacking pure glue and a single-side copper-containing FCCL board on two sides of the double-side copper-containing FCCL board, and then carrying out first pressing treatment to obtain the flexible board without an outer layer, wherein one side, without a copper layer, of the single-side copper-containing FCCL board is attached to the pure glue layer, and the side, with the copper layer, of the single-side copper-containing FCCL board is far away from the pure glue layer;
the manufacturing method of the outer layer of the flexible board comprises the steps of etching an embedded welding pad on a flexible area on an outer copper layer of the flexible substrate by adopting an etching process when an outer layer circuit of the flexible substrate is manufactured, then carrying out AOI (automated optical inspection), carrying out solder mask printing on the outer copper layer of the flexible substrate with the embedded welding pad after the AOI inspection, and printing solder mask ink on a copper sheet positioned on a rigid-flex boundary line.
Referring to fig. 1, in a non-limiting embodiment of the present invention, the outer layer process of the flexible board further comprises, before the circuit is fabricated, target-trimming-first browning-CO 2 laser-copper-deposition-hole-filling electroplating, wherein the first browning ensures the bottom copper on the FCCL board with the single-sided copper-containing board, so that the CO2 laser can directly break the copper; the method comprises the steps of after-curing, adhering an anti-plating dry film, gold deposition, film stripping, punching T holes, performing second brown oxidation, adhering pure glue, quickly pressing and tearing the PET film, wherein the adhered anti-plating dry film is selected from a CO2 dry film, during manufacturing, the anti-plating dry film is adhered to a flexible plate area on a single-side copper-containing FCCL board, guarantee is provided for follow-up laser uncapping of CO2, efficiency is improved, the T hole punching step aims to hang PIN alignment, the second brown oxidation is used for coarsening the board surface, and adhesion force is increased for the follow-up pure glue adhesion.
Referring to fig. 1, in one non-limiting embodiment of the present invention, the pure glue is prepared by: the process is for cutting-to be equipped with the pure glue on the PET membrane and beat T hole-CNC type of cutting-to be equipped with the PET membrane, wherein, CNC type of cutting process will correspond rigidity board time inlayer pad and flexbile plate region of uncapping and drag for the sky, be formed with the pure glue of dragging for the sky region, it is after the pure glue is dragged for the sky to be equipped with the PET membrane process, the one side laminating of pure glue no PET membrane is on being equipped with the PET membrane, then take off the incomplete PET membrane of dragging for the sky back, make the pure glue one side have the PET membrane, the another side does not have the PET membrane, in the follow-up pure glue process of pasting, the one side laminating of pure glue no PET membrane is on flexible substrate.
Referring to fig. 1, according to a non-limiting embodiment of the present invention, the pure PI protective film is prepared by: the process comprises the steps of cutting, drilling a T hole on a pure PI prepared on a PET film, carrying out ESI laser depth control cutting, and preparing the PET film, wherein the cutting step is to cut the pure PI protective film into sheets, the sheet size of the pure PI protective film is smaller than the size of a flexible board area of a rigid-flex combination board, and the distance between the outer edge of the size of the pure PI protective film and the scooping edge on a pure glue layer is 0.15mm for being attached to an embedded bonding pad in the flexible board area; the ESI laser depth-control cutting process is characterized in that a PET film is subjected to semi-radium treatment on a pure PI protective film in an area except for a rigid plate inner-layer bonding pad, the PET film is guaranteed not to be radium broken, then one side, without the PET film, of the fully radium-treated pure PI protective film is attached to a prepared PET film, the incomplete PET film, after the other side of the pure PI protective film is subjected to semi-radium treatment, is removed, the PET film is arranged on one side of the pure PI protective film, the PET film is arranged on the other side of the pure PI protective film, and during attaching, one side, without the PET film, of the PI protective film is attached to an embedded bonding.
Referring to FIG. 1, a non-limiting embodiment of the invention, the Core plate is made by: the process comprises the steps of cutting, drilling, exposing/developing, developing the copper blocking position, plating, wiring, drilling T holes and browning, and the Core plate with one surface being a full copper surface and the other surface being a bottom plate and only the copper blocking area and the other area containing copper is manufactured.
Referring to fig. 1, a non-limiting embodiment of the present invention, the copper barrier of the copper barrier design extends 0.15mm into the rigid board, the Core board is a single-sided wire design, one side of the copper barrier design is wire designed only in the copper barrier area, and one side of the Core board design copper barrier is attached with pure glue and pure PI protective film.
Referring to fig. 1, in a non-limiting embodiment of the present invention, the outer layer of the rigid-flex printed circuit board is manufactured by the processes of target-trimming, edge cutting, browning, CO2 laser, first film pressing/exposure/development, copper deposition, hole filling electroplating, circuit-AOI-solder resist printing, post curing, CO2 laser controlled deep uncovering, plasma degumming, sand blasting pretreatment, second film pressing/exposure/development, acid etching, AOI-CNC cutting of the uncovered groove, uncovering, sand blasting pretreatment, nickel palladium gold, film pressing/exposure, CNC molding, film stripping, cutting, washing of finished products, leveling and baking, and packaging, wherein the first film pressing/exposure/development process is to develop all positions except for the uncovered area requiring the cover of a dry film of CO2, the second film pressing/exposure/development process is to develop the rigid board sub-layer pad area, and then the copper foil of the copper blocking area is etched in the acid etching process, removing residual copper; CNC cuts open two limits that the flexible plate district that covers the groove is cut is close to the technology limit, and flexible plate district is uncovered easily when making follow-up uncapping, promotes the efficiency of uncapping, carries out nickel palladium gold surface treatment and press mold/exposure in the flexible plate district after uncapping, and here exposure is empty exposure, and the press mold all covers a rete with all areas, scrapes the golden face and hinders the solder mask surface when preventing to expose, and then effectively ensures product appearance quality.
Referring to fig. 1, in a non-limiting embodiment of the present invention, the uncapping area of the flexible board area is designed with a CO2 laser path by the CO2 laser depth control uncapping, and the outer edge of the CO2 laser path coincides with the rigid-flex boundary lines on both sides, so as to effectively ensure that the flexible board area is burned off during the CO2 laser depth control, and ensure that the rigid board area is not burned off, thereby ensuring the product quality.
Referring to fig. 1, according to a non-limiting embodiment of the present invention, the spot size of the CO2 laser is 0.15mm, adjacent spots intersect with each other, the intersection overlapping area is 3/4 of the spot size, a plurality of spots overlap with each other to form a laser line with a width of 0.5mm, and the flowing glue and the ink are burned off from top to bottom, so that the CO2 laser has high efficiency and good quality.
The above embodiments are only specific embodiments of the present invention, and the description thereof is specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications are possible without departing from the inventive concept, and such obvious alternatives fall within the scope of the invention.
Claims (10)
1. A process method of an embedded pad type rigid-flex printed circuit board is characterized by comprising the following steps: respectively manufacturing a flexible substrate, pure glue, a pure PI protective film and a Core plate, sequentially stacking the pure PI protective film, the pure glue and the Core plate on two surfaces of the manufactured flexible substrate respectively, performing press-fitting treatment to obtain a rigid-flex printed circuit board after press-fitting, and manufacturing an outer layer of the rigid-flex printed circuit board to complete the complete manufacture of the rigid-flex printed circuit board, wherein,
when the flexible substrate is manufactured, synchronously etching an embedded bonding pad in a flexible board area in a circuit process, then performing AOI (automated optical inspection), performing solder resist printing on an outer copper layer of the flexible substrate with the embedded bonding pad after the AOI is detected, printing solder resist ink on a copper sheet positioned on a rigid-flex boundary line, and attaching a pure PI protective film in the embedded bonding pad area after the flexible substrate is manufactured;
when the Core plate is manufactured, one surface of the Core plate is designed to be full copper, the other surface of the Core plate is only subjected to copper blocking design in a flexible plate area, a copper blocking area extends into a rigid plate, when the Core plate circuit is manufactured, only one surface which is designed with copper blocking is manufactured in the flexible plate area, and the other surface of the Core plate is protected by dry film exposure;
when the outer layer of the rigid-flex board is manufactured, the flexible board area is uncovered in a CO2 laser depth-control uncovering mode, a copper blocking layer is not broken down when CO2 laser is carried out, the copper blocking layer is etched and removed in acid etching in a post process, and uncovering of a TOP surface and an uncovering of a BOT surface are manufactured separately.
2. The process of manufacturing an embedded pad type rigid-flex printed circuit board according to claim 1, wherein the manufacturing of the flexible substrate includes manufacturing of a flexible board and an outer layer of the flexible board, wherein,
the manufacturing method of the flexible board comprises the steps of sequentially stacking pure glue and a single-side copper-containing FCCL board on two sides of the double-side copper-containing FCCL board, and then carrying out first pressing treatment to obtain the flexible board without an outer layer, wherein one side, without a copper layer, of the single-side copper-containing FCCL board is attached to the pure glue layer, and the side, with the copper layer, of the single-side copper-containing FCCL board is far away from the pure glue layer;
the manufacturing method of the outer layer of the flexible board comprises the steps of etching an embedded welding pad on a flexible area on an outer copper layer of the flexible substrate by adopting an etching process when an outer layer circuit of the flexible substrate is manufactured, then carrying out AOI (automated optical inspection), carrying out solder mask printing on the outer copper layer of the flexible substrate with the embedded welding pad after the AOI inspection, and printing solder mask ink on a copper sheet positioned on a rigid-flex boundary line.
3. The process method for manufacturing the rigid-flex printed circuit board with the embedded bonding pad according to claim 2, wherein the outer layer process of the flexible printed circuit board further comprises the steps of target shooting, edge cutting, first browning, CO2 laser, copper deposition, hole filling and electroplating before circuit manufacturing, and further comprises the steps of post curing, plating resistant dry film pasting, gold deposition, film stripping, T hole punching, second browning, pure glue pasting, fast pressing and PET film tearing after the solder mask printing process.
4. The process method for the rigid-flex printed circuit board with the embedded bonding pad according to claim 1, wherein the manufacturing of the pure glue comprises the following steps: the process is for cutting-to be equipped with the pure glue on the PET membrane and beat T hole-CNC type of cutting-to be equipped with the PET membrane, wherein, CNC type of cutting process will correspond rigidity board time inlayer pad and flexbile plate region of uncapping and drag for the sky, be formed with the pure glue of dragging for the sky region, it is after the pure glue is dragged for the sky to be equipped with the PET membrane process, the one side laminating of pure glue no PET membrane is on being equipped with the PET membrane, then take off the incomplete PET membrane of dragging for the sky back, make the pure glue one side have the PET membrane, the another side does not have the PET membrane, in the follow-up pure glue process of pasting, the one side laminating of pure glue no PET membrane is on flexible substrate.
5. The process method for the rigid-flex printed circuit board with the embedded pad according to claim 1, wherein the pure PI protective film is manufactured by the following steps: the method comprises the following steps of cutting, perforating T holes on pure PI prepared on a PET film, carrying out ESI laser depth control cutting, and preparing the PET film, wherein the cutting step is to cut the pure PI protective film into sheets, and the sheet size of the pure PI protective film is smaller than that of a flexible board area of a rigid-flex combination board and is used for being attached to an embedded bonding pad of the flexible board area; the ESI laser depth-control cutting process is characterized in that a PET film is subjected to semi-radium treatment on a pure PI protective film in an area except for a rigid plate inner-layer bonding pad, the PET film is guaranteed not to be radium broken, then one side, without the PET film, of the fully radium-treated pure PI protective film is attached to a prepared PET film, the incomplete PET film, after the other side of the pure PI protective film is subjected to semi-radium treatment, is removed, the PET film is arranged on one side of the pure PI protective film, the PET film is arranged on the other side of the pure PI protective film, and during attaching, one side, without the PET film, of the PI protective film is attached to an embedded bonding.
6. The process of manufacturing an embedded pad type rigid-flex printed circuit board according to claim 1, wherein the Core board is manufactured by: the process comprises the steps of cutting, drilling, exposing/developing, developing the copper blocking position, plating, wiring, drilling T holes and browning, and the Core plate with one surface being a full copper surface and the other surface being a bottom plate and only the copper blocking area and the other area containing copper is manufactured.
7. The process of claim 6, wherein the copper barrier of the copper barrier design extends into the rigid plate by 0.15mm, the Core plate is designed to be a single-sided circuit, the circuit design is only carried out on one side of the copper barrier design in the copper barrier area, and the copper barrier of the Core plate is designed to be attached to pure glue and a pure PI protective film.
8. The process of manufacturing the rigid-flex printed circuit board with the embedded pad according to claim 1, wherein the outer layer of the rigid-flex printed circuit board is manufactured by the processes of target hitting, edge cutting, browning, CO2 laser, film pressing, exposure, development, copper deposition, hole filling and electroplating, circuit, AOI, solder resist printing, post curing, CO2 laser controlled deep uncovering, plasma glue removing, sand blasting pretreatment, film pressing, exposure, development, acid etching, AOI, CNC cover groove cutting, sand blasting pretreatment, nickel palladium gold, film pressing, exposure, CNC forming, film stripping, cutting, product washing, leveling, baking and packaging.
9. The process of manufacturing an embedded pad type rigid-flex printed circuit board according to claim 8, wherein the CO2 laser depth control uncapping designs a CO2 laser path in the uncapping area of the flexible board area, and the outer edge of the CO2 laser path coincides with the rigid-flex boundary lines on two sides.
10. The process of claim 9 wherein said CO2 laser has a spot size of 0.15mm, and adjacent spots intersect with each other at an intersection overlap region of spot size 3/4.
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