CN105430899A - Rigid-flex PCB with flexible region equipped with solder pad and manufacturing method thereof - Google Patents
Rigid-flex PCB with flexible region equipped with solder pad and manufacturing method thereof Download PDFInfo
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- CN105430899A CN105430899A CN201510776372.8A CN201510776372A CN105430899A CN 105430899 A CN105430899 A CN 105430899A CN 201510776372 A CN201510776372 A CN 201510776372A CN 105430899 A CN105430899 A CN 105430899A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a rigid-flex PCB with a flexible region equipped with a solder pad and a manufacturing method thereof. The manufacturing method includes the steps that raw materials of a pre-process flexible board, a PP prepreg and a rigid board are manufactured, manufacturing of internal wiring of the flexible board is completed to a quick pressing cover film, laser winding processing and quick pressing adhesive resistance processing of the cover film are performed on the cover film, and the flexible board with a copper solder pad and the prepreg and the rigid board are laminated together from the top to the bottom in turn and then transferred to a board lamination pressing process to perform total pressing processing; after total pressing processing is completed, the process goes to an external layer solder resistance process according to the conventional process; then flexible board region de-cap processing and manufacturing a flexible board framework are performed, the copper surface is cleaned by an abrasive blasting mode, and then internal and external solder pad synchronous gold immersion processing is performed on the flexible region solder pad and an external solder pad; and finally CNC rigid board formation processing is performed on a rigid board framework so that a finished board meeting the profile dimension required by a client can be obtained. The rigid-flex PCB with the flexible region equipped with the solder pad and the manufacturing method thereof have advantages of being concise in flow, low in cost and environment-friendly and pollution-free without skip plating in gold immersion.
Description
Technical field
The present invention relates to the manufacture technology field of rigid/flexible combined printed circuit board, be specially a kind of rigid-flex combined board of flexure region band pad.
Background technology
Along with miniaturization of electronic products and the three-dimensional growth requirement assembled, rigid-flex combined board obtained fast development in recent years; Simultaneously in order to tackle stricter miniaturization trend, portioned product has been attempted at flexibility bending zone design pad, to alleviate rigid plate placement pressure.For the rigid-flex combined board of this kind of flex plate region bands pad, the traditional method of flexible position turmeric first completes front operation process, the i.e. sawing sheet of flex plate internal layer, boring, the operations such as interior lines make, need after flex plate circuit completes to cover epiphragma soon, and before entering stagnation pressure, complete local internal layer flex plate turmeric 1 time, during this soft board turmeric process, also need before turmeric process on the one hand to paste dry film protection, this dry film is at heavy nickel, endurance not enough easily stripping during turmeric, and have pollution to tank liquor, affect the useful life of tank liquor, on the other hand, soft board rigidity is not enough, protecting border need be pasted when turmeric, this time and effort consuming, moreover, soft board is usually at IC or golden finger position turmeric, its load area is less, at heavy nickel, easily plating leakage is there is during turmeric.Enter after stagnation pressure operation completes stagnation pressure in flex plate, prepreg and rigid plate, also need surface treatment turmeric 1 time again, the local turmeric completed before adding stagnation pressure 1 time, totally 2 turmerics, consumptive material is many, and cost is high.This traditional method soft board turmeric flow process is loaded down with trivial details, and need to paste towing plate in process, tape, paste many handwork operations that need such as protecting border, its whole efficiency is low, and is unfavorable for batch production.
Summary of the invention
The invention provides a kind of streamlining, production efficiency is high, and cost is low, realizes the rigid-flex combined board processing method of the flexure region band pad of the synchronous turmeric process of ectonexine pad.
The present invention can be achieved through the following technical solutions:
A kind of rigid-flex combined board of flexure region band pad, comprise flex plate, coverlay, PP prepreg and rigid plate, on described flex plate, zone line is provided with pad, the coated pressing of flex plate outer surface with pad has coverlay, described coverlay is provided with windowing of adapting with pad, and coated pressing has the flex plate of coverlay and PP prepreg and rigid plate to set gradually from top to bottom to be pressed into rigid-flex combined board.
Further, window described in and compensate process by monolateral increasing 0.1mm to 0.2mm.
Present invention also offers a kind of streamlining, production efficiency is high, and cost is low, realizes the manufacture method of the rigid-flex combined board of the flexure region band pad of the synchronous turmeric process of ectonexine pad.
A manufacture method for the rigid-flex combined board of flexure region band pad, is characterized in that: comprise the steps:
The first step, the making of the various raw material of front operation, flex plate with copper pad is completed to covering epiphragma soon, and the laser that coverlay carries out coverlay is windowed process and the process of fast pressure drag glue, then the flex plate with copper pad is superimposed together from top to bottom successively with the PP prepreg completed and rigid plate, is then transferred to lamination pressing working procedure;
Second step, stagnation pressure process, above-mentioned coverlay is windowed and is exposed the copper pad of flexure region, after the process of coverlay curable adhesive layer, start stagnation pressure operation and stagnation pressure process carried out to flex plate, PP prepreg and the rigid plate after lamination successively, after stagnation pressure process routinely technological process process to outer welding resistance operation;
3rd step, lid process and soft board frame manufacture are taken off in soft board region, mainly comprise the dark V of control and cut the pre-groove milling with CNC, the position of first presetting copper cash in rigid-flexible junction is carried out controlling dark V and is cut, then optimizing CNC file is soft board pre-groove milling stiffened plate CNC, after the dark V of control cuts, carry out the pre-groove milling of soft board, the hardboard milling of flexure region broken, other hardboard join domain is retained as soft board framework; Cut after pre-groove milling completes with CNC at the dark V of control, the hardboard covering layer of soft board outside is removed, expose internal layer soft board and need change golden copper pad;
4th step, the turmeric process synchronous with outer layer pad of flexure region pad, adopts sandblasting mode to clean copper face, then carries out the synchronous turmeric process of ectonexine pad;
5th step, CNC hardboard forming processes, turmeric process completes laggard row test step, after test step completes, carries out to hardboard housing the production board that CNC hardboard forming processes obtains meeting client's overall dimension.
The manufacture method of the rigid-flex combined board of flexure region band pad of the present invention eliminates flex plate internal layer flex plate turmeric flow process before stagnation pressure in conventional fabrication method, direct and other subassembly lamination carries out stagnation pressure process, make it after stagnation pressure, take off lid again and expose internal layer copper pad, sandblasting mode is adopted to clean copper face, then the synchronous turmeric process of ectonexine pad is carried out together to flexure region pad and outer layer pad, effectively reduce turmeric number of times, improve production efficiency, reduce production cost simultaneously; Owing to eliminating internal layer flex plate turmeric flow process before stagnation pressure, synchronously also eliminate and paste towing plate, paste dry film, tape, paste many handwork operations such as protecting border, effectively simplified flow process, be beneficial to batch production, improve production efficiency.The dark V of control that simultaneously soft board region is taken off in lid process and soft board frame manufacture step cuts with CNC after pre-groove milling, and the hardboard join domain of reservation forms soft board framework, make soft board after stagnation pressure during turmeric operation processing procedure without the need to pasting protecting border again.
Enter a ground, the laser of coverlay described in the first step is windowed process, comprise the steps, after flex plate interior lines have etched, first made coverlay and to window file, pad is windowed and is compensated process by monolateral large 0.1mm to 0.2mm, then pore-forming broken up by file of windowing, be converted to laser drill file, remove unwanted coverlay by laser cutting, make copper pad flex plate exposing flexure region.
Enter a ground, the fast pressure drag glue process of coverlay described in the first step, comprise the steps: first to adjust fast press parameter, use the auxiliary fast pressure of the release film with the effect of resistance glue, put on baking sheet frame after fast pressure, then put into baking box and be cured a period of time, make coverlay glue-line fully solidify process, form secondary when effectively avoiding follow-up stagnation pressure and to overflow glue.
Enter a ground, described in there is resistance glue effect release film must change for 2 to 3 times often using, effectively guarantee resistance glue effect.
Enter a ground, described fast press parameter is: temperature 180 degree to 190 degree, fast pressure pressure force is 90 tons to 100 tons, fast pressure pressing time is 90 seconds to 120 seconds, make coverlay quick pressing on flex plate, pressing timeliness is fast, effective, good control coverlay is pressing through the excessive glue in journey soon, effectively avoids the quality of the excessive formation of excessive glue bad.
Enter a ground, described roasting the temperature inside the box is 150 degree, and the coverlay curable adhesive layer time is 60 minutes to 120 minutes, and curable adhesive layer is abundant, effectively avoids follow-up stagnation pressure operation to form secondary and to overflow glue.
Rigid-flex combined board of a kind of flexure region band of the present invention pad and preparation method thereof, has following beneficial effect:
The first, technological process is simplified, and eliminate prior art Central Plains internal layer flex plate turmeric flow process, eliminate and paste towing plate, tape, paste protecting border etc. and need handwork operation, technological process is simplified;
The second, production efficiency is high, and from first, technological process is simplified, wherein eliminate in many prior aries and need handwork operation, it, except operation is simplified and can be enhanced productivity, makes manufacturing process produce in batches, substantially increases production efficiency;
Three, effectively cost-saving, from first, technological process is simplified and is eliminated prior art Central Plains internal layer flex plate turmeric flow process, after whole process only needs stagnation pressure, the synchronous turmeric process of ectonexine pad is carried out together to flexure region pad and outer layer pad, effectively reduce turmeric number of times, improve production efficiency, reduce simultaneously and saved production cost;
Four, soft boardization gold is without the need to pasting protecting border, the dark V of control that soft board region is taken off in lid process and soft board frame manufacture step cuts with CNC after pre-groove milling, the hardboard join domain retained forms soft board framework, make soft board after stagnation pressure during turmeric operation processing procedure without the need to pasting protecting border;
Five, the synchronous turmeric process of ectonexine pad is realized, flex plate is carried out to the fast pressure drag glue process of window documenting and the coverlay of coverlay before stagnation pressure, baking box is used to be cured coverlay glue-line after fast pressure, achieve and omit internal layer flex plate turmeric flow process before stagnation pressure, achieve the synchronous turmeric process of ectonexine pad after stagnation pressure, efficiency is high, and ectonexine synchronous turmeric load area is enough, not easily occur plating leakage, turmeric is effective.
Accompanying drawing explanation
Accompanying drawing 1 is the structural representation of the rigid-flex combined board of a kind of flexure region band of the present invention pad;
Accompanying drawing 2 is the process chart of the manufacture method of the rigid-flex combined board of a kind of flexure region band of the present invention pad.
Embodiment
In order to make those skilled in the art person understand technical scheme of the present invention better, below in conjunction with embodiment and accompanying drawing, product of the present invention is described in further detail.
Embodiment 1
As shown in Figure 1, a kind of rigid-flex combined board of flexure region band pad, comprise flex plate 1, coverlay, PP prepreg 2 and rigid plate 3, pad is provided with in the middle of on described flex plate 1, the coated pressing of flex plate 1 outer surface with pad has coverlay, described coverlay is provided with windowing of adapting with pad, described windowing compensates process by monolateral increasing 0.1mm, and coated pressing has the flex plate 1 of coverlay to set gradually from top to bottom with PP prepreg 2 and rigid plate 3 to be pressed into rigid-flex combined board.
As depicted in figs. 1 and 2, a kind of manufacture method of rigid-flex combined board of flexure region band pad, comprises the steps:
The first step, the making of the various raw material of front operation, flex plate 1 with copper pad is completed to covering epiphragma soon, and the laser that coverlay carries out coverlay is windowed process and the process of fast pressure drag glue, then the flex plate 1 with copper pad is superimposed together from upper at least successively with the PP prepreg 2 completed and rigid plate 3, is then transferred to lamination pressing working procedure;
Second step, stagnation pressure process, above-mentioned coverlay is windowed and is exposed the copper pad of flexure region, after the process of coverlay curable adhesive layer, start stagnation pressure operation and stagnation pressure process carried out to flex plate 1, PP prepreg 2 and the rigid plate 3 after lamination successively, after stagnation pressure process routinely technological process process to outer welding resistance operation;
3rd step, lid process and soft board frame manufacture are taken off in soft board region, mainly comprise the dark V of control and cut the pre-groove milling with CNC, the position of first presetting copper cash in rigid-flexible junction is carried out controlling dark V and is cut, then optimizing CNC file is soft board pre-groove milling stiffened plate CNC, after the dark V of control cuts, carry out the pre-groove milling of soft board, the hardboard milling of flexure region broken, other hardboard join domain is retained as soft board framework; Cut after pre-groove milling completes with CNC at the dark V of control, the hardboard covering layer of soft board outside is removed, expose internal layer soft board and need change golden copper pad;
4th step, the turmeric process synchronous with outer layer pad of flexure region pad, adopts sandblasting mode to clean copper face, then carries out the synchronous turmeric process of ectonexine pad;
5th step, CNC hardboard forming processes, turmeric process completes laggard row test step, after test step completes, carries out to hardboard housing the production board that CNC hardboard forming processes obtains meeting client's overall dimension.
As depicted in figs. 1 and 2, the manufacture method of the rigid-flex combined board of flexure region band pad of the present invention eliminates flex plate 1 internal layer flex plate 1 turmeric flow process before stagnation pressure in conventional fabrication method, direct and other subassembly lamination carries out stagnation pressure process, make it after stagnation pressure, take off lid again and expose internal layer copper pad, sandblasting mode is adopted to clean copper face, then the synchronous turmeric process of ectonexine pad is carried out together to flexure region pad and outer layer pad, effectively reduce turmeric number of times, improve production efficiency, reduce production cost simultaneously; Owing to eliminating internal layer flex plate 1 turmeric flow process before stagnation pressure, synchronously also eliminate and paste towing plate, paste dry film, tape, paste many handwork operations such as protecting border, effectively simplified flow process, be beneficial to batch production, improve production efficiency.The dark V of control that simultaneously soft board region is taken off in lid process and soft board frame manufacture step cuts with CNC after pre-groove milling, and the hardboard join domain of reservation forms soft board framework, make soft board after stagnation pressure during turmeric operation processing procedure without the need to pasting protecting border.
As depicted in figs. 1 and 2, the laser of coverlay described in the first step is windowed process, comprise the steps, after flex plate 1 interior lines have etched, first made coverlay and to window file, pad is windowed and is compensated process by monolateral large 0.1mm, then pore-forming broken up by file of windowing, be converted to laser drill file, remove unwanted coverlay by laser cutting, make copper pad flex plate 1 exposing flexure region.
As depicted in figs. 1 and 2, the fast pressure drag glue process of coverlay described in the first step, comprise the steps: first to adjust fast press parameter, use the auxiliary fast pressure of the release film with the effect of resistance glue, put into after fast pressure in baking sheet, put into baking box with baking sheet and be cured a period of time, make coverlay glue-line fully solidify process, form secondary when effectively avoiding follow-up stagnation pressure and to overflow glue.
As depicted in figs. 1 and 2, described in there is resistance glue effect release film often use and change for 2 times, effectively guarantee resistance glue effect.
As depicted in figs. 1 and 2, described fast press parameter is: temperature 180 degree, fast pressure pressure force is 90 tons, fast pressure pressing time is 90 seconds, make coverlay quick pressing on flex plate 1, pressing timeliness is fast, effective, good control coverlay is pressing through the excessive glue in journey soon, effectively avoids the quality of the excessive formation of excessive glue bad.
As depicted in figs. 1 and 2, described roasting the temperature inside the box is 150 degree, and the coverlay curable adhesive layer time is 60 minutes, and curable adhesive layer is abundant, effectively avoids follow-up stagnation pressure operation to form secondary and to overflow glue.
Embodiment 2
As shown in Figure 1, a kind of rigid-flex combined board of flexure region band pad, comprise flex plate 1, coverlay, PP prepreg 2 and rigid plate 3, pad is provided with in the middle of on described flex plate 1, the coated pressing of flex plate 1 outer surface with pad has coverlay, described coverlay is provided with windowing of adapting with pad, described windowing compensates process by monolateral increasing 0.2mm, and coated pressing has the flex plate 1 of coverlay to set gradually from top to bottom with PP prepreg 2 and rigid plate 3 to be pressed into rigid-flex combined board.
As depicted in figs. 1 and 2, a kind of manufacture method of rigid-flex combined board of flexure region band pad, comprises the steps:
The first step, the making of the various raw material of front operation, flex plate 1 with copper pad is completed to covering epiphragma soon, and the laser that coverlay carries out coverlay is windowed process and the process of fast pressure drag glue, then the flex plate 1 with copper pad is superimposed together from upper at least successively with the PP prepreg 2 completed and rigid plate 3, is then transferred to lamination pressing working procedure;
Second step, stagnation pressure process, above-mentioned coverlay is windowed and is exposed the copper pad of flexure region, after the process of coverlay curable adhesive layer, start stagnation pressure operation and stagnation pressure process carried out to flex plate 1, PP prepreg 2 and the rigid plate 3 after lamination successively, after stagnation pressure process routinely technological process process to outer welding resistance operation;
3rd step, lid process and soft board frame manufacture are taken off in soft board region, mainly comprise the dark V of control and cut the pre-groove milling with CNC, the position of first presetting copper cash in rigid-flexible junction is carried out controlling dark V and is cut, then optimizing CNC file is soft board pre-groove milling stiffened plate CNC, after the dark V of control cuts, carry out the pre-groove milling of soft board, the hardboard milling of flexure region broken, other hardboard join domain is retained as soft board framework; Cut after pre-groove milling completes with CNC at the dark V of control, the hardboard covering layer of soft board outside is removed, expose internal layer soft board and need change golden copper pad;
4th step, the turmeric process synchronous with outer layer pad of flexure region pad, adopts sandblasting mode to clean copper face, then carries out the synchronous turmeric process of ectonexine pad;
5th step, CNC hardboard forming processes, turmeric process completes laggard row test step, after test step completes, carries out to hardboard housing the production board that CNC hardboard forming processes obtains meeting client's overall dimension.
As depicted in figs. 1 and 2, the manufacture method of the rigid-flex combined board of flexure region band pad of the present invention eliminates flex plate 1 internal layer flex plate 1 turmeric flow process before stagnation pressure in conventional fabrication method, direct and other subassembly lamination carries out stagnation pressure process, make it after stagnation pressure, take off lid again and expose internal layer copper pad, sandblasting mode is adopted to clean copper face, then the synchronous turmeric process of ectonexine pad is carried out together to flexure region pad and outer layer pad, effectively reduce turmeric number of times, improve production efficiency, reduce production cost simultaneously; Owing to eliminating internal layer flex plate 1 turmeric flow process before stagnation pressure, synchronously also eliminate and paste towing plate, paste dry film, tape, paste many handwork operations such as protecting border, effectively simplified flow process, be beneficial to batch production, improve production efficiency.The dark V of control that simultaneously soft board region is taken off in lid process and soft board frame manufacture step cuts with CNC after pre-groove milling, and the hardboard join domain of reservation forms soft board framework, make soft board after stagnation pressure during turmeric operation processing procedure without the need to pasting protecting border.
As depicted in figs. 1 and 2, the laser of coverlay described in the first step is windowed process, comprise the steps, after flex plate 1 interior lines have etched, first made coverlay and to window file, pad is windowed and is compensated process by monolateral large 0.2mm, then pore-forming broken up by file of windowing, be converted to laser drill file, remove unwanted coverlay by laser cutting, make copper pad flex plate 1 exposing flexure region.
As depicted in figs. 1 and 2, the fast pressure drag glue process of coverlay described in the first step, comprise the steps: first to adjust fast press parameter, use the auxiliary fast pressure of the release film with the effect of resistance glue, put into after fast pressure in baking sheet, put into baking box with baking sheet and be cured a period of time, make coverlay glue-line fully solidify process, form secondary when effectively avoiding follow-up stagnation pressure and to overflow glue.
As depicted in figs. 1 and 2, described in there is resistance glue effect release film often use and change for 3 times, effectively guarantee resistance glue effect.
As depicted in figs. 1 and 2, described fast press parameter is: temperature 190 degree, fast pressure pressure force is 100 tons, fast pressure pressing time is 120 seconds, make coverlay quick pressing on flex plate 1, pressing timeliness is fast, effective, good control coverlay is pressing through the excessive glue in journey soon, effectively avoids the quality of the excessive formation of excessive glue bad.
As depicted in figs. 1 and 2, described roasting the temperature inside the box is 150 degree, and the coverlay curable adhesive layer time is 120 minutes, and curable adhesive layer is abundant, effectively avoids follow-up stagnation pressure operation to form secondary and to overflow glue.
The above, be only preferred embodiment of the present invention, not does any pro forma restriction to the present invention; The those of ordinary skill of all industry all can shown in by specification accompanying drawing and the above and implement the present invention swimmingly; But all those skilled in the art are not departing within the scope of technical solution of the present invention, disclosed above technology contents can be utilized and make a little change, modify with differentiation equivalent variations, be Equivalent embodiments of the present invention; Meanwhile, all according to substantial technological of the present invention to the change of any equivalent variations that above embodiment is done, modify and differentiation etc., within the protection range all still belonging to technical scheme of the present invention.
Claims (8)
1. the rigid-flex combined board of a flexure region band pad, it is characterized in that: comprise flex plate, coverlay, PP prepreg and rigid plate, on described flex plate, zone line is provided with pad, the coated pressing of flex plate outer surface with pad has coverlay, described coverlay is provided with windowing of adapting with pad, and coated pressing has the flex plate of coverlay and PP prepreg and rigid plate to set gradually from top to bottom to be pressed into rigid-flex combined board.
2. the rigid-flex combined board of flexure region band pad according to claim 1, is characterized in that: described in window and compensate process by monolateral increasing 0.1mm to 0.2mm.
3. the manufacture method of the rigid-flex combined board of flexure region band pad as claimed in claim 1 or 2, is characterized in that: comprise the steps:
The first step, the making of the various raw material of front operation, flex plate with copper pad is completed to covering epiphragma soon, and the laser that coverlay carries out coverlay is windowed process and the process of fast pressure drag glue, then the flex plate with copper pad is superimposed together from top to bottom successively with the PP prepreg completed and rigid plate, is then transferred to lamination pressing working procedure;
Second step, stagnation pressure process, above-mentioned coverlay is windowed and is exposed the copper pad of flexure region, after the process of coverlay curable adhesive layer, start stagnation pressure operation and stagnation pressure process carried out to flex plate, PP prepreg and the rigid plate after lamination successively, after stagnation pressure process routinely technological process process to outer welding resistance operation;
3rd step, lid process and soft board frame manufacture are taken off in soft board region, mainly comprise the dark V of control and cut the pre-groove milling with CNC, the position of first presetting copper cash in rigid-flexible junction is carried out controlling dark V and is cut, then optimizing CNC file is soft board pre-groove milling stiffened plate CNC, after the dark V of control cuts, carry out the pre-groove milling of soft board, the hardboard milling of flexure region broken, other hardboard join domain is retained as soft board framework; Cut after pre-groove milling completes with CNC at the dark V of control, the hardboard covering layer of soft board outside is removed, expose internal layer soft board and need change golden copper pad;
4th step, flexure region pad turmeric synchronous with outer layer pad, adopts sandblasting mode to clean copper face, then carries out the synchronous turmeric process of ectonexine pad;
5th step, CNC hardboard forming processes, turmeric process completes laggard row test step, after test step completes, carries out to hardboard housing the production board that CNC hardboard forming processes obtains meeting client's overall dimension.
4. the manufacture method of the rigid-flex combined board of flexure region band pad according to claim 3, it is characterized in that: the laser of coverlay described in the first step is windowed process, comprise the steps, first make coverlay to window file, pad is windowed and is compensated process by monolateral large 0.1mm to 0.2mm, and pore-forming broken up by file of then windowing, and is converted to laser drill file, remove unwanted coverlay by laser cutting, make copper pad flex plate exposing flexure region.
5. the manufacture method of the rigid-flex combined board of flexure region band pad according to claim 3, it is characterized in that: the fast pressure drag glue process of coverlay described in the first step, comprise the steps: first to adjust fast press parameter, use the auxiliary fast pressure of the release film with the effect of resistance glue, put on baking sheet frame after fast pressure, then put into baking box and be cured a period of time, coverlay glue-line is fully solidified.
6. the manufacture method of the rigid-flex combined board of flexure region band pad according to claim 5, is characterized in that: described in there is resistance glue effect release film must change for 2 to 3 times often using.
7. the manufacture method of the rigid-flex combined board of flexure region band pad according to claim 5, is characterized in that: described fast press parameter is: temperature 180 degree to 190 degree, and fast pressure pressure force is 90 tons to 100 tons, and fast pressure pressing time is 90 seconds to 120 seconds.
8. the manufacture method of the rigid-flex combined board of flexure region band pad according to claim 5, it is characterized in that: described roasting the temperature inside the box is 150 degree, the coverlay curable adhesive layer time is 60 minutes to 120 minutes, and curable adhesive layer is abundant.
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| CN112788860A (en) * | 2021-01-31 | 2021-05-11 | 惠州中京电子科技有限公司 | Manufacturing method of soft-hard combined board synchronization gold |
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