CN105758686A - Manufacturing method for bent test bar of rigid-flexible combined plate - Google Patents
Manufacturing method for bent test bar of rigid-flexible combined plate Download PDFInfo
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- CN105758686A CN105758686A CN201610224836.9A CN201610224836A CN105758686A CN 105758686 A CN105758686 A CN 105758686A CN 201610224836 A CN201610224836 A CN 201610224836A CN 105758686 A CN105758686 A CN 105758686A
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- flexible
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- test strip
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- bending test
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
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- Life Sciences & Earth Sciences (AREA)
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- General Health & Medical Sciences (AREA)
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- Pathology (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention relates to the technical field of circuit board production and specifically relates to a manufacturing method for a bent test bar of a rigid-flexible combined plate. The manufacturing method comprises the following steps of: manufacturing the bent test bar on a technical edge while manufacturing an inner-layer line on a flexible core plate; causing the parameters, such as, line width, line distance, copper thickness, covering film thickness, and the like, of the bent test bar be consistent with the parameters of the inner-layer line in the flexible core plate; correspondingly locating the bent test bar after being bent on the technical edge of the flexible core plate; performing subsequent process flows on the bent test bar together with the flexible core plate and causing the property of the bent test bar be closer to the property of the flexible core plate, thereby reducing the error between the bending resistance of the bent test bar and the bending resistance of the rigid-flexible combined plate. The result of testing the bending resistance of the rigid-flexible combined plate through the bent test bar according to the invention is more accurate. The bent test bar is manufactured on the technical edge and can serve as a product sample for system sampling inspection.
Description
Technical field
The present invention relates to board production technical field, particularly relate to the manufacture method of the bending test strip of a kind of rigid-flex combined board.
Background technology
Rigid-flex combined board is the one in printed circuit board, have rigid layer and flexible layers concurrently, there is feature flexible, folding, rigid-flex combined board changes the design concept of traditional plane formula, expand the three dimensions concept of solid to, reduce the space shared by whole system, bring huge convenience to product design.Bending resistance folding endurance is the important feature of rigid-flex combined board, is also one of detection project investigating rigid-flex combined board qualitative reliability.The bending resistance folding endurance of rigid-flex combined board is made by bending test strip and what the tester of resistance to bending carried out testing, bending test strip is locked, and make alligator clamp be sandwiched on the copper PAD (pad) at test strip two ends respectively to form the loop of conducting, if occurring broken string in test process, then the fracture because of any one line is opened a way by the loop of whole conducting.The bending resistance folding endurance test philosophy of rigid-flex combined board determines the rigid-flex combined board of actual production and cannot be directly used to bending test.Main cause is as follows: first the completely coating epiphragma in the bending region of rigid-flex combined board covers, without conductive clamp point；Additionally general and bending tester and IPC standard-required the overall dimensions of the overall dimensions in the bending region of rigid-flex combined board does not mate；In addition the wire in the bending region of rigid-flex combined board is not necessarily at the same circuit, if not at the same circuit, can not carry out bending test.At present, general and rigid-flex combined board the production of the design and fabrication flow process of bending test strip is separately performed, namely before or after producing rigid-flex combined board, carries out designing and producing of bending test strip for the bent region of rigid-flex combined board, and bending resistance folding endurance is tested.The Making programme of bending test strip is generally: sawing sheet → pre-treatment → dry film/wet film → exposure → development → etching → pressing coverlay → molding.There is following defect in the existing independent method making bending test strip: the design and fabrication flow process of bending test strip is inconsistent with the actual production environment of rigid-flex combined board, rigid-flex combined board needs through processes such as multiple liquid medicine tanks and surface treatments in manufacturing process, the Making programme bending test strip is then relatively brief, therefore can cause there is bigger error between bending resistance folding endurance and the bending resistance folding endurance of rigid-flex combined board of bending test strip；Do not specify the parameters such as the bending live width of test strip, line-spacing, copper thickness and coverlay thickness, when the parameter bending test strip is inconsistent with rigid-flex combined board, between bending resistance folding endurance and the bending resistance folding endurance of rigid-flex combined board of bending test strip, can there is bigger error yet.In addition, client's needs that bending resistance folding endurance has strict demand do systematic sampling detection to completing plate, systematic sampling is the product convenience sampling detection to the product produced in certain time interval or a segment number, and individually makes bending test strip, then be not provided that the catalog that systematic sampling detects.
Summary of the invention
The present invention is directed to the bending resistance folding endurance bigger error of existence that the manufacture method of existing bending test strip can cause test result and rigid-flex combined board actual, and the problem that the catalog that systematic sampling checks cannot be provided, it is provided that the manufacture method of the bending test strip of a kind of rigid-flex combined board.
For achieving the above object, the present invention is by the following technical solutions.
The manufacture method of the bending test strip of a kind of rigid-flex combined board, described bending test strip includes the pad being positioned at two ends and the plain conductor connecting two pads；Described bending test strip is produced on rigid-flexible combination and produces on the technique edges of plate.
The manufacture method of the bending test strip of the above rigid-flex combined board, comprises the following steps:
S1 flexibility central layer and rigidity central layer: described flexible central layer and rigidity central layer all include line areas and technique edges；On the line areas of flexible central layer and rigidity central layer, make internal layer circuit respectively, and on the technique edges of flexible central layer, make bending test strip, then on flexible central layer, paste epiphragma.
Making on the line areas of described flexible central layer has the region of internal layer circuit to be called flexible region；Making on the technique edges of described flexible central layer has the region of bending test strip to be called test section.
Preferably, in described bending test strip, the live width of plain conductor, line-spacing and copper layer thickness are consistent with the live width of internal layer circuit on flexible central layer, line-spacing and copper layer thickness.
It is furthermore preferred that the length of described bending test strip is 130mm, wide for 16mm；The length of the pad at described bending test strip two ends is 16mm, wide for 10mm.
The rigid-flexible daughter board of S2: in a predetermined order by prepreg, flexible central layer, rigidity central layer with outer copper foil stacks and pressing is integrated, obtain rigid-flexible daughter board.
S3 outer-layer circuit: rigid-flexible daughter board is sequentially carried out boring, heavy copper, electric plating of whole board, outer graphics, graphic plating, etching, silk-screen welding resistance and surface treatment according to prior art.
S4 controlled depth milling groove: position corresponding with the flexible region of flexible central layer and test section on rigid-flexible daughter board carries out controlled depth milling groove, makes flexible region and test section expose, obtains rigid-flexible combination and produces plate；The bending test strip of described test section is positioned at rigid-flexible combination and produces on the technique edges of plate.
Compared with prior art, the invention has the beneficial effects as follows: on technique edges, make bending test strip when the present invention passes through to make internal layer circuit on flexible central layer in the lump, make the parameters such as the live width of bending test strip, line-spacing, copper thickness and coverlay thickness consistent with each parameter of internal layer circuit in flexible central layer；Bend test strip after pressing and be then correspondingly positioned on the technique edges of rigid-flexible daughter board, bending test strip together experiences all work flows of postorder with rigid-flexible daughter board, make the performance of bending test strip and flexible central layer closer to, thus the error reduced between the bending resistance folding endurance of bending test strip and the bending resistance folding endurance of rigid-flexible combination production plate, more accurate by the result of the bending resistance folding endurance of the bending test strip of present invention test rigid-flex combined board.And owing to bending test strip is produced on technique edges, the catalog that can check as systematic sampling.
Accompanying drawing explanation
Fig. 1 is the structural representation bending test strip in embodiment；
Fig. 2 is the structural representation that in embodiment, rigid-flexible combination produces plate.
Detailed description of the invention
In order to understand the technology contents of the present invention more fully, below in conjunction with specific embodiment technical scheme it is described further and illustrates.
Embodiment
The present embodiment provides the manufacture method of the bending test strip of a kind of rigid-flex combined board, on the technique edges of flexible central layer, bending test strip is made in the lump when key point is to make internal layer circuit on flexible central layer, make the live width of bending test strip, line-spacing, the parameters such as copper thickness and coverlay thickness are consistent with flexible central layer, and bend test strip and can together experience follow-up all work flows with flexible central layer, so that in performance and the rigid-flex combined board of bending test strip the performance of flexible region closer to, the bending resistance folding endurance of bending resistance folding endurance and the flexible region of bending test strip closer to, error is less.Concrete making step is as follows:
(1) flexible central layer
Obtaining flexible central layer (not making internal layer circuit) by pre-set dimension cutting base material (sawing sheet), flexible central layer includes line areas and is wound on outward the technique edges of periphery, line areas.Then in the line areas of flexible central layer, internal layer circuit is made according to prior art, on the technique edges of flexible central layer, additionally make bending test strip, as it is shown in figure 1, bending test strip 30 includes the pad 31,32 at two ends, and connect the plain conductor 33 of two pads 31,32.Then on flexible central layer, epiphragma is pasted.
Making on the line areas of described flexible central layer has the region of internal layer circuit to be called flexible region；Making on the technique edges of described flexible central layer has the region of bending test strip to be called test section.
Owing to bending test strip makes with the internal layer circuit in flexible region simultaneously, thick and coverlay the thickness of the bending live width of test strip, line-spacing, copper is consistent with internal layer circuit.
Concrete, the size of bending test strip is as follows: long is 130mm, wide for 16mm；The length of pad is 16mm, wide for 10mm.
(2) rigidity central layer is made
Obtaining rigidity central layer (not making internal layer circuit) by pre-set dimension cutting base material (sawing sheet), the size of rigidity central layer is mated with the size of flexible central layer, including line areas and technique edges.In the line areas of rigidity central layer, internal layer circuit is made according to prior art.
(3) rigid-flexible daughter board is made
According to prior art, in a predetermined order by prepreg, flexible central layer, rigidity central layer with outer copper foil stacks and pressing is integrated, obtain rigid-flexible daughter board.
After pressing, the technique edges of the technique edges of rigidity central layer and flexible central layer is corresponding to the technique edges of rigid-flexible daughter board, and namely the technique edges of rigidity central layer is overlapping with the technique edges of flexibility central layer and be positioned at the internal layer of technique edges of rigid-flexible daughter board.
(4) outer-layer circuit
According to prior art, rigid-flexible daughter board is sequentially carried out boring, heavy copper, electric plating of whole board, outer graphics, graphic plating, etching, silk-screen welding resistance and surface treatment.
(5) controlled depth milling groove
Position corresponding with the flexible region of flexible central layer and test section on rigid-flexible daughter board carries out controlled depth milling groove, makes flexible region and test section expose, and obtains rigid-flexible combination and produces plate；The bending test strip of described test section is positioned at rigid-flexible combination and produces on the technique edges (corresponding with the technique edges of rigid-flexible daughter board) of plate, as in figure 2 it is shown, 10 is flexible region, 30 is test section (bending test strip is positioned at this region).
(6) operation afterwards
According to prior art, rigid-flexible combination is produced plate to be shaped processing, prepare rigid-flex combined board.
The above only further illustrates the technology contents of the present invention with embodiment, in order to reader is easier to understand, but does not represent embodiments of the present invention and be only limitted to this, and any technology done according to the present invention extends or recreation, all by the protection of the present invention.
Claims (5)
1. a manufacture method for the bending test strip of rigid-flex combined board, described bending test strip includes the pad being positioned at two ends and the plain conductor connecting two pads；It is characterized in that, described bending test strip is produced on rigid-flexible combination and produces on the technique edges of plate.
2. the manufacture method of the bending test strip of a kind of rigid-flex combined board according to claim 1, it is characterised in that comprise the following steps:
S1 flexibility central layer and rigidity central layer: described flexible central layer and rigidity central layer all include line areas and technique edges；On the line areas of flexible central layer and rigidity central layer, make internal layer circuit respectively, and on the technique edges of flexible central layer, make bending test strip, then on flexible central layer, paste epiphragma；
Making on the line areas of described flexible central layer has the region of internal layer circuit to be called flexible region；Making on the technique edges of described flexible central layer has the region of bending test strip to be called test section；
The rigid-flexible daughter board of S2: in a predetermined order by prepreg, flexible central layer, rigidity central layer with outer copper foil stacks and pressing is integrated, obtain rigid-flexible daughter board；
S3 outer-layer circuit: rigid-flexible daughter board is sequentially carried out boring, heavy copper, electric plating of whole board, outer graphics, graphic plating, etching, silk-screen welding resistance and surface treatment according to prior art；
S4 controlled depth milling groove: position corresponding with the flexible region of flexible central layer and test section on rigid-flexible daughter board carries out controlled depth milling groove, makes flexible region and test section expose, obtains rigid-flexible combination and produces plate；The bending test strip of described test section is positioned at rigid-flexible combination and produces on the technique edges of plate.
3. the manufacture method of the bending test strip of a kind of rigid-flex combined board according to claim 1, it is characterized in that, in described bending test strip, the live width of plain conductor, line-spacing and copper layer thickness are consistent with the live width of internal layer circuit on flexible central layer, line-spacing and copper layer thickness.
4. the manufacture method of the bending test strip of a kind of rigid-flex combined board according to claim 3, it is characterised in that the length of described bending test strip is 130mm, wide for 16mm.
5. the manufacture method of the bending test strip of a kind of rigid-flex combined board according to claim 4, it is characterised in that the length of the pad at described bending test strip two ends is 16mm, wide for 10mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610224836.9A CN105758686A (en) | 2016-04-11 | 2016-04-11 | Manufacturing method for bent test bar of rigid-flexible combined plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610224836.9A CN105758686A (en) | 2016-04-11 | 2016-04-11 | Manufacturing method for bent test bar of rigid-flexible combined plate |
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| CN105758686A true CN105758686A (en) | 2016-07-13 |
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| CN201610224836.9A Pending CN105758686A (en) | 2016-04-11 | 2016-04-11 | Manufacturing method for bent test bar of rigid-flexible combined plate |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108901128A (en) * | 2018-08-26 | 2018-11-27 | 陈赵军 | Double-faced flexible pcb board |
| CN112188726A (en) * | 2020-10-20 | 2021-01-05 | 江西强达电路科技有限公司 | Multilayer board for performing V _ CUT depth detection through electrical test |
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| JPH0992998A (en) * | 1995-09-26 | 1997-04-04 | Toshiba Chem Corp | Manufacture of shielding plate for composite multilayer printed wiring board |
| US7982135B2 (en) * | 2006-10-30 | 2011-07-19 | Ibiden Co., Ltd. | Flex-rigid wiring board and method of manufacturing the same |
| CN105050337A (en) * | 2015-07-02 | 2015-11-11 | 广州杰赛科技股份有限公司 | Manufacturing method for rigid-flex printed circuit board |
| CN105246263A (en) * | 2015-10-12 | 2016-01-13 | 深圳崇达多层线路板有限公司 | Process for protecting goldfinger and bonding pad in rigid-flex printed circuit board |
| CN105430899A (en) * | 2015-11-14 | 2016-03-23 | 惠州市金百泽电路科技有限公司 | Rigid-flex PCB with flexible region equipped with solder pad and manufacturing method thereof |
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2016
- 2016-04-11 CN CN201610224836.9A patent/CN105758686A/en active Pending
Patent Citations (5)
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|---|---|---|---|---|
| JPH0992998A (en) * | 1995-09-26 | 1997-04-04 | Toshiba Chem Corp | Manufacture of shielding plate for composite multilayer printed wiring board |
| US7982135B2 (en) * | 2006-10-30 | 2011-07-19 | Ibiden Co., Ltd. | Flex-rigid wiring board and method of manufacturing the same |
| CN105050337A (en) * | 2015-07-02 | 2015-11-11 | 广州杰赛科技股份有限公司 | Manufacturing method for rigid-flex printed circuit board |
| CN105246263A (en) * | 2015-10-12 | 2016-01-13 | 深圳崇达多层线路板有限公司 | Process for protecting goldfinger and bonding pad in rigid-flex printed circuit board |
| CN105430899A (en) * | 2015-11-14 | 2016-03-23 | 惠州市金百泽电路科技有限公司 | Rigid-flex PCB with flexible region equipped with solder pad and manufacturing method thereof |
Non-Patent Citations (3)
| Title |
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| 国家技术监督局: "《中华人民共和国国家标准》", 1 June 2001 * |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108901128A (en) * | 2018-08-26 | 2018-11-27 | 陈赵军 | Double-faced flexible pcb board |
| CN108901128B (en) * | 2018-08-26 | 2021-12-28 | 深圳华秋电子有限公司 | Double-sided flexible PCB |
| CN112188726A (en) * | 2020-10-20 | 2021-01-05 | 江西强达电路科技有限公司 | Multilayer board for performing V _ CUT depth detection through electrical test |
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Application publication date: 20160713 |
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