CN108112192A - Method for manufacturing gold finger in a kind of plate - Google Patents
Method for manufacturing gold finger in a kind of plate Download PDFInfo
- Publication number
- CN108112192A CN108112192A CN201711329744.8A CN201711329744A CN108112192A CN 108112192 A CN108112192 A CN 108112192A CN 201711329744 A CN201711329744 A CN 201711329744A CN 108112192 A CN108112192 A CN 108112192A
- Authority
- CN
- China
- Prior art keywords
- gold finger
- lead
- gold
- finger
- electric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1383—Temporary protective insulating layer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses method for manufacturing gold finger in a kind of plate, comprise the following steps：Golden finger is produced together when making outer-layer circuit on producing plate, and forms gold finger lead between adjacent golden finger；The anti-electric bronze ink of silk-screen and cure on the gold finger lead；The pad pasting on production plate, and open a window at corresponding golden finger position to film；It is powered to the gold finger lead, gold-plated processing is carried out on the golden finger surface；Return film and anti-electric bronze ink；The anti-electric bronze ink buffer zone of silk-screen and cure between gold finger lead and outer-layer circuit, and the windowing at the position of hole；The pad pasting on production plate, and open a window at corresponding gold finger lead position to film；Etching removes the gold finger lead, then returns film and anti-electric bronze ink buffer zone.Caused by inventive process avoids etching solution drainage when etching gold finger lead there is the problems such as broken string, open circuit, notch in circuit and PAD, improve the yields of product.
Description
Technical field
The present invention relates to printed wiring board manufacture technology fields, and in particular to method for manufacturing gold finger in a kind of plate.
Background technology
In order to realize the needs in some featured functions and product design of electronic product, part PCB golden fingers are broken
Conventional golden finger designs the way in edges of boards, and golden finger is designed in the inside of plate unit.Such golden finger would generally be to needing
Want gold-plated golden finger that a lead is drawn golden finger to be made to be turned on edges of boards copper sheet, lead at this time can be passed through in plate to pcb board side
Line areas.In industry, the plating flow of such golden finger is mainly：Preceding process → heavy copper → plate electricity → outer graphics transfer is 1.
2. (making outer layer positive figure) → graphic plating → alkali etching → AOI detects 1. → outer graphics transfer (with anti-electric polishes
Ink protection gold finger lead) the 3. transfer of → outer graphics (with the circuit in dry film protection non-electrical gold region, exposes golden finger) → electricity
Golden finger → move back film (dry film+anti-electric bronze ink) → outer graphics transfer 4. (with the circuit in dry film protection non-electrical gold region, exposing
Gold finger lead) → outer layer alkali etching is 2. (etching gold finger lead) → move back film (dry film) → AOI detection 2. → welding resistance → word
Symbol → process adhesive tape (the thick carat (measure of the purity of gold) of protection) → surface treatment → rear process.
When etching lead using the above method, in outer graphics transfer 4. (with the circuit in dry film protection non-electrical gold region, dew
Go out gold finger lead) in step, easily dry film gap is formed in the joint of circuit and base material, it may appear that etching solution drains into gold
In the outer-layer circuit and PAD on finger lead periphery, outer-layer circuit broken string, open circuit and gap problem are caused, influences the quality of circuit,
Reduce the fraction defective of wiring board.
The content of the invention
There is drawbacks described above in the present invention, provide golden finger in a kind of plate for method for manufacturing gold finger in existing plate
Production method, this method avoid etching solution drainage when etching gold finger lead caused by circuit and PAD there is broken string, open
The problems such as road, notch, improves the yields of product.
In order to solve the above technical problem, the present invention provides method for manufacturing gold finger in a kind of plate, comprise the following steps：
S1, golden finger and gold finger lead are produced together when making outer-layer circuit on producing plate；
S2, the anti-electric bronze ink of silk-screen and cure on the gold finger lead；
S3, the pad pasting on production plate, and open a window at corresponding golden finger position to film；
S4, it is powered to the gold finger lead, gold-plated processing is carried out on the golden finger surface；
S5, film and anti-electric bronze ink are returned；
S6, the anti-electric bronze ink buffer zone of silk-screen and cure between gold finger lead and outer-layer circuit, and opened at the position of hole
Window；
S7, the pad pasting on production plate, and open a window at corresponding gold finger lead position to film；
S8, etching remove the gold finger lead, then return film and anti-electric bronze ink buffer zone.
Preferably, in step S2,15-30min is first stood after the anti-electric bronze ink silk-screen, is then toasted at 100 DEG C
30min。
Preferably, in step S2, the unilateral distance of the unilateral stretching gold finger lead homonymy of the anti-electric bronze ink
≥1mil。
Preferably, in step S6, the anti-electric bronze ink buffer zone first stands 15-30min after silk-screen, then 100
60min is toasted at DEG C.
Preferably, in step S2, the thickness and the thickness phase of the outer-layer circuit layers of copper of the anti-electric bronze ink buffer zone
Together.
Preferably, in step S3 and S7, dry film is pasted on production plate.
Preferably, in step S1, the gold finger lead is formed between adjacent golden finger.
Preferably, in step S7, the distance between side of the windowing and golden finger unilateral side is 1mil-2mil.
Compared with prior art, the present invention has the advantages that：
The method of the present invention is by the way that before gold finger lead is etched, silk-screen resists between outer-layer circuit, PAD and gold finger lead
Electric bronze ink, and pass through pad pasting and thoroughly separate gold finger lead and surrounding circuit, PAD, protect gold finger lead week
The circuit and PAD enclosed avoids when etching gold finger lead circuit and PAD caused by etching solution drainage from there is broken string, open circuit, lack
The problems such as mouth, improves the yields of product.
Specific embodiment
In order to more fully understand the technology contents of the present invention, below in conjunction with specific embodiment to the technical side of the present invention
Case is described further and illustrates.
Embodiment
A kind of method for manufacturing circuit board shown in the present embodiment, including method for manufacturing gold finger in a kind of plate, successively
Including following treatment process：
(1), sawing sheet：Core plate is outputed by jigsaw size 520mm × 620mm, core thickness 1.2mm, the outer layer copper on core plate
Paper tinsel thickness is 0.5OZ.
(2), internal layer circuit makes (negative film technique)：Inner figure shifts, and light-sensitive surface, light-sensitive surface are coated with vertical application machine
8 μm of film thickness monitoring, using Full-automatic exposure machine, internal layer circuit exposure is completed with 5-6 lattice exposure guide rule (21 lattice exposure guide rule)；Internal layer
Core plate after exposure imaging is etched internal layer circuit by etching, and internal layer line width is measured as 3mil；Internal layer AOI, then checks internal layer
The defects of opening short circuit, circuit notch, circuit pin hole of circuit, defective to scrap processing, flawless product goes out to downstream.
(3), press：Brown speed according to bottom copper copper thickness brown, by outer copper foil, prepreg, core plate, prepreg,
Outer copper foil overlaps successively on request, then according to plate Tg appropriate lamination is selected to press superimposed sheet, is formed
Produce plate.
(4), drill：According to existing drilling technique, drill according to design requirement on production plate.
(5), heavy copper：Make the hole metallization on production plate, backlight tests 10 grades, and the heavy copper thickness in hole is 0.5 μm.
(6), electric plating of whole board：Electric plating of whole board is carried out to production plate according to the prior art and by design requirement.
(7), outer-layer circuit makes (positive blade technolgy)：Outer graphics shift, luxuriant and rich with fragrance using Full-automatic exposure machine and positive circuit
Woods completes outer-layer circuit, PAD, golden finger and gold finger lead with 5-7 lattice exposure guide rule (21 lattice exposure guide rule) and exposes, developed,
It produces and outer-layer circuit figure, PAD figures, golden finger figure and gold finger lead figure is formed on plate；Outer graphics are electroplated, then
The copper facing and tin plating respectively on production plate, copper facing is the current density electric plating of whole board 60min with 1.8ASD, and tin plating is with 1.2ASD
Current density plating 10min, 3-5 μm of tin thickness；Then move back film successively again, etch and move back tin, outer layer is etched on production plate
Circuit, PAD, golden finger and gold finger lead；Wherein, gold finger lead is formed between adjacent golden finger.
(8) electric golden finger：Comprise the following steps：
A, the anti-electric bronze ink of silk-screen and cure on gold finger lead；
Wherein, 15-30min is first stood after anti-electric bronze ink silk-screen, 30min is then toasted at 100 DEG C makes anti-electric polishes
Ink cures.
Wherein, the unilateral distance >=1mil of the unilateral stretching gold finger lead homonymy of anti-electric bronze ink, to ensure golden finger
Lead will not plated with nickel gold.
B, dry film is pasted on production plate, and corresponds in dry film and open a window at golden finger position, with dry film protection non-electrical gold
The circuit in region exposes golden finger.
C, it is powered to gold finger lead, gold-plated processing is carried out on golden finger surface, i.e., in golden finger surface plating last layer gold
Layer；
D, the anti-electric bronze ink on the dry film and gold finger lead on production plate is returned successively；
E, the anti-electric bronze ink buffer zone of silk-screen one between gold finger lead and surrounding outer-layer circuit and PAD, so
Solidify afterwards, and open a window in anti-electric bronze ink buffer zone at corresponding hole position, with the anti-electric golden hand of bronze ink buffer zone protection
The outer-layer circuit and PAD on index wire periphery.
Wherein, anti-electric bronze ink buffer zone first stands 15-30min after silk-screen, and 60min is then toasted at 100 DEG C makes
It cures.
Wherein, the thickness of anti-electric bronze ink buffer zone is identical with the thickness of outer-layer circuit layers of copper, and the later stage pastes on production plate
After dry film, it is ensured that thoroughly separated between the outer-layer circuit and PAD on gold finger lead and its periphery, there is no gaps.
F, dry film is pasted on production plate, and corresponds in dry film and open a window at gold finger lead position, and opened a window and golden hand
Refer to the distance between unilateral side as 1mil-2mil, to be reduced when ensureing that the later stage etches gold finger lead to golden finger bottom
The lateral erosion of layers of copper, and can remove gold finger lead to greatest extent makes remaining terminal pin minimum.
G, then etching removal gold finger lead returns dry film and anti-electric bronze ink buffer zone successively.
(9), welding resistance, silk-screen character：According to the prior art and by design requirement solder mask and silk-screen are made on production plate
Character；
(10), surface treatment (heavy nickel gold)：The copper face of welding resistance windowing position leads to the principles of chemistry, and uniform deposition centainly requires thickness
Nickel gold.
(11), it is molded：According to the prior art and by design requirement gong shape, wiring board is made.
(12), electric performance test：The electric property of wiring board is detected, qualified wiring board is detected and enters next processing
Link；
(13), final inspection：Appearance, hole copper thickness, thickness of dielectric layers, green oil thickness, internal layer copper thickness of finished product etc. is taken a sample test respectively,
Qualified product can shipment.
The technical solution provided above the embodiment of the present invention is described in detail, specific case used herein
The principle and embodiment of the embodiment of the present invention are set forth, the explanation of above example is only applicable to help to understand this
The principle of inventive embodiments；Meanwhile for those of ordinary skill in the art, according to the embodiment of the present invention, in specific embodiment party
There will be changes in formula and application range, in conclusion this specification content should not be construed as limiting the invention.
Claims (8)
1. method for manufacturing gold finger in a kind of plate, which is characterized in that comprise the following steps：
S1, golden finger and gold finger lead are produced together when making outer-layer circuit on producing plate；
S2, the anti-electric bronze ink of silk-screen and cure on the gold finger lead；
S3, the pad pasting on production plate, and open a window at corresponding golden finger position to film；
S4, it is powered to the gold finger lead, gold-plated processing is carried out on the golden finger surface；
S5, film and anti-electric bronze ink are returned；
S6, the anti-electric bronze ink buffer zone of silk-screen and cure between gold finger lead and outer-layer circuit, and the windowing at the position of hole；
S7, the pad pasting on production plate, and open a window at corresponding gold finger lead position to film；
S8, etching remove the gold finger lead, then return film and anti-electric bronze ink buffer zone.
2. method for manufacturing gold finger in plate according to claim 1, which is characterized in that in step S2, the anti-electric polishes
15-30min is first stood after black silk-screen, then toasts 30min at 100 DEG C.
3. method for manufacturing gold finger in plate according to claim 2, which is characterized in that in step S2, the anti-electric polishes
Unilateral distance >=the 1mil of the black unilateral stretching gold finger lead homonymy.
4. method for manufacturing gold finger in plate according to claim 1, which is characterized in that in step S6, the anti-electric polishes
Black buffer zone first stands 15-30min after silk-screen, then toasts 60min at 100 DEG C.
5. method for manufacturing gold finger in plate according to claim 4, which is characterized in that in step S2, the anti-electric polishes
The thickness of black buffer zone is identical with the thickness of the outer-layer circuit layers of copper.
6. method for manufacturing gold finger in plate according to claim 1, which is characterized in that in step S3 and S7, in production plate
Upper patch dry film.
7. method for manufacturing gold finger in plate according to claim 1, which is characterized in that in step S1, in adjacent golden finger
Between form the gold finger lead.
8. method for manufacturing gold finger in plate according to claim 7, which is characterized in that in step S7, the windowing and institute
The distance between side of golden finger unilateral side is stated as 1mil-2mil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711329744.8A CN108112192A (en) | 2017-12-13 | 2017-12-13 | Method for manufacturing gold finger in a kind of plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711329744.8A CN108112192A (en) | 2017-12-13 | 2017-12-13 | Method for manufacturing gold finger in a kind of plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108112192A true CN108112192A (en) | 2018-06-01 |
Family
ID=62216736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711329744.8A Pending CN108112192A (en) | 2017-12-13 | 2017-12-13 | Method for manufacturing gold finger in a kind of plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108112192A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111372390A (en) * | 2020-03-16 | 2020-07-03 | 信泰电子（西安）有限公司 | Gold plating process |
| CN112384005A (en) * | 2020-11-03 | 2021-02-19 | 珠海杰赛科技有限公司 | Wire etching method for full-plate gold-plated printed circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20120004088A (en) * | 2010-07-06 | 2012-01-12 | 엘지이노텍 주식회사 | Manufacturing method for pcb |
| CN102638945A (en) * | 2012-03-21 | 2012-08-15 | 深圳崇达多层线路板有限公司 | Method for producing goldfinger via twice electroplating |
| CN103648241A (en) * | 2013-12-09 | 2014-03-19 | 深圳市深联电路有限公司 | Internal-arranged lead manufacturing technology of long and short printed plug circuit board |
-
2017
- 2017-12-13 CN CN201711329744.8A patent/CN108112192A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20120004088A (en) * | 2010-07-06 | 2012-01-12 | 엘지이노텍 주식회사 | Manufacturing method for pcb |
| CN102638945A (en) * | 2012-03-21 | 2012-08-15 | 深圳崇达多层线路板有限公司 | Method for producing goldfinger via twice electroplating |
| CN103648241A (en) * | 2013-12-09 | 2014-03-19 | 深圳市深联电路有限公司 | Internal-arranged lead manufacturing technology of long and short printed plug circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111372390A (en) * | 2020-03-16 | 2020-07-03 | 信泰电子（西安）有限公司 | Gold plating process |
| CN112384005A (en) * | 2020-11-03 | 2021-02-19 | 珠海杰赛科技有限公司 | Wire etching method for full-plate gold-plated printed circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102946693B (en) | Step circuit board with gold-masking copper-plating hybrid surface process and manufacture method thereof | |
| CN106231816A (en) | A kind of manufacture method of golden fingerboard without lead wire | |
| CN110351955A (en) | A kind of production method of the PCB with local electric thick gold PAD | |
| CN108323037A (en) | A kind of PCB processing technologys of two-sided ladder position electricity gold | |
| CN104717846B (en) | The preparation method of metallization slotted eye in a kind of PCB | |
| CN105848423B (en) | A kind of production method of the PCB with electroplating gold and chemical two kinds of surface treatments of turmeric | |
| CN110678011A (en) | Manufacturing method of rigid-flex printed circuit board | |
| CN107027245B (en) | A kind of production method of welding resistance bridge | |
| CN106973514A (en) | PAD preparation method in a kind of PCB | |
| CN104883820B (en) | A kind of outer-layer circuit production method of the structure asymmetry backboard of warpage | |
| CN105682348A (en) | Fabrication method for printed circuit board (PCB) with gold finger of which three surfaces coated with gold | |
| CN105764270A (en) | Manufacturing method of PCB possessing entire board electrolytic gold and golden finger surface processing | |
| CN109275268A (en) | A kind of PCB back drill production method being less than 0.15mm for medium thickness | |
| CN109348637A (en) | A kind of film aligning method for preventing negative film plate circuit etching not clean | |
| CN107708316A (en) | A kind of preparation method of superfinishing fine rule road | |
| CN108289388A (en) | The undesirable PCB production methods of tin in a kind of prevention | |
| CN110602890A (en) | Manufacturing method of negative film circuit board with step circuit | |
| CN106714453B (en) | A kind of false rigid-flex combined board and preparation method thereof | |
| CN108449883A (en) | A kind of surface treatment is the production method for the wiring board that electric nickel gold adds part electricity gold | |
| CN108401381A (en) | A kind of production method of disconnecting golden finger class printed circuit board | |
| CN108556045A (en) | A kind of method in drill straight chamfered groove hole | |
| CN108112192A (en) | Method for manufacturing gold finger in a kind of plate | |
| CN109831874A (en) | A method of solving the upper PAD of the quick-fried oil of welding resistance | |
| CN110121239A (en) | A kind of production method of mechanical blind hole half bore | |
| CN105517373B (en) | A kind of production method of PCB backboards outer-layer circuit figure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180601 |