CN111372390A - Gold plating process - Google Patents
Gold plating process Download PDFInfo
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- CN111372390A CN111372390A CN202010183648.2A CN202010183648A CN111372390A CN 111372390 A CN111372390 A CN 111372390A CN 202010183648 A CN202010183648 A CN 202010183648A CN 111372390 A CN111372390 A CN 111372390A
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- gold
- dry film
- golden finger
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
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Abstract
The invention relates to a gold plating process, which belongs to the technical field of electroplating processes and comprises the following steps of outer layer treatment: etching the copper-clad plate to form a circuit pattern part, a golden finger part and a golden finger part; primary dry film treatment: pasting a dry film on the copper-clad plate, covering the surface of the copper-clad plate with the dry film, then exposing and developing, and removing the dry film of the golden finger part to expose the golden finger; gold plating treatment: immersing the copper-clad plate into a gold plating solution, and electroplating a gold layer on the gold finger; secondary dry film treatment: sticking a dry film on the gold layer, covering the surface of the copper clad plate with the dry film, then exposing and developing, and removing the dry film on the gold finger line part; etching treatment: spraying etching liquid to etch the gold finger lead; and (3) stripping treatment: spraying alkali liquor to remove the dry film on the surface of the copper clad laminate. The gold plating process has the effects of reducing the gold plating area and reducing the production cost.
Description
Technical Field
The invention relates to the technical field of electroplating processes, in particular to a gold plating process.
Background
The golden finger is used for the electric contact part of relevant equipment such as a computer display card, a memory card, a USB interface and the like and other copper-clad plates, has good wear resistance and low contact resistance, can meet the requirement of repeated plugging and unplugging, and is frequently subjected to gold plating operation in order to increase the wear resistance, oxidation resistance and conductivity of the golden finger and prolong the service life of the golden finger.
The existing gold-plating method for the gold fingers generally comprises the steps of etching the gold fingers and patterns in a copper-clad plate, manufacturing gold-plated conducting wires, conducting the gold fingers with the gold-plated conducting wires, covering non-gold-plated areas with solder resist ink, and plating gold on the gold fingers through the gold-plated conducting wires. Because the gold-plated wire is actually a process auxiliary wire, the gold-plated wire needs to be removed after the gold plating is finished.
The above prior art solutions have the following drawbacks: in the process of gold plating on the gold finger by adopting the method, because the gold ions can also form a gold-plated layer on the surface of the gold-plated wire in the electrifying process of the gold-plated wire, the gold-plated area is increased, the gold-plated wire needs to be removed after the gold-plating is finished, and the gold layer formed on the surface of the gold-plated wire can be removed, so that a large amount of gold ions are wasted, and the production cost of the product is increased.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a gold plating process which has the effects of reducing the gold plating area and reducing the production cost.
The technical purpose of the invention is realized by the following technical scheme:
a gold plating process comprising the steps of:
(1) outer layer treatment: etching the copper-clad plate to form a circuit pattern part, a golden finger part and a golden finger part;
(2) primary dry film treatment: pasting a dry film on the copper-clad plate at the temperature of 100-110 ℃, covering the surface of the copper-clad plate with the dry film, then carrying out exposure and development, and removing part of the dry film of the golden finger to expose the golden finger;
(3) gold plating treatment: immersing the copper-clad plate into a gold plating solution, and electroplating a gold layer on the gold finger;
(4) secondary dry film treatment: adhering a dry film to the gold layer at the temperature of 100-110 ℃, covering the surface of the copper-clad plate with the dry film, and then carrying out exposure and development to remove the dry film at the part of the gold finger;
(5) etching treatment: spraying etching solution to the golden finger lead part to remove the golden finger lead;
(6) and (3) stripping treatment: and spraying alkali liquor on the surface of the copper-clad plate to remove a dry film on the surface of the copper-clad plate.
By adopting the technical scheme, in the gold plating process of the gold finger, the dry film is adopted to cover the circuit pattern part, the gold plating on the circuit pattern part is avoided, and meanwhile, the dry film covers the part of the gold finger line, so that the gold finger is only exposed, the gold finger is only plated in the gold plating process, gold ions cannot be deposited on the gold finger lead, a gold layer cannot be formed on the gold finger lead, the gold plating area is reduced, the waste of the gold ions is reduced, and the production cost of a product is reduced.
After gold plating of the gold finger is completed, the circuit pattern part and the gold finger part are covered by the dry film, only the gold finger part is exposed, etching solution is sprayed on the copper-clad plate, and the gold finger lead is etched, so that the gold finger lead is removed. The gold plating process is adopted to avoid gold plating on the gold finger lead, so that when the gold finger lead is removed, the waste of gold ions is avoided, the utilization rate of the gold ions is improved, and the production cost is reduced.
The present invention may be further configured in a preferred example that the gold plating process further includes, between step (1) and step (2): and processing the protective film to form the protective film on the golden finger part and the golden finger lead part.
By adopting the technical scheme, the golden finger part and the golden finger lead part are coated with the protective films, so that the golden finger part and the golden finger lead part are further protected, when the golden finger is plated with gold, the gold plating solution is effectively prevented from permeating and diffusing, a gold layer is prevented from being formed on the part of the copper-clad plate without being plated with gold, and the waste of gold ions is reduced; on the other hand, the protective film is positioned between the dry film and the copper-clad plate, so that the fitting property and the bonding property between the dry film and the copper-clad plate can be improved, and the gap between the dry film and the copper-clad plate is reduced. When the dry film is not well combined with the copper-clad plate or a gap exists, the gold plating solution can penetrate under the dry film to form a gold layer in the gold plating process, the gold layer between the dry film and the copper-clad plate cannot be etched by the etching solution in the later etching process, so that the gold layer subjected to diffusion plating is reserved, and after the gold layer subjected to diffusion plating exceeds a certain specification, the appearance and the performance of a product can be influenced, the defect of diffusion plating is formed, and the quality of gold plating is influenced. Therefore, the protective film reduces the gap between the dry film and the copper-clad plate, reduces the diffusion coating defect, improves the appearance of the product and ensures the quality of the product.
In addition, because the protective film has stronger bonding property with the copper-clad plate, and the protective film is difficult to remove after the gold plating is finished, the protective film is coated only on the gold finger part and the gold finger lead part which need to be plated with gold, so that the penetration of gold plating solution can be reduced, the coating area of the protective film is reduced, the later demolding treatment is facilitated, and the gold plating cost is reduced.
The present invention in a preferred example may be further configured to: the protective film is formed by spraying epoxy resin, the epoxy resin is sprayed on the golden finger part and the golden finger lead part, and the protective film is obtained after the golden finger part and the golden finger lead part are baked for 28-32min at 78-82 ℃.
By adopting the technical scheme, the epoxy resin has strong acting force with adjacent interface molecules, and some epoxy resins can also form chemical bonds, so that the epoxy resin has strong adhesive force. According to the invention, the protective film formed by epoxy resin is coated between the dry film and the copper-clad plate, and the protective film is used as a connecting layer between the dry film and the copper-clad plate, so that the attaching degree and the bonding strength of the dry film and the copper-clad plate are increased, thus preventing a gold plating solution from penetrating into a gap between the dry film and the copper-clad plate, reducing the diffusion plating defect, improving the appearance of the product, reducing the condition of poor contact or short circuit of a gold finger, and ensuring the quality of the product.
The invention may further be configured in a preferred example, that the gold plating process further includes, between step (3) and step (4): and processing the protective layer to form the protective layer on the golden finger part.
Through adopting above-mentioned technical scheme, after the gilding is accomplished, need etch the golden finger lead wire, add the protective layer at golden finger part, on the one hand, increase the cover intensity to the golden finger, prevent that etching solution from permeating the etching golden finger, on the other hand, the protective layer increases the laminating degree of dry film and copper-clad plate, increase the adhesion properties of dry film and copper-clad plate, reduce the space between the two, prevent that etching solution from getting into space etching golden finger or copper-clad plate between dry film and the copper-clad plate, prevent that the golden finger from producing appearance defects, reduce the condition of golden finger contact failure or short circuit, the quality of product has been guaranteed, the defective rate of product has been reduced.
The present invention in a preferred example may be further configured to: the protective layer is formed by spraying epoxy resin, the epoxy resin is sprayed on the golden finger part, and the golden finger part is baked for 28-32min at 78-82 ℃ to obtain the protective layer.
By adopting the technical scheme, the protective layer formed by coating the epoxy resin between the dry film and the copper-clad plate is used for increasing the laminating degree and the bonding strength of the dry film and the copper-clad plate, so that the gap between the dry film and the copper-clad plate is reduced by permeating etching liquid, the golden finger is prevented from being etched by the etching liquid, the appearance defect of the golden finger is avoided, the condition of poor contact or short circuit of the golden finger is reduced, the quality of a product is ensured, and the reject ratio of the product is reduced.
The present invention in a preferred example may be further configured to: and (3) solder mask treatment is further included between the step (1) and the step (2), and solder mask ink is used for covering part of the non-gold-plated area.
The present invention in a preferred example may be further configured to: the concentration of gold ions in the gold plating solution in the step (3) is 2.7-3.3g/L, the current density is 0.86-0.88ASD, and the electrifying time is 3-4 min.
By adopting the technical scheme, when the concentration of gold ions in the gold plating solution is too high, gold deposition is easy to occur on the gold plating layer to abrade the smoothness of the gold layer, and when the concentration of the gold ions is lower, the electroplating speed is lower, and the production efficiency is influenced, so that when the concentration of the gold ions is 2.7-3.3g/L, the current density is 0.86-0.88ASD, and the electrifying time is 3-4min, the formed gold layer has a better effect.
The present invention in a preferred example may be further configured to: the thickness of the gold layer formed in the step (3) is 0.76-0.83 μm.
The present invention in a preferred example may be further configured to: the etching solution in the step (5) is hydrochloric acid solution, the concentration is 2.5-3.5 mol/L, the spraying pressure is 0.1-0.22 MPa, and the spraying time is 15-20 s.
The present invention in a preferred example may be further configured to: the alkali liquor in the step (6) is sodium hydroxide solution, and the mass concentration is 4-7%.
In summary, the invention includes at least one of the following beneficial technical effects:
1. when gold plating is carried out on the golden finger, the dry film is adopted to cover the circuit pattern part and the golden finger lead part, and only the golden finger is exposed, so that only gold plating is carried out on the golden finger, gold ions cannot be deposited on the golden finger lead, and a gold layer cannot be formed on the golden finger lead, namely, the gold plating area is reduced, the waste of the gold ions is reduced, and the production cost of the product is reduced;
2. the protective film formed by epoxy resin is coated between the dry film and the copper-clad plate, the dry film and the copper-clad plate are connected through the protective film, the attaching degree and the bonding performance between the dry film and the copper-clad plate are increased, a gold plating solution is prevented from permeating a gap between the dry film and the copper-clad plate, the diffusion plating defect is reduced, the appearance defect of a golden finger is reduced, the phenomenon of poor contact or short circuit of the golden finger is reduced, and the reject ratio of a product is reduced;
3. a protective layer is coated between the dry film and the copper-clad plate, so that the bonding performance of the dry film and the copper-clad plate is improved, a gap between the dry film and the copper-clad plate is reduced, etching liquid is prevented from entering the gap between the dry film and the copper-clad plate to etch the golden finger, the integrity of the golden finger is ensured, and the reject ratio of a product is reduced;
4. the gold ion concentration of the gold plating solution can effectively improve the gold plating speed, thereby improving the gold plating efficiency, and meanwhile, the gold plating solution with the concentration can not generate the gold accumulation phenomenon on the surface of the gold layer, thereby ensuring the smoothness of the gold layer and reducing the fraction defective of gold fingers.
Drawings
Fig. 1 is a schematic structural view of the present invention.
Reference numerals: 1. copper-clad plate; 2. a golden finger; 3. and (6) a gold finger lead.
Detailed Description
The invention is described in further detail below with reference to the examples and figure 1 of the accompanying drawings.
Polyethylene films were used as the dry films in the following examples.
Example 1
A gold plating process comprises the following steps,
(1) outer layer treatment: etching the copper-clad plate 1 to form a circuit pattern part, a golden finger 2 part and a golden finger lead 3 part;
(2) primary dry film treatment: pasting a dry film on the copper-clad plate 1 at the temperature of 100 ℃, covering the surface of the copper-clad plate 1 with the dry film, then carrying out exposure by using an exposure machine and developing, and removing the dry film on the part of the golden finger 2 to expose the golden finger 2;
(3) gold plating treatment: immersing the copper-clad plate 1 into a gold plating solution, and electroplating a gold layer on the gold finger 2, wherein the concentration of gold ions in the gold plating solution is 2.7g/L, the current density is 0.86ASD, the electrifying time is 3min, and the thickness of the gold layer is 0.76 mu m;
(4) secondary dry film treatment: adhering a dry film to the gold layer at the temperature of 100 ℃, covering the surface of the copper-clad plate 1 with the dry film, then carrying out exposure by using an exposure machine and developing, and removing the dry film on the part of the gold finger lead 3 to expose the gold finger lead 3;
(5) etching treatment: spraying an etching solution to the part of the gold finger lead 3 to etch the gold finger lead 3, wherein the etching solution adopts a hydrochloric acid solution with the concentration of 2.5 mol/L, the spraying pressure is 0.1MPa, and the spraying time is 15 s;
(6) and (3) stripping treatment: and spraying alkali liquor on the surface of the copper-clad plate 1 to remove a dry film on the surface of the copper-clad plate 1, wherein the alkali liquor is sodium hydroxide solution with the mass concentration of 4%.
Example 2
A gold plating process comprises the following steps,
(1) outer layer treatment: etching the copper-clad plate 1 to form a circuit pattern part, a golden finger 2 part and a golden finger lead 3 part;
(2) primary dry film treatment: pasting a dry film on the copper-clad plate 1 at the temperature of 105 ℃, covering the surface of the copper-clad plate 1 with the dry film, then carrying out exposure by using an exposure machine and developing, and removing the dry film on the part of the golden finger 2 to expose the golden finger 2;
(3) gold plating treatment: immersing the copper-clad plate 1 into a gold plating solution, and electroplating a gold layer on the gold finger 2, wherein the concentration of gold ions in the gold plating solution is 3.0g/L, the current density is 0.87ASD, the electrifying time is 3.5min, and the thickness of the gold layer is 0.79 mu m;
(4) secondary dry film treatment: adhering a dry film to the gold layer at the temperature of 105 ℃, covering the surface of the copper-clad plate 1 with the dry film, then carrying out exposure by using an exposure machine and developing, and removing the dry film on the part of the gold finger lead 3 to expose the gold finger lead 3;
(5) etching treatment: spraying an etching solution to the part of the gold finger lead 3 to etch the gold finger lead 3, wherein the etching solution adopts hydrochloric acid with the concentration of 3.0 mol/L, the spraying pressure is 0.16MPa, and the spraying time is 17 s;
(6) and (3) stripping treatment: and spraying alkali liquor on the surface of the copper-clad plate 1 to remove a dry film on the surface of the copper-clad plate 1, wherein the alkali liquor is sodium hydroxide solution with the mass concentration of 5.5%.
Example 3
A gold plating process comprises the following steps,
(1) outer layer treatment: etching the copper-clad plate 1 to form a circuit pattern part, a golden finger 2 part and a golden finger lead 3 part;
(2) primary dry film treatment: pasting a dry film on the copper-clad plate 1 at the temperature of 110 ℃, covering the surface of the copper-clad plate 1 with the dry film, then carrying out exposure by using an exposure machine and developing, and removing the dry film on the part of the golden finger 2 to expose the golden finger 2;
(3) gold plating treatment: immersing the copper-clad plate 1 into a gold plating solution, and electroplating a gold layer on the gold finger 2, wherein the concentration of gold ions in the gold plating solution is 3.3g/L, the current density is 0.88ASD, the electrifying time is 4min, and the thickness of the gold layer is 0.83 mu m;
(4) secondary dry film treatment: adhering a dry film to the gold layer at the temperature of 110 ℃, covering the surface of the copper-clad plate 1 with the dry film, then carrying out exposure by using an exposure machine and developing, and removing the dry film on the part of the gold finger lead 3 to expose the gold finger lead 3;
(5) etching treatment: spraying an etching solution to the part of the gold finger lead 3 to etch the gold finger lead 3, wherein the etching solution adopts a hydrochloric acid solution with the concentration of 3.5 mol/L, the spraying pressure is 0.22MPa, and the spraying time is 20 s;
(6) and (3) stripping treatment: and spraying alkali liquor on the surface of the copper-clad plate 1 to remove a dry film on the surface of the copper-clad plate 1, wherein the alkali liquor is sodium hydroxide solution with the mass concentration of 7%.
Example 4
A gold plating process, which is different from embodiment 2 in that the gold plating process further comprises, between step (1) and step (2): and (3) processing a protective film, namely spraying epoxy resin on the gold finger 2 part and the gold finger lead 3 part, and baking at 78 ℃ for 28min to obtain the protective film.
Example 5
A gold plating process, which is different from embodiment 2 in that the gold plating process further comprises, between step (1) and step (2): and (3) processing a protective film, namely spraying epoxy resin on the gold finger 2 part and the gold finger lead 3 part, and baking for 30min at 80 ℃ to obtain the protective film.
Example 6
A gold plating process, which is different from embodiment 2 in that the gold plating process further comprises, between step (1) and step (2): and (3) processing a protective film, namely spraying epoxy resin on the gold finger 2 part and the gold finger lead 3 part, and baking for 32min at 82 ℃ to obtain the protective film.
Example 7
A gold plating process, which is different from embodiment 2 in that the gold plating process further comprises, between step (3) and step (4): and (4) treating a protective layer, namely spraying epoxy resin on the part of the gold finger 2, and baking for 28min at 78 ℃ to obtain the protective layer.
Example 8
A gold plating process, which is different from embodiment 2 in that the gold plating process further comprises, between step (3) and step (4): and (4) treating the protective layer, namely spraying epoxy resin on the part 2 of the gold finger, and baking for 30min at 80 ℃ to obtain the protective layer.
Example 9
A gold plating process, which is different from embodiment 2 in that the gold plating process further comprises, between step (3) and step (4): and (4) treating the protective layer, namely spraying epoxy resin on the part of the gold finger 2, and baking for 32min at 82 ℃ to obtain the protective layer.
Example 10
A gold plating process differs from example 2 in that the gold plating process further includes solder resist treatment between step (1) and step (2), covering a part of the non-gold plated area, i.e., the wiring pattern part, with solder resist ink.
Performance detection
1. The surface of the product plated by the gold plating process of examples 1 to 10 was subjected to appearance inspection to determine the fraction defective of the product.
2000 products without gold-plated layer on the gold finger are selected, and the surfaces of the products before gold-plating have no appearance defects. The 2000 products without gold plating are averagely divided into 10 groups, the products with 200 products without gold plating in each group are respectively plated with gold by the gold plating process of the embodiment 1-10, the appearance inspection is carried out after the electroplating is finished, and the fraction defective of each group is calculated.
(1) The appearance inspection method comprises the following steps: under the conditions of illumination intensity of 800-. Defects occurring on products are classified into a critical defect (CR), a major defect (MA), and a minor defect (MI) according to their phenomena, wherein the critical defect (CR) and the major defect (MA) are identified as defective products.
(2) Product failure rate (%) = (number of defective products/total number of detections) × 100%.
The results of the defective ratio are shown in Table 1.
TABLE 1 inspection results of product reject ratio
| Detecting items | Product failure rate (%) |
| Example 1 | 1 |
| Example 2 | 0.5 |
| Example 3 | 1 |
| Example 4 | 0 |
| Example 5 | 0 |
| Example 6 | 0 |
| Example 7 | 0 |
| Example 8 | 0 |
| Example 9 | 0 |
| Example 10 | 0 |
As can be seen from table 1, it is,
the defect rate in examples 1-3 was only 1% or less, which shows that the gold plating process according to the present invention achieves a very good success rate and effect.
The product reject ratio in the embodiments 4-6 is lower than that in the embodiments 1-3, which shows that before gold plating, the protective film is coated between the dry film and the copper-clad plate to increase the bonding strength and the bonding strength between the dry film and the copper-clad plate, reduce the gap between the dry film and the copper-clad plate, and reduce the condition that the gold plating solution permeates between the dry film and the copper-clad plate to form a gold layer, thereby reducing the defects of the product and reducing the reject ratio of the product.
The defective product rate in the embodiments 7 to 9 is lower than that in the embodiments 1 to 3, which shows that before etching, the protective layer is coated between the dry film and the copper-clad plate to increase the attaching degree and the bonding strength between the dry film and the copper-clad plate, reduce the gap between the dry film and the copper-clad plate, and reduce the etching condition that the etching solution penetrates into the gap between the dry film and the copper-clad plate to etch the golden finger, thereby reducing the defects of the product and reducing the defective rate of the product.
The defective product rate of example 10 was lower than those of examples 1 to 3, indicating that the increased solder resist treatment could achieve better success rate and effect.
The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications of the present embodiment without inventive contribution as needed after reading the present specification, but all of them are protected by patent law within the scope of the claims of the present invention.
Claims (10)
1. A gold plating process, comprising the steps of:
(1) outer layer treatment: etching the copper-clad plate to form a circuit pattern part, a golden finger part and a golden finger part;
(2) primary dry film treatment: pasting a dry film on the copper-clad plate at the temperature of 100-110 ℃, covering the surface of the copper-clad plate with the dry film, then carrying out exposure and development, and removing the dry film on the golden finger part to expose the golden finger;
(3) gold plating treatment: immersing the copper-clad plate into a gold plating solution, and electroplating a gold layer on the gold finger;
(4) secondary dry film treatment: adhering a dry film to the gold layer at the temperature of 100-110 ℃, covering the surface of the copper clad plate with the dry film, and then carrying out exposure and development to remove the dry film on the part of the gold finger;
(5) etching treatment: spraying etching liquid to the golden finger lead part to etch the golden finger lead;
(6) and (3) stripping treatment: and spraying alkali liquor on the surface of the copper-clad plate to remove a dry film on the surface of the copper-clad plate.
2. The gold plating process of claim 1, further comprising, between step (1) and step (2): and processing the protective film to form the protective film on the golden finger part and the golden finger lead part.
3. A gold plating process according to claim 2, characterized in that: the protective film is formed by spraying epoxy resin, the epoxy resin is sprayed on the golden finger part and the golden finger lead part, and the protective film is obtained after the golden finger part and the golden finger lead part are baked for 28-32min at 78-82 ℃.
4. The gold plating process of claim 1, further comprising, between step (3) and step (4): and processing the protective layer to form the protective layer on the golden finger part.
5. A gold plating process according to claim 4, characterized in that: the protective layer is formed by spraying epoxy resin, the epoxy resin is sprayed on the golden finger part, and the golden finger part is baked for 28-32min at 78-82 ℃ to obtain the protective layer.
6. The gold plating process according to claim 1, further comprising, between step (1) and step (2): and solder mask processing, covering the part of the non-gold-plated area with solder mask ink.
7. A gold plating process according to claim 1, characterized by: the concentration of gold ions in the gold plating solution in the step (3) is 2.7-3.3g/L, the current density is 0.86-0.88ASD, and the electrifying time is 3-4 min.
8. A gold plating process according to claim 1, characterized by: the thickness of the gold layer formed in the step (3) is 0.76-0.83 μm.
9. A gold plating process according to claim 1, characterized by: the etching solution in the step (5) is hydrochloric acid solution, the concentration is 2.5-3.5 mol/L, the spraying pressure is 0.1-0.22 MPa, and the spraying time is 15-20 s.
10. A gold plating process according to claim 1, characterized by: the alkali liquor in the step (6) is sodium hydroxide solution, and the mass concentration is 4-7%.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112384005A (en) * | 2020-11-03 | 2021-02-19 | 珠海杰赛科技有限公司 | Wire etching method for full-plate gold-plated printed circuit board |
| CN112996247A (en) * | 2021-01-26 | 2021-06-18 | 广州广合科技股份有限公司 | Method for manufacturing stepped PCB |
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| CN112996247A (en) * | 2021-01-26 | 2021-06-18 | 广州广合科技股份有限公司 | Method for manufacturing stepped PCB |
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