CN109348650A - A kind of method of optical module plate etched plate lead - Google Patents
A kind of method of optical module plate etched plate lead Download PDFInfo
- Publication number
- CN109348650A CN109348650A CN201811205243.3A CN201811205243A CN109348650A CN 109348650 A CN109348650 A CN 109348650A CN 201811205243 A CN201811205243 A CN 201811205243A CN 109348650 A CN109348650 A CN 109348650A
- Authority
- CN
- China
- Prior art keywords
- plate
- lead
- etching
- ink
- exposure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
Abstract
The invention discloses a kind of methods of optical module plate etched plate lead, be related to integrated circuit fields, comprising the following steps: 1), the etching of acid etching dry film, 2), anti-plate gold photosensitive-ink, 3), UV solidification, 4), plating golden finger, 5), anti-etching photosensitive-ink, 6), secondary dry film, 7), alkali etching lead, 8), it is anti-welding；In step 5) and step 6), respectively include such as flowering structure: the outer-layer circuit of optical mode plate pcb board part, the lead made from the outer-layer circuit of optical mode plate pcb board part, the anti-etching photosensitive-ink exposure layer of optical mode plate pcb board part, the secondary dry film exposure layer of optical mode plate pcb board part and optic module PCB panel hole.The present invention may be implemented plate lead attachment pad, via hole, route without over etching, can promote product quality by anti-etching photosensitive-ink and secondary dry film step, avoids the over etching in traditional etching lead, leads to pcb board bulk the problem of scrapping.
Description
Technical field
The present invention relates to integrated circuit fields, the method for specifically a kind of optical module plate etched plate lead.
Background technique
Position in optical mode printed circuit board close to edges of boards is arranged in rows there are many rectangular metal contact piece, and metal touches
Piece is that one layer of nickel gold is electroplated on the copper face of printed circuit board to be formed.These metal contact pieces are a part of printed circuit board, because
Its plating nickel on surface is golden and shape is similar to finger, therefore referred to as golden finger.Golden finger, can for the connection between printed circuit board
Connect circuit and transmission signal.The nickel-gold layer on golden finger surface can be improved the resistance to plug at the position, electric conductivity and anti-oxidant
Property.Golden finger is generally divided into isometric golden finger, grading connecting finger and segmentation golden finger, and classification, segmentation golden finger are in design
Original golden finger design concept is breached, golden finger is designed as different in size or segmentation structure, is transmitted in this way in signal
The effective time difference is formed in the process, convenient for the transmission of high-frequency signal, and electrification hot-plugging technology may be implemented, to subsequent
Upgrade maintenance has very big convenience.Design gold finger lead is usually required in plating golden finger processing, by golden hand
Index wire, which is powered, to carry out electroplating processes to golden finger.It is electroplated after the completion of golden finger, gold finger lead is not in finished product pcb board
Allow remaining, removing method generally has physics mode and two kinds of chemical mode.Wherein physics mode generally uses milling gong, cuts
It cuts, drill, chemistry is general by the way of etching.
But physics mode will product lead ends remaining influence loss of signal, be not suitable for high-speed high frequency field；Change
Mode is generally by the way of liquid medicine etching, and according to the mode of lead, optical module product can be divided into plate lead mode and plate
Outer lead mode, because plate outer lead mode, which etches, has dew copper among finger after making, in the long-term use process of client,
It can be aoxidized in place of this dew copper, corrode, cause to be affected using function, present big customer and require relatively high product client all
Selection uses the mode of plate lead, and has size definition to the residual of lead.Therefore, those skilled in the art provide
A kind of method of optical module plate etched plate lead.
Summary of the invention
The purpose of the present invention is to provide a kind of methods of optical module plate etched plate lead, to solve above-mentioned background skill
The physics mode proposed in art will product lead ends remaining influence loss of signal, be not suitable for high-speed high frequency field；Chemistry
Mode is generally by the way of liquid medicine etching, and according to the mode of lead, optical module product can be divided into outside plate lead mode and plate
Gage system, because plate outer lead mode, which etches, has dew copper among finger after making, in the long-term use process of client, this
It can be aoxidized in place of dew copper, corrode, lead to the problem of being affected using function.
To achieve the above object, the invention provides the following technical scheme:
A kind of method of optical module plate etched plate lead, comprising the following steps:
1), the etching of acid etching dry film: on having finished drilling plating plank, dry film in pressure；Egative film is penetrated using exposure machine
Required image is transferred on dry film, then image work develops via chemicals, etches, the process of striping, needed for obtaining
Image line；The maintenance that route is finally done using A.O.I, completes the production of outer-layer circuit.
2), anti-plate gold photosensitive-ink: anti-plate gold photosensitive-ink is printed in the plate face for having made route, passes through exposure
Golden finger is exposed in development, and other positions lid oil, makees exposure-processed using exposure machine in plate.
3), UV solidifies: using UV lamp, irradiates plate face using ultraviolet light, keep plate face ink solidification more complete, increase ink
Binding force.
4) golden finger, is electroplated: by electroplating principle, the plated with nickel gold on golden finger.
5), anti-etching photosensitive-ink: printing anti-etching photosensitive-ink in the plate face for having made route, aobvious by exposing
Shadow exposes lead, and other positions lid oil, makees exposure-processed using exposure machine in plate.
6), secondary dry film: sticking upper 2.0 dry film again on the plank for having printed anti-etching photosensitive-ink, and exposing is drawn
Line, other positions lid oil, makees exposure-processed using exposure machine in plate.
7) it, alkali etching lead: carries out stinging erosion using the lead that alkali etching liquid medicine comes out windowing.
8), anti-welding: in route ink for screen printing and exposure development.
As a further solution of the present invention: in step 5) and step 6), respectively including such as flowering structure: optical mode plate PCB
The outer-layer circuit of plate, the lead made from the outer-layer circuit of optical mode plate pcb board part, optical mode plate pcb board part it is against corrosion
Carve the secondary dry film exposure layer and optic module PCB panel hole of photosensitive-ink exposure layer, optical mode plate pcb board part.
As further scheme of the invention: the width of the lead is 5mil-9mil, and more excellent distance is 7mil.
As further scheme of the invention: the windowing width of the anti-etching photosensitive-ink exposure layer is 0.7mil,
Opening a window to the distance of outer-layer circuit is 2mil, and opening a window to the distance of lead is 0.3mil.
As further scheme of the invention: the secondary dry film exposure layer entirety window size is than anti-etching photosensitive oil
The black unilateral increasing 2mil-4mil of exposure layer, more excellent distance are 3mil.
As further scheme of the invention: being needed between the optic module PCB panel hole and secondary dry film exposure layer
Keep the spacing of 0.3mil.
Compared with prior art, the beneficial effects of the present invention are:
The present invention by anti-etching photosensitive-ink and secondary dry film step, may be implemented plate lead attachment pad, via hole,
Route can promote product quality without over etching, avoid the over etching in traditional etching lead, lead to pcb board batch
The problem of property is scrapped.
Detailed description of the invention
Fig. 1 is the flow chart of a kind of method of optical module plate etched plate lead；
Fig. 2 is the structural schematic diagram of PVC board.
In figure: 1, outer-layer circuit；2, lead；3, anti-etching photosensitive-ink exposure layer；4, secondary dry film exposure layer；5, optical mode
Block pcb board part hole.
Specific embodiment
Please refer to Fig. 1~2, in the embodiment of the present invention, a kind of method of optical module plate etched plate lead, including it is following
Step:
1), the etching of acid etching dry film: on having finished drilling plating plank, dry film in pressure；Egative film is penetrated using exposure machine
Required image is transferred on dry film, then image work develops via chemicals, etches, the process of striping, needed for obtaining
Image line；The maintenance of route is finally done using A.O.I, completes the production of outer-layer circuit 1.
2), anti-plate gold photosensitive-ink: anti-plate gold photosensitive-ink is printed in the plate face for having made route, passes through exposure
Golden finger is exposed in development, and other positions lid oil, makees exposure-processed using exposure machine in plate.
3), UV solidifies: using UV lamp, irradiates plate face using ultraviolet light, keep plate face ink solidification more complete, increase ink
Binding force.
4) golden finger, is electroplated: by electroplating principle, the plated with nickel gold on golden finger.
5), anti-etching photosensitive-ink: printing anti-etching photosensitive-ink in the plate face for having made route, aobvious by exposing
Shadow exposes lead 2, and other positions lid oil, makees exposure-processed using exposure machine in plate.
6), secondary dry film: sticking upper 2.0 dry film again on the plank for having printed anti-etching photosensitive-ink, and exposing is drawn
Line 2, other positions lid oil, makees exposure-processed using exposure machine in plate.
7) it, alkali etching lead 2: carries out stinging erosion using the lead 2 that alkali etching liquid medicine comes out windowing.
8), anti-welding: in route ink for screen printing and exposure development.
Preferably, it in step 5) and step 6), respectively includes such as flowering structure: the outer-layer circuit 1 of optical mode plate pcb board part,
The anti-etching photosensitive-ink exposure of the lead 2, optical mode plate pcb board part made from the outer-layer circuit 1 of optical mode plate pcb board part
Layer 3, the secondary dry film exposure layer 4 of optical mode plate pcb board part and optic module PCB panel hole 5.
Preferably, the width of lead 2 is 5mil-9mil, and more excellent distance is 7mil.
Preferably, the windowing width of anti-etching photosensitive-ink exposure layer 3 is 0.7mil, is opened a window to the distance of outer-layer circuit 1
Distance for 2mil, and windowing to lead 2 is 0.3mil.
Preferably, the whole window size of secondary dry film exposure layer 4 is than the unilateral increasing of anti-etching photosensitive-ink exposure layer 3
2mil-4mil, more excellent distance are 3mil.
Preferably, need to keep the spacing of 0.3mil between optic module PCB panel hole 5 and secondary dry film exposure layer 4.
It is above-described, it is merely preferred embodiments of the present invention, but protection scope of the present invention is not limited to
This, anyone skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention
And its inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (6)
1. a kind of method of optical module plate etched plate lead, which comprises the following steps:
1), the etching of acid etching dry film: on having finished drilling plating plank, dry film in pressure；Egative film is penetrated by institute using exposure machine
The image needed is transferred on dry film, then image work develops via chemicals, etches, the process of striping, obtains required figure
As route；The maintenance that route is finally done using A.O.I, completes the production of outer-layer circuit.
2), anti-plate gold photosensitive-ink: printing anti-plate gold photosensitive-ink in the plate face for having made route, aobvious by exposing
Shadow exposes golden finger, and other positions lid oil, makees exposure-processed using exposure machine in plate.
3), UV solidifies: using UV lamp, irradiates plate face using ultraviolet light, keep plate face ink solidification more complete, increase the knot of ink
With joint efforts.
4) golden finger, is electroplated: by electroplating principle, the plated with nickel gold on golden finger.
5), anti-etching photosensitive-ink: anti-etching photosensitive-ink is printed in the plate face for having made route, passes through exposure development, dew
Lead out, other positions lid oil, makees exposure-processed using exposure machine in plate.
6), secondary dry film: sticking upper 2.0 dry film again on the plank for having printed anti-etching photosensitive-ink, exposes lead, plate
Interior other positions lid oil, makees exposure-processed using exposure machine.
7) it, alkali etching lead: carries out stinging erosion using the lead that alkali etching liquid medicine comes out windowing.
8), anti-welding: in route ink for screen printing and exposure development.
2. a kind of method of optical module plate etched plate lead according to claim 1, which is characterized in that in step 5)
With in step 6), respectively include such as flowering structure: the outer-layer circuit of optical mode plate pcb board part, from the outer-layer circuit of optical mode plate pcb board part
In make lead, the anti-etching photosensitive-ink exposure layer of optical mode plate pcb board part, optical mode plate pcb board part secondary dry film
Exposure layer and optic module PCB panel hole.
3. a kind of method of optical module plate etched plate lead according to claim 2, which is characterized in that the lead
Width be 5mil-9mil, more excellent distance be 7mil.
4. a kind of method of optical module plate etched plate lead according to claim 2, which is characterized in that described against corrosion
The windowing width for carving photosensitive-ink exposure layer is 0.7mil, and opening a window to the distance of outer-layer circuit is 2mil, and is opened a window to lead
Distance is 0.3mil.
5. a kind of method of optical module plate etched plate lead according to claim 2, which is characterized in that described secondary
Dry film exposure layer entirety window size is increasing 2mil-4mil more unilateral than anti-etching photosensitive-ink exposure layer, and more excellent distance is 3mil.
6. a kind of method of optical module plate etched plate lead according to claim 2, which is characterized in that the optical mode
Need to keep the spacing of 0.3mil between block pcb board part hole and secondary dry film exposure layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811205243.3A CN109348650A (en) | 2018-10-16 | 2018-10-16 | A kind of method of optical module plate etched plate lead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811205243.3A CN109348650A (en) | 2018-10-16 | 2018-10-16 | A kind of method of optical module plate etched plate lead |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109348650A true CN109348650A (en) | 2019-02-15 |
Family
ID=65309844
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811205243.3A Pending CN109348650A (en) | 2018-10-16 | 2018-10-16 | A kind of method of optical module plate etched plate lead |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109348650A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110687642A (en) * | 2019-09-26 | 2020-01-14 | 胜宏科技（惠州）股份有限公司 | Surface treatment method of high-speed optical module board |
| CN111372390A (en) * | 2020-03-16 | 2020-07-03 | 信泰电子（西安）有限公司 | Gold plating process |
| CN112203431A (en) * | 2020-10-28 | 2021-01-08 | 奥士康科技股份有限公司 | Two-stage grading golden finger manufacturing method |
| CN112752431A (en) * | 2020-11-12 | 2021-05-04 | 惠州市金百泽电路科技有限公司 | Processing method of printed plug PCB of high-speed photoelectric coupling module |
| CN112888177A (en) * | 2020-12-30 | 2021-06-01 | 信丰迅捷兴电路科技有限公司 | Manufacturing method of optical module board for 5G |
| CN114760760A (en) * | 2022-04-12 | 2022-07-15 | 胜宏科技（惠州）股份有限公司 | Double-sided lead drilling method for inner pull finger |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101309556A (en) * | 2008-07-08 | 2008-11-19 | 深圳崇达多层线路板有限公司 | Production method of circuit board having long and short golden finger |
| CN103237421A (en) * | 2013-04-26 | 2013-08-07 | 胜宏科技（惠州）股份有限公司 | PCB (printed circuit board) segmentation golden finger preparation method |
| CN103648241A (en) * | 2013-12-09 | 2014-03-19 | 深圳市深联电路有限公司 | Internal-arranged lead manufacturing technology of long and short printed plug circuit board |
| CN106455346A (en) * | 2016-09-06 | 2017-02-22 | 深圳崇达多层线路板有限公司 | Method for improving corrosion of non-plated PAD in lead etching |
| CN107318231A (en) * | 2017-07-20 | 2017-11-03 | 深圳明阳电路科技股份有限公司 | A kind of preparation method of golden finger, printed wiring board |
-
2018
- 2018-10-16 CN CN201811205243.3A patent/CN109348650A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101309556A (en) * | 2008-07-08 | 2008-11-19 | 深圳崇达多层线路板有限公司 | Production method of circuit board having long and short golden finger |
| CN103237421A (en) * | 2013-04-26 | 2013-08-07 | 胜宏科技（惠州）股份有限公司 | PCB (printed circuit board) segmentation golden finger preparation method |
| CN103648241A (en) * | 2013-12-09 | 2014-03-19 | 深圳市深联电路有限公司 | Internal-arranged lead manufacturing technology of long and short printed plug circuit board |
| CN106455346A (en) * | 2016-09-06 | 2017-02-22 | 深圳崇达多层线路板有限公司 | Method for improving corrosion of non-plated PAD in lead etching |
| CN107318231A (en) * | 2017-07-20 | 2017-11-03 | 深圳明阳电路科技股份有限公司 | A kind of preparation method of golden finger, printed wiring board |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110687642A (en) * | 2019-09-26 | 2020-01-14 | 胜宏科技（惠州）股份有限公司 | Surface treatment method of high-speed optical module board |
| CN110687642B (en) * | 2019-09-26 | 2021-10-01 | 胜宏科技（惠州）股份有限公司 | Surface treatment method of high-speed optical module board |
| CN111372390A (en) * | 2020-03-16 | 2020-07-03 | 信泰电子（西安）有限公司 | Gold plating process |
| CN112203431A (en) * | 2020-10-28 | 2021-01-08 | 奥士康科技股份有限公司 | Two-stage grading golden finger manufacturing method |
| CN112752431A (en) * | 2020-11-12 | 2021-05-04 | 惠州市金百泽电路科技有限公司 | Processing method of printed plug PCB of high-speed photoelectric coupling module |
| CN112752431B (en) * | 2020-11-12 | 2023-10-13 | 惠州市金百泽电路科技有限公司 | Processing method of printed plug PCB of high-speed photoelectric coupling module |
| CN112888177A (en) * | 2020-12-30 | 2021-06-01 | 信丰迅捷兴电路科技有限公司 | Manufacturing method of optical module board for 5G |
| CN114760760A (en) * | 2022-04-12 | 2022-07-15 | 胜宏科技（惠州）股份有限公司 | Double-sided lead drilling method for inner pull finger |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109348650A (en) | A kind of method of optical module plate etched plate lead | |
| CN104918421B (en) | A kind of production method of PCB golden fingers | |
| CN108174510A (en) | A kind of production method of grading connecting finger and optic module PCB plate comprising the golden finger | |
| CN206564726U (en) | The FPC with ultra fine-line that Novel dry film makes | |
| CN101351085B (en) | Preparation method of gold finger for circuit board | |
| CN102264194A (en) | Processing technique for sectional golden finger | |
| CN102647856A (en) | Method for producing COF (Chip on Film) flexible printed circuit board | |
| CN102638945A (en) | Method for producing goldfinger via twice electroplating | |
| CN104582319A (en) | Metallized semi-hole forming method and printed circuit board manufacturing method | |
| CN104812178B (en) | The production method of circuit board with sectional golden finger | |
| CN105960113A (en) | Golden finger plate processing technology | |
| CN102917540B (en) | Printed wiring board selectivity hole copper minimizing technology | |
| CN104661446A (en) | Circuit board processing method | |
| CN102006735A (en) | Method for manufacturing multilayer printed circuit board | |
| CN105764270A (en) | Manufacturing method of PCB possessing entire board electrolytic gold and golden finger surface processing | |
| CN104820535A (en) | Process for manufacturing single-layer multi-point capacitive touch screen with pure ITO membrane structure | |
| KR20070106669A (en) | Circuit board and the method of its fabrication | |
| CN105451454A (en) | Fabrication method of gold-plated finger board | |
| CN104684277A (en) | Method for manufacturing gold fingers of printed circuit board | |
| CN107222975B (en) | A kind of gradation etches the pattern-producing method of thick metal plated micro-strip plate | |
| CN105282985A (en) | Circuit board single-sided local gold plating method and circuit board | |
| CN109587938A (en) | A kind of processing method of ultrathin flexible wiring board | |
| CN109362179A (en) | A kind of novel die method | |
| CN110167272B (en) | Over-etching depth control method | |
| CN110049625A (en) | It is a kind of with gold-plated and immersion process PCB plate production method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190215 |