CN102917540B - Printed wiring board selectivity hole copper minimizing technology - Google Patents
Printed wiring board selectivity hole copper minimizing technology Download PDFInfo
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- CN102917540B CN102917540B CN201210396126.6A CN201210396126A CN102917540B CN 102917540 B CN102917540 B CN 102917540B CN 201210396126 A CN201210396126 A CN 201210396126A CN 102917540 B CN102917540 B CN 102917540B
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention provides a kind of printed wiring board selectivity hole copper minimizing technology, it comprises: machine drilling step, for being removed the protective layer that covers copper surface, hole, problem hole and/or can layer by machine drilling, and remove the partial hole copper on copper surface, hole, problem hole, and residual fraction hole copper; Step of membrane sticking, for pasting dry film on printed wiring board surface; Problem hole exposing step, for throwing off the PET protection film on dry film surface, and discloses out the dry film at the two ends of corresponding position, problem hole, thus exposes problem hole, and wherein said problem hole is the non-metallic hole being coated with hole copper; Acidic etching steps, for removing the residual partial hole copper in problem hole completely by acid etching; Washing and drying steps, for performing washing to printed wiring board, and carry out drying after washing, thus remove the residual liquid medicine of acidic etching steps; Dry film removal step, for taking off the dry film on printed wiring board surface.
Description
Technical field
The present invention relates to printed wiring board and manufacture field, more particularly, the present invention relates to a kind of printed wiring board selectivity hole copper minimizing technology.
Background technology
Plated-through hole (Plated Through Hole, PTH) and non-metallic hole (No Plated ThroughHole, NPTH) are two large common types of printed wiring board through hole, possess plated-through hole and non-metallic hole in most of printed wiring board simultaneously.
But, when manufacturing printed wiring board, due to the reason such as error of project data or technological operation, in the manufacturing process of printed wiring board, there will be the situation that indivedual non-metallic hole plates hole copper by mistake.And for the printed wiring board carrying out sequent surface process, the copper surface, hole of by mistake plating can cover again other protective layers and/or can layer.
In the prior art, in order to remove the hole copper in problems hole, mechanical hole reaming method can be passed through, by the protective layer on hole copper and its top layer and/or can once remove by layer; But for this method, only get out the hole more bigger than original aperture at problem hole place, guarantee thoroughly removes the layers of copper of hole wall; That is, the method can increase the aperture in non-metallic hole, affects aperture precision, and even can therefore cause scrapping of printed wiring board.
Therefore, it is desirable to provide a kind of can overcome existing machinery expanding method cause aperture increase not enough and realize the non-metallic hole of removing printed wiring board by mistake on the method for hole copper.
Summary of the invention
Technical problem to be solved by this invention is for there is above-mentioned defect in prior art, provide a kind of can overcome deficiency that existing machinery expanding method causes aperture to increase and realize removing the non-metallic hole of printed wiring board by mistake on the method for employing chemical method selective removal hole copper of hole copper.
According to the present invention, provide a kind of printed wiring board selectivity hole copper minimizing technology, it comprises: step of membrane sticking, for pasting dry film on printed wiring board surface; Problem hole exposing step, for throwing off polyester (Polyester, the PET) diaphragm on dry film surface, and discloses out the dry film at the two ends of corresponding position, problem hole, thus exposes problem hole, and wherein said problem hole is the NPTH hole being coated with hole copper; Acidic etching steps, for removing the residual partial hole copper in problem hole completely by acid etching; Washing and drying steps, for performing washing to printed wiring board, and carry out drying after washing, thus remove the residual liquid medicine of acidic etching steps; Dry film removal step, for taking off the dry film on printed wiring board surface.
Preferably; described printed wiring board selectivity hole copper minimizing technology also comprises: the machine drilling step performed before step of membrane sticking; for being removed the protective layer that covers copper surface, hole, problem hole and/or can layer by machine drilling; and remove the partial hole copper on copper surface, hole, problem hole, and residual fraction hole copper.
Preferably, copper surface, hole, problem hole protective layer and/or can layer comprises slicker solder layer, tin layers, nickel dam, layer gold, nickel-gold layer, NiPdAu layer, silver layer, organic guarantor weld rete.
Preferably; in machine drilling step; for problem hole setting drilling program; and with pin, printed wiring board is located; drill is adopted to hole to problem hole; between the effective aperture in bore diameter problem hole before surface treatment of wherein said drill and the design aperture, non-metallic hole in problem hole, guarantee the protective layer on copper surface, hole, problem hole thus and/or can remove completely by layer.
Preferably, in type printed wiring board, in step of membrane sticking, adopt and cut film vacuum film pressing method subsides dry film; For not shaping printed wiring board, in step of membrane sticking, note film vacuum film pressing method is adopted to paste dry film; The printed wiring board keeping away Copper treatment is not carried out for edge, plate face, in step of membrane sticking, paste protective tapes at the edges of boards of printed wiring board, and dry film removal step first removed protective tapes before being taken off by the protection dry film on printed wiring board surface.
Preferably, the protective tapes of employing is resistance to electroplating tape.
Preferably, acidic etching steps at DES(Develop-Etch-Strip, development-etching-stripping) the etching section of production line carries out.
Preferably, in washing and drying steps, perform and dry up and dry to carry out drying.
Preferably, described washing, dry up, the process of drying is positioned on same horizontal line.
By printed wiring board selectivity hole according to the present invention copper minimizing technology; the hole copper in non-metallic hole can be removed completely; and overcome the deficiency of the aperture increase that existing machinery expanding method causes; ensure that non-metallic hole precision is unaffected, effectively protect the plate face figure of printed wiring board.
Accompanying drawing explanation
By reference to the accompanying drawings, and by reference to detailed description below, will more easily there is more complete understanding to the present invention and more easily understand its adjoint advantage and feature, wherein:
Fig. 1 schematically shows the flow chart of printed wiring board selectivity hole copper minimizing technology according to the preferred embodiment of the invention.
It should be noted that, accompanying drawing is for illustration of the present invention, and unrestricted the present invention.
Embodiment
In order to make content of the present invention clearly with understandable, below in conjunction with specific embodiments and the drawings, content of the present invention is described in detail.
Fig. 1 schematically shows the flow chart of printed wiring board selectivity hole copper minimizing technology according to the preferred embodiment of the invention.
Specifically, as shown in Figure 1, printed wiring board selectivity hole copper minimizing technology comprises according to the preferred embodiment of the invention:
Machine drilling step S1: remove the protective layer that covers copper surface, hole, problem hole and/or can layer by machine drilling, and remove the partial hole copper on copper surface, hole, problem hole, and residual fraction hole copper; Specifically, remove a small amount of hole copper on copper surface, hole, problem hole, and residual most of hole copper.
Wherein, " problem hole " refers to the non-metallic hole being coated with hole copper.Further, wherein, the protective layer on the copper of hole or can layer comprises slicker solder layer, tin layers, nickel dam, layer gold, nickel-gold layer, NiPdAu layer, silver layer, organic guarantor weld film (OSP, Organic Solderability Preservatives) layer etc.
Specifically, such as, for problem hole setting drilling program, and with pin, printed wiring board can be located; The drill of suitable diameter is adopted to hole to problem hole; Between the effective aperture in bore diameter problem hole before surface treatment of described drill and the design aperture, non-metallic hole in problem hole, and can guarantee the protective layer on copper surface, hole and/or can remove by layer.
Step of membrane sticking S2: paste dry film on printed wiring board surface, so that other hole copper and the surfacial patterns except problem hole in baffle face, and preferably, pastes protecting glue and brings baffle limit.
Specifically, such as, in type printed wiring board, can adopt and cut film vacuum film pressing technique subsides dry film; For the printed wiring board in not shaping large plate face, note film vacuum film pressing technique is adopted to paste dry film.Preferably, do not carry out for edge, plate face the printed wiring board keeping away Copper treatment, need to paste protective tapes to protect at the edges of boards of printed wiring board, further preferably, the protective tapes of employing is resistance to electroplating tape (PVC).
Problem hole exposing step S3: the PET protection film throwing off dry film surface, and adopt the drill bit of suitable diameter to disclose out the dry film at the two ends of corresponding position, problem hole, thus expose problem hole.
Acidic etching steps S4: the residual partial hole copper being removed problem hole by acid etching completely.
Specifically, because two ends, problem hole are without dry film protection, so the partial hole copper remained can be made to be removed completely by etching solution.Such as, this step can be carried out in the etching section of DES production line.
More particularly, do not remove residual partial hole copper completely if once etched, then can increase etching number of times until the residual partial hole copper in problem hole is completely removed.
Washing and drying steps S5: perform washing (such as high-pressure washing) to printed wiring board, and carry out drying after washing, such as, perform and dry up and dry, thus remove the residual liquid medicine of acidic etching steps S4.
Specifically, for the situation performing the 4th step S4 at development production line, the washing of development production line etching section is normally insufficient, and do not dry up, dry design, so will further high-pressure washing be carried out to the printed wiring board of process and dry up, dry, remain to reach the liquid medicine thoroughly removed after the process of etching section.Preferably, described washing (such as high-pressure washing), dry up, the process of drying can be on same horizontal line.
Dry film removal step S6: when posting protective tapes, throws off the protective tapes being attached to edges of boards, and is taken off by the protection dry film on printed wiring board surface such as taking off on film line.
Thus, in printed wiring board selectivity hole copper minimizing technology according to the preferred embodiment of the invention, by above step can remove non-metallic hole by mistake on hole copper, and avoid the precision affecting non-metallic hole.Figure 1 shows that the implementation step example of printed wiring board selectivity hole copper minimizing technology according to the preferred embodiment of the invention.For the situation of not carrying out surface-treated printed wiring board, namely non-metallic hole surface only has the situation of copper, the method can skip machine drilling removing protective layer or/or can the step of layer, directly adopts to paste dry film protection and carry out chemical etching and remove hole copper by mistake; Or make machine drilling step only for removing partial hole copper, thus hole, the chemical etching problem hole copper time can be reduced.
By printed wiring board selectivity hole copper minimizing technology according to the preferred embodiment of the invention; the hole copper in non-metallic hole can be removed completely; and overcome the deficiency of the aperture increase that existing machinery expanding method causes; ensure that non-metallic hole precision is unaffected, effectively protect the plate face figure of printed wiring board.
Be understandable that, although the present invention with preferred embodiment disclose as above, but above-described embodiment and be not used to limit the present invention.For any those of ordinary skill in the art, do not departing under technical solution of the present invention ambit, the technology contents of above-mentioned announcement all can be utilized to make many possible variations and modification to technical solution of the present invention, or be revised as the Equivalent embodiments of equivalent variations.Therefore, every content not departing from technical solution of the present invention, according to technical spirit of the present invention to any simple modification made for any of the above embodiments, equivalent variations and modification, all still belongs in the scope of technical solution of the present invention protection.
Claims (4)
1. a printed wiring board selectivity hole copper minimizing technology, is characterized in that comprising:
Machine drilling step, for being removed the protective layer that covers copper surface, hole, problem hole and/or can layer by machine drilling, and removes the partial hole copper on copper surface, hole, problem hole, and residual fraction hole copper; Wherein, in machine drilling step, for problem hole setting drilling program, and with pin, printed wiring board is located, drill is adopted to carry out machine drilling to problem hole, between the effective aperture in bore diameter problem hole before surface treatment of described drill and the design aperture, non-metallic hole in problem hole; Wherein, copper surface, hole, problem hole protective layer and/or slicker solder layer, tin layers, nickel dam, layer gold, nickel-gold layer, NiPdAu layer, silver layer or organic guarantor can be comprised weld rete by layer;
Step of membrane sticking, for pasting dry film on printed wiring board surface; Wherein, in type printed wiring board, adopt and cut film vacuum film pressing method subsides dry film; For not shaping printed wiring board, note film vacuum film pressing method is adopted to paste dry film; The printed wiring board keeping away Copper treatment is not carried out for edge, plate face, pastes resistance to electroplating tape at the edges of boards of printed wiring board, and dry film removal step first removed resistance to electroplating tape before being taken off by the protection dry film on printed wiring board surface;
Problem hole exposing step, for throwing off the polyester diaphragm on dry film surface, and discloses out the dry film at the two ends in corresponding position, problem hole, thus exposes problem hole, and wherein said problem hole is the non-metallic hole being coated with hole copper;
Acidic etching steps, for removing the residual partial hole copper in problem hole completely by acid etching;
Washing and drying steps, for performing washing to printed wiring board, and carry out drying after washing, thus remove the residual liquid medicine of acidic etching steps;
Dry film removal step, for taking off the dry film on printed wiring board surface.
2. printed wiring board selectivity hole according to claim 1 copper minimizing technology, it is characterized in that, acidic etching steps carries out in the etching section of DES production line.
3. printed wiring board selectivity hole according to claim 1 and 2 copper minimizing technology, is characterized in that, in washing and drying steps, performs and dries up and dry to carry out drying.
4. printed wiring board selectivity hole according to claim 3 copper minimizing technology, it is characterized in that, the process drying up and dry is positioned on same horizontal line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210396126.6A CN102917540B (en) | 2012-10-17 | 2012-10-17 | Printed wiring board selectivity hole copper minimizing technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210396126.6A CN102917540B (en) | 2012-10-17 | 2012-10-17 | Printed wiring board selectivity hole copper minimizing technology |
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| Publication Number | Publication Date |
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| CN102917540A CN102917540A (en) | 2013-02-06 |
| CN102917540B true CN102917540B (en) | 2015-10-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210396126.6A Active CN102917540B (en) | 2012-10-17 | 2012-10-17 | Printed wiring board selectivity hole copper minimizing technology |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104640380B (en) * | 2013-11-13 | 2018-07-24 | 北大方正集团有限公司 | A kind of non-heavy copper hole with orifice ring and print circuit plates making method |
| CN105228349B (en) * | 2015-08-27 | 2018-07-31 | 深圳崇达多层线路板有限公司 | A method of improve without golden on copper hole |
| CN106358385A (en) * | 2016-08-31 | 2017-01-25 | 开平依利安达电子第三有限公司 | Printed circuit board processing method adopting etching process for forming backdrilled holes |
| CN109618500A (en) * | 2018-12-27 | 2019-04-12 | 广州兴森快捷电路科技有限公司 | Reparation detection method for semiconductor test board |
| CN111970848B (en) * | 2020-08-31 | 2024-04-09 | 深圳全成信电子有限公司 | Method for rapidly treating copper sticking in PCB hole |
| CN112672525B (en) * | 2020-11-12 | 2022-05-17 | 广州广合科技股份有限公司 | Treatment method for incomplete etching in PCB negative film process |
| CN113194620A (en) * | 2021-04-25 | 2021-07-30 | 珠海方正科技多层电路板有限公司 | Method for drilling non-metallized hole and printed circuit board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101533887A (en) * | 2009-04-13 | 2009-09-16 | 瀚宇博德科技（江阴）有限公司 | Method for manufacturing thermoelectric cell of bottom board of printed circuit board and structure thereof |
| CN102523703A (en) * | 2012-01-06 | 2012-06-27 | 汕头超声印制板公司 | Manufacturing method of back drill holes on PCB (Printed Circuit Board) |
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2012
- 2012-10-17 CN CN201210396126.6A patent/CN102917540B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101533887A (en) * | 2009-04-13 | 2009-09-16 | 瀚宇博德科技（江阴）有限公司 | Method for manufacturing thermoelectric cell of bottom board of printed circuit board and structure thereof |
| CN102523703A (en) * | 2012-01-06 | 2012-06-27 | 汕头超声印制板公司 | Manufacturing method of back drill holes on PCB (Printed Circuit Board) |
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| CN102917540A (en) | 2013-02-06 |
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