CN109362179A - A kind of novel die method - Google Patents
A kind of novel die method Download PDFInfo
- Publication number
- CN109362179A CN109362179A CN201811211320.6A CN201811211320A CN109362179A CN 109362179 A CN109362179 A CN 109362179A CN 201811211320 A CN201811211320 A CN 201811211320A CN 109362179 A CN109362179 A CN 109362179A
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- CN
- China
- Prior art keywords
- film
- dry film
- die
- punching
- gold
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The invention discloses a kind of novel die methods, are related to wiring board manufacture field, include the following steps: acid negative film dry film, anti-welding, punch die, change gold, molding, test and visually, negative film dry film acidity be finishing drilling plating plank on, dry film in pressure；Required image is transferred on dry film through egative film using exposure machine, image work is developed, etched and gone film process via chemicals again, required image line, finally utilizes A.O.I out, that is the production of outer-layer circuit is completed in the automated optical inspection maintenance of making route simultaneously.The information die method, using the way of punching die in flakes, both the other efficiency in ensure that gold station, it can avoid being easy board falling problem when platelet crosses pre-treatment again, and batch cutting edge of a knife or a sword technique and die process are removed compared to molding before more common alkali etching, this method largely reduces cost required for production, the production and processing suitable for medium-sized and small enterprises.
Description
Technical field
The present invention relates to wiring board manufacture field, specially a kind of novel die method.
Background technique
With the high speed development of electronic industry, increasingly higher demands are proposed to the miniaturization of wiring board, multifunction,
High density, multi-functional, miniaturization have become the developing direction of wiring board.Nowadays the component on wiring board is just increased with geometric index
Add, but route board size is constantly reducing, client needs to arrange in pairs or groups some small support plates often to inlay with cage plate.These small support plates are special
Point are as follows: the smaller, element sides of individual have entire row metallized semi-pore, as the daughter board of a motherboard, by these metallized semi-pores with
The pin of motherboard and component is welded together, and chip pin is fixed in the metallized semi-pore, is welded on motherboard together.
This mother baby plate is widely used in vehicle audio, computer, camera etc., small in size, and performance is good.Wherein, metallized semi-pore is
There is metal in finger-hole, and hole need to be milled to broken hole.It common are 1/2 metallized semi-pore, 1/3 metallized semi-pore.
Existing processing method include before alkali etching molding remove batch cutting edge of a knife or a sword technique and die process, wherein before alkali etching at
Type goes the process of batch cutting edge of a knife or a sword technique successively are as follows: next stop, positive dry film, graphic plating copper and tin, molding one, alkali etching, anti-welding, change
Gold, molding two, test, visual and packaging, this process flow have the disadvantage that first, production procedure is long, inefficiency,
Cost is excessively high；The second, molding fishing half bore uses 0.8mm milling cutter, and speed of production is slow, and is easy deviation；Third uses sky before etching
Alkalinity removal batch cutting edge of a knife or a sword is run, because dry film is intolerant to alkali etching liquid medicine, liquid medicine is easy to make the molten pine of dry film, causes route overetch；4th,
Use one fishing of molding empty in plate, plate support is few, and rear station is easy disconnected plate；5th, used one fishing of molding empty in plate, anti-solder paste
Black easy entry empty slot, leads to not rinse well, anti-solder ink is caused to remain；6th, if it is blind hole plate, also usually because of figure
The permeability of shape plating line electrotinning is insufficient, cause it is tin plating can not cover hole bottom, can not be protected after alkali etching blind
There is blind hole having no copper in the holes in Kong Kongtong after etching；The process flow of die process is successively are as follows: next stop, negative film dry film, acid erosion
It carves, is anti-welding, changing gold, punch die, test, visual and packaging, this kind of process flow has the disadvantage that first, surface treatment is laggard
Copper is revealed in row punch die, finished product half bore section；The second, it is bad to be easy Product jointing when client welds for half bore section dew copper；Third, visitor
If failing to weld tin in the use process of family, process is used because of potential difference problem, it will Jafani effect is generated, it is long and long
Easily become trust sexual abnormality, for this purpose, we have proposed a kind of novel die methods.
Summary of the invention
The technical problem to be solved by the present invention is to overcome the existing defects, provides a kind of novel die method, can be effective
Solve to propose that the prior art goes batch cutting edge of a knife or a sword technique using molding before alkali etching and die process is ineffective asks in background technique
Topic.
To achieve the above object, the invention provides the following technical scheme: a kind of novel die method, includes the following steps:
S1, negative film dry film & are acid；On having finished drilling plating plank, dry film in pressure；It will through egative film using exposure machine
Required image is transferred on dry film, then develops, etches and go film process for image work via chemicals, out required image
Route, finally utilizes A.O.I, i.e. the production of outer-layer circuit is completed in the automated optical inspection maintenance of making route simultaneously；
It is S2, anti-welding；In route silk-screen anti-solder ink and exposure development；
S3, punch die；Half hole site PCB is punched out using large-tonnage 120T hydraulic punch machine, leaves the connection between set
Point；
S4, change gold；Microetch processing is first carried out, can be disposed the capillary copper thorn of punching by microetch, then carry out surface
Change the processing of nickel gold；
S5, molding；Pcb board is cut into the shape of customer requirement；
S6, test；Open-short circuit is carried out to finished product；
S7, visually；Appearance detection is carried out to finished product.
As a preferred technical solution of the present invention, hydraulic punch machine rushes half hole site PCB in the step S3
It cuts, forms metallized semi-pore, the bridge crane point that the tie point left connects between set and set, after punching between set and set
Leaving punch die punching slot, set1, set2 and set3 at punching respectively, these three set connect into an active gage, and set
Jigsaw quantity can be depending on the size of set itself.
As a preferred technical solution of the present invention, hydraulic punch machine rushes half hole site PCB in the step S3
It cuts, the metallized semi-pore being punched, to its progress gold.
Compared with prior art, the beneficial effects of the present invention are: the information die method, using punching die in flakes
Way, not only ensure that gold was stood other efficiency, but also can avoid being easy board falling problem when platelet crosses pre-treatment, and compare
Batch cutting edge of a knife or a sword technique and die process are removed in molding before common alkali etching, this method largely reduce required for production at
This, the production and processing suitable for medium-sized and small enterprises.
Detailed description of the invention
Fig. 1 is flowage structure schematic block diagram of the invention；
Fig. 2 is metallized semi-pore plan view of the invention；
Fig. 3 is metallized semi-pore sectional view of the present invention.
In figure: 1, metallized semi-pore；2, bridge crane point；3, punch die is punched slot；4,set1；5,set2；6,set3；7, it metallizes
Half bore section.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Fig. 1-3 is please referred to, the present invention provides a kind of technical solution:
Referring to Fig. 1, a kind of novel die method, includes the following steps:
S1, negative film dry film & are acid；On having finished drilling plating plank, dry film in pressure；It will through egative film using exposure machine
Required image is transferred on dry film, then develops, etches and go film process for image work via chemicals, out required image
Route, finally utilizes A.O.I, i.e. the production of outer-layer circuit is completed in the automated optical inspection maintenance of making route simultaneously；
It is S2, anti-welding；In route silk-screen anti-solder ink and exposure development；
S3, punch die；Half hole site PCB is punched out using large-tonnage 120T hydraulic punch machine, leaves the connection between set
Point；
S4, change gold；Microetch processing is first carried out, can be disposed the capillary copper thorn of punching by microetch, then carry out surface
Change the processing of nickel gold；
S5, molding；Pcb board is cut into the shape of customer requirement；
S6, test；Open-short circuit is carried out to finished product；
S7, visually；Appearance detection is carried out to finished product.
Referring to Fig. 2, hydraulic punch machine is punched out half hole site PCB in step S3, metallized semi-pore 1 is formed, is left
The bridge crane point 2 that is connected between set and set of tie point, bridge crane point 2 is punch die residue link position, and designing can make in this way
Set is connect with set, avoids set size too small, and pre-treatment board falling when changing gold production leaves punching between set and set after punching
Stamping grooving 3 avoids rear processing procedure from generating copper face oxidation, influences so that punching disconnected section can smoothly change upper gold when subsequentization gold
Client uses, and set1, set2 and set3 at punching, these three set connect into an active gage respectively, with the subsequent life of convenience
It produces, set jigsaw quantity can not limit number depending on set size.
Referring to Fig. 3, hydraulic punch machine is punched out half hole site PCB in the step S3, the metallization being punched
Half bore section 7, to its progress gold, finished product is wrapped up on metallized semi-pore section 7 for nickel gold.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (3)
1. a kind of novel die method, characterized by the following steps:
S1, negative film dry film & are acid；On having finished drilling plating plank, dry film in pressure；It will be required through egative film using exposure machine
Image be transferred on dry film, then via chemicals by image work develop, etch and go film process, out needed for image line
Road, finally utilizes A.O.I, i.e. the production of outer-layer circuit is completed in the automated optical inspection maintenance of making route simultaneously；
It is S2, anti-welding；In route silk-screen anti-solder ink and exposure development；
S3, punch die；Half hole site PCB is punched out using large-tonnage 120T hydraulic punch machine, leaves the tie point between set；
S4, change gold；Microetch processing is first carried out, can be disposed the capillary copper thorn of punching by microetch, then carry out the change nickel on surface
Gold processing；
S5, molding；Pcb board is cut into the shape of customer requirement；
S6, test；Open-short circuit is carried out to finished product；
S7, visually；Appearance detection is carried out to finished product.
2. a kind of novel die method according to claim 1, in the step S3 hydraulic punch machine to half hole site PCB into
Row punching, forms metallized semi-pore, the bridge crane point that the tie point left connects between set and set, in set and set after punching
Between leave punch die punching slot, set1, set2 and set3 at punching, these three set connect into an active gage respectively, and
The jigsaw quantity of set can be depending on the size of set itself.
3. a kind of novel die method according to claim 2, it is characterised in that: hydraulic punch machine pair in the step S3
Half hole site PCB is punched out, the metallized semi-pore being punched, to its progress gold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811211320.6A CN109362179A (en) | 2018-10-17 | 2018-10-17 | A kind of novel die method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811211320.6A CN109362179A (en) | 2018-10-17 | 2018-10-17 | A kind of novel die method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109362179A true CN109362179A (en) | 2019-02-19 |
Family
ID=65345635
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811211320.6A Pending CN109362179A (en) | 2018-10-17 | 2018-10-17 | A kind of novel die method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109362179A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112654176A (en) * | 2020-12-08 | 2021-04-13 | 深圳市祺利电子有限公司 | Method for manufacturing metallized semi-hole of circuit board |
| CN112839437A (en) * | 2020-12-31 | 2021-05-25 | 广州金升阳科技有限公司 | Double-sided plastic package power supply product |
| CN114667001A (en) * | 2020-12-24 | 2022-06-24 | 深南电路股份有限公司 | Circuit board hole inner processing method and circuit board |
| CN118555753A (en) * | 2024-07-25 | 2024-08-27 | 丰顺县锦顺科技有限公司 | PCB half-hole plate processing device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0242789A (en) * | 1988-08-01 | 1990-02-13 | Matsushita Electric Ind Co Ltd | Manufacture of printed-wiring board |
| CN105007683A (en) * | 2015-07-03 | 2015-10-28 | 深圳市景旺电子股份有限公司 | Method for no-glass-cloth ceramic high-frequency PCB plate edge metallization |
| CN106132098A (en) * | 2016-06-30 | 2016-11-16 | 浙江罗奇泰克电子有限公司 | A kind of manufacture method of LED metal base circuit board |
| US20170110390A1 (en) * | 2014-03-26 | 2017-04-20 | Heraeus Deutschland GmbH & Co. KG | Support and/or clip for semiconductor elements, semiconductor component, and production method |
-
2018
- 2018-10-17 CN CN201811211320.6A patent/CN109362179A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0242789A (en) * | 1988-08-01 | 1990-02-13 | Matsushita Electric Ind Co Ltd | Manufacture of printed-wiring board |
| US20170110390A1 (en) * | 2014-03-26 | 2017-04-20 | Heraeus Deutschland GmbH & Co. KG | Support and/or clip for semiconductor elements, semiconductor component, and production method |
| CN105007683A (en) * | 2015-07-03 | 2015-10-28 | 深圳市景旺电子股份有限公司 | Method for no-glass-cloth ceramic high-frequency PCB plate edge metallization |
| CN106132098A (en) * | 2016-06-30 | 2016-11-16 | 浙江罗奇泰克电子有限公司 | A kind of manufacture method of LED metal base circuit board |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112654176A (en) * | 2020-12-08 | 2021-04-13 | 深圳市祺利电子有限公司 | Method for manufacturing metallized semi-hole of circuit board |
| CN112654176B (en) * | 2020-12-08 | 2022-02-15 | 深圳市祺利电子有限公司 | Method for manufacturing metallized semi-hole of circuit board |
| CN114667001A (en) * | 2020-12-24 | 2022-06-24 | 深南电路股份有限公司 | Circuit board hole inner processing method and circuit board |
| CN112839437A (en) * | 2020-12-31 | 2021-05-25 | 广州金升阳科技有限公司 | Double-sided plastic package power supply product |
| WO2022143735A1 (en) * | 2020-12-31 | 2022-07-07 | 广州金升阳科技有限公司 | Double-sided plastic package power supply product |
| CN118555753A (en) * | 2024-07-25 | 2024-08-27 | 丰顺县锦顺科技有限公司 | PCB half-hole plate processing device |
| CN118555753B (en) * | 2024-07-25 | 2024-09-27 | 丰顺县锦顺科技有限公司 | PCB half-hole plate processing device |
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Application publication date: 20190219 |