CN102264194A - Processing technique for sectional golden finger - Google Patents
Processing technique for sectional golden finger Download PDFInfo
- Publication number
- CN102264194A CN102264194A CN2010101823417A CN201010182341A CN102264194A CN 102264194 A CN102264194 A CN 102264194A CN 2010101823417 A CN2010101823417 A CN 2010101823417A CN 201010182341 A CN201010182341 A CN 201010182341A CN 102264194 A CN102264194 A CN 102264194A
- Authority
- CN
- China
- Prior art keywords
- golden finger
- layer circuit
- sectional
- circuit plate
- sectional golden
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention discloses a processing technique for a sectional golden finger. The processing technique for the sectional golden finger comprises the following steps of: directly pressing a photoreceptive wet film on a drilled and electroplated outer circuit board, aerating and developing to electroplate the sectional golden finger at one time, manufacturing outer circuits, and then carrying out subsequent steps such as solder welding, writing, gold smelting and the like. The whole processing process is simple and easy, the production efficiency is improved; and the processed sectional golden finger has good quality.
Description
Technical field
The present invention relates to the manufacture craft improvement of a kind of printed circuit board (PCB) (PCB), specifically relate to a kind of manufacture method of golden finger.
Background technology
Printed circuit board (PCB) (PCB) is the important electron parts, is the supplier that electronic devices and components are electrically connected.Two PCB to be interconnected, usually adopt edge connector (edge connector) to carry out, this edge connector industry slang is golden finger (connecting finger), when connecting usually, the golden finger of a PCB is inserted in the slot of another piece PCB, in computer, for example, video card, sound card, RAM (random access memory) card etc. are connected with motherboard by golden finger.
Golden finger is made up of numerous flavous conductive contact blades, because of its surface gold-plating and conductive contact blade are arranged as finger-shaped, so be called " golden finger ".Golden finger is actually in copper-clad plate and is covered with one deck gold again by special process, because the non-oxidizability of gold is extremely strong, and conductibility is also very strong.
Defectives such as the processing method ubiquity processed complex of some sectional golden fingers that present stage adopts, process-cycle length, cost height.
Summary of the invention
In order to overcome above-mentioned defective, the invention provides a kind of processing technology of sectional golden finger, the processing technology of this sectional golden finger is simple to operation, can enhance productivity, and the sectional golden finger quality better that processes.
The present invention for the technical scheme that solves its technical problem and adopt is:
A kind of processing technology of sectional golden finger comprises the steps:
1., on the outer-layer circuit plate after the plating, press photosensitive type wet film and exposure;
2., need gold-plated part to develop out sectional golden finger, all the other copper faces except that golden finger and segmentation place of golden finger are covered by wet film;
3., the golden finger position of developing is carried out gold-plated, make sectional golden finger;
The pressure photosensitive type wet film of 4., 1. step being pressed divests;
5., on the outer-layer circuit plate, press dry film, and exposure, with except all the other copper faces beyond layer line road and the golden finger expose;
6., the naked copper etching that will be covered by dry film removes, and makes outer-layer circuit.
Further technical scheme of the present invention is:
Step is carried out outer-layer circuit scanning detection, welding resistance, literal and change gold after 6. outer-layer circuit completes again successively.
Earlier the outer-layer circuit plate is holed, again the outer-layer circuit plate is electroplated, make outer-layer circuit plate surface and hole wall cover copper, carry out step 1. then.
Described sectional golden finger is the two-part golden finger.
The invention has the beneficial effects as follows: the present invention directly presses the photosensitive type wet film on the outer-layer circuit plate after the plating, after exposure and developing, the disposable sectional golden finger of electroplating out, carry out the making of outer-layer circuit again, and then carry out steps such as follow-up welding resistance, literal and change gold, the whole course of processing is simple to operation, has improved production efficiency, and the sectional golden finger quality better that processes.
Embodiment
Embodiment: a kind of processing technology of two-part golden finger, undertaken by following step:
Outer-layer circuit plate holed, again the outer-layer circuit plate is electroplated, make outer-layer circuit plate surface and hole wall cover copper, on the outer-layer circuit plate after the plating, press photosensitive type wet film and exposure then 1., earlier;
2., need gold-plated part to develop out the two-part golden finger, all the other copper faces except that golden finger and segmentation place of golden finger are covered by wet film;
3., the golden finger position of developing is carried out gold-plated, make the two-part golden finger;
The pressure photosensitive type wet film of 4., 1. step being pressed divests;
5., on the outer-layer circuit plate, press dry film, and exposure, with except all the other copper faces beyond layer line road and the golden finger expose;
6., the naked copper etching that will be covered by dry film removes, and makes outer-layer circuit, after outer-layer circuit completes, carries out outer-layer circuit scanning detection, welding resistance, literal and change gold more successively.
Claims (4)
1. the processing technology of a sectional golden finger is characterized in that, comprises the steps:
1., on the outer-layer circuit plate after the plating, press photosensitive type wet film and exposure;
2., need gold-plated part to develop out sectional golden finger, all the other copper faces except that golden finger and segmentation place of golden finger are covered by wet film;
3., the golden finger position of developing is carried out gold-plated, make sectional golden finger;
The pressure photosensitive type wet film of 4., 1. step being pressed divests;
5., on the outer-layer circuit plate, press dry film, and exposure, with except all the other copper faces beyond layer line road and the golden finger expose;
6., the naked copper etching that will be covered by dry film removes, and makes outer-layer circuit.
2. the processing technology of sectional golden finger according to claim 1 is characterized in that: step is carried out outer-layer circuit scanning detection, welding resistance, literal and change gold after 6. outer-layer circuit completes again successively.
3. the processing technology of sectional golden finger according to claim 1 is characterized in that: earlier the outer-layer circuit plate is holed, the outer-layer circuit plate is electroplated again, make outer-layer circuit plate surface and hole wall cover copper, carry out step 1. then.
4. according to the processing technology of the described sectional golden finger of one of claim 1 to 3, it is characterized in that: described sectional golden finger is the two-part golden finger.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101823417A CN102264194A (en) | 2010-05-25 | 2010-05-25 | Processing technique for sectional golden finger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101823417A CN102264194A (en) | 2010-05-25 | 2010-05-25 | Processing technique for sectional golden finger |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102264194A true CN102264194A (en) | 2011-11-30 |
Family
ID=45010576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101823417A Pending CN102264194A (en) | 2010-05-25 | 2010-05-25 | Processing technique for sectional golden finger |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102264194A (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013107199A1 (en) * | 2012-01-19 | 2013-07-25 | 华为技术有限公司 | Golden finger and plate edge interconnection device |
| CN103237421A (en) * | 2013-04-26 | 2013-08-07 | 胜宏科技（惠州）股份有限公司 | PCB (printed circuit board) segmentation golden finger preparation method |
| CN104470233A (en) * | 2014-11-21 | 2015-03-25 | 广州杰赛科技股份有限公司 | Printed wiring board containing gold at different thicknesses and manufacturing method thereof |
| CN104812178A (en) * | 2015-03-27 | 2015-07-29 | 深圳市五株科技股份有限公司 | Manufacturing method for circuit board with segmented metal pin |
| CN105163500A (en) * | 2015-09-01 | 2015-12-16 | 胜宏科技（惠州）股份有限公司 | Method for completely eradicating lead residues at golden finger subsection positions of sectional high-frequency connector |
| CN107645831A (en) * | 2017-09-20 | 2018-01-30 | 广合科技（广州）有限公司 | One kind segmentation I-shaped graphical design method of golden finger |
| CN108174510A (en) * | 2017-12-29 | 2018-06-15 | 深圳欣强智创电路板有限公司 | A kind of production method of grading connecting finger and optic module PCB plate comprising the golden finger |
| CN108235590A (en) * | 2017-12-29 | 2018-06-29 | 深圳欣强智创电路板有限公司 | A kind of golden grading connecting finger optic module PCB production method of plate internalization |
| CN108463058A (en) * | 2018-04-16 | 2018-08-28 | 惠州市纬德电路有限公司 | A kind of production technology of staged golden finger pcb board |
| CN111050491A (en) * | 2019-12-19 | 2020-04-21 | 广州兴森快捷电路科技有限公司 | Leadless four-side gold-coating process manufacturing method |
| CN112203431A (en) * | 2020-10-28 | 2021-01-08 | 奥士康科技股份有限公司 | Two-stage grading golden finger manufacturing method |
| CN113115520A (en) * | 2021-03-02 | 2021-07-13 | 广州广合科技股份有限公司 | Manufacturing method of high-order HDI (high Density interconnection) grading golden finger printing plate |
| CN114340218A (en) * | 2021-12-29 | 2022-04-12 | 江苏苏杭电子有限公司 | Manufacturing method of second-order HDI multilayer circuit board containing loop type dense circuit |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101355856A (en) * | 2008-08-13 | 2009-01-28 | 东莞生益电子有限公司 | Method for preparing hierarchical and grading gold finger plate using method of selecting wet film |
-
2010
- 2010-05-25 CN CN2010101823417A patent/CN102264194A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101355856A (en) * | 2008-08-13 | 2009-01-28 | 东莞生益电子有限公司 | Method for preparing hierarchical and grading gold finger plate using method of selecting wet film |
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013107199A1 (en) * | 2012-01-19 | 2013-07-25 | 华为技术有限公司 | Golden finger and plate edge interconnection device |
| US9699901B2 (en) | 2012-01-19 | 2017-07-04 | Huawei Technologies Co., Ltd. | Golden finger and board edge interconnecting device |
| CN103237421A (en) * | 2013-04-26 | 2013-08-07 | 胜宏科技（惠州）股份有限公司 | PCB (printed circuit board) segmentation golden finger preparation method |
| CN103237421B (en) * | 2013-04-26 | 2016-08-10 | 胜宏科技（惠州）股份有限公司 | A kind of PCB segmentation golden finger preparation method |
| CN104470233A (en) * | 2014-11-21 | 2015-03-25 | 广州杰赛科技股份有限公司 | Printed wiring board containing gold at different thicknesses and manufacturing method thereof |
| CN104812178B (en) * | 2015-03-27 | 2019-12-03 | 深圳市五株科技股份有限公司 | The production method of circuit board with sectional golden finger |
| CN104812178A (en) * | 2015-03-27 | 2015-07-29 | 深圳市五株科技股份有限公司 | Manufacturing method for circuit board with segmented metal pin |
| CN105163500A (en) * | 2015-09-01 | 2015-12-16 | 胜宏科技（惠州）股份有限公司 | Method for completely eradicating lead residues at golden finger subsection positions of sectional high-frequency connector |
| CN105163500B (en) * | 2015-09-01 | 2018-06-26 | 胜宏科技（惠州）股份有限公司 | One kind prevents to be segmented the high frequency connectors golden finger segmentation remaining method of position lead |
| CN107645831A (en) * | 2017-09-20 | 2018-01-30 | 广合科技（广州）有限公司 | One kind segmentation I-shaped graphical design method of golden finger |
| CN108174510A (en) * | 2017-12-29 | 2018-06-15 | 深圳欣强智创电路板有限公司 | A kind of production method of grading connecting finger and optic module PCB plate comprising the golden finger |
| CN108235590A (en) * | 2017-12-29 | 2018-06-29 | 深圳欣强智创电路板有限公司 | A kind of golden grading connecting finger optic module PCB production method of plate internalization |
| CN108463058A (en) * | 2018-04-16 | 2018-08-28 | 惠州市纬德电路有限公司 | A kind of production technology of staged golden finger pcb board |
| CN108463058B (en) * | 2018-04-16 | 2022-03-29 | 惠州市纬德电路有限公司 | Production process of stepped gold finger PCB |
| CN111050491A (en) * | 2019-12-19 | 2020-04-21 | 广州兴森快捷电路科技有限公司 | Leadless four-side gold-coating process manufacturing method |
| CN111050491B (en) * | 2019-12-19 | 2021-07-20 | 广州兴森快捷电路科技有限公司 | Leadless four-side gold-coating process manufacturing method |
| CN112203431A (en) * | 2020-10-28 | 2021-01-08 | 奥士康科技股份有限公司 | Two-stage grading golden finger manufacturing method |
| CN113115520A (en) * | 2021-03-02 | 2021-07-13 | 广州广合科技股份有限公司 | Manufacturing method of high-order HDI (high Density interconnection) grading golden finger printing plate |
| CN114340218A (en) * | 2021-12-29 | 2022-04-12 | 江苏苏杭电子有限公司 | Manufacturing method of second-order HDI multilayer circuit board containing loop type dense circuit |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102264194A (en) | Processing technique for sectional golden finger | |
| CN100591197C (en) | Method for preparing hierarchical and grading gold finger plate using method of selecting wet film | |
| WO2015085933A1 (en) | Method for manufacturing leadless printed circuit board locally plated with hard gold | |
| CN104918421B (en) | A kind of production method of PCB golden fingers | |
| CN107567196B (en) | Method for manufacturing top nickel-palladium-gold and bottom hard gold plate | |
| US20090095508A1 (en) | Printed circuit board and method for manufacturing the same | |
| CN110402020B (en) | Flexible printed circuit board and manufacturing method thereof | |
| CN108738241A (en) | The production method of circuit board and its circuit board obtained | |
| JP2000353760A (en) | Manufacture of semiconductor device mounting relay board | |
| CN105764270A (en) | Manufacturing method of PCB possessing entire board electrolytic gold and golden finger surface processing | |
| US20130029500A1 (en) | Connector and fabrication method thereof | |
| US6632343B1 (en) | Method and apparatus for electrolytic plating of surface metals | |
| CN102111964B (en) | Method for manufacturing circuit board | |
| CN109769344A (en) | The manufacturing method of circuit board and the circuit board | |
| CN104023483A (en) | Gold finger three-surface plating method | |
| CN103731995A (en) | Leadless gold plating package substrate and manufacturing method thereof | |
| JP2011086681A (en) | Method of manufacturing printed board | |
| US20080010822A1 (en) | Method for increasing a production rate of printed wiring boards | |
| CN104684277A (en) | Method for manufacturing gold fingers of printed circuit board | |
| US7534145B1 (en) | Design and method for plating PCI express (PCIE) edge connector | |
| CN114980562A (en) | Manufacturing method of pure tin plated plate, PCB and terminal equipment | |
| CN102065641B (en) | Production method of circuit board | |
| CN102076181A (en) | Manufacturing method of graded golden finger | |
| CN103037625B (en) | With chip window printed substrate remove short-circuiting method | |
| CN115474350A (en) | Circuit board surface treatment method and gold finger manufacturing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20111130 |