CN100591197C - Method for preparing hierarchical and grading gold finger plate using method of selecting wet film - Google Patents
Method for preparing hierarchical and grading gold finger plate using method of selecting wet film Download PDFInfo
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- CN100591197C CN100591197C CN 200810142426 CN200810142426A CN100591197C CN 100591197 C CN100591197 C CN 100591197C CN 200810142426 CN200810142426 CN 200810142426 CN 200810142426 A CN200810142426 A CN 200810142426A CN 100591197 C CN100591197 C CN 100591197C
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Abstract
The invention relates to a method for manufacturing a sectional and segmented gold fingerplate by a selective wet membrane method, comprising the following: a step of resistance welding, in which thegold fingerplate is subjected to resistance welding; a step of selecting a wet membrane, in which the wet membrane is selected to protect the sectional and segmented position of the gold fingerplate;a step of microetching, in which the copper surface of the gold fingerplate is microetched; a step of plating a gold finger, in which the gold fingers except the sectional and segmented position is gilded; a step of removing the selective wet membrane; and a step of etching for the second time, in which an attach tape is adopted to protect the copper surface of the gold fingerplate, and the sectional and segmented positions of the gold finger are etched. The method manufactures the sectional and segmented gold fingerplate by the selective wet membrane method, is used for removing plating leadwires, has easily controlled production process, and has low distortion rate of the signal and high accuracy when a client uses the method on a core network.
Description
Technical field
The present invention relates to printed circuit board and make the field, relate in particular to a kind of method of selecting the wet film legal system to make classification, segmentation gold finger plate that adopts.
Background technology
Printed circuit board (PCB) (PCB) is the important electron parts, is the supplier that electronic devices and components are electrically connected.Two PCB to be linked mutually, usually adopt edge connector (edge connector) to carry out, this edge connector industry slang is a golden finger, when usually connecting, the golden finger of a PCB is wherein injected on the slot on another sheet PCB, be generally expansion slot (Slot), in computer, for example, display card, sound card, RAM (random access memory) card etc. are connected with motherboard by golden finger.
Present stage, carry out classification in the industry, the segmentation golden finger mainly contains internal layer leads method, secondary drilling method several methods such as (removal middle leads), these class methods are not easy that operation, operability are strong, precision is low, signal distortion rate is high.
Summary of the invention
The object of the present invention is to provide a kind of method of selecting the wet film legal system to make classification, segmentation gold finger plate that adopts, its lead-in wire of using when selecting the wet film method with gold finger galvanizing removes, and makes production process control easily, and signal distortion rate is low, the precision height.
For achieving the above object, the invention provides a kind of method of selecting the wet film legal system to make classification, segmentation gold finger plate that adopts, comprise the steps:
Step 1: welding resistance, gold finger plate is carried out welding resistance;
Step 2: select wet film, adopt in classification, the segmentation position of gold finger plate and select wet film to protect;
Step 3: microetch, the copper face of gold finger plate is carried out microetch;
Step 4: gold-plated finger, carry out gold-plated to the golden finger beyond classification, the segmentation position;
Step 5: the selection wet film of decorporating;
Step 6: second etch, adopt the copper face of the protection gold finger plate of taping, classification, the segmentation position of golden finger etched.
Beneficial effect of the present invention: make classification, segmentation golden finger by selecting the wet film legal system, be used to remove electroplate lead wire, production process is controlled easily, and the client is on core net in the application process, and signal distortion rate is low, the precision height, precision can be controlled in+/-2mil in.
In order further to understand feature of the present invention and technology contents, see also following about detailed description of the present invention and accompanying drawing, yet appended graphic only provide with reference to and the explanation usefulness, be not to be used for the present invention is limited.
Description of drawings
Below in conjunction with accompanying drawing,, will make technical scheme of the present invention and other beneficial effects apparent by the specific embodiment of the present invention is described in detail.
In the accompanying drawing,
The flow chart that Fig. 1 selects the wet film legal system to make the method for classification, segmentation gold finger plate for the present invention adopts.
Embodiment
Describe the present invention below in conjunction with accompanying drawing.
As shown in Figure 1, the present invention adopts the method for selecting the wet film legal system to make classification, segmentation gold finger plate, comprises the steps:
Step 1: welding resistance, gold finger plate is carried out welding resistance; Welding resistance plays insulating effect, prevents short circuit in welding process.
Step 2: select wet film, adopt in classification, the segmentation position of gold finger plate and select wet film to protect; The classification of described golden finger, segmentation position are the power supply lead-in wire of golden finger; adopt the protection of selection wet film for classification, the segmentation position of golden finger; when avoiding gold finger galvanizing, power supply lead-in wire is by gold-plated and be difficult for being removed, and described selection wet film adopts light-curable ink; it is little that it has retractility; the characteristics that precision is good, by making after silk-screen → preliminary drying → exposure → development, also can be by increasing contraposition pad (PAD); increase exposure film aligning accuracy, improve classification, segmentation positional precision.
Step 3: microetch, the copper face of gold finger plate is carried out microetch; Cancellation nog plate flow process, the microetch process can be removed the oxide layer of copper face, obtains clean coarse copper face, so that gold-plated operation.
Step 4: gold-plated finger; Control rate and electric current in the gold-plated process carry out the golden finger beyond classification, the segmentation position gold-plated.
Step 5: the selection wet film of decorporating.
Step 6: second etch, adopt the copper face of the protection gold finger plate of taping, classification, the segmentation position of golden finger etched, the lead-in wire of using in the time of can be with gold finger galvanizing etches away, thereby removes this lead-in wire.
Classification, the segmentation gold finger plate of the present invention by selecting the wet film method to make is used to remove electroplate lead wire, and production process is controlled easily, and the client is on core net in the application process, and signal distortion rate is low, the precision height, precision can be controlled at ± 2mil in.
The above; for the person of ordinary skill of the art; can make other various corresponding changes and distortion according to technical scheme of the present invention and technical conceive, and all these changes and distortion all should belong to the protection range of accompanying Claim of the present invention.
Claims (3)
1, a kind of method of selecting the wet film legal system to make classification, segmentation gold finger plate that adopts is characterized in that, comprises the steps:
Step 1: welding resistance, gold finger plate is carried out welding resistance;
Step 2: select wet film, adopt in classification, the segmentation position of gold finger plate and select wet film to protect;
Step 3: microetch, the copper face of gold finger plate is carried out microetch;
Step 4: gold-plated finger, carry out gold-plated to the golden finger beyond classification, the segmentation position;
Step 5: the selection wet film of decorporating;
Step 6: second etch, adopt the copper face of the protection gold finger plate of taping, classification, the segmentation position of golden finger etched.
2, employing as claimed in claim 1 selects the wet film legal system to make the method for classification, segmentation gold finger plate, it is characterized in that, the classification of described golden finger, segmentation position are the power supply lead-in wire of golden finger.
3, employing as claimed in claim 1 selects the wet film legal system to make the method for classification, segmentation gold finger plate, it is characterized in that described selection wet film adopts light-curable ink, makes by silk-screen, preliminary drying, exposure and after developing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810142426 CN100591197C (en) | 2008-08-13 | 2008-08-13 | Method for preparing hierarchical and grading gold finger plate using method of selecting wet film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810142426 CN100591197C (en) | 2008-08-13 | 2008-08-13 | Method for preparing hierarchical and grading gold finger plate using method of selecting wet film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101355856A CN101355856A (en) | 2009-01-28 |
| CN100591197C true CN100591197C (en) | 2010-02-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 200810142426 Active CN100591197C (en) | 2008-08-13 | 2008-08-13 | Method for preparing hierarchical and grading gold finger plate using method of selecting wet film |
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| CN (1) | CN100591197C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101841977A (en) * | 2010-05-28 | 2010-09-22 | 淳华科技(昆山)有限公司 | Broken-line etching design method of soft printed circuit board electroplating lead |
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-
2008
- 2008-08-13 CN CN 200810142426 patent/CN100591197C/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101841977A (en) * | 2010-05-28 | 2010-09-22 | 淳华科技(昆山)有限公司 | Broken-line etching design method of soft printed circuit board electroplating lead |
| CN101841977B (en) * | 2010-05-28 | 2012-02-22 | 淳华科技(昆山)有限公司 | Broken-line etching design method of soft printed circuit board gold-electroplating lead |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101355856A (en) | 2009-01-28 |
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Address after: 523127 Dongcheng District City, Guangdong province (with sand) science and Technology Industrial Park Road, No. 33 vibration with the number of Patentee after: Shengyi electronic Limited by Share Ltd Address before: 413 No. 523039 Guangdong province Dongguan City Wanjiang Wando spike Avenue Patentee before: Dongguan Shengyi Electronics Ltd. |