CN102958280B - Method for gold-plating sectional gold fingers - Google Patents
Method for gold-plating sectional gold fingers Download PDFInfo
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- CN102958280B CN102958280B CN201110248179.9A CN201110248179A CN102958280B CN 102958280 B CN102958280 B CN 102958280B CN 201110248179 A CN201110248179 A CN 201110248179A CN 102958280 B CN102958280 B CN 102958280B
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- golden finger
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Abstract
The invention discloses a method for gold-plating sectional gold fingers. The method includes the steps: S01, making an in-board figure and a sectional gold finger figure; S02, gold-plating gold fingers; S03, depositing a copper layer on the whole surface of a circuit board; S04, setting anti-plating ink parts at joints of the gold fingers; S05, attaching blue glue to non-plating areas to expose the sectional gold fingers, and removing the deposited copper layer on the sectional gold fingers; S06, using the copper layer covered with the blue glue as a conductive layer, and gold-plating the sectional gold fingers; S07, removing the anti-plating ink at the joints of the sectional gold fingers; and S08, removing the residual copper layer on the circuit board. The problem that short circuit and residual copper easily occur to the sectional gold fingers at present can be solved by the use of the method.
Description
Technical field
The present invention relates to the processing technology of wiring board, particularly relate to a kind of gold plating method of segmentation golden finger.
Background technology
Increasing client introduces Microtea association criterion general in the world in communication system design at present, adopts segmentation golden finger mode to separate, electric current integrated for Circuits System and signal as a universal standard part of subsequent wideband product design.
The feature of segmentation golden finger is, the gold-plated finger network that each root is complete, is be made up of the golden finger of two sections of different length; This design is at the early-stage at home, current domestic general work flow first forms all figures by first time outer graphics in the circuit board with first time outer etching, wherein golden finger part is made as complete unsegmented golden finger, and produces glodclad wire and make golden finger be connected to auxiliary copper bound; Then first time welding resistance exposure imaging is carried out to wiring board, make figure solidification on wiring board; Then carry out second time welding resistance in golden finger area local, print plating resist bronze ink, the plating resist bronze ink of reservation glodclad wire and golden finger segmentation place during exposure imaging, exposing needs to carry out gold-plated region and carries out gold-plated; Second time outer graphics and second time outer etching is finally adopted the layers of copper at golden finger segmentation place and glodclad wire place to be etched away.
In this processing technology, need employing twice outer graphics, twice outer etching, twice welding resistance exposure imaging technique to complete the making of segmentation golden finger.Technological process is long, complex process, in addition, the difficult point of this technique is: because the spacing of golden finger segmentation place generally only has about 0.2mm, in second time welding resistance exposure imaging process, plating resist bronze ink herein and copper face adhesion not firm, easily there is falling plating resist ink, herein can plated with gold and the golden finger that should be divided into two sections is linked together when causing gold-plated, there is the situation of short circuit.Simultaneously because the spacing of this segmentation place is too little, in the etching of last second time skin, also easily occur that etching does not cause segmentation place to leave remaining copper only.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of gold plating method of segmentation golden finger, solves current processing process long, complex process, and easily occurs short circuit and leave the problem of remaining copper.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: the gold plating method providing a kind of segmentation golden finger, comprises step:
Step 1: make figure and segmentation golden finger figure in ejecting plate;
Step 2: the gold-plated process of golden finger, and the gold-plated treatment step of described golden finger specifically comprises:
S03: the layers of copper in wiring board whole plate surface deposition a layer thickness being 0.3 μm ~ 0.8 μm;
S04: silk-screen plating resist bronze ink in the circuit board, retains the plating resist bronze ink of segmentation golden finger segmentation place after overexposure, development;
S05: stick blue glue in non-gold-plated region, expose segmentation golden finger, adopts microetch technique to remove the layers of copper that segmentation golden finger deposits in step S03;
S06: the layers of copper of blue glue overlay area is as conductive layer in S05, carries out gold-plated to segmentation golden finger;
S07: the plating resist bronze ink removing segmentation place of segmentation golden finger;
S08: adopt microetch technique to remove remaining layers of copper on wiring board.
Wherein, described step 1 is specially:
S01: with dry film lid in the circuit board, through overexposure, development after expose Copper Foil part wiring board needing etch away;
S02: etch wiring board, etches away the Copper Foil exposed in step S01, forms figure and segmentation golden finger figure in plate.
Wherein, in step S05 and step S08, described microetch technique is specially: wiring board is put into sodium peroxydisulfate solution and soak 3 ~ 20S.
Wherein, in described sodium peroxydisulfate solution, the concentration of sodium peroxydisulfate is 60 ~ 120g/L.
Wherein, in step S07, adopt and wiring board is put into alkaline solution soak to remove plating resist bronze ink.
Wherein, the NaOH solution of described alkaline solution to be concentration be 4% ~ 6% (weight).
Wherein, wiring board soak time in described NaOH solution is 3 ~ 5 minutes.
Wherein, it is 0.3 μm ~ 0.8 μm at the thickness of the layers of copper of the whole plate surface deposition of wiring board in step S03.
Wherein, step S04 is specially: silk-screen plating resist bronze ink in the circuit board, retains the plating resist bronze ink of segmentation golden finger segmentation place, thus produce plating resist bronze ink portion in segmentation place of described golden finger after overexposure, development.
The invention has the beneficial effects as follows: the gold plating method being different from prior art segmentation golden finger easily occurs that golden finger short circuit or segmentation place leave the problem of remaining copper, the gold plating method of segmentation golden finger of the present invention first produces segmentation golden finger figure before gold-plated process, then deposition of thin layers of copper in the circuit board, gold-plated to segmentation golden finger using this layers of copper as conductive layer, segmentation place of segmentation golden finger arranges plating resist bronze ink portion to prevent segmentation place plated with gold, because segmentation place is lower than segmentation golden finger pattern height, segmentation place belongs to groove, plating resist bronze ink is in this bottom portion of groove, do not have the situation of plating resist bronze ink, therefore there will not be as in prior art because plating resist bronze ink and the too little ink of layers of copper adhesion come off and occur the situation of remaining copper and short circuit, effectively ensure that the gold plating quality of segmentation golden finger, improve the electric property of wiring board.Adopt gold plating method of the present invention in addition, relative to the processing technology of prior art, decrease the operation of an outer graphics and once outer etching, add heavy copper process, two compare, and decrease a procedure, simplify work flow.
Accompanying drawing explanation
Fig. 1 is the flow chart of the gold plating method of segmentation golden finger of the present invention;
Fig. 2 is the state after wiring board of the present invention forms line pattern;
Fig. 3 is the state after wiring board of the present invention print plating resist bronze ink exposure imaging;
Fig. 4 is the state after wiring board of the present invention sticks blue glue;
Fig. 5 be wiring board segmentation golden finger of the present invention gold-plated after state;
Fig. 6 is the end-state after wiring board craft of gilding of the present invention completes.
In figure: 1, figure in plate; 2, segmentation golden finger; 21, segmentation place; 3, layers of copper; 4, plating resist bronze ink; 5, blue glue.
Embodiment
By describing technology contents of the present invention, structural feature in detail, realized object and effect, accompanying drawing is coordinated to be explained in detail below in conjunction with execution mode.
Refer to Fig. 1 to Fig. 6, the invention provides a kind of gold plating method of segmentation golden finger, comprise step:
Step 1: make figure and segmentation golden finger figure in ejecting plate, in one embodiment, its step is specially:
S01: with dry film lid in the circuit board, through overexposure, development after expose Copper Foil part wiring board needing etch away;
S02: etch wiring board, etches away the Copper Foil exposed in step S01, forms figure 1 and segmentation golden finger 2 in plate; Wiring board state after this step as shown in Figure 2.
In step 1, be different from prior art makes it be divided into two sections by etching again segmentation golden finger after a complete golden finger is produced, the step of the present embodiment adopts and once makes segmentation golden finger shaping, is easy to controlled working precision, and decreases manufacturing procedure.
After step 1 completes, carry out step 2: to the gold-plated process of segmentation golden finger, the concrete steps of this gold-plated process comprise:
S03: in wiring board whole plate surface deposition layers of copper 3; Be beneficial to gold-plated for reaching good electric property and facilitate the removal of layers of copper in subsequent step, preferably, in this step, the thickness of layers of copper 3 is 0.3 μm ~ 0.8 μm.
S04: plating resist bronze ink portion is set in segmentation golden finger segmentation place 21, segmentation place 21 plated with gold when this plating resist bronze ink portion is in order to prevent gold-plated and occur short-circuit conditions.The invention provides an embodiment of this step: silk-screen plating resist bronze ink 4 in the circuit board, after overexposure, development, retain the plating resist bronze ink 4 of segmentation golden finger segmentation place 21; Certainly this plating resist bronze ink portion not can only adopt the manner, as long as other modes can reach and make plating resist bronze ink be deposited on segmentation place all to can be used as the specific embodiment of the present invention; Wiring board state after this step as shown in Figure 3;
S05: stick blue glue 5 in non-gold-plated region, expose segmentation golden finger 2, adopts microetch technique to remove the layers of copper 3 that segmentation golden finger 2 deposits in step S03; The wiring board state of this step as shown in Figure 4;
S06: the layers of copper of blue glue overlay area is as conductive layer in S05, carries out gold-plated to segmentation golden finger 2; Wiring board state after this step as shown in Figure 5;
S07: the plating resist bronze ink 4 removing segmentation golden finger segmentation place 21;
S08: adopt microetch technique to remove remaining layers of copper 3 on wiring board; The wiring board state of final formation as shown in Figure 6.
The gold plating method being different from prior art segmentation golden finger easily occurs that golden finger short circuit or segmentation place leave the problem of remaining copper, the gold plating method of segmentation golden finger of the present invention first produces segmentation golden finger figure before gold-plated process, then deposition of thin layers of copper in the circuit board, gold-plated to segmentation golden finger using this layers of copper as conductive layer, segmentation place of segmentation golden finger arranges plating resist bronze ink portion to prevent segmentation place plated with gold, because segmentation place is lower than segmentation golden finger pattern height, segmentation place belongs to groove, plating resist bronze ink is in this bottom portion of groove, do not have the situation of plating resist bronze ink, therefore there will not be as in prior art because plating resist bronze ink and the too little ink of layers of copper adhesion come off and occur the situation of remaining copper and short circuit, effectively ensure that the gold plating quality of segmentation golden finger, improve the electric property of wiring board.Adopt gold plating method of the present invention in addition, relative to the processing technology of prior art, decrease the operation of an outer graphics and once outer etching, add heavy copper process, two compare, and decrease a procedure, simplify work flow.
In the present embodiment, in step S05 and step S08, described microetch technique is specially: wiring board is put into sodium peroxydisulfate solution and soak 3 ~ 20S.Wherein, in described sodium peroxydisulfate solution, the concentration of sodium peroxydisulfate is 60 ~ 120g/L.By completely etched for the layers of copper of wiring board surface deposition in step S03, can not affect follow-up wiring board processing and the electric property of wiring board like this.
In one embodiment, adopt in step S07 and wiring board is put into alkaline solution soak to remove plating resist bronze ink.Preferably, the NaOH solution of this alkaline solution to be concentration be 4% ~ 6% (weight), wiring board is that in the NaOH solution of 4% ~ 6% (weight), soak time is 3 ~ 5 minutes in this concentration.Soak by adopting alkaline solution and residual plating resist bronze ink can be removed completely, make next step remove the work of layers of copper smooth and easy, prevent the electrical insulation properties that have impact on segmentation golden finger because segmentation place has residual ink or metal.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize specification of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (8)
1. a gold plating method for segmentation golden finger, is characterized in that, comprises step:
Step 1: make figure and segmentation golden finger figure in ejecting plate, be specially, S01: with dry film lid in the circuit board, after overexposure, development, expose Copper Foil part wiring board needing etch away; S02: etch wiring board, etches away the Copper Foil exposed in step S01, forms figure and segmentation golden finger figure in plate;
Step 2: the gold-plated process of golden finger, and the gold-plated treatment step of described golden finger specifically comprises:
S03: in wiring board whole plate surface deposition layers of copper;
S04: plating resist bronze ink portion is set in golden finger segmentation place, wherein, segmentation place is lower than segmentation golden finger pattern height, and segmentation place belongs to groove, and plating resist bronze ink is in this bottom portion of groove;
S05: stick blue glue in non-gold-plated region, expose segmentation golden finger, adopts microetch technique to remove the layers of copper that segmentation golden finger deposits in step S03;
S06: the layers of copper of blue glue overlay area is as conductive layer in S05, carries out gold-plated to segmentation golden finger;
S07: the plating resist bronze ink removing segmentation place of segmentation golden finger;
S08: adopt microetch technique to remove remaining layers of copper on wiring board.
2. the gold plating method of segmentation golden finger according to claim 1, is characterized in that: in step S05 and step S08, and described microetch technique is specially: wiring board is put into sodium peroxydisulfate solution and soak 3 ~ 20S.
3. the gold plating method of segmentation golden finger according to claim 2, is characterized in that: in described sodium peroxydisulfate solution, the concentration of sodium peroxydisulfate is 60 ~ 120g/L.
4. the gold plating method of segmentation golden finger according to claim 1, is characterized in that: in step S07, adopts wiring board is put into alkaline solution to soak to remove plating resist bronze ink.
5. the gold plating method of segmentation golden finger according to claim 4, is characterized in that: the NaOH solution of described alkaline solution to be concentration be 4% ~ 6% (weight).
6. the gold plating method of segmentation golden finger according to claim 5, is characterized in that: wiring board soak time in described NaOH solution is 3 ~ 5 minutes.
7. the gold plating method of segmentation golden finger according to claim 1, is characterized in that: be 0.3 μm ~ 0.8 μm at the thickness of the layers of copper of the whole plate surface deposition of wiring board in step S03.
8. the gold plating method of segmentation golden finger according to claim 1, it is characterized in that: step S04 is specially: silk-screen plating resist bronze ink in the circuit board, after overexposure, development, retain the plating resist bronze ink of segmentation golden finger segmentation place, thus produce plating resist bronze ink portion in segmentation place of described golden finger.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110248179.9A CN102958280B (en) | 2011-08-24 | 2011-08-24 | Method for gold-plating sectional gold fingers |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110248179.9A CN102958280B (en) | 2011-08-24 | 2011-08-24 | Method for gold-plating sectional gold fingers |
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| CN102958280A CN102958280A (en) | 2013-03-06 |
| CN102958280B true CN102958280B (en) | 2015-06-03 |
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Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103702526A (en) * | 2013-12-30 | 2014-04-02 | 景旺电子科技(龙川)有限公司 | Method for treating leadless electroplated golden finger |
| CN103700517B (en) * | 2013-12-31 | 2015-10-07 | 南通万德科技有限公司 | Switch contact element and preparation method thereof |
| CN103763865B (en) * | 2014-02-13 | 2016-05-04 | 遂宁市广天电子有限公司 | Welding resistance ink hand-hole processing method |
| CN105163500B (en) * | 2015-09-01 | 2018-06-26 | 胜宏科技（惠州）股份有限公司 | One kind prevents to be segmented the high frequency connectors golden finger segmentation remaining method of position lead |
| CN105357871A (en) * | 2015-11-26 | 2016-02-24 | 深圳市迅捷兴电路技术有限公司 | Processing method for segmental golden finger |
| CN105636364A (en) * | 2016-03-08 | 2016-06-01 | 深圳崇达多层线路板有限公司 | Manufacturing method of golden finger |
| CN107241873A (en) * | 2017-07-17 | 2017-10-10 | 胜宏科技（惠州）股份有限公司 | A kind of improved golden finger gold plating method |
| CN110109321A (en) * | 2019-05-31 | 2019-08-09 | 高德（无锡）电子有限公司 | Limp outer lead is segmented the design method of the golden finger segmentation location segment egative film film |
| CN113316327B (en) * | 2020-02-27 | 2022-05-10 | 北大方正集团有限公司 | Method for manufacturing golden finger of circuit board and circuit board with golden finger |
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| CN101835351A (en) * | 2010-04-08 | 2010-09-15 | 梅州市志浩电子科技有限公司 | Manufacture process of sectional golden finger |
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| CN101643927A (en) * | 2008-08-05 | 2010-02-10 | 北大方正集团有限公司 | Method for manufacturing printed circuit board edge connector |
| CN101355856A (en) * | 2008-08-13 | 2009-01-28 | 东莞生益电子有限公司 | Method for preparing hierarchical and grading gold finger plate using method of selecting wet film |
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| CN102958280A (en) | 2013-03-06 |
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Address after: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENNAN CIRCUITS Co.,Ltd. Address before: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: SHENNAN CIRCUITS Co.,Ltd. |
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Effective date of registration: 20170113 Address after: 214000 Changjiang Road, New District, Jiangsu, Wuxi, No. 18 Patentee after: WUXI SHENNAN CIRCUITS Co.,Ltd. Address before: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: SHENNAN CIRCUITS Co.,Ltd. |