CN103702526A - Method for treating leadless electroplated golden finger - Google Patents
Method for treating leadless electroplated golden finger Download PDFInfo
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- CN103702526A CN103702526A CN201310742466.4A CN201310742466A CN103702526A CN 103702526 A CN103702526 A CN 103702526A CN 201310742466 A CN201310742466 A CN 201310742466A CN 103702526 A CN103702526 A CN 103702526A
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- copper plating
- electroless copper
- golden finger
- lead
- plating layer
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Abstract
The invention discloses a method for treating a leadless electroplated golden finger. The method comprises the following steps: (A) performing electroless copper plating treatment on a printed circuit board after circuit manufacturing to obtain an electroless copper plating layer; (B) performing circuit manufacturing again to expose a golden finger position; (C) electroplating a golden finger by using the electroless copper plating layer as a conductor, and then performing membrane removal treatment; (D) micro-etching the electroless copper plating layer, and then performing green oil manufacturing. According to the method, the electroless copper plating layer with smaller thickness can be completely removed in the subsequent micro-etching treatment, so that the problem of lead residue is avoided, the problem that the golden finger cannot be electroplated on a plating layer due to open circuit of an electroplating lead is solved, and the product quality is improved; moreover, in the whole flow, a conventional process is modified without addition of equipment, so that the total cost is not increased; meanwhile, golden finger leads are not needed to be designed on an external circuit, so that the problem of inconsistency in length of residues of the golden finger leads is solved.
Description
Technical field
The present invention relates to PCB process of surface treatment field, relate in particular to a kind of PCB surface treatment method without lead-in wire electrogilding finger.
Background technology
In prior art, the conventional PCB printed circuit board with golden finger, General Requirements golden finger is done electronickelling gold (gold firmly) and is processed, to guarantee that golden finger position plugs frequently, bring less golden surface damage, conventional electrogilding finger flow process is: circuit is made (containing gold finger galvanizing lead-in wire) → green oil makings → outer graphics (expose and electroplate golden finger position) → electronickelling gold → bis-and bored (boring disconnected electroplate lead wire) → etch gold and point electroplate lead wire → take off film → character → normal flow.
As shown in Figure 1, the treatment process of prior art need to be used electroplate lead wire 120 just can make the electric plated with nickel gold of golden finger 110 as conductor on printed circuit board 100, and 120 of electroplate lead wires after plating completes without any the meaning existing, need on the contrary to remove and just can make finished product PCB not be subject to electric property and appearance effects.But, as shown in Figure 2, circular stain place represents to bore disconnected position, under equipment itself due to two brills (boring disconnected electroplate lead wire), bore positional precision and have certain deviation (about +/-4mil), therefore current on the golden finger PCB of PCB industry printed circuit board, all exist the problem of the residual certain electroplate lead wire in golden finger position, as shown in Figure 2, the residual about 0-6mil of electroplate lead wire length does not wait even larger, but become PCB industry, cannot solve a difficult problem of having to face.
Therefore, prior art has yet to be improved and developed.
Summary of the invention
In view of above-mentioned the deficiencies in the prior art, the object of the present invention is to provide a kind of processing method without lead-in wire electrogilding finger, be intended to solve the problem that existing gold finger galvanizing technique exists residual electroplate lead wire.
Technical scheme of the present invention is as follows:
A processing method without lead-in wire electrogilding finger, wherein, comprises step:
A, conducting transmission line carry out electroless copper plating processing to printed circuit board after making, and obtain electroless copper plating layer;
B, carry out secondary line making again, expose golden finger position;
C, utilize described electroless copper plating layer, as conductor, golden finger is carried out to electroplating processes, then take off film and process;
D, electroless copper plating layer is carried out to microetch processing, carry out afterwards green oil making.
The described processing method without lead-in wire electrogilding finger, wherein, in described steps A, the process conditions that electroless copper plating is processed are: heavy copper cylinder temperature is controlled at 31 ± 3 ℃, copper ion is controlled at 1.8-2.2g/L, and NaOH is controlled at 9-11g/L, and HCHO is controlled at 5-7 g/L.
The described processing method without lead-in wire electrogilding finger, wherein, in described step B, secondary line is made and is adopted anti-plate dry film to make, and golden finger position is windowed and is made by monolateral 2-3mil.
The described processing method without lead-in wire electrogilding finger, wherein, in described step D, the process conditions that microetch is processed are: H
2sO
4: 2%-4%, H
2o
2: 2%-4%, Cu
2+:≤45g/L.
The described processing method without lead-in wire electrogilding finger, wherein, in described step D, micro-etching speed is 1.2 ~ 1.5 μ m/min.
Beneficial effect: method of the present invention is improved traditional golden finger manufacture craft, utilize the electroless copper plating layer forming after heavy copper, as conductor, golden finger is carried out to electroplating processes, in processing, follow-up microetch just can remove the electroless copper plating layer that through thickness is thinner like this, avoided the problem of residual lead-in wire, can not produce gold finger galvanizing that electroplate lead wire open circuit causes and not go up the problem of coating, improved product quality, and whole flow process is without increase equipment, just common process is modified, do not increase total cost, need to not carry out gold finger lead design in outer-layer circuit simultaneously, there is not the residual problem different in size of gold finger lead.
Accompanying drawing explanation
Fig. 1 is the structural representation of pointing without lead-in wire electrogilding in prior art.
Fig. 2 is the structural representation while removing electroplate lead wire without lead-in wire electrogilding finger in prior art.
Fig. 3 is the structural representation without lead-in wire electrogilding finger of made of the present invention.
Embodiment
The invention provides a kind of processing method without lead-in wire electrogilding finger, for making object of the present invention, technical scheme and effect clearer, clear and definite, below the present invention is described in more detail.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
A kind of processing method preferred embodiment without lead-in wire electrogilding finger provided by the present invention, it comprises step:
S1, conducting transmission line carry out electroless copper plating processing to printed circuit board after making, and obtain electroless copper plating layer;
S2, carry out secondary line making again, expose golden finger position;
S3, utilize described electroless copper plating layer, as conductor, golden finger is carried out to electroplating processes, then take off film and process;
S4, electroless copper plating layer is carried out to microetch processing, carry out afterwards green oil making.
By the technological process to traditional, improve, by the electroless copper plating layer making, as conductor, carry out electrogilding finger, do not need the place of electroplating to adopt anti-plate dry film to cover, two operations of heavy copper and microetch in whole flow process, have been increased, having reduced two bores and two operations of etching, produce not extra increasing of main-process stream, so can not increase cost.
The present invention, by the improvement of gold finger galvanizing technique being realized to the batch making of electrogilding finger, has eliminated simultaneously and has electroplated the residual problem of gold finger lead, is embodied in:
1, adopt electroless copper plating layer to carry out gold finger galvanizing as electric conductor, outer-layer circuit does not need additionally to carry out gold finger galvanizing lead design, so the gold finger galvanizing causing without worry electroplate lead wire open circuit is not gone up the problem of coating.
2, because electroless copper plating layer thickness is thinner, after completing, gold finger galvanizing only needed microetch electroless copper plating layer can be cleaned completely, and simple to operate.
3, solved the residual problem of traditional electrical plating gold finger lead, because need not carry out gold finger lead design in outer-layer circuit, do not exist after gold finger galvanizing two to bore flow process and mechanical deflection problems, also just not there is not the problem of the residual length of gold finger lead, as shown in Figure 3, on the printed circuit board 100 finally making, 110 of golden fingers do not have residual electroplate lead wire.
Further, the process conditions that the electroless copper plating in the present embodiment step S1 is processed are: heavy copper cylinder temperature is controlled at 31 ± 3 ℃, and copper ion is controlled at 1.8-2.2g/L, and NaOH is controlled at 9-11g/L, and HCHO is controlled at 5-7 g/L.
For example, in a specific embodiment, heavy copper cylinder temperature is controlled at 31 ℃, and copper ion is controlled at 2.0g/L, and NaOH is controlled at 10g/L, and HCHO is controlled at 6 g/L; Or heavy copper cylinder temperature is controlled at 31 ℃, and copper ion is controlled at 1.8g/L, and NaOH is controlled at 9g/L, and HCHO is controlled at 5 g/L; Or heavy copper cylinder temperature is controlled at 31 ℃, and copper ion is controlled at 2.2g/L, and NaOH is controlled at 11g/L, and HCHO is controlled at 7g/L.The electroless copper plating layer thickness of above-described embodiment made is better, is convenient to remove, and can guarantees preferably electroplating effect.
In addition, preferably deposition rate is controlled at 0.03 μ m/min, and this speed can guarantee that the thickness of electroless copper plating layer is better, wherein, preferably thickness is the thickness that remains on 1 μ m, and this thickness can guarantee the effect as conductor, easily remove completely again, so effect is better.
Further, adopt anti-plate dry film to make in step S2 secondary line is made, golden finger position is windowed and is made by monolateral 2-3mil.Do not need the place of electroplating to adopt anti-plate dry film to cover, and golden finger position is windowed according to monolateral 2-3mil making, to make preferably golden finger.
Further, the process conditions that microetch is processed are: H
2sO
4: 2%-4%, H
2o
2: 2%-4%, Cu
2+:≤45g/L.Taking off after film processes, can directly adopt microetch to process to remove electroless copper plating layer, be complete removal electroless copper plating layer, microetch amount a little transition some.
In specific embodiment, the process conditions that microetch is processed are: H
2sO
4: 3%, H
2o
2: 2%, Cu
2+:=20g/L; Or the process conditions that microetch is processed are: H
2sO
4: 2%, H
2o
2: 4%, Cu
2+:=28g/L; The process conditions that microetch is processed are: H
2sO
4: 4%, H
2o
2: 3%, Cu
2+:=36g/L.Above-mentioned process conditions can guarantee that microetch effect is better, can remove complete electroplate lead wire, avoid residual.
Micro-etching speed is controlled at 1.2 ~ 1.5 μ m/min, and for example controlling micro-etching speed is 1.2,1.3,1.4 or 1.5 μ m/min, and preferably controlling is 1.3 μ m/min, and microetch effect is better.And speed is 2m/min.
In sum, method of the present invention is improved traditional golden finger manufacture craft, utilize the electroless copper plating layer forming after heavy copper, as conductor, golden finger is carried out to electroplating processes, in processing, follow-up microetch just can remove the electroless copper plating layer that through thickness is thinner like this, avoided the problem of residual lead-in wire, can not produce gold finger galvanizing that electroplate lead wire open circuit causes and not go up the problem of coating, improved product quality, and whole flow process is without increase equipment, just common process is modified, do not increase total cost, need to not carry out gold finger lead design in outer-layer circuit simultaneously, there is not the residual problem different in size of gold finger lead.
Should be understood that, application of the present invention is not limited to above-mentioned giving an example, and for those of ordinary skills, can be improved according to the above description or convert, and all these improvement and conversion all should belong to the protection range of claims of the present invention.
Claims (5)
1. without a processing method for lead-in wire electrogilding finger, it is characterized in that, comprise step:
A, conducting transmission line carry out electroless copper plating processing to printed circuit board after making, and obtain electroless copper plating layer;
B, carry out secondary line making again, expose golden finger position;
C, utilize described electroless copper plating layer, as conductor, golden finger is carried out to electroplating processes, then take off film and process;
D, electroless copper plating layer is carried out to microetch processing, carry out afterwards green oil making.
2. the processing method that nothing lead-in wire electrogilding according to claim 1 is pointed, it is characterized in that, in described steps A, the process conditions that electroless copper plating is processed are: heavy copper cylinder temperature is controlled at 31 ± 3 ℃, copper ion is controlled at 1.8-2.2g/L, NaOH is controlled at 9-11g/L, and HCHO is controlled at 5-7 g/L.
3. the processing method without lead-in wire electrogilding finger according to claim 1, is characterized in that, in described step B, secondary line is made and adopted anti-plate dry film to make, and golden finger position is windowed and made by monolateral 2-3mil.
4. the processing method without lead-in wire electrogilding finger according to claim 1, is characterized in that, in described step D, the process conditions that microetch is processed are: H
2sO
4: 2%-4%, H
2o
2: 2%-4%, Cu
2+:≤45g/L.
5. the processing method without lead-in wire electrogilding finger according to claim 1, is characterized in that, in described step D, micro-etching speed is 1.2 ~ 1.5 μ m/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310742466.4A CN103702526A (en) | 2013-12-30 | 2013-12-30 | Method for treating leadless electroplated golden finger |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310742466.4A CN103702526A (en) | 2013-12-30 | 2013-12-30 | Method for treating leadless electroplated golden finger |
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|---|---|
| CN103702526A true CN103702526A (en) | 2014-04-02 |
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| CN201310742466.4A Pending CN103702526A (en) | 2013-12-30 | 2013-12-30 | Method for treating leadless electroplated golden finger |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104661446A (en) * | 2015-02-10 | 2015-05-27 | 深圳市五株科技股份有限公司 | Circuit board processing method |
| CN104968163A (en) * | 2015-05-29 | 2015-10-07 | 胜宏科技（惠州）股份有限公司 | Golden finger processing method characterized by no lead wire residues |
| CN105228372A (en) * | 2015-09-25 | 2016-01-06 | 深圳崇达多层线路板有限公司 | The manufacture method of a kind of wiring board local golden finger |
| CN106231816A (en) * | 2016-09-06 | 2016-12-14 | 深圳崇达多层线路板有限公司 | A kind of manufacture method of golden fingerboard without lead wire |
| CN107422503A (en) * | 2017-08-10 | 2017-12-01 | 深圳市华星光电技术有限公司 | Display panel and display device |
| CN107645855A (en) * | 2016-07-20 | 2018-01-30 | 鹏鼎控股(深圳)股份有限公司 | Non-conductor electroplating circuit board and preparation method thereof |
| CN109714903A (en) * | 2019-01-15 | 2019-05-03 | 广东科翔电子科技有限公司 | A kind of IC support plate surface treatment method |
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| CN101624715A (en) * | 2008-07-11 | 2010-01-13 | 惠阳科惠工业科技有限公司 | Process flow for selective thick-gold electroplating without gold plated lead |
| CN102014586A (en) * | 2010-11-24 | 2011-04-13 | 深南电路有限公司 | Method for gold-plating long and short gold fingers |
| CN102045955A (en) * | 2010-12-28 | 2011-05-04 | 深南电路有限公司 | Method for plating gold on equilong connecting fingers |
| CN102958280A (en) * | 2011-08-24 | 2013-03-06 | 深南电路有限公司 | Method for gold-plating sectional gold fingers |
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2013
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101624715A (en) * | 2008-07-11 | 2010-01-13 | 惠阳科惠工业科技有限公司 | Process flow for selective thick-gold electroplating without gold plated lead |
| CN102014586A (en) * | 2010-11-24 | 2011-04-13 | 深南电路有限公司 | Method for gold-plating long and short gold fingers |
| CN102045955A (en) * | 2010-12-28 | 2011-05-04 | 深南电路有限公司 | Method for plating gold on equilong connecting fingers |
| CN102958280A (en) * | 2011-08-24 | 2013-03-06 | 深南电路有限公司 | Method for gold-plating sectional gold fingers |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104661446A (en) * | 2015-02-10 | 2015-05-27 | 深圳市五株科技股份有限公司 | Circuit board processing method |
| CN104968163A (en) * | 2015-05-29 | 2015-10-07 | 胜宏科技（惠州）股份有限公司 | Golden finger processing method characterized by no lead wire residues |
| CN105228372A (en) * | 2015-09-25 | 2016-01-06 | 深圳崇达多层线路板有限公司 | The manufacture method of a kind of wiring board local golden finger |
| CN107645855A (en) * | 2016-07-20 | 2018-01-30 | 鹏鼎控股(深圳)股份有限公司 | Non-conductor electroplating circuit board and preparation method thereof |
| CN107645855B (en) * | 2016-07-20 | 2020-01-07 | 庆鼎精密电子（淮安）有限公司 | Leadless electroplating circuit board and manufacturing method thereof |
| CN106231816A (en) * | 2016-09-06 | 2016-12-14 | 深圳崇达多层线路板有限公司 | A kind of manufacture method of golden fingerboard without lead wire |
| CN107422503A (en) * | 2017-08-10 | 2017-12-01 | 深圳市华星光电技术有限公司 | Display panel and display device |
| CN109714903A (en) * | 2019-01-15 | 2019-05-03 | 广东科翔电子科技有限公司 | A kind of IC support plate surface treatment method |
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Application publication date: 20140402 |