CN101624715A - Process flow for selective thick-gold electroplating without gold plated lead - Google Patents
Process flow for selective thick-gold electroplating without gold plated lead Download PDFInfo
- Publication number
- CN101624715A CN101624715A CN200810029391A CN200810029391A CN101624715A CN 101624715 A CN101624715 A CN 101624715A CN 200810029391 A CN200810029391 A CN 200810029391A CN 200810029391 A CN200810029391 A CN 200810029391A CN 101624715 A CN101624715 A CN 101624715A
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- gold
- thick
- circuit board
- printed circuit
- dry film
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Abstract
The invention discloses a manufacturing method for selective thick-gold electroplating on a printed circuit board without a gold plated lead, wherein surface processing of the printed circuit board refers to anti-oxidation, tin emersion, silver emersion, gold emersion or hot air solder leveling. The technical implementation scheme comprises the following steps: electroplating the whole board of the printed circuit board to make thickness of copper in a hole and on the surface achieve a required thickness; performing a primary dry film figure transfer and exposing a position needing selective thick-gold electroplating to perform the selective thick-gold electroplating by adopting an electroplating mode; after the thick-gold electroplating, not etching the printed circuit board, removing a primary dry film and performing a secondary dry film figure transfer by adopting a negative film; and then etching the printed circuit board and removing a secondary dry film so as to completely finish circuit pattern and the selective thick-gold electroplating and realize the selective thick-gold electroplating of the printed circuit board without the gold plated lead. The process flow method adopts a form of twice dry film figure transfer to finish the selective thick-gold electroplating and then performs the etching without the gold plated lead, thereby overcoming the difficulty that the selective thick-gold electroplating cannot be performed on the printed circuit board in the absence of the gold plated lead after the etching.
Description
Technical field
Belong to printed circuit board flow process manufacturing technology, be applicable to that surface treatment is the making that anti-oxidant, heavy tin, heavy silver, turmeric or the printed circuit board that sprays tin do not have gold plated lead selectively electroplating thick gold.
Background technology
In the printed wiring board manufacturing process,, need do the selectively electroplating thick gold and handle in order to increase printed circuit board button position or golden finger position electroconductibility, wear resistance and erosion resistance.When general printed circuit board is made, this part has all designed gold plated lead, after finishing etching, can directly add the thick gold of plating, but along with the printed circuit board development, some printed circuit board needs because of design and appearance requirement can't increase gold plated lead, after printed circuit board was finished etching, button position or golden finger position can't be thick metal plated because of no gold plated lead conduction like this.This technical process method is not having under the situation of gold plated lead to adopt the form of twice dry film figure transfer to finish the etching again of selectively electroplating thick gold exactly, has solved the difficulty that can't do the selectively electroplating thick gold after the printed circuit board etching because of no gold plated lead.
Summary of the invention
This technical process adopts twice dry film figure transfer that selectively electroplating thick gold figure and line pattern are made in two steps, at first printed circuit board being put in order plate earlier electroplates and to make in its hole that the thick and surperficial copper of copper is thick to reach desired thickness, do dry film figure transfer for the first time again, exposing needs the selectively electroplating thick carat (measure of the purity of gold) to put, adopt plating mode, do the selectively electroplating thick gold, plate not etching behind the thick gold, take off for the first time dry film and do dry film figure transfer for the second time again, the dry film figure transfer adopts the negative film film for the second time, take off film after the etching again, so far capable the and selectively electroplating thick gold of wiring diagram is all finished, and has realized not having lead-in wire printed circuit board selectively electroplating thick gold.
Embodiment:
1, make flow process:
Open material → boring → plated-through-hole → whole plate dry film platings → first time figure transfer → selectively electroplating thick gold → take off dry film → dry film figure transfer → etching second time first time → take off dry film → welding resistance → surface treatment → moulding → finished product second time
2, make explanation and requirement:
(1) boring: adopt machine dimensions drill to get out the through hole in different apertures, realize the conducting between pcb board layer and layer and line and the line.
(2) plated-through-hole: utilize chemical process to realize the metalized of through hole.
(3) whole plate is electroplated: utilize plating mode, and disposable with the thick thickness requirement that is plating to of the thick and surperficial copper of copper in the hole.
(4) dry film figure transfer for the first time: on the light copper coin, stick dry film and exposure, expose the position of selectivity thickening gold.
(6) selectively electroplating thick gold: thick metal plated processing is carried out in the position of exposing.
(7) take off dry film for the first time: utilization is taken off dry film liquid medicine dry film is taken off.
(8) dry film figure transfer for the second time: on the light copper coin, paste the dry film exposure, with the capable dry film covering protection of using of required wiring diagram.
(9) etching: utilize chemistry erosion copper liquid medicine with unnecessary copper eating away, residue is required line pattern.
(10) take off dry film for the second time: utilization is taken off dry film liquid medicine dry film is taken off.
(11) welding resistance: the corresponding position light sensitive anti-solder protective layer of coating on printed circuit board.
(12) surface treatment: do anti-oxidant, turmeric, heavy tin, heavy silver or spray tin surfaces on request and handle.
(13) moulding: utilize gong machine or hydraulic cutting presser that printed circuit board is cut into corresponding one-tenth article unit.
Claims (1)
- A kind of surface treatment is the making method that the printed circuit board of anti-oxidant, heavy tin, heavy silver, turmeric or spray tin does not have gold plated lead selectively electroplating thick gold.Its basic feature is: printed circuit board is put in order plate earlier electroplate and to make in its hole that the thick and surperficial copper of copper is thick to reach desired thickness, do dry film figure transfer for the first time again, exposing needs the selectively electroplating thick carat (measure of the purity of gold) to put, adopt plating mode, do the selectively electroplating thick gold, plate not etching behind the thick gold, the dry film of decorporating is for the first time done dry film figure transfer for the second time again, the dry film figure transfer adopts the negative film film for the second time, moves back film after the etching again.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810029391A CN101624715A (en) | 2008-07-11 | 2008-07-11 | Process flow for selective thick-gold electroplating without gold plated lead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810029391A CN101624715A (en) | 2008-07-11 | 2008-07-11 | Process flow for selective thick-gold electroplating without gold plated lead |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101624715A true CN101624715A (en) | 2010-01-13 |
Family
ID=41520702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810029391A Pending CN101624715A (en) | 2008-07-11 | 2008-07-11 | Process flow for selective thick-gold electroplating without gold plated lead |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101624715A (en) |
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101861054A (en) * | 2010-04-08 | 2010-10-13 | 冠锋电子科技(梅州)有限公司 | Method for removing goldplated plug lead wires |
| CN102026491A (en) * | 2010-12-07 | 2011-04-20 | 深南电路有限公司 | Manufacturing process of whole gold-plated panel |
| CN102045962A (en) * | 2010-12-28 | 2011-05-04 | 深南电路有限公司 | Method for plating gold on equilong connecting fingers |
| CN102045958A (en) * | 2010-12-28 | 2011-05-04 | 深南电路有限公司 | Method for plating gold on equilong connecting fingers |
| CN102045955A (en) * | 2010-12-28 | 2011-05-04 | 深南电路有限公司 | Method for plating gold on equilong connecting fingers |
| CN102045960A (en) * | 2010-12-28 | 2011-05-04 | 深南电路有限公司 | Method for plating gold on equilong connecting fingers |
| CN102045956A (en) * | 2010-12-28 | 2011-05-04 | 深南电路有限公司 | Method for plating gold on equilong connecting fingers |
| CN102045961A (en) * | 2010-12-28 | 2011-05-04 | 深南电路有限公司 | Method for plating gold on equilong connecting fingers |
| CN102045957A (en) * | 2010-12-28 | 2011-05-04 | 深南电路有限公司 | Method for plating gold on equilong connecting fingers |
| CN102045959A (en) * | 2010-12-28 | 2011-05-04 | 深南电路有限公司 | Method for gold-plating gold fingers with equal length |
| CN102045963A (en) * | 2010-12-28 | 2011-05-04 | 深南电路有限公司 | Method for plating gold on equilong connecting fingers |
| CN103702526A (en) * | 2013-12-30 | 2014-04-02 | 景旺电子科技(龙川)有限公司 | Method for treating leadless electroplated golden finger |
| CN103731992A (en) * | 2013-12-27 | 2014-04-16 | 广州兴森快捷电路科技有限公司 | Method for reducing pits generated in gold-plated area of circuit board |
| CN105142351A (en) * | 2015-08-04 | 2015-12-09 | 深圳市景旺电子股份有限公司 | Leadless local gold electroplating method |
| CN110267464A (en) * | 2019-06-04 | 2019-09-20 | 深圳市迅捷兴科技股份有限公司 | The half bore board manufacturing method of the hard gold of part plating of line can not be pulled |
| CN110944454A (en) * | 2019-12-19 | 2020-03-31 | 黄石星河电路有限公司 | Circuit board production process |
| CN111850643A (en) * | 2020-08-04 | 2020-10-30 | 天水华洋电子科技股份有限公司 | Electroplating method of lead frame |
| CN112867275A (en) * | 2021-01-06 | 2021-05-28 | 深圳市迅捷兴科技股份有限公司 | Method for plating nickel and gold on part without lead |
| CN113038725A (en) * | 2021-03-08 | 2021-06-25 | 深圳市迅捷兴科技股份有限公司 | Method for forming conductive layer circuit side wall and surface gold plating by high-frequency circuit board chemical copper deposition |
-
2008
- 2008-07-11 CN CN200810029391A patent/CN101624715A/en active Pending
Cited By (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101861054A (en) * | 2010-04-08 | 2010-10-13 | 冠锋电子科技(梅州)有限公司 | Method for removing goldplated plug lead wires |
| CN102026491B (en) * | 2010-12-07 | 2012-05-09 | 深南电路有限公司 | Manufacturing process of whole gold-plated panel |
| CN102026491A (en) * | 2010-12-07 | 2011-04-20 | 深南电路有限公司 | Manufacturing process of whole gold-plated panel |
| CN102045963B (en) * | 2010-12-28 | 2012-07-04 | 深南电路有限公司 | Method for plating gold on equilong connecting fingers |
| CN102045955B (en) * | 2010-12-28 | 2012-09-05 | 深南电路有限公司 | Method for plating gold on equilong connecting fingers |
| CN102045960A (en) * | 2010-12-28 | 2011-05-04 | 深南电路有限公司 | Method for plating gold on equilong connecting fingers |
| CN102045956A (en) * | 2010-12-28 | 2011-05-04 | 深南电路有限公司 | Method for plating gold on equilong connecting fingers |
| CN102045961A (en) * | 2010-12-28 | 2011-05-04 | 深南电路有限公司 | Method for plating gold on equilong connecting fingers |
| CN102045957A (en) * | 2010-12-28 | 2011-05-04 | 深南电路有限公司 | Method for plating gold on equilong connecting fingers |
| CN102045959A (en) * | 2010-12-28 | 2011-05-04 | 深南电路有限公司 | Method for gold-plating gold fingers with equal length |
| CN102045963A (en) * | 2010-12-28 | 2011-05-04 | 深南电路有限公司 | Method for plating gold on equilong connecting fingers |
| CN102045958A (en) * | 2010-12-28 | 2011-05-04 | 深南电路有限公司 | Method for plating gold on equilong connecting fingers |
| CN102045962A (en) * | 2010-12-28 | 2011-05-04 | 深南电路有限公司 | Method for plating gold on equilong connecting fingers |
| CN102045958B (en) * | 2010-12-28 | 2012-07-04 | 深南电路有限公司 | Method for plating gold on equilong connecting fingers |
| CN102045955A (en) * | 2010-12-28 | 2011-05-04 | 深南电路有限公司 | Method for plating gold on equilong connecting fingers |
| CN102045960B (en) * | 2010-12-28 | 2012-09-05 | 深南电路有限公司 | Method for plating gold on equilong fingers |
| CN102045956B (en) * | 2010-12-28 | 2012-09-05 | 深南电路有限公司 | Method for plating gold on equilong connecting fingers |
| CN103731992A (en) * | 2013-12-27 | 2014-04-16 | 广州兴森快捷电路科技有限公司 | Method for reducing pits generated in gold-plated area of circuit board |
| CN103731992B (en) * | 2013-12-27 | 2017-07-04 | 广州兴森快捷电路科技有限公司 | Reduce the method that the gold-plated region of circuit board produces pit |
| CN103702526A (en) * | 2013-12-30 | 2014-04-02 | 景旺电子科技(龙川)有限公司 | Method for treating leadless electroplated golden finger |
| CN105142351A (en) * | 2015-08-04 | 2015-12-09 | 深圳市景旺电子股份有限公司 | Leadless local gold electroplating method |
| CN110267464A (en) * | 2019-06-04 | 2019-09-20 | 深圳市迅捷兴科技股份有限公司 | The half bore board manufacturing method of the hard gold of part plating of line can not be pulled |
| CN110944454A (en) * | 2019-12-19 | 2020-03-31 | 黄石星河电路有限公司 | Circuit board production process |
| CN111850643A (en) * | 2020-08-04 | 2020-10-30 | 天水华洋电子科技股份有限公司 | Electroplating method of lead frame |
| CN112867275A (en) * | 2021-01-06 | 2021-05-28 | 深圳市迅捷兴科技股份有限公司 | Method for plating nickel and gold on part without lead |
| CN113038725A (en) * | 2021-03-08 | 2021-06-25 | 深圳市迅捷兴科技股份有限公司 | Method for forming conductive layer circuit side wall and surface gold plating by high-frequency circuit board chemical copper deposition |
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Open date: 20100113 |