CN102045958B - Method for plating gold on equilong connecting fingers - Google Patents
Method for plating gold on equilong connecting fingers Download PDFInfo
- Publication number
- CN102045958B CN102045958B CN2010106090164A CN201010609016A CN102045958B CN 102045958 B CN102045958 B CN 102045958B CN 2010106090164 A CN2010106090164 A CN 2010106090164A CN 201010609016 A CN201010609016 A CN 201010609016A CN 102045958 B CN102045958 B CN 102045958B
- Authority
- CN
- China
- Prior art keywords
- gold
- golden finger
- plating
- adhesive tape
- conductive tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The invention relates to a method for plating gold on equilong connecting fingers. The method comprises the following steps: (1) preparing a printed circuit board (PCB) and manufacturing intra-board patterns, conductive auxiliary sides and equilong connecting finger patterns on the PCB; (2) sticking a conductive adhesive tape; (3) sticking an anti-plating adhesive tape to the non-gold plating area; (4) utilizing the conductive adhesive tape as the gold-plating lead to plate gold on the equilong connecting fingers; (5) tearing off the anti-plating adhesive tape; (6) tearing off the conductive adhesive tape; and (7) carrying out resistance welding on the PCB, trimming and chamfering the PCB. The method has the following beneficial effects: in the method, the gold-plating leads are not arranged on the PCB and are unnecessary to be removed, thus naturally avoiding the problem of hidden trouble of reliability of the areas of the connecting fingers in long-term use because the gold-plating leads are not thoroughly removed so that the residues of the gold-plating leads are left on the board or the gold-plating leads are excessively removed so that the copper at the tips of the connecting fingers is exposed; and the aim of ensuring the equilong connecting fingers to conduct mutually can be achieved by replacing the gold-plating leads with the conductive adhesive tape.
Description
Technical field
The present invention relates to a kind of gold plating method of isometric golden finger.
Background technology
Making isometric golden finger and isometric golden finger is being carried out in the gold-plated process; The method that prior art adopts is at first figure in the plate and glodclad wire etching to be come out with outer erosion through outer figure; Utilize resistance solder paste China ink to cover non-gold-plated zone then, carry out through glodclad wire gold-plated, the finishing touch profile; Machinery is removed glodclad wire and chamfering, and said chamfering is used for the convenient groove of pegging graft.
What this kind mode adopted is to draw the glodclad wire that 8-18mil does not wait width from isometric golden finger termination, the conductive layer during as gold-plated finger, and glodclad wire is a kind of technology auxiliary line in fact, it is not retained in final product; After having plated gold; Behind recontour, adopt the V carving method to remove glodclad wire; The problem that has precision because of the removal method of machinery; Glodclad wire exist to be removed and totally not to be caused it to remain on the plate face, perhaps removes excessively to cause the golden finger termination to occur revealing copper, causes that there is hidden danger in safety in the life-time service of product golden finger zone.
Summary of the invention
The technical problem that the present invention mainly solves provides and a kind ofly in pcb board golden finger termination glodclad wire is not set, thereby needn't adopt mechanical system to remove the isometric golden finger gold plating method of glodclad wire.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of gold plating method of isometric golden finger is provided, comprises:
(1) prepare pcb board, figure, conduction are assisted limit and isometric golden finger figure in the making ejecting plate on pcb board, and auxiliary limit of conduction and golden finger are spaced from each other, and isometric golden finger passes through figure mutual conduction in lead-in wire and the plate, connecting zone of the leaded place's formation of institute;
(2) paste conductive tape, said conductive tape covers the connecting zone of figure in isometric golden finger and the plate, makes that institute is leaded assists the limit to conduct each other with conduction;
(3) paste anti-plating adhesive tape in non-gold-plated zone;
(4) utilize conductive tape to carry out gold-plated to isometric golden finger as glodclad wire;
(5) tear anti-plating adhesive tape;
(6) tear conductive tape;
(7) pcb board is hindered weldering, recontour and chamfered.
Wherein, in step (2), utilize professional adhesive-tape application machine to paste conductive tape.
Wherein, said anti-plating adhesive tape is blue adhesive tape.
Wherein, in step (2), said conductive tape width is 3mm-10mm.
Wherein, in step (2), said conductive tape width is 5mm.
The invention has the beneficial effects as follows: because the isometric golden finger gold plating method of the present invention is not provided with glodclad wire on the termination of pcb board golden finger, needn't remove glodclad wire, not exist removal totally not cause it to remain on the plate face naturally; Perhaps remove and excessively cause the golden finger termination copper to occur revealing; Cause safety in the life-time service of product golden finger zone to have the problem of hidden danger, adopt and paste conductive resin and bring the replacement glodclad wire, can reach the purpose that makes isometric golden finger mutual conduction; Owing to paste conductive tape, tear conductive tape and all only need several minutes time; Efficient is high, and is with short production cycle, and cost is lower.
Description of drawings
Fig. 1 is a pcb board embodiment who adopts the gold plating method of the isometric golden finger of the present invention;
Fig. 2 is the synoptic diagram after sticking conductive tape on the pcb board;
Fig. 3 is the synoptic diagram after anti-plating adhesive tape is sticked in the non-gold-plated zone of pcb board;
Fig. 4 is the synoptic diagram after gold-plated to pcb board;
Fig. 5 tears the synoptic diagram behind the anti-plating adhesive tape on the pcb board;
Fig. 6 tears the synoptic diagram behind the conductive tape on the pcb board;
Fig. 7 is to the final effect figure after pcb board resistance weldering, recontour, the chamfering.
Wherein, 1, figure in the plate; 2, golden finger; 3, the auxiliary limit of conduction; 4, conductive tape; 5, anti-plating adhesive tape.
Embodiment
By specifying technology contents of the present invention, structural attitude, realized purpose and effect, give explanation below in conjunction with embodiment and conjunction with figs. are detailed.
Embodiment as the gold plating method of the isometric golden finger of the present invention comprises like Fig. 1 to Fig. 7:
(1) prepares pcb board; On pcb board, make figure 1 in the ejecting plate, the auxiliary limit 3 of conduction and isometric golden finger 2 figures; Conduction assists limit 3 and isometric golden finger 2 to be spaced from each other, and isometric golden finger 2 is through interior figure 1 mutual conduction of lead-in wire and plate, and the leaded place of institute forms a connecting zone;
(2) paste conductive tape 4, said conductive tape 4 covers the connecting zone of figure in isometric golden fingers and the plate, makes that institute is leaded assists limit 3 to conduct each other with conduction;
(3) paste anti-plating adhesive tape 5 in non-gold-plated zone;
(4) utilize conductive tape 4 to carry out gold-plated to isometric golden finger as glodclad wire;
(5) tear anti-plating adhesive tape 5;
(6) tear conductive tape 4;
(7) pcb board is hindered weldering, recontour and chamfered.
In step (2), conductive tape 4 covers the auxiliary limit 3 of said conduction, and when gold-plated, the auxiliary limit 3 of conduction is connected with gold-plated equipment negative pole.
In the present embodiment, said anti-plating adhesive tape 5 can be blue adhesive tape.
Because the isometric golden finger gold plating method of the present invention is not provided with glodclad wire on the termination of pcb board golden finger, needn't remove glodclad wire, does not exist removal totally not cause it to remain on the plate face naturally; Perhaps remove and excessively cause the golden finger termination copper to occur revealing; Cause safety in the life-time service of product golden finger zone to have the problem of hidden danger, adopt and paste conductive resin and bring the replacement glodclad wire, can reach the purpose that makes isometric golden finger mutual conduction; Owing to paste conductive tape, tear conductive tape and all only need several minutes time; Efficient is high, and is with short production cycle, and cost is lower.
In step (2), when pasting conductive tape 4, if operate not in place; Conductive tape 4 is understood the situation of appearance and golden finger 2 loose contacts, has the risk of plating leakage, requires very high to personnel operation; And adopt professional adhesive-tape application machine to paste conductive tape, can at utmost reduce risk.
In step (2), said conductive tape 4 width are generally selected 3mm-10mm for use, and in this width, the convenient ribbon gymnastics of pasting is done, and can guarantee the effect that conducts between conductive tape 4 and the golden finger 2 again, and for usual prodn, conductive tape 4 width more preferably are worth and are 5mm.
The above is merely embodiments of the invention; Be not so limit claim of the present invention; Every equivalent structure or equivalent flow process conversion that utilizes specification sheets of the present invention and accompanying drawing content to be done; Or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (5)
1. the gold plating method of an isometric golden finger is characterized in that, comprising:
(1) prepare pcb board, figure, conduction are assisted limit and isometric golden finger figure in the making ejecting plate on pcb board, and auxiliary limit of conduction and golden finger are spaced from each other, and isometric golden finger passes through figure mutual conduction in lead-in wire and the plate, connecting zone of the leaded place's formation of institute;
(2) paste conductive tape, said conductive tape covers the connecting zone of figure in isometric golden finger and the plate, makes that institute is leaded assists the limit to conduct each other with conduction;
(3) paste anti-plating adhesive tape in non-gold-plated zone;
(4) utilize conductive tape to carry out gold-plated to isometric golden finger as glodclad wire;
(5) tear anti-plating adhesive tape;
(6) tear conductive tape;
(7) pcb board is hindered weldering, recontour and chamfered.
2. according to the gold plating method of the said isometric golden finger of claim 1, it is characterized in that: in step (2), utilize professional adhesive-tape application machine to paste conductive tape.
3. according to the gold plating method of the said isometric golden finger of claim 1, it is characterized in that: said anti-plating adhesive tape is blue adhesive tape.
4. according to the gold plating method of the said isometric golden finger of claim 1, it is characterized in that: in step (2), said conductive tape width is 3mm-10mm.
5. according to the gold plating method of the said isometric golden finger of claim 4, it is characterized in that: in step (2), said conductive tape width is 5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010106090164A CN102045958B (en) | 2010-12-28 | 2010-12-28 | Method for plating gold on equilong connecting fingers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010106090164A CN102045958B (en) | 2010-12-28 | 2010-12-28 | Method for plating gold on equilong connecting fingers |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102045958A CN102045958A (en) | 2011-05-04 |
| CN102045958B true CN102045958B (en) | 2012-07-04 |
Family
ID=43911552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010106090164A Expired - Fee Related CN102045958B (en) | 2010-12-28 | 2010-12-28 | Method for plating gold on equilong connecting fingers |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102045958B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101594743A (en) * | 2008-05-28 | 2009-12-02 | 江苏苏杭电子有限公司 | Method with manufacturing outer graphics of electronic circuit board by encapsulation |
| CN101624715A (en) * | 2008-07-11 | 2010-01-13 | 惠阳科惠工业科技有限公司 | Process flow for selective thick-gold electroplating without gold plated lead |
| CN101699940A (en) * | 2009-11-10 | 2010-04-28 | 广州兴森快捷电路科技有限公司 | Manufacture method of golden finger printed board |
| CN101702869A (en) * | 2009-10-30 | 2010-05-05 | 陈国富 | Method for directly producing circuit boards from insulated substrate without cladding copper |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8156645B2 (en) * | 2007-06-06 | 2012-04-17 | Ddi Global Corp. | Method of manufacturing a multilayer printed wiring board with copper wrap plated hole |
-
2010
- 2010-12-28 CN CN2010106090164A patent/CN102045958B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101594743A (en) * | 2008-05-28 | 2009-12-02 | 江苏苏杭电子有限公司 | Method with manufacturing outer graphics of electronic circuit board by encapsulation |
| CN101624715A (en) * | 2008-07-11 | 2010-01-13 | 惠阳科惠工业科技有限公司 | Process flow for selective thick-gold electroplating without gold plated lead |
| CN101702869A (en) * | 2009-10-30 | 2010-05-05 | 陈国富 | Method for directly producing circuit boards from insulated substrate without cladding copper |
| CN101699940A (en) * | 2009-11-10 | 2010-04-28 | 广州兴森快捷电路科技有限公司 | Manufacture method of golden finger printed board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102045958A (en) | 2011-05-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102045960B (en) | Method for plating gold on equilong fingers | |
| CN102045963B (en) | Method for plating gold on equilong connecting fingers | |
| CN102045956B (en) | Method for plating gold on equilong connecting fingers | |
| CN105813392A (en) | Flexible LED substrate preparation method | |
| CN102045962A (en) | Method for plating gold on equilong connecting fingers | |
| CN102014586A (en) | Method for gold-plating long and short gold fingers | |
| CN105430892A (en) | Gold finger manufacturing method and gold finger | |
| CN102045955B (en) | Method for plating gold on equilong connecting fingers | |
| CN102014580A (en) | Manufacturing technology of whole-plate gold-plated plate | |
| CN102014579B (en) | Gold-plating method of long and short golden fingers | |
| CN102045961B (en) | Method for plating gold on equilong connecting fingers | |
| CN102045959B (en) | Method for gold-plating gold fingers with equal length | |
| CN102905463B (en) | PCB (printed circuit board) structure available for grafting and transplanting and PCB structure grafting method | |
| CN102045958B (en) | Method for plating gold on equilong connecting fingers | |
| CN202218478U (en) | Composite metal connecting piece capable of being mounted on PCB | |
| CN209056543U (en) | A kind of novel positive and negative electrode assembly for button cell and its used braid | |
| CN102014585A (en) | Process for plating gold on long and short gold fingers | |
| CN102045957B (en) | Method for plating gold on equilong connecting fingers | |
| CN203435230U (en) | Gold finger electroplating structure of multilayer printed circuit board | |
| CN102076175A (en) | Full gold-plated board manufacturing technology | |
| CN103847162B (en) | A kind of golden reinforcing chip of surface gold-plating and preparation technology thereof | |
| CN102510680A (en) | Manufacturing process for circuit board with long and short gold fingers | |
| CN101937744B (en) | The nead frame termination case of chip potentiometer and method for production thereof | |
| CN202269098U (en) | Circuit board processing structure with long and short goldfingers | |
| CN201601893U (en) | PCB board provided with golden finger |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: SHENNAN CIRCUIT CO., LTD. Free format text: FORMER NAME: SHENZHEN SHENNAN CIRCUITS CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120704 Termination date: 20151228 |
|
| EXPY | Termination of patent right or utility model |