CN103847162B - A kind of golden reinforcing chip of surface gold-plating and preparation technology thereof - Google Patents
A kind of golden reinforcing chip of surface gold-plating and preparation technology thereof Download PDFInfo
- Publication number
- CN103847162B CN103847162B CN201410060016.1A CN201410060016A CN103847162B CN 103847162 B CN103847162 B CN 103847162B CN 201410060016 A CN201410060016 A CN 201410060016A CN 103847162 B CN103847162 B CN 103847162B
- Authority
- CN
- China
- Prior art keywords
- winding
- gold
- reinforcing chip
- plating
- stainless steel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The invention discloses a kind of golden reinforcing chip and preparation technology thereof of surface gold-plating, carry out partially plating gold at stainless-steel roll belt surface, the spacing between adjacent gold-plated region keeps equal; One deck winding gum is attached by parcel-gilt for surface stainless steel winding; Utilize press equipment by stainless steel winding and the tight pressing of winding gum; And form the forming area of interval to be punched as the golden reinforcing chip of surface gold-plating; Utilize precise punching die to carry out product punching press, the region of punching press must be positioned at interval to be punched; Precise punching die carries out punching press to form the golden reinforcing chip of surface gold-plating.By the way, the golden reinforcing chip of a kind of surface gold-plating of the present invention and preparation technology thereof, improve traditional preparation method, not only ensured the product quality of reinforcing chip, improve the service behaviour of reinforcing chip, and its surface color is attractive in appearance, being not easy to be corroded, is preferred in equivalents.
Description
Technical field
The present invention relates to flexible PCB manufacture field, particularly a kind of golden reinforcing chip of surface gold-plating and preparation technology thereof.
Background technology
Increasingly mature along with electronic product FPC technique, the requirement of outward appearance and performance that designer tackles FPC part mutually also improves day by day, especially for embodying the high texture of outward appearance and comparatively strong more stable electric conductivity.Workpiece main on the real FPC of reinforcing chip, the reinforcing chip with works fine performance can increase substantially the product quality of FPC.Anti-oxidant and the resistance to corrosion of common reinforcing chip is more weak, often causes peeling off of reinforcing chip surface color, affects the electric conductivity of product significantly.And traditional preparation technology's loudness is complicated, operating efficiency is low, is unfavorable for expanding production.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of golden reinforcing chip and preparation technology thereof of surface gold-plating, improves the preparation method of traditional reinforcing chip, improves the product quality of reinforcing chip.
For solving the problems of the technologies described above, the present invention adopt a technical scheme be: the golden reinforcing chip that a kind of surface gold-plating is provided, this golden reinforcing chip is the layer structure of compound, its with stainless steel winding for basic unit, stainless-steel roll belt surface local complexity Gold plated Layer; Size between adjacent Gold plated Layer requires to determine according to Product Process; Described Gold plated Layer is also pasted with winding gum, and the size of winding gum and the consistent size of stainless steel winding, to realize accurate laminating.
Prepare the preparation technology of above-mentioned reinforcing chip, the step of described preparation technology comprises:
The first, the stainless steel winding of selection standard specification, carries out partially plating gold at stainless-steel roll belt surface, and the spacing between adjacent gold-plated region keeps equal;
The second, attach one deck winding gum by parcel-gilt for surface stainless steel winding, stainless steel winding and winding gum are accurately located by localization tool;
3rd, utilize press equipment by stainless steel winding and the tight pressing of winding gum; And form the forming area of interval to be punched as the golden reinforcing chip of surface gold-plating; This interval to be punched for be fitted with winding gum and cover the stainless steel winding of Gold plated Layer;
4th, utilize precise punching die to carry out product punching press, the region of punching press must be positioned at interval to be punched; Precise punching die carries out punching press to form the golden reinforcing chip of surface gold-plating.
The invention has the beneficial effects as follows: golden reinforcing chip and preparation technology thereof that a kind of surface gold-plating is provided, improve traditional preparation method, not only ensure the product quality of reinforcing chip, improve the service behaviour of reinforcing chip, and its surface color is attractive in appearance, being not easy to be corroded, is preferred in equivalents.
Accompanying drawing explanation
Fig. 1 is a kind of structural representation of metal reinforcement sheet of surface gold-plating;
Structural representation when Fig. 2 is press equipment pressing;
Plan structure schematic diagram when Fig. 3 is press equipment pressing;
Structural representation when Fig. 4 is diel punching press;
Mark in accompanying drawing is as follows: 1, stainless steel winding; 2, Gold plated Layer; 3, winding gum; 4, press equipment; 5, localization tool; 6, interval to be punched; 7, precise punching die; 8, forming area; 9, the golden reinforcing chip of surface gold-plating.
Detailed description of the invention
Below preferred embodiment of the present invention is described in detail, can be easier to make advantages and features of the invention be readily appreciated by one skilled in the art, thus more explicit defining is made to protection scope of the present invention.
The embodiment of the present invention comprises: a kind of golden reinforcing chip of surface gold-plating, and this golden reinforcing chip is the layer structure of compound, its with stainless steel winding 1 for basic unit, the surperficial local complexity Gold plated Layer 2 of stainless steel winding 1; Size between adjacent Gold plated Layer 2 requires to determine according to Product Process; Described Gold plated Layer 2 is also pasted with winding gum 3, and the size of winding gum 3 and the consistent size of stainless steel winding, to realize accurate laminating.
Prepare the preparation technology of above-mentioned reinforcing chip, the step of described preparation technology comprises:
The first, the stainless steel winding 1 of selection standard specification, carries out partially plating gold on stainless steel winding 1 surface, and the spacing between adjacent gold-plated region keeps equal;
The second, on surface, parcel-gilt stainless steel winding 1 on the surface, attaches one deck winding gum 3 by press equipment 4, and stainless steel winding 1 and winding gum 3 are accurately located by localization tool 5;
3rd, utilize press equipment 4 by stainless steel winding 1 and winding gum 3 closely pressing; And form to be punched interval 6 as the forming area 8 of the golden reinforcing chip 9 of surface gold-plating; This to be punched interval 6 for be fitted with winding gum 3 and cover the stainless steel winding 1 of Gold plated Layer 2;
4th, utilize precise punching die 7 to carry out product punching press, the region of punching press must be positioned to be punched interval 6; Precise punching die 7 carries out punching press to form the golden reinforcing chip 9 of surface gold-plating.
The golden reinforcing chip of a kind of surface gold-plating of the present invention and preparation technology thereof, improve traditional preparation method, not only ensured the product quality of reinforcing chip, improve the service behaviour of reinforcing chip, and its surface color is attractive in appearance, being not easy to be corroded, is preferred in equivalents.
Above-described embodiment is only for illustrating technical conceive of the present invention and feature; its object is to person skilled in the art can be understood content of the present invention and be implemented; can not limit the scope of the invention with this; all equivalences done according to Spirit Essence of the present invention change or modify, and all should be encompassed in protection scope of the present invention.
Claims (1)
1. prepare a preparation technology for the golden reinforcing chip of surface gold-plating, this golden reinforcing chip is the layer structure of compound, its with stainless steel winding for basic unit, stainless-steel roll belt surface local complexity Gold plated Layer; Size between adjacent Gold plated Layer requires to determine according to Product Process; Described Gold plated Layer is also pasted with winding gum, and the size of winding gum and the consistent size of stainless steel winding, to realize accurate laminating;
It is characterized in that, described preparation technology comprises the steps:
First: the stainless steel winding of selection standard specification, carry out partially plating gold at stainless-steel roll belt surface, the spacing between adjacent gold-plated region keeps equal;
Second: attach one deck winding gum by parcel-gilt for surface stainless steel winding, stainless steel winding and winding gum are accurately located by localization tool;
3rd: utilize press equipment by stainless steel winding and the tight pressing of winding gum; And form the forming area of interval to be punched as the golden reinforcing chip of surface gold-plating; This interval to be punched for be fitted with winding gum and cover the stainless steel winding of Gold plated Layer;
4th: utilize precise punching die to carry out product punching press, the region of punching press must be positioned at interval to be punched; Precise punching die carries out punching press to form the golden reinforcing chip of surface gold-plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410060016.1A CN103847162B (en) | 2014-02-21 | 2014-02-21 | A kind of golden reinforcing chip of surface gold-plating and preparation technology thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410060016.1A CN103847162B (en) | 2014-02-21 | 2014-02-21 | A kind of golden reinforcing chip of surface gold-plating and preparation technology thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103847162A CN103847162A (en) | 2014-06-11 |
| CN103847162B true CN103847162B (en) | 2016-01-27 |
Family
ID=50855511
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410060016.1A Active CN103847162B (en) | 2014-02-21 | 2014-02-21 | A kind of golden reinforcing chip of surface gold-plating and preparation technology thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103847162B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104411096A (en) * | 2014-11-28 | 2015-03-11 | 苏州米达思精密电子有限公司 | Production method of glue contraction reinforcing slice |
| CN105392290A (en) * | 2015-12-11 | 2016-03-09 | 苏州米达思精密电子有限公司 | Fabrication method of regularly composed reinforcing panel with single electrophoretic surface |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1475226A1 (en) * | 2003-05-09 | 2004-11-10 | Kabushiki Kaisha Kobe Seiko Sho | Resin coated metal sheet |
| JP2005213580A (en) * | 2004-01-29 | 2005-08-11 | Jfe Steel Kk | Production method of tin plated steel plate |
| CN1875128A (en) * | 2003-11-04 | 2006-12-06 | 山特维克知识产权股份有限公司 | A stainless steel strip coated with a metallic layer |
| CN102009504A (en) * | 2010-02-10 | 2011-04-13 | 湘潭大学 | Steel strip plated with multi-layer micron/nano-crystal nickel films and preparation method thereof |
| CN102209436A (en) * | 2010-03-31 | 2011-10-05 | 比亚迪股份有限公司 | Method for manufacturing coiled circuit board |
| CN102677111A (en) * | 2012-04-20 | 2012-09-19 | 立兆股份有限公司 | Preparation method of workpiece with bright surface coating layer |
| CN202721899U (en) * | 2012-06-27 | 2013-02-06 | 淳华科技(昆山)有限公司 | Flexible printed circuit board reinforcing sheet bonding device |
| CN103085384A (en) * | 2011-11-07 | 2013-05-08 | 日本帕卡濑精株式会社 | A metal exterior material having a resin film and a method for manufacturing the same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101171450B1 (en) * | 2009-12-29 | 2012-08-06 | 주식회사 포스코 | Method for hot press forming of coated steel and hot press formed prodicts using the same |
-
2014
- 2014-02-21 CN CN201410060016.1A patent/CN103847162B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1475226A1 (en) * | 2003-05-09 | 2004-11-10 | Kabushiki Kaisha Kobe Seiko Sho | Resin coated metal sheet |
| CN1875128A (en) * | 2003-11-04 | 2006-12-06 | 山特维克知识产权股份有限公司 | A stainless steel strip coated with a metallic layer |
| JP2005213580A (en) * | 2004-01-29 | 2005-08-11 | Jfe Steel Kk | Production method of tin plated steel plate |
| CN102009504A (en) * | 2010-02-10 | 2011-04-13 | 湘潭大学 | Steel strip plated with multi-layer micron/nano-crystal nickel films and preparation method thereof |
| CN102209436A (en) * | 2010-03-31 | 2011-10-05 | 比亚迪股份有限公司 | Method for manufacturing coiled circuit board |
| CN103085384A (en) * | 2011-11-07 | 2013-05-08 | 日本帕卡濑精株式会社 | A metal exterior material having a resin film and a method for manufacturing the same |
| CN102677111A (en) * | 2012-04-20 | 2012-09-19 | 立兆股份有限公司 | Preparation method of workpiece with bright surface coating layer |
| CN202721899U (en) * | 2012-06-27 | 2013-02-06 | 淳华科技(昆山)有限公司 | Flexible printed circuit board reinforcing sheet bonding device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103847162A (en) | 2014-06-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203722926U (en) | PCB made of PTFE material | |
| CN203618240U (en) | Gasket for pressing stepped printed circuit board | |
| CN105307438A (en) | Electronic device shell, manufacturing method of electronic device shell and electronic device | |
| CN201823813U (en) | Punch forming mould | |
| CN103847162B (en) | A kind of golden reinforcing chip of surface gold-plating and preparation technology thereof | |
| WO2008111309A1 (en) | Recognition mark, and circuit substrate manufacturing method | |
| CN203697139U (en) | Die for punching half holes | |
| CN201838582U (en) | Lead frame structure with big top and small bottom of metal foot of integrated circuit or discrete device | |
| CN203843910U (en) | Die-cutting machine with automatic waste discharge function | |
| CN202826579U (en) | Peelable composite plate for manufacturing composite gasket | |
| CN203752603U (en) | Golden stainless steel coil tape with locally-gilded surface | |
| CN103002671A (en) | Manufacture method of joint part of hard-and-soft combined plate | |
| CN202773167U (en) | Circuit board | |
| CN203528068U (en) | Printing plate for finishing embossing and gold stamping at different positions through one step | |
| CN202998654U (en) | Flexible circuit single sided board with PET film being attached to base material | |
| CN204090314U (en) | A kind of electricity collection sheet semi-finished product | |
| CN204725586U (en) | A kind of die cutting mechanism | |
| CN202045255U (en) | Precise compound die | |
| CN205436755U (en) | Forming device of reinforcement piece | |
| CN104411094A (en) | FPC manufacture method | |
| CN201418202Y (en) | PCB board with stamp hole | |
| CN109462021A (en) | The production method of NFC antenna | |
| CN204180380U (en) | A kind of pcb board with stepped hole | |
| CN204763921U (en) | Electronic equipment's protective sheath | |
| CN204991697U (en) | Mask exposure utilizes poor packaging part of optimizing pin of metal hardness down |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20191010 Address after: 226300 group 1, Zixing village, Xingdong street, Tongzhou District, Nantong City, Jiangsu Province Patentee after: Nantong Junqi Machinery Co., Ltd. Address before: Wuzhong District Luzhi Town, Dong Zhuang Road Suzhou City, Jiangsu province 215127 -4 No. 18 Suzhou Midasi Precision Electronics Co. Ltd. Patentee before: Suzhou Midas Precision Electronic Co., Ltd. |