CN204180380U - A kind of pcb board with stepped hole - Google Patents
A kind of pcb board with stepped hole Download PDFInfo
- Publication number
- CN204180380U CN204180380U CN201420736354.8U CN201420736354U CN204180380U CN 204180380 U CN204180380 U CN 204180380U CN 201420736354 U CN201420736354 U CN 201420736354U CN 204180380 U CN204180380 U CN 204180380U
- Authority
- CN
- China
- Prior art keywords
- hole
- shrinkage pool
- ink layer
- stepped hole
- diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model discloses a kind of pcb board with stepped hole, comprise the substrate of band through hole, substrate is provided with ink layer, and leave a blank and form the shrinkage pool be communicated with through hole in the corresponding lead to the hole site place of ink layer, and described shrinkage pool diameter is greater than through-hole diameter to form stepped hole.The utility model owing to directly forming shrinkage pool on ink layer, and make shrinkage pool diameter be greater than through-hole diameter on substrate, thus formation stepped hole, without the need to carrying out twice punch operation, processing is simple, and directly forms shrinkage pool due to ink layer, and the degree of depth of shrinkage pool depends on the thickness of ink layer, not by the restriction of drilling technology, the thickness of circuit board thus effectively can be reduced.
Description
Technical field
The utility model relates to pcb board field, particularly a kind of pcb board with stepped hole.
Background technology
It is fixing that existing pcb board generally realizes with other elements by the fixed leg on its corner, it is in the course of processing, need to carry out twice punch operation, first aperture is processed, then on aperture, process macropore to form stepped hole, then fixed leg is inserted in aperture, and heat the part that fixed leg is positioned at macropore, make it be melted in macropore, thus fixed leg and pcb board are fixed as one.This pcb board carries out twice punch operation due to needs, processes trouble, and is subject to the restriction of drilling technology, and circuit board thickness is larger.
Utility model content
In order to overcome the deficiencies in the prior art, the utility model provides a kind of pcb board with stepped hole, and it is easy to process, without the need to carrying out twice punching, and can reduce circuit board thickness.
The utility model solves the technical scheme that its technical problem adopts:
With a pcb board for stepped hole, comprise the substrate of band through hole, substrate is provided with ink layer, and leave a blank and form the shrinkage pool be communicated with through hole in the corresponding lead to the hole site place of ink layer, and described shrinkage pool diameter is greater than through-hole diameter to form stepped hole.
As the improvement of technique scheme, the thickness of described ink layer is 0.1mm ~ 1mm.
Further, the center line of described shrinkage pool and the center line of through hole overlapping.
The beneficial effects of the utility model are: the utility model owing to directly forming shrinkage pool on ink layer, and make shrinkage pool diameter be greater than through-hole diameter on substrate, thus formation stepped hole, without the need to carrying out twice punch operation, processing is simple, and directly forms shrinkage pool due to ink layer, and the degree of depth of shrinkage pool depends on the thickness of ink layer, not by the restriction of drilling technology, the thickness of circuit board thus effectively can be reduced.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is further illustrated.
Fig. 1 is structural representation of the present utility model.
Embodiment
With reference to Fig. 1, a kind of pcb board with stepped hole of the present utility model, comprise the substrate 1 of band through hole 11, substrate 1 is provided with ink layer 2, leave a blank and form the shrinkage pool 21 be communicated with through hole 11 in ink layer 2 corresponding through hole 11 position, and described shrinkage pool 21 diameter is greater than through hole 11 diameter to form stepped hole.Preferably, the thickness of described ink layer 2 is 0.1mm ~ 1mm, and its processing technology is better, and ink layer 2 thickness can be avoided too thin and cause shrinkage pool 21 degree of depth to affect being fixedly connected with between fixed leg with pcb board not.The center line of described shrinkage pool 21 is overlapping with the center line of through hole 11, effectively can ensure that fixed leg heating and melting part opposing through-bores 11 center line is uniformly distributed, and improves the stress performance of fixed leg.
The utility model owing to directly forming shrinkage pool 21 on ink layer 2, and make shrinkage pool 21 diameter be greater than through hole 11 diameter on substrate 1, thus formation stepped hole, without the need to carrying out twice punch operation, processing is simple, and directly forms shrinkage pool 21 due to ink layer 2, and the degree of depth of shrinkage pool 21 depends on the thickness of ink layer 2, not by the restriction of drilling technology, the thickness of circuit board thus effectively can be reduced.
Certainly, the utility model, except above-mentioned execution mode, can also have other structural distortion, and these equivalent technical solutions also should within its protection range.
Claims (3)
1. the pcb board with stepped hole, it is characterized in that: the substrate (1) comprising band through hole (11), substrate (1) is provided with ink layer (2), leave a blank and form the shrinkage pool (21) be communicated with through hole (11) in ink layer (2) corresponding through hole (11) position, and described shrinkage pool (21) diameter is greater than through hole (11) diameter to form stepped hole.
2. a kind of pcb board with stepped hole according to claim 1, is characterized in that: the thickness of described ink layer (2) is 0.1mm ~ 1mm.
3. a kind of pcb board with stepped hole according to claim 1, is characterized in that: the center line of described shrinkage pool (21) is overlapping with the center line of through hole (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420736354.8U CN204180380U (en) | 2014-11-28 | 2014-11-28 | A kind of pcb board with stepped hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420736354.8U CN204180380U (en) | 2014-11-28 | 2014-11-28 | A kind of pcb board with stepped hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204180380U true CN204180380U (en) | 2015-02-25 |
Family
ID=52569151
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420736354.8U Expired - Fee Related CN204180380U (en) | 2014-11-28 | 2014-11-28 | A kind of pcb board with stepped hole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204180380U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104411087A (en) * | 2014-11-28 | 2015-03-11 | 江门市宏丰电子科技有限公司 | PCB with stepped hole |
-
2014
- 2014-11-28 CN CN201420736354.8U patent/CN204180380U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104411087A (en) * | 2014-11-28 | 2015-03-11 | 江门市宏丰电子科技有限公司 | PCB with stepped hole |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150225 Termination date: 20181128 |