CN203691767U - High-temperature-resistant peelable blue gel printed circuit board - Google Patents

High-temperature-resistant peelable blue gel printed circuit board Download PDF

Info

Publication number
CN203691767U
CN203691767U CN201320877223.7U CN201320877223U CN203691767U CN 203691767 U CN203691767 U CN 203691767U CN 201320877223 U CN201320877223 U CN 201320877223U CN 203691767 U CN203691767 U CN 203691767U
Authority
CN
China
Prior art keywords
peelable blue
temperature
blue gel
printed circuit
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201320877223.7U
Other languages
Chinese (zh)
Inventor
屈云波
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DALIAN CHONGDA CIRCUIT CO LTD
Original Assignee
DALIAN CHONGDA CIRCUIT CO LTD
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DALIAN CHONGDA CIRCUIT CO LTD filed Critical DALIAN CHONGDA CIRCUIT CO LTD
Priority to CN201320877223.7U priority Critical patent/CN203691767U/en
Application granted granted Critical
Publication of CN203691767U publication Critical patent/CN203691767U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The utility model belongs to a high-temperature-resistant peelable blue gel printed circuit board. The high-temperature-resistant peelable blue gel printed circuit board includes a finished board (1), a substrate (5), a mounting groove (2), a component plug-in hole (3) and a finished board circuit (4). The high-temperature-resistant peelable blue gel printed circuit board is characterized in that: the mounting groove (2) is internally provided with a peelable blue gel (2 - 2); a mounting slot (2 - 1) is arranged above the peelable blue gel (2 - 2); the finished board circuit (4) is formed by providing a circuit copper layer (4 - 2) above the substrate (5); and a peelable blue gel layer (4 - 1) is arranged above the circuit copper layer (4 - 2). The high-temperature-resistant peelable blue gel printed circuit board saves the solder, can withstand the lead-free reflow cycle, is easy to peel off after welding, and is resistant to the high temperature.

Description

High temperature resistant peelable blue glue printed wiring board
Technical field
The utility model belongs to wiring board, particularly a kind of high temperature resistant peelable blue glue printed wiring board.
Background technology
High temperature resistant peelable blue glue is mainly used in wiring board and shields installing in welding process, can effectively improve in welding process solder residue in wiring board slotted eye, and prevents the scolder on welding region not.More to come and go the waste that kind of scolder causes, and can cause repeatedly reflow soldering circulation, postwelding is difficult for peeling off.
Summary of the invention
The object of the invention is to overcome above-mentioned technical deficiency, a kind of scolder of saving is provided, can keep out repeatedly unleaded reflux cycle; The high temperature resistant peelable blue glue printed wiring board of easily peeling off after welding.
The technical scheme that the utility model technical solution problem adopts is: a kind of high temperature resistant peelable blue glue printed wiring board, comprise production board, base material, mounting groove, components and parts insert hole and production board circuit, it is characterized in that being equipped with peelable blue glue in the groove of mounting groove, on peelable blue glue, be provided with installation groove; Production board circuit is that circuit copper layer is housed on base material, and peelable blue glue-line is housed on circuit copper layer.
The beneficial effects of the utility model are: this utility model is saved scolder, can keep out unleaded reflux cycle; After welding, easily peel off, high temperature resistant.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, illustrate with embodiment.
Fig. 1 is the front view of high temperature resistant peelable blue glue printed wiring board;
Fig. 2 is the A-A profile of Fig. 1;
Fig. 3 is the B-B profile of Fig. 1.
In figure: 1-production board; 2-mounting groove; 2-1-installs groove; The peelable blue glue of 2-2-; 3-components and parts insert hole; 4-production board circuit; The peelable blue glue-line of 4-1-; 4-2-circuit copper layer; 5-base material.
Embodiment
Embodiment, with reference to accompanying drawing, a kind of high temperature resistant peelable blue glue printed wiring board, comprise production board 1, base material 5, mounting groove 2, components and parts insert hole 3 and production board circuit 4, is characterized in that being equipped with peelable blue glue 2-2 in the groove of mounting groove 2, is provided with groove 2-1 is installed on peelable blue glue 2-2; Production board circuit 4 is that circuit copper layer 4-2 is housed on base material 5, and peelable blue glue-line 4-1 is housed on circuit copper layer 4-2.
The processing method of high temperature resistant peelable blue glue printed wiring board is: basic roughly the same with common circuit board processing method, peelable blue glue 2-2 is housed in mounting groove 2, and leave in the above a mounting groove 2-1; Production board circuit 4, on base material 5, exceeds the plane of base material 5.

Claims (1)

1. a high temperature resistant peelable blue glue printed wiring board, comprise production board (1), base material (5), mounting groove (2), components and parts insert hole (3) and production board circuit (4), it is characterized in that being equipped with peelable blue glue (2-2) in the groove of mounting groove (2), on peelable blue glue (2-2), be provided with groove (2-1) is installed; Production board circuit (4) is that circuit copper layer (4-2) is housed on base material (5), and peelable blue glue-line (4-1) is housed on circuit copper layer (4-2).
CN201320877223.7U 2013-12-30 2013-12-30 High-temperature-resistant peelable blue gel printed circuit board Expired - Fee Related CN203691767U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320877223.7U CN203691767U (en) 2013-12-30 2013-12-30 High-temperature-resistant peelable blue gel printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320877223.7U CN203691767U (en) 2013-12-30 2013-12-30 High-temperature-resistant peelable blue gel printed circuit board

Publications (1)

Publication Number Publication Date
CN203691767U true CN203691767U (en) 2014-07-02

Family

ID=51013615

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320877223.7U Expired - Fee Related CN203691767U (en) 2013-12-30 2013-12-30 High-temperature-resistant peelable blue gel printed circuit board

Country Status (1)

Country Link
CN (1) CN203691767U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107466170A (en) * 2017-07-24 2017-12-12 惠州市金百泽电路科技有限公司 There is the printed circuit board processing method that insert hole designs in a kind of step groove

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107466170A (en) * 2017-07-24 2017-12-12 惠州市金百泽电路科技有限公司 There is the printed circuit board processing method that insert hole designs in a kind of step groove
CN107466170B (en) * 2017-07-24 2019-09-03 惠州市金百泽电路科技有限公司 A kind of printed circuit board processing method for thering is insert hole to design in step groove

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140702

Termination date: 20191230