CN203691767U - High-temperature-resistant peelable blue gel printed circuit board - Google Patents
High-temperature-resistant peelable blue gel printed circuit board Download PDFInfo
- Publication number
- CN203691767U CN203691767U CN201320877223.7U CN201320877223U CN203691767U CN 203691767 U CN203691767 U CN 203691767U CN 201320877223 U CN201320877223 U CN 201320877223U CN 203691767 U CN203691767 U CN 203691767U
- Authority
- CN
- China
- Prior art keywords
- peelable blue
- temperature
- blue gel
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound data:image/svg+xml;base64,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 data:image/svg+xml;base64,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 [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052802 copper Inorganic materials 0.000 claims abstract description 9
- 239000010949 copper Substances 0.000 claims abstract description 9
- 239000003292 glue Substances 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 9
- 238000003466 welding Methods 0.000 abstract description 6
- 229910000679 solder Inorganic materials 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract 2
- 238000000034 method Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 208000008425 Protein Deficiency Diseases 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- -1 mounting groove Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Abstract
The utility model belongs to a high-temperature-resistant peelable blue gel printed circuit board. The high-temperature-resistant peelable blue gel printed circuit board includes a finished board (1), a substrate (5), a mounting groove (2), a component plug-in hole (3) and a finished board circuit (4). The high-temperature-resistant peelable blue gel printed circuit board is characterized in that: the mounting groove (2) is internally provided with a peelable blue gel (2 - 2); a mounting slot (2 - 1) is arranged above the peelable blue gel (2 - 2); the finished board circuit (4) is formed by providing a circuit copper layer (4 - 2) above the substrate (5); and a peelable blue gel layer (4 - 1) is arranged above the circuit copper layer (4 - 2). The high-temperature-resistant peelable blue gel printed circuit board saves the solder, can withstand the lead-free reflow cycle, is easy to peel off after welding, and is resistant to the high temperature.
Description
Technical field
The utility model belongs to wiring board, particularly a kind of high temperature resistant peelable blue glue printed wiring board.
Background technology
High temperature resistant peelable blue glue is mainly used in wiring board and shields installing in welding process, can effectively improve in welding process solder residue in wiring board slotted eye, and prevents the scolder on welding region not.More to come and go the waste that kind of scolder causes, and can cause repeatedly reflow soldering circulation, postwelding is difficult for peeling off.
Summary of the invention
The object of the invention is to overcome above-mentioned technical deficiency, a kind of scolder of saving is provided, can keep out repeatedly unleaded reflux cycle; The high temperature resistant peelable blue glue printed wiring board of easily peeling off after welding.
The technical scheme that the utility model technical solution problem adopts is: a kind of high temperature resistant peelable blue glue printed wiring board, comprise production board, base material, mounting groove, components and parts insert hole and production board circuit, it is characterized in that being equipped with peelable blue glue in the groove of mounting groove, on peelable blue glue, be provided with installation groove; Production board circuit is that circuit copper layer is housed on base material, and peelable blue glue-line is housed on circuit copper layer.
The beneficial effects of the utility model are: this utility model is saved scolder, can keep out unleaded reflux cycle; After welding, easily peel off, high temperature resistant.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, illustrate with embodiment.
Fig. 1 is the front view of high temperature resistant peelable blue glue printed wiring board;
Fig. 2 is the A-A profile of Fig. 1;
Fig. 3 is the B-B profile of Fig. 1.
In figure: 1-production board; 2-mounting groove; 2-1-installs groove; The peelable blue glue of 2-2-; 3-components and parts insert hole; 4-production board circuit; The peelable blue glue-line of 4-1-; 4-2-circuit copper layer; 5-base material.
Embodiment
Embodiment, with reference to accompanying drawing, a kind of high temperature resistant peelable blue glue printed wiring board, comprise production board 1, base material 5, mounting groove 2, components and parts insert hole 3 and production board circuit 4, is characterized in that being equipped with peelable blue glue 2-2 in the groove of mounting groove 2, is provided with groove 2-1 is installed on peelable blue glue 2-2; Production board circuit 4 is that circuit copper layer 4-2 is housed on base material 5, and peelable blue glue-line 4-1 is housed on circuit copper layer 4-2.
The processing method of high temperature resistant peelable blue glue printed wiring board is: basic roughly the same with common circuit board processing method, peelable blue glue 2-2 is housed in mounting groove 2, and leave in the above a mounting groove 2-1; Production board circuit 4, on base material 5, exceeds the plane of base material 5.
Claims (1)
1. a high temperature resistant peelable blue glue printed wiring board, comprise production board (1), base material (5), mounting groove (2), components and parts insert hole (3) and production board circuit (4), it is characterized in that being equipped with peelable blue glue (2-2) in the groove of mounting groove (2), on peelable blue glue (2-2), be provided with groove (2-1) is installed; Production board circuit (4) is that circuit copper layer (4-2) is housed on base material (5), and peelable blue glue-line (4-1) is housed on circuit copper layer (4-2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320877223.7U CN203691767U (en) | 2013-12-30 | 2013-12-30 | High-temperature-resistant peelable blue gel printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320877223.7U CN203691767U (en) | 2013-12-30 | 2013-12-30 | High-temperature-resistant peelable blue gel printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203691767U true CN203691767U (en) | 2014-07-02 |
Family
ID=51013615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320877223.7U Expired - Fee Related CN203691767U (en) | 2013-12-30 | 2013-12-30 | High-temperature-resistant peelable blue gel printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203691767U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107466170A (en) * | 2017-07-24 | 2017-12-12 | 惠州市金百泽电路科技有限公司 | There is the printed circuit board processing method that insert hole designs in a kind of step groove |
-
2013
- 2013-12-30 CN CN201320877223.7U patent/CN203691767U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107466170A (en) * | 2017-07-24 | 2017-12-12 | 惠州市金百泽电路科技有限公司 | There is the printed circuit board processing method that insert hole designs in a kind of step groove |
| CN107466170B (en) * | 2017-07-24 | 2019-09-03 | 惠州市金百泽电路科技有限公司 | A kind of printed circuit board processing method for thering is insert hole to design in step groove |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140702 Termination date: 20191230 |