CN104411087A - PCB with stepped hole - Google Patents
PCB with stepped hole Download PDFInfo
- Publication number
- CN104411087A CN104411087A CN201410715295.0A CN201410715295A CN104411087A CN 104411087 A CN104411087 A CN 104411087A CN 201410715295 A CN201410715295 A CN 201410715295A CN 104411087 A CN104411087 A CN 104411087A
- Authority
- CN
- China
- Prior art keywords
- hole
- ink layer
- stepped hole
- shrinkage pool
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
Abstract
The invention discloses a PCB (Printed Circuit Board) with a stepped hole. The PCB comprises a substrate with a through hole, wherein an ink layer is arranged on the substrate, a position, corresponding to the through hole, of the ink layer leaves a blank to form a concave hole communicated with the through hole, and the diameter of the concave hole is more than that of the through hole to form the stepped hole. According to the invention, the concave hole is directly formed in the ink layer and the diameter of the concave hole is more than that of the through hole in the substrate, so that the stepped hole is formed, two punching operations are not needed, the processing is simple, in addition, as the concave hole is directly formed in the ink layer, the depth of the concave hole is determined by the thickness of the ink layer and is not limited by the punching process, so that the thickness of the circuit board is effectively reduced.
Description
Technical field
The present invention relates to pcb board field, particularly a kind of pcb board with stepped hole.
Background technology
It is fixing that existing pcb board generally realizes with other elements by the fixed leg on its corner, it is in the course of processing, need to carry out twice punch operation, first aperture is processed, then on aperture, process macropore to form stepped hole, then fixed leg is inserted in aperture, and heat the part that fixed leg is positioned at macropore, make it be melted in macropore, thus fixed leg and pcb board are fixed as one.This pcb board carries out twice punch operation due to needs, processes trouble, and is subject to the restriction of drilling technology, and circuit board thickness is larger.
Summary of the invention
In order to overcome the deficiencies in the prior art, the invention provides a kind of pcb board with stepped hole, it is easy to process, without the need to carrying out twice punching, and can reduce circuit board thickness.
The technical solution adopted for the present invention to solve the technical problems is:
With a pcb board for stepped hole, comprise the substrate of band through hole, substrate is provided with ink layer, and leave a blank and form the shrinkage pool be communicated with through hole in the corresponding lead to the hole site place of ink layer, and described shrinkage pool diameter is greater than through-hole diameter to form stepped hole.
As the improvement of technique scheme, the thickness of described ink layer is 0.1mm ~ 1mm.
Further, the center line of described shrinkage pool and the center line of through hole overlapping.
The invention has the beneficial effects as follows: the present invention owing to directly forming shrinkage pool on ink layer, and make shrinkage pool diameter be greater than through-hole diameter on substrate, thus formation stepped hole, without the need to carrying out twice punch operation, processing is simple, and directly forms shrinkage pool due to ink layer, and the degree of depth of shrinkage pool depends on the thickness of ink layer, not by the restriction of drilling technology, the thickness of circuit board thus effectively can be reduced.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the present invention is further described.
Fig. 1 is structural representation of the present invention.
Embodiment
With reference to Fig. 1, a kind of pcb board with stepped hole of the present invention, comprise the substrate 1 of band through hole 11, substrate 1 is provided with ink layer 2, leave a blank and form the shrinkage pool 21 be communicated with through hole 11 in ink layer 2 corresponding through hole 11 position, and described shrinkage pool 21 diameter is greater than through hole 11 diameter to form stepped hole.Preferably, the thickness of described ink layer 2 is 0.1mm ~ 1mm, and its processing technology is better, and ink layer 2 thickness can be avoided too thin and cause shrinkage pool 21 degree of depth to affect being fixedly connected with between fixed leg with pcb board not.The center line of described shrinkage pool 21 is overlapping with the center line of through hole 11, effectively can ensure that fixed leg heating and melting part opposing through-bores 11 center line is uniformly distributed, and improves the stress performance of fixed leg.
The present invention owing to directly forming shrinkage pool 21 on ink layer 2, and make shrinkage pool 21 diameter be greater than through hole 11 diameter on substrate 1, thus formation stepped hole, without the need to carrying out twice punch operation, processing is simple, and directly forms shrinkage pool 21 due to ink layer 2, and the degree of depth of shrinkage pool 21 depends on the thickness of ink layer 2, not by the restriction of drilling technology, the thickness of circuit board thus effectively can be reduced.
Certainly, the present invention, except above-mentioned execution mode, can also have other structural distortion, and these equivalent technical solutions also should within its protection range.
Claims (3)
1. the pcb board with stepped hole, it is characterized in that: the substrate (1) comprising band through hole (11), substrate (1) is provided with ink layer (2), leave a blank and form the shrinkage pool (21) be communicated with through hole (11) in ink layer (2) corresponding through hole (11) position, and described shrinkage pool (21) diameter is greater than through hole (11) diameter to form stepped hole.
2. a kind of pcb board with stepped hole according to claim 1, is characterized in that: the thickness of described ink layer (2) is 0.1mm ~ 1mm.
3. a kind of pcb board with stepped hole according to claim 1, is characterized in that: the center line of described shrinkage pool (21) is overlapping with the center line of through hole (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410715295.0A CN104411087B (en) | 2014-11-28 | 2014-11-28 | A kind of pcb board with stepped hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410715295.0A CN104411087B (en) | 2014-11-28 | 2014-11-28 | A kind of pcb board with stepped hole |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104411087A true CN104411087A (en) | 2015-03-11 |
| CN104411087B CN104411087B (en) | 2017-10-17 |
Family
ID=52648667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410715295.0A Active CN104411087B (en) | 2014-11-28 | 2014-11-28 | A kind of pcb board with stepped hole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104411087B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106211592A (en) * | 2016-08-31 | 2016-12-07 | 奥士康科技股份有限公司 | A kind of method for designing about ink plugging instrument |
| CN111212527A (en) * | 2020-01-15 | 2020-05-29 | 广东科翔电子科技股份有限公司 | Through hole filling and plating method applied to optical module high-density interconnection HDI board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1462172A (en) * | 2002-05-27 | 2003-12-17 | 联测科技股份有限公司 | Printing circuit board having fixed antiwelding layer |
| CN103167724A (en) * | 2011-12-16 | 2013-06-19 | 田茂福 | Light-emitting diode (LED) double-sided circuit board made by four wires |
| US20130213705A1 (en) * | 2012-02-21 | 2013-08-22 | Fujitsu Limited | Method of fabricating printed-wiring board, and printed-wiring board |
| CN204180380U (en) * | 2014-11-28 | 2015-02-25 | 江门市宏丰电子科技有限公司 | A kind of pcb board with stepped hole |
-
2014
- 2014-11-28 CN CN201410715295.0A patent/CN104411087B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1462172A (en) * | 2002-05-27 | 2003-12-17 | 联测科技股份有限公司 | Printing circuit board having fixed antiwelding layer |
| CN103167724A (en) * | 2011-12-16 | 2013-06-19 | 田茂福 | Light-emitting diode (LED) double-sided circuit board made by four wires |
| US20130213705A1 (en) * | 2012-02-21 | 2013-08-22 | Fujitsu Limited | Method of fabricating printed-wiring board, and printed-wiring board |
| CN204180380U (en) * | 2014-11-28 | 2015-02-25 | 江门市宏丰电子科技有限公司 | A kind of pcb board with stepped hole |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106211592A (en) * | 2016-08-31 | 2016-12-07 | 奥士康科技股份有限公司 | A kind of method for designing about ink plugging instrument |
| CN106211592B (en) * | 2016-08-31 | 2019-01-29 | 奥士康科技股份有限公司 | A kind of design method about ink plugging tool |
| CN111212527A (en) * | 2020-01-15 | 2020-05-29 | 广东科翔电子科技股份有限公司 | Through hole filling and plating method applied to optical module high-density interconnection HDI board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104411087B (en) | 2017-10-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210512 Address after: 529152 floor 1-5, block 312, phase 3, new fortune environmental protection industrial park, yamen Town, Xinhui District, Jiangmen City, Guangdong Province Patentee after: Jiangmen Hongru Electronic Technology Co.,Ltd. Address before: 529000 building 12, 168 Gaoxin West Road, Jianghai District, Jiangmen City, Guangdong Province Patentee before: JIANGMEN HONGFENG ELECTRONIC TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20211011 Address after: 529000 buildings 4 and 6, No. 16, lile Dongrong Road, Jianghai District, Jiangmen City, Guangdong Province Patentee after: JIANGMEN HONGFENG ELECTRONIC TECHNOLOGY Co.,Ltd. Address before: 529152 floor 1-5, block 312, phase 3, new fortune environmental protection industrial park, yamen Town, Xinhui District, Jiangmen City, Guangdong Province Patentee before: Jiangmen Hongru Electronic Technology Co.,Ltd. |
|
| TR01 | Transfer of patent right |