CN203279331U - Novel positioning hole structure for circuit board - Google Patents
Novel positioning hole structure for circuit board Download PDFInfo
- Publication number
- CN203279331U CN203279331U CN 201320200242 CN201320200242U CN203279331U CN 203279331 U CN203279331 U CN 203279331U CN 201320200242 CN201320200242 CN 201320200242 CN 201320200242 U CN201320200242 U CN 201320200242U CN 203279331 U CN203279331 U CN 203279331U
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- CN
- China
- Prior art keywords
- positioning hole
- location hole
- hole structure
- sides
- layer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a novel positioning hole structure for a circuit board. The novel positioning hole structure comprises a board body, wherein the board body comprises a PI layer and metal layers, the metal layers are distributed at the two sides of the PI layer, the board body is provided with a positioning hole penetrating the PI layer and the metal layers, metal circular rings surrounding the outer periphery of the positioning hole are respectively formed on the metal layers at the two sides in a segmented manner, and the metal circular rings at the two sides are equal in outer circumferential diameter. The novel positioning hole structure for a circuit board is characterized in that the two upper and lower sides of the positioning hole are provided with the metal circular rings; compared with a single side circular ring arrangement mode, the two side circular ring arrangement mode in the novel positioning hole structure is advantaged by greatly increased strength and stability; the positioning hole not easy to deform in utilization processes.
Description
Technical field
The utility model relates to the circuit board structure technology, is specially a kind of novel location hole structure of wiring board.
Background technology
Location hole is the common structure on wiring board, and it is used for wiring board is positioned.In the circuit board structure that the metal level by PI layer and both sides forms, the generation of its location hole generally uses the form of punching ring to realize.As shown in Figure 1, the location hole structure used of tradition only has a side to be provided with metal ring, and it is relatively poor, too soft that this single face is established the location hole structural stability of ring, and orifice ring distortion easily occurs or tears phenomenon when positioning.
Summary of the invention
For the problems referred to above, the utility model provides the novel location hole structure of a kind of Stability Analysis of Structures, on-deformable wiring board.
The utility model is that the technical scheme that its technical problem of solution adopts is:
The novel location hole structure of wiring board, comprise plate body, plate body comprises PI layer and the metal level that is distributed in PI layer both sides, plate body is provided with the location hole that penetrates PI layer and metal level, form respectively by the mode of cutting apart the metal ring that is surrounded on the location hole periphery on the metal level of both sides, the metal ring excircle diameter of both sides is identical.
Preferably, the interval between the metal level outside metal ring and metal ring is not more than 0.08mm.
Preferably, described metal level is the copper layer.
The beneficial effects of the utility model are: the utility model all is provided with metal ring in the both sides up and down of location hole, and comparing its strength and stability with one-sided mode of establishing annulus increases greatly, and location hole is not easy distortion in use.
Description of drawings
Be further detailed below in conjunction with the drawings and specific embodiments:
Fig. 1 is the structural representation of the location hole of traditional circuit plate;
Fig. 2 is location hole structural representation of the present utility model.
Embodiment
With reference to Fig. 2, there is shown the plate body 1 and the location hole 2 of being located on plate body 1 of wiring board.PI layer 11 in the middle of plate body 1 comprises and the metal level 12 that is distributed in PI layer 11 both sides, location hole 2 penetrates in PI layer 11 and metal level 12.Above-mentioned metal level 12 is generally the copper layer.
In order to guarantee the strength and stability of location hole 2, form respectively by the mode of cutting apart the metal ring 13 that is surrounded on location hole 2 peripheries on metal level 12, the metal ring 13 excircle diameters of both sides are identical.
In order further to guarantee the stability of location hole 2, preferably, the interval between the metal level outside metal ring and metal ring is not more than 0.08mm.This set makes the location hole ring wall thicken, and plays good effect to fixedlying positioning the hole.
Execution mode of the present utility model is not restricted to the described embodiments, as long as it reaches technique effect of the present utility model with essentially identical means, all should belong to protection range of the present utility model.
Claims (3)
1. the novel location hole structure of wiring board, comprise plate body, plate body comprises PI layer and the metal level that is distributed in PI layer both sides, plate body is provided with the location hole that penetrates PI layer and metal level, it is characterized in that forming respectively by the mode of cutting apart the metal ring that is surrounded on the location hole periphery on the metal level of both sides, the metal ring excircle diameter of both sides is identical.
2. the novel location hole structure of wiring board according to claim 1, is characterized in that the interval between the metal level outside metal ring and metal ring is not more than 0.08mm.
3. the novel location hole structure of wiring board according to claim 1, is characterized in that described metal level is the copper layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320200242 CN203279331U (en) | 2013-04-19 | 2013-04-19 | Novel positioning hole structure for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320200242 CN203279331U (en) | 2013-04-19 | 2013-04-19 | Novel positioning hole structure for circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203279331U true CN203279331U (en) | 2013-11-06 |
Family
ID=49509647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320200242 Expired - Fee Related CN203279331U (en) | 2013-04-19 | 2013-04-19 | Novel positioning hole structure for circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203279331U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106941761A (en) * | 2017-04-20 | 2017-07-11 | 苏州市华扬电子股份有限公司 | A kind of target practice hole orifice ring of flexible PCB |
| WO2019037460A1 (en) * | 2017-08-23 | 2019-02-28 | 昆山国显光电有限公司 | Positioning structure and flexible circuit board |
-
2013
- 2013-04-19 CN CN 201320200242 patent/CN203279331U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106941761A (en) * | 2017-04-20 | 2017-07-11 | 苏州市华扬电子股份有限公司 | A kind of target practice hole orifice ring of flexible PCB |
| CN106941761B (en) * | 2017-04-20 | 2019-11-19 | 苏州市华扬电子股份有限公司 | A kind of target practice hole orifice ring of flexible circuit board |
| WO2019037460A1 (en) * | 2017-08-23 | 2019-02-28 | 昆山国显光电有限公司 | Positioning structure and flexible circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131106 Termination date: 20180419 |