CN206077826U - A kind of pcb board structure of optimization power plane channel pressure drop - Google Patents
A kind of pcb board structure of optimization power plane channel pressure drop Download PDFInfo
- Publication number
- CN206077826U CN206077826U CN201621058886.6U CN201621058886U CN206077826U CN 206077826 U CN206077826 U CN 206077826U CN 201621058886 U CN201621058886 U CN 201621058886U CN 206077826 U CN206077826 U CN 206077826U
- Authority
- CN
- China
- Prior art keywords
- pad
- adjacent
- layer
- hole
- difference
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model discloses a kind of pcb board structure of optimization power plane channel pressure drop, including pad layer, adjacent anti-pad layer and non-adjacent anti-pad layer, the pad layer includes pad and difference through hole, the difference through hole of left and right two runs through the adjacent anti-pad layer and the non-adjacent anti-pad layer, the adjacent anti-pad layer and the non-adjacent anti-pad layer are respectively equipped with anti-pad around the difference through hole, radius of the Edge Distance of the adjacent layer anti-pad more than the pad, Edge Distance of the Edge Distance of the non-adjacent layers anti-pad less than the adjacent layer anti-pad.This utility model ensure that through hole impedance, the area of non-adjacent layers anti-pad is reduced simultaneously, and non-adjacent layers are usually some power supplys or reference layer, the complete of power supply and reference layer is also just farthest ensure that so, the pressure drop of power plane passage is greatly reduced, the stability of system power supply work is improve.
Description
Technical field
This utility model is related to PCB technical field, specifically, is to be related to a kind of optimization power plane passage pressure
The pcb board structure of drop.
Background technology
Printed circuit board（Printed Circuit Board, pcb board）Also known as printed circuit board (PCB), printed substrate, it is electricity
The important component part of the physical support and signal transmission of sub- product, the plated through-hole in pcb board（Plated through
Hole, PTH）Impedance would generally be more much lower than the impedance of transmission line, in order to the impedance for increasing PTH reach and transmission line resistance
Anti- to match, all layers around PTH of metal flat can be emptied common practice by we, especially the via of differential signal,
We can by between differential signal and surrounding metal flat in definite shape as oval or rectangle is emptied, empty area and get over
Greatly, PTH impedances are higher.The region emptied is referred to as the anti-pad of PTH for we.
At the same time, the bus plane for also having some crucial on pcb board and reference layer, due to above-mentioned signal via anti-pad
Exist, also correspondingly can empty on corresponding bus plane and reference layer, empty that area is bigger, passage such as pressure drop to power plane and
Noise etc. affects also bigger, thus also influences whether the stability of system.
Drawbacks described above, is worth improving.
The content of the invention
In order to overcome the shortcomings of existing technology, this utility model provides a kind of PCB of optimization power plane channel pressure drop
Hardened structure.
Technical solutions of the utility model are as described below：
A kind of pcb board structure of optimization power plane channel pressure drop, including adjacent adjacent with the pad layer of pad layer
Anti-pad layer and the non-adjacent anti-pad layer adjacent with the adjacent anti-pad layer, pad layer are provided with two groups of pad holes, two groups
The symmetrical distribution of the pad hole, the pad hole include pad and difference through hole, and the difference through hole of left and right two runs through
The adjacent anti-pad layer and the non-adjacent anti-pad layer, it is characterised in that the adjacent anti-pad layer is in the difference mistake
Adjacent layer anti-pad is provided with around hole, the Edge Distance of the adjacent layer anti-pad is more than the radius of the pad, described adjacent
Layer anti-pad includes the first left hole anti-pad, the first right hole pad and middle anti-pad；
The non-adjacent anti-pad layer is provided with non-adjacent layers anti-pad around the difference through hole, and the non-adjacent layers are anti-
Edge Distance of the Edge Distance of pad less than the adjacent layer anti-pad, the non-adjacent layers anti-pad include that the second left hole is anti-
Pad and the second right hole pad, are provided with middle reserved area between the second left hole anti-pad and the second right hole pad.
Further, the adjacent layer anti-pad is in playground shape or rectangle, and the non-adjacent layers anti-pad is two sizes
Consistent circle.
Further, the adjacent layer anti-pad be in playground shape, turning radius and the weldering of the adjacent layer anti-pad
The difference of the radius of disk is a, and the scope of a is：6mil≤a≤10mil.
Further, the difference of the radius of the non-adjacent layers anti-pad and the radius of the pad is b, the scope of the b
For：4mil≤b≤6mil.
According to this utility model of such scheme, its advantage is that this utility model ensure that through hole impedance, while
The area of non-adjacent layers anti-pad is reduced, and non-adjacent layers are usually some power supplys or reference layer, so also just at utmost
Ensure that the complete of power supply and reference layer, be greatly reduced the pressure drop of power plane passage, improve system power supply work
Stability.
Description of the drawings
Fig. 1 is sectional view of the present utility model；
Fig. 2 is structural representation of the present utility model；
Fig. 3 is the schematic diagram of adjacent layer in this utility model；
Fig. 4 is the non-adjacent layers schematic diagram in this utility model；
Fig. 5 is the turning radius comparison schematic diagram of the radius with adjacent layer anti-pad of pad in this utility model；
Fig. 6 is the radius comparison schematic diagram of the radius with non-adjacent layers anti-pad of pad in this utility model.
In figure, 1, pad layer；11st, pad；12nd, difference through hole；2nd, adjacent anti-pad layer；21st, the first left hole anti-pad；
22nd, middle anti-pad；23rd, the first right hole anti-pad；3rd, non-adjacent anti-pad layer；31st, the second left hole anti-pad；32nd, second is right
Hole anti-pad；The difference of a, the turning radius of adjacent layer anti-pad and pad radius；B, the radius of non-adjacent layers anti-pad and pad
Radius difference.
Specific embodiment
Below in conjunction with the accompanying drawings and embodiment is conducted further description to this utility model：
As shown in figures 1 to 6, a kind of pcb board structure of optimization power plane channel pressure drop, including pad layer 1, and the weldering
The adjacent adjacent anti-pad layer 2 of disc layer 1 and the non-adjacent anti-pad layer 3 adjacent with the adjacent anti-pad layer 2, on pad layer 1
Two groups of pad holes, the symmetrical distribution of pad hole described in two groups are provided with, the pad hole includes pad 11 and difference through hole 12, it is left
Right two difference through holes 12 run through the adjacent anti-pad layer 2 and the non-adjacent anti-pad layer 3, it is characterised in that institute
State adjacent anti-pad layer 2 and be provided with adjacent layer anti-pad around the difference through hole 12, the edge of the adjacent layer anti-pad away from
From more than the pad 11 radius, the adjacent layer anti-pad include the first left hole anti-pad 21, the first right hole pad 23 and
Middle anti-pad 22；
The non-adjacent anti-pad layer 3 is provided with non-adjacent layers anti-pad around the difference through hole 12, described non-adjacent
Edge Distance of the Edge Distance of layer anti-pad less than the adjacent layer anti-pad, the non-adjacent layers anti-pad include that second is left
Hole anti-pad 31 and the second right hole pad 32, in being provided between the second left hole anti-pad 31 and the second right hole pad 32
Between reserved area.
The adjacent layer anti-pad is in playground shape or rectangle, and the non-adjacent layers anti-pad is two circles of the same size
Shape.
The adjacent layer anti-pad be in playground shape, the turning radius of the adjacent layer anti-pad and the radius of the pad it
Difference a scope be：6mil≤a≤10mil, the radius of the non-adjacent layers anti-pad and the model of difference b of the radius of the pad
Enclose for：4mil≤b≤6mil.
This utility model and prior art by it is all layers of anti-pad whole it is large-area empty compared with, this reality
With the new anti-pad area for increasing adjacent layer, while reducing the anti-pad area of non-adjacent layers, generally reduce whole
The etched-off area of individual anti-pad.This utility model ensure that through hole impedance, while the area of non-adjacent layers anti-pad is reduced, and
Non-adjacent layers are usually some power supplys or reference layer, so also just farthest ensure that the complete of power supply and reference layer, greatly
The big pressure drop for reducing power plane passage, improves the stability of system power supply work.
This utility model specific embodiment：
This utility model include pad layer, adjacent layer and and non-adjacent layers, adjacent layer and non-adjacent layers are respectively equipped with anti-weldering
Disk, in PCB design or actual production process, the radius of non-adjacent layers anti-pad with difference b of the radius of pad is：4mil≤b
≤ 6mil, non-adjacent layers anti-pad are emptied, and two non-adjacent layers anti-pad mid portions need not be emptied；
The turning radius of adjacent layer anti-pad with difference a of the radius of pad are：6mil≤a≤10mil, adjacent layer anti-pad
Region is emptied, and adjacent layer anti-pad mid portion is also required to empty.
A, b numerical value shown in above structure are with aperture, thickness of slab, material is different and needs change accordingly, and purpose is to make in a word
Obtain difference through hole optimal impedance matching is reached with differential signal.
It should be appreciated that for those of ordinary skills, can be improved according to the above description or be converted,
And all these modifications and variations should all belong to the protection domain of this utility model claims.
Exemplary description is carried out to this utility model patent above in conjunction with accompanying drawing, it is clear that the reality of this utility model patent
Now it is not subject to the restrictions described above, as long as the method design for employing this utility model patent is various with what technical scheme was carried out
Improve, or it is not improved the design of this utility model patent and technical scheme are directly applied to into other occasions, in this reality
With in new protection domain.
Claims (4)
1. a kind of adjacent anti-adjacent with the pad layer of pcb board structure of optimization power plane channel pressure drop, including pad layer
Pad layer and the non-adjacent anti-pad layer adjacent with the adjacent anti-pad layer, pad layer are provided with two groups of pad holes, two groups of institutes
The symmetrical distribution of pad hole is stated, the pad hole includes pad and difference through hole, and the difference through hole of left and right two runs through institute
State adjacent anti-pad layer and the non-adjacent anti-pad layer, it is characterised in that the adjacent anti-pad layer is in the difference through hole
Surrounding is provided with adjacent layer anti-pad, and the Edge Distance of the adjacent layer anti-pad is more than the radius of the pad, the adjacent layer
Anti-pad includes the first left hole anti-pad, the first right hole pad and middle anti-pad；
The non-adjacent anti-pad layer is provided with non-adjacent layers anti-pad, the non-adjacent layers anti-pad around the difference through hole
Edge Distance less than the adjacent layer anti-pad Edge Distance, the non-adjacent layers anti-pad includes the second left hole anti-pad
And the second right hole pad, middle reserved area is provided between the second left hole anti-pad and the second right hole pad.
2. it is according to claim 1 optimization power plane channel pressure drop pcb board structure, it is characterised in that it is described adjacent
Layer anti-pad is in playground shape or rectangle, and the non-adjacent layers anti-pad is two circles of the same size.
3. it is according to claim 2 optimization power plane channel pressure drop pcb board structure, it is characterised in that it is described adjacent
Layer anti-pad is in playground shape, and the turning radius of the adjacent layer anti-pad and the difference of the radius of the pad are a, the model of a
Enclose for：6mil≤a≤10mil.
4. it is according to claim 2 optimization power plane channel pressure drop pcb board structure, it is characterised in that the non-phase
The difference of the radius of adjacent bed anti-pad and the radius of the pad is b, and the scope of the b is：4mil≤b≤6mil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621058886.6U CN206077826U (en) | 2016-09-18 | 2016-09-18 | A kind of pcb board structure of optimization power plane channel pressure drop |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621058886.6U CN206077826U (en) | 2016-09-18 | 2016-09-18 | A kind of pcb board structure of optimization power plane channel pressure drop |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206077826U true CN206077826U (en) | 2017-04-05 |
Family
ID=58436699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621058886.6U Active CN206077826U (en) | 2016-09-18 | 2016-09-18 | A kind of pcb board structure of optimization power plane channel pressure drop |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206077826U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI640230B (en) * | 2017-05-16 | 2018-11-01 | 中華精測科技股份有限公司 | Load board with high speed transmitting structure |
| CN111712044A (en) * | 2020-06-24 | 2020-09-25 | 苏州浪潮智能科技有限公司 | Method, device and equipment for adjusting direction of reverse welding disk of PCB |
| CN113747656A (en) * | 2021-07-30 | 2021-12-03 | 苏州浪潮智能科技有限公司 | PCB and differential wiring structure thereof |
| CN114071857A (en) * | 2020-08-05 | 2022-02-18 | 深南电路股份有限公司 | Circuit board |
-
2016
- 2016-09-18 CN CN201621058886.6U patent/CN206077826U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI640230B (en) * | 2017-05-16 | 2018-11-01 | 中華精測科技股份有限公司 | Load board with high speed transmitting structure |
| CN111712044A (en) * | 2020-06-24 | 2020-09-25 | 苏州浪潮智能科技有限公司 | Method, device and equipment for adjusting direction of reverse welding disk of PCB |
| CN111712044B (en) * | 2020-06-24 | 2022-02-18 | 苏州浪潮智能科技有限公司 | Method, device and equipment for adjusting direction of reverse welding disk of PCB |
| CN114071857A (en) * | 2020-08-05 | 2022-02-18 | 深南电路股份有限公司 | Circuit board |
| CN114071857B (en) * | 2020-08-05 | 2024-04-05 | 深南电路股份有限公司 | Circuit board |
| CN113747656A (en) * | 2021-07-30 | 2021-12-03 | 苏州浪潮智能科技有限公司 | PCB and differential wiring structure thereof |
| CN113747656B (en) * | 2021-07-30 | 2023-11-03 | 苏州浪潮智能科技有限公司 | PCB and differential wiring structure thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206077826U (en) | A kind of pcb board structure of optimization power plane channel pressure drop | |
| CN204335143U (en) | The pcb board structure of a kind of optimizing metal finger devices impedance | |
| CN105704946B (en) | A kind of method for manufacturing printed circuit board with four sides golden finger covered with gold leaf | |
| CN105307427A (en) | Press fit structure for multilayer board with hollow inner layer and making method thereof | |
| CN104661436B (en) | Printed circuit board blind slot processing method | |
| CN105101623B (en) | The circuit board and its manufacture craft of ultra-thin medium layer | |
| CN206314070U (en) | A kind of electric welding machine high current pcb board | |
| CN102946691B (en) | Method for producing printed circuit board (PCB) with locally metalized stepped groove | |
| CN204377257U (en) | The circuit board of the metal forming making of die-cut band glue | |
| CN203919969U (en) | A kind of circuit board screen printing device | |
| CN203884075U (en) | PCB structure based on back drill | |
| CN203194015U (en) | PCB (printed circuit board) structure with yin-yang symmetry | |
| CN204014259U (en) | The HDI circuit board of adjustable blind hole position degree | |
| CN107835591A (en) | A kind of processing technology that can lift soft or hard combination printed substrate contraposition precision | |
| CN107506520A (en) | A kind of method for hollowing out the adjacent aspect copper foils of pad | |
| CN104411087A (en) | PCB with stepped hole | |
| CN202773167U (en) | Circuit board | |
| CN204350438U (en) | High density bubble-free golden finger pressing structure plate | |
| CN202385393U (en) | Printed circuit board (PCB) with precise half holes | |
| CN209545983U (en) | A kind of pcb board structure optimizing plated through-hole impedance | |
| CN205726675U (en) | One is uncapped after improving Rigid Flex radium-shine cutting structure | |
| CN201601887U (en) | Multilayered blind hole PCB plate | |
| CN204948501U (en) | The circuit board of ultra-thin medium layer | |
| CN104717829A (en) | High-density bubble-free golden finger pressing structural slab and processing method thereof | |
| WO2016082381A1 (en) | Pcb structure capable of reducing through-hole crosstalk |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000, 12H-12I, 12th Floor, Kangjia Research Building, 28 Science and Technology South 12 Road, Nanshan District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Yibo Science and Technology Co., Ltd. Address before: 518000, 12H-12I, 12th Floor, Kangjia Research Building, 28 Science and Technology South 12 Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Yi Bo Science and Technology Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: 11F, Metro financial technology building, 9819 Shennan Avenue, Shenda community, Yuehai street, Nanshan District, Shenzhen, Guangdong 518000 Patentee after: EDADOC Co.,Ltd. Address before: 518000, 12H-12I, 12th Floor, Kangjia Research Building, 28 Science and Technology South 12 Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: EDADOC Co.,Ltd. |
|
| CP02 | Change in the address of a patent holder |