CN205179490U - Pile up printed circuit board - Google Patents
Pile up printed circuit board Download PDFInfo
- Publication number
- CN205179490U CN205179490U CN201520826967.5U CN201520826967U CN205179490U CN 205179490 U CN205179490 U CN 205179490U CN 201520826967 U CN201520826967 U CN 201520826967U CN 205179490 U CN205179490 U CN 205179490U
- Authority
- CN
- China
- Prior art keywords
- daughter board
- circuit board
- printed circuit
- board
- regional
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model provides a pile up printed circuit board, the circuit board includes: first daughter board, a plurality of shield cover bases, set up in the edge of first daughter board, first shielding is regional, set up in on the first daughter board, and with shield cover base contactless, the second daughter board, the secondary shielding is regional, set up in first shielding regional with between the second daughter board, first daughter board with the regional structure of secondary shielding cooperatees, the secondary shielding regional with be provided with the solder mask between the second daughter board, the solder mask is the copper sheet. The utility model provides a pile up printed circuit board only does on the inside PCB of product and handles, does not influence the overall product outward appearance, do not choose the operating environment and the applicable field of product, it needs the shielded device to be applicable to any one, the cost of B board shield cover has been practiced thrift, can make any one shape, the flexibility is strong, reduced whole PCB plate thickness, made its outward appearance thinner gentlier more pleasing to the eye.
Description
Technical field
The utility model relates to electronic circuit field, particularly relates to a kind of stack printed circuit board.
Background technology
In electronic product, due to structure, large-tonnage product all can do double-deck PCB (PrintedCircuitBoard, printed circuit board (PCB)) structure, in modern comfort, there is various radiofrequency signal, high speed signal, simulation small-signal, power supply signal, systems grow is complicated, usually needs effectively to isolate, to improve the performance of system.Existing radome realizes reason, under double-decker PCB scene due to its technology: the kind of radome has a lot, and the radome that patent document is announced mostly is made up of upper outlet body and lower cover, and need to make radome and lower radome, cost is higher simultaneously.And because upper cover radome exists, make whole system have three-decker, add the thickness of system product.
Utility model content
In view of the above problems, the application describes a kind of stack printed circuit board, and described circuit board comprises:
First daughter board;
Some radome bases, are arranged at the edge of described first daughter board;
First shielding area, is arranged on described first daughter board, and does not contact with described radome base.
Preferably, described circuit board also comprises:
Second daughter board;
Secondary shielding region, is arranged between described first shielding area and described second daughter board.
Preferably, described first daughter board matches with the structure in described secondary shielding region.
Preferably, solder mask is provided with between described secondary shielding region and described second daughter board.
Preferably, described solder mask is copper sheet.
Technique scheme tool has the following advantages or beneficial effect: a kind of stack printed circuit board, and mainly for two pcb boards needing to connect, and A plate has enough spaces to serve as the ground plane of B plate; A plate D does welding resistance process in region, improves screening effectiveness.Described stack printed circuit board, only deals with, does not affect Total Product outward appearance on the PCB of interiors of products; Do not choose running environment and the suitable application area of product, be applicable to the device that any one needs shielding; Save the cost of B plate radome; Can make any one shape, flexibility is strong; Reduce the thickness of overall pcb board, make its outward appearance thinner lighter more attractive in appearance.
Accompanying drawing explanation
With reference to appended accompanying drawing, to describe embodiment of the present utility model more fully.But, appended accompanying drawing only for illustration of and elaboration, do not form the restriction to the utility model scope.
Fig. 1 is the structural representation one of a kind of stack printed circuit board of the utility model;
Fig. 2 is the structural representation two of a kind of stack printed circuit board of the utility model;
Fig. 3 is the stereogram of a kind of stack printed circuit board of the utility model.
Embodiment
Below in conjunction with the drawings and specific embodiments, a kind of stack printed circuit board of the utility model is described in detail.
As shown in Figure 1, a kind of stack printed circuit board, comprising:
First daughter board 01 (B plate), the i.e. daughter board of PCB;
Several radome bases 02, described radome base 02 is evenly arranged at the edge of described first daughter board 01, and does not contact with described radome base;
First shielding area 03 (C region), is placed on described first daughter board 01, and described first shielding area 03 is the region that described first daughter board 01 needs shielding.
Composition graphs 2 and Fig. 3, described stack printed circuit board also comprises:
Second daughter board 04 (A plate) is also the daughter board of described PCB;
Secondary shielding area 05 (D region), be placed in described second daughter board 04 top, wherein, between the second daughter board 04 and D region, do welding resistance process, namely be also provided with solder mask (Soldemask) between described second daughter board 04 and D region, described solder mask spreads copper sheet.Like this in PCB makes, leakage Copper treatment can be done in D region, being equivalent to D region is exactly one block of copper, because the conductivity of copper is higher, so compared with conductive aluminum, the screening effectiveness of copper is higher.In addition, the one side of the first shielding area 03 of B plate is pressed close to the D region of A plate, the D region of such A plate had both become the radome upper cover of B plate.Can find out in figure 3, the structure of described first daughter board 01 and described secondary shielding area 05 matches.It is worthy of note, in figure 3, do not draw the first shielding area 03 and radome base 02.
Specifically, in described stack printed circuit board, first lay a daughter board---A plate, described A plate arranges secondary shielding area 05, i.e. D region.It is worthy of note, be also provided with solder mask between the second daughter board 04 and secondary shielding area 05, described solder mask can be copper sheet.This setup, makes PCB on the make, and leakage Copper treatment is done in D region.Because the conductivity of copper is higher, so compared with conductive aluminum, the screening effectiveness of copper is higher.
In addition, the one side of described secondary shielding area 05 connects with described first daughter board 01, and another side connects with described first shielding area 03.Wherein, the first shielding area 03 (C region) is placed on described first daughter board 01, and described first shielding area 03 is the region that described first daughter board 01 needs shielding.It is worthy of note, the top of described radome base 02 is evenly arranged at the edge of described first daughter board 01.In the present embodiment, be connected with radome draw-in groove between two plates.Namely D region both can be used as the screening cover of B plate, saved the screening cover of B plate.
A kind of stack printed circuit board that the present embodiment proposes, mainly for two pcb boards needing to connect, and A plate has enough spaces to serve as the ground plane of B plate; A plate D does welding resistance process in region, improves screening effectiveness.In the present embodiment, only deal with on the PCB of interiors of products, do not affect Total Product outward appearance; Do not choose running environment and the suitable application area of product, be applicable to the device that any one needs shielding; Save the cost of B plate radome; Can make any one shape, flexibility is strong; Reduce the thickness of overall pcb board, make its outward appearance thinner lighter more attractive in appearance.
For a person skilled in the art, after reading above-mentioned explanation, various changes and modifications undoubtedly will be apparent.Therefore, appending claims should regard the whole change and correction of containing true intention of the present utility model and scope as.In Claims scope, the scope of any and all equivalences and content, all should think and still belong in intention of the present utility model and scope.
Claims (5)
1. a stack printed circuit board, is characterized in that, described circuit board comprises:
First daughter board;
Some radome bases, are arranged at the edge of described first daughter board;
First shielding area, is arranged on described first daughter board, and does not contact with described radome base.
2. stack printed circuit board according to claim 1, is characterized in that, described circuit board also comprises:
Second daughter board;
Secondary shielding region, is arranged between described first shielding area and described second daughter board.
3. stack printed circuit board according to claim 2, is characterized in that, described first daughter board matches with the structure in described secondary shielding region.
4. stack printed circuit board according to claim 2, is characterized in that, is provided with solder mask between described secondary shielding region and described second daughter board.
5. stack printed circuit board according to claim 4, is characterized in that, described solder mask is copper sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520826967.5U CN205179490U (en) | 2015-10-22 | 2015-10-22 | Pile up printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520826967.5U CN205179490U (en) | 2015-10-22 | 2015-10-22 | Pile up printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205179490U true CN205179490U (en) | 2016-04-20 |
Family
ID=55743415
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520826967.5U Expired - Fee Related CN205179490U (en) | 2015-10-22 | 2015-10-22 | Pile up printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205179490U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113597093A (en) * | 2021-07-01 | 2021-11-02 | Oppo广东移动通信有限公司 | Electronic equipment and combined circuit board thereof |
-
2015
- 2015-10-22 CN CN201520826967.5U patent/CN205179490U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113597093A (en) * | 2021-07-01 | 2021-11-02 | Oppo广东移动通信有限公司 | Electronic equipment and combined circuit board thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160420 Termination date: 20181022 |