CN113597093A

CN113597093A - Electronic equipment and combined circuit board thereof

Info

Publication number: CN113597093A
Application number: CN202110745972.3A
Authority: CN
Inventors: 刘幕俊
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2021-07-01
Filing date: 2021-07-01
Publication date: 2021-11-02

Abstract

The application provides an electronic device and a combined circuit board thereof; the combined circuit board comprises a first circuit board and a second circuit board which are connected in a welding mode; at least two electronic component stacking areas are arranged on the surface of one side of the first circuit board; the second circuit board is provided with at least two avoidance areas which are arranged in one-to-one correspondence with the stacking areas of the electronic components on the first circuit board; the electronic component stacking areas of the first circuit board are respectively arranged in the avoiding areas of the second circuit board. This combination formula circuit board passes through the HDI board and the cooperation design of through-hole board to produce a plurality of cavitys on the through-hole board, through the design to the through-hole board cavity separates the muscle, completely cut off the mutual interference of signal in each cavity, finally realized signal shielding function. Through this kind of design, reduced the shield cover design of HDI board bottom surface, greatly reduced product cost, can also make the volume of combination formula circuit board littleer simultaneously.

Description

Electronic equipment and combined circuit board thereof

Technical Field

The invention relates to the technical field of combined circuit board structures, in particular to electronic equipment and a combined circuit board thereof.

Background

Electronic products in life are visible everywhere, and the functions of the electronic products need to be realized by the circuit board inside. With the complexity of circuit realization functions, the refinement of circuit lines and the High speed of signal rate, the circuit board is also provided with more advanced designs such as HDI (High Density interconnect). The cost of HDI design is then significantly increased over the cost of a conventional via PCB.

In order to take fine design and cost optimization into consideration, a method of separating circuit modules on different PCBs and finally recombining the circuit modules is proposed. I.e. high speed, high density interconnected modules, using HDI design; and other modules adopt a common through hole plate design, and then the HDI plate is welded on the through hole plate to realize signal intercommunication between the HDI plate and the through hole plate. Because HDI board area is little, its high cost is low to account for, reaches the purpose of cost optimization.

In the conventional technology, when a plurality of HDI boards or HDI boards have a plurality of functional areas and are welded on a through hole board at the same time, a corresponding plurality of shielding cases are required to be designed to improve the electromagnetic interference of the circuit board. For example, for a communication module, different shielding cases with different functions and different frequency band regions may be required to be separately isolated, and if a plurality of shielding cases are used to separate the module, the product cost is greatly increased. If a plurality of shielding covers are not independently made, but a method of dividing a single shielding cover into a plurality of cavities is adopted, due to the limitation of the manufacturing method of the shielding cover, a larger gap is formed between the two cavities in the divided cavities, the shielding effect is poor, and the shielding effect and the cost cannot be obtained at the same time.

Disclosure of Invention

A first aspect of an embodiment of the present application provides a combined circuit board, where the combined circuit board includes a first circuit board and a second circuit board that are connected by soldering;

at least two electronic component stacking areas are arranged on the surface of one side of the first circuit board;

the second circuit board is provided with at least two avoidance areas which are arranged in one-to-one correspondence with the stacking areas of the electronic components on the first circuit board; the electronic component stacking areas of the first circuit board are respectively arranged in the avoiding areas of the second circuit board.

In a second aspect, an embodiment of the present application provides an electronic device, where the electronic device includes a housing and the combined circuit board described in any of the above embodiments, and the combined circuit board is disposed in the housing.

The combined circuit board provided by the embodiment of the application is designed by matching the HDI board (the first circuit board) and the through hole board PCB (the second circuit board), a plurality of cavities are manufactured on the through hole board, and through the design of the through hole board cavity spacer bars, mutual interference of signals in each cavity is isolated, and finally, the signal shielding function is realized. Through the design, the design of the shielding case on the bottom surface of the HDI board (the first circuit board) is reduced, the product cost is greatly reduced, and meanwhile, the combined circuit board is smaller and smaller in size.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic structural diagram of a through hole plate and an HDI plate of a combined circuit board according to a conventional technical scheme;

FIG. 2 is a schematic structural diagram of a shield case of the combined circuit board of the embodiment of FIG. 1;

FIG. 3 is a schematic diagram of a front view of an embodiment of the assembled circuit board of the present application;

FIG. 4 is a schematic cross-sectional view of the combined circuit board at A-A in the embodiment of FIG. 3;

FIG. 5 is a schematic diagram of a first circuit board of the combined circuit board of the embodiment of FIG. 3;

FIG. 6 is a schematic diagram of a second circuit board of the combined circuit board of the embodiment of FIG. 3;

FIG. 7 is a cross-sectional view of another embodiment of the modular circuit board of the present application;

FIG. 8 is a schematic cross-sectional view of another embodiment of the modular circuit board of the present application;

FIG. 9 is a schematic front view of a combined circuit board according to another embodiment of the present application;

FIG. 10 is a schematic cross-sectional view of the combined circuit board of the embodiment of FIG. 9 at B-B;

FIG. 11 is a cross-sectional view of another embodiment of the modular circuit board of the present application;

FIG. 12 is a schematic structural diagram of an embodiment of an electronic device of the present application;

FIG. 13 is a schematic cross-sectional view of the electronic device at C-C in the embodiment of FIG. 12;

fig. 14 is a block diagram illustrating a structural composition of an embodiment of an electronic device according to the present application.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be noted that the following examples are only illustrative of the present invention, and do not limit the scope of the present invention. Likewise, the following examples are only some but not all examples of the present invention, and all other examples obtained by those skilled in the art without any inventive step are within the scope of the present invention.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

As used herein, an "electronic device" (or simply "terminal") includes, but is not limited to, an apparatus that is configured to receive/transmit communication signals via a wireline connection, such as via a Public Switched Telephone Network (PSTN), a Digital Subscriber Line (DSL), a digital cable, a direct cable connection, and/or another data connection/network, and/or via a wireless interface (e.g., for a cellular network, a Wireless Local Area Network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and/or another communication terminal). A communication terminal arranged to communicate over a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal" or "mobile terminal". Examples of mobile terminals include, but are not limited to, satellite or cellular telephones; a Personal Communications System (PCS) terminal that may combine a cellular radiotelephone with data processing, facsimile and data communications capabilities; PDAs that may include radiotelephones, pagers, internet/intranet access, Web browsers, notepads, calendars, and/or Global Positioning System (GPS) receivers; and conventional laptop and/or palmtop receivers or other electronic devices that include a radiotelephone transceiver. A cellular phone is an electronic device equipped with a cellular communication module.

Referring to fig. 1 and 2 together, fig. 1 is a schematic structural diagram of a through hole plate and an HDI plate of a combined circuit board according to a conventional technical solution, and fig. 2 is a schematic structural diagram of a shielding case provided on the combined circuit board in the embodiment of fig. 1. When a plurality of HDI boards 10a are soldered to the through hole board 20a at the same time in the conventional art, it is necessary to design a corresponding plurality of shielding cases 30a to improve the electromagnetic interference of the circuit board. For example, for a communication module, different shielding cases with different functions and different frequency band regions may be required to be separated, and if a mode of separating the module by using a plurality of shielding cases 30a is adopted, the material cost of the product is greatly improved, and the assembly difficulty of the combined circuit board is improved. In the drawing, 10a1 indicates a pad on the HDI board 10a, 10a2 indicates an electronic component on the HDI board 10a, and 20a1 indicates a pad on the via board 20 a.

In view of the above, an embodiment of the present invention provides a structure of a combined circuit board, please refer to fig. 3 and fig. 4 together, fig. 3 is a schematic structural front view of the combined circuit board of the embodiment of the present invention, and fig. 4 is a schematic structural cross-sectional view of the combined circuit board at a-a in the embodiment of fig. 3. It should be noted that the combined circuit board in the present application may be used in an electronic device, and the electronic device may include any electronic device that needs to use a circuit board, such as a mobile phone, a tablet computer, a notebook computer, and a wearable device. The combined circuit board 10 in the present embodiment includes the first circuit board 100 and the second circuit board 200 which are solder-connected. It should be noted that the terms "comprises" and "comprising," and any variations thereof, in the embodiments of the present application, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or may alternatively include other steps or elements inherent to such process, method, article, or apparatus.

Specifically, referring to fig. 5, fig. 5 is a schematic structural diagram of the first circuit board of the combined circuit board in the embodiment of fig. 3, at least two electronic component stacking areas 110 are disposed on one side surface of the first circuit board 100, wherein in the embodiment, the first circuit board 100 is exemplified by three electronic component stacking areas 110. The electronic component stacking area 110 is provided with electronic components 111 such as resistors, chips, capacitors, etc., and functions of each electronic component stacking area 110 may be the same or different, such as a communication module for communication transmission, an image processing module for image processing, a storage module for storing information, etc., which is not limited herein. Alternatively, the first circuit board 100 in this embodiment may be an HDI board (High Density interconnect), a High Density Interconnect (HDI) manufacturing type printed circuit board, and the printed circuit board is a structural element formed by an insulating material supplemented with a conductor wiring. Printed circuit boards are manufactured as end products with integrated circuits, transistors (transistors, diodes), passive components (e.g., resistors, capacitors, connectors, etc.), and other various electronic components mounted thereon. The connection of the wires can form the connection of electronic signals and the proper function. Thus, the printed circuit board is a platform for providing component connection to receive the substrate of the associated component.

Referring to fig. 6, fig. 6 is a schematic structural diagram of the second circuit board of the combined circuit board in the embodiment of fig. 3, the second circuit board 200 is provided with at least two avoidance areas 210 that are arranged in a one-to-one correspondence with the electronic component stacking areas 110 on the first circuit board 100, and similarly, in this embodiment, three avoidance areas 210 are arranged on the second circuit board 200 as an example for description. Optionally, the avoiding region 210 in this embodiment is a structure penetrating through the second circuit board 200. The maximum height of the electronic components 111 in the electronic component stacking area 110 of the first circuit board 100 is not greater than the thickness T of the second circuit board 200, and the design structure can ensure that the electronic components in the electronic component stacking area 110 can be completely located in the avoidance area 210, so that a better shielding effect is achieved.

The electronic component stacking areas 110 of the first circuit board 100 are respectively and correspondingly disposed in the avoiding area 210 of the second circuit board 200. The avoiding region 210 of the second circuit board 200 is used to form a shielding space of the electronic component stacking region 110 of the first circuit board 100, so that the electronic component stacking regions 110 with different functions of the first circuit board 100 are prevented from interfering with each other. Optionally, the integration density of the first circuit board 100 is greater than that of the second circuit board 200, wherein the second circuit board 200 may be a common through hole board, and the first circuit board 100 may be the HDI board.

Optionally, with continuing reference to fig. 4 and fig. 5, first pads 120 for isolating adjacent electronic component stacking regions are disposed between the electronic component stacking regions 110 of the first circuit board 100, optionally, the first pads 120 may be in a continuous dot-shaped distribution structure, or may be in a strip-shaped distribution structure, which is not specifically limited herein, and in this embodiment, only the structure of the dot-shaped first pads 120 is taken as an example for description. Alternatively, the first bonding pads 120 may also surround each of the electronic component stacking sections 110, that is, the first bonding pads 120 may also be disposed around each of the electronic component stacking sections 110, except for being disposed between adjacent electronic component stacking sections 110 at intervals.

Optionally, with continuing reference to fig. 4 and fig. 6, a spacing rib 220 is formed at a spacing position between adjacent avoidance areas 210 of the second circuit board 200, and optionally, a minimum width of the spacing rib 220 on the second circuit board 200 may be generally 2mm (the width is too small, on one hand, the structure is not strong, and is easy to break, and on the other hand, the shielding effect between the electronic component stacking areas 110 with different functions of the first circuit board 100 is also weak), so that the reserved distance between the electronic component stacking areas 110 with different functions of the first circuit board 100 should also be greater than 2 mm. It should be noted that the terms "first", "second" and "third" in the embodiments of the present application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature.

Optionally, a second pad 230 corresponding to the first pad 120 is disposed on the spacing rib 220, and the first pad 120 is used for being connected to the second pad 230 by welding. Similarly, the second pads 230 may be in a continuous dot distribution structure, or may be in a stripe distribution, which is not specifically limited herein, and only the dot distribution structure of the second pads 230 is taken as an example in this embodiment for description.

Referring to fig. 7, fig. 7 is a schematic cross-sectional structure diagram of another embodiment of the combined circuit board of the present application, which is different from the foregoing embodiments in that the avoiding region 210 of the second circuit board 200 in the present embodiment is a non-penetrating structure, so that when the avoiding region 210 is matched with the board body of the first circuit board 100, a sealed shielding space can be formed, and a better shielding effect can be achieved on the electronic components 111 in the electronic component stacking region 110 of the first circuit board 100.

Referring to fig. 8, fig. 8 is a schematic cross-sectional structure diagram of a combined circuit board 10 according to another embodiment of the present application, which includes a first circuit board 100 and a second circuit board 200 connected by soldering. At least two electronic component stacking regions 110 are disposed on one side surface of the first circuit board 100. Electronic components 111 such as resistors, chips, and capacitors are disposed in the electronic component stacking area 110. The second circuit board 200 is provided with at least two avoidance areas 210 which are arranged corresponding to the electronic component stacking areas 110 on the first circuit board 100 one by one. The avoidance region 210 in this embodiment is a structure penetrating the second circuit board 200. The electronic component stacking areas 110 of the first circuit board 100 are respectively and correspondingly arranged in the avoidance areas 210 of the second circuit board 200. The avoiding region 210 of the second circuit board 200 is used to form a shielding space of the electronic component stacking region 110 of the first circuit board 100.

Optionally, different from the foregoing embodiment, in the present embodiment, a second electronic component stacking area 130 is disposed on a surface of the first circuit board 100, opposite to the electronic component stacking area 110, and a shape, a number, and an arrangement manner of the second electronic component stacking area 130 are not specifically limited. A second electronic component 131 such as a resistor, a chip, a capacitor, etc. is disposed in the second electronic component stacking area 130. With such a design structure, the device integration density of the first circuit board 100 can be further improved, and electronic components that do not need shielding or need shielding alone can be disposed in the second electronic component stacking area 130. For other structural features of the combined circuit board 10, reference may be made to the description of the foregoing embodiments, and further description is omitted here.

Referring to fig. 9 and 10 together, fig. 9 is a schematic structural front view of a combined circuit board according to still another embodiment of the present application, and fig. 10 is a schematic structural cross-sectional view of the combined circuit board at a position B-B in the embodiment of fig. 9. The combined circuit board 10 in the present embodiment also includes the first circuit board 100 and the second circuit board 200 which are solder-connected. At least two electronic component stacking areas 110 are disposed on a surface of one side of the first circuit board 100, wherein in this embodiment, the first circuit board 100 is exemplified by three electronic component stacking areas 110. The electronic component stacking area 110 is provided with electronic components 111 such as resistors, chips, capacitors, etc., and functions of each electronic component stacking area 110 may be the same or different, such as a communication module for communication transmission, an image processing module for image processing, a storage module for storing information, etc., which is not limited herein. The first circuit board 100 in the present embodiment may also be an HDI board.

Optionally, at least two avoidance areas 210 corresponding to the electronic component stacking areas 110 on the first circuit board 100 one by one are disposed on the second circuit board 200, and similarly, in this embodiment, three avoidance areas 210 are disposed on the second circuit board 200 as an example for description. The avoidance region 210 in this embodiment is a structure penetrating the second circuit board 200. The electronic component stacking areas 110 of the first circuit board 100 are respectively and correspondingly arranged in the avoidance areas 210 of the second circuit board 200. The avoiding region 210 of the second circuit board 200 is used to form a shielding space of the electronic component stacking region 110 of the first circuit board 100, so that the electronic component stacking regions 110 with different functions of the first circuit board 100 are prevented from interfering with each other. Optionally, the integration density of the first circuit board 100 is greater than the integration density of the second circuit board 200, wherein the second circuit board 200 may be a common through hole board. It is noted that in the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically defined otherwise. All directional indications (such as up, down, left, right, front, and rear … …) in the embodiments of the present application are only used to explain the relative positional relationship between the components, the movement, and the like in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indication is changed accordingly.

Optionally, first pads 120 for isolating adjacent electronic component stacking regions are disposed between the electronic component stacking regions 110 of the first circuit board 100, where the first pads 120 may be in a continuous dot-shaped distribution structure or in a strip-shaped distribution structure, which is not specifically limited herein, and in this embodiment, only the dot-shaped distribution structure of the first pads 120 is taken as an example for description. Alternatively, the first bonding pads 120 may also surround each of the electronic component stacking sections 110, that is, the first bonding pads 120 may also be disposed around each of the electronic component stacking sections 110, except for being disposed between adjacent electronic component stacking sections 110 at intervals. A spacing rib 220 is formed at a spacing position of the second circuit board 200 adjacent to the avoiding region 210, and optionally, a minimum width of the spacing rib 220 on the second circuit board 200 may generally be 2mm (the width is too small, on one hand, the structure is not strong, and the structure is easy to break, and on the other hand, the shielding effect between the electronic component stacking regions 110 with different functions of the first circuit board 100 is also weak), so that a reserved distance between the electronic component stacking regions 110 with different functions of the first circuit board 100 should also be greater than 2 mm. The spacing rib 220 is provided with a second pad 230 corresponding to the first pad 120, and the first pad 120 is used for being connected with the second pad 230 in a welding manner. Similarly, the second pads 230 may be in a continuous dot distribution structure, or may be in a stripe distribution, which is not specifically limited herein, and only the dot distribution structure of the second pads 230 is taken as an example in this embodiment for description.

Alternatively, unlike the previous embodiment, the spacing rib 220 of the second circuit board 200 in this embodiment is provided with a plurality of shielding holes 240 arranged in a row along the extending direction of the spacing rib 220. The shielding holes 240 are also ground holes, and the ground holes penetrate through the second circuit board 200 to form a hole wall, so that signals of each sub-cavity can be effectively isolated. In order to isolate different cavity signals, the punching density needs to be adjusted according to the frequency of the signals. The perforation density is at least 1/20 of the signal wavelength. For example: according to λ ═ V/f, the frequency of the signal is 10G, the wavelength is 3cm, the minimum punching density is 3/20 ═ 0.15cm ═ 1.5mm, that is, at least one through hole is punched every 1.5 mm. Optionally, in this embodiment, the shielding holes 240 are respectively arranged along two sides of the second pad 230 in sequence.

The combined circuit board in the embodiment is designed by matching the first circuit board and the second circuit board, a plurality of cavities are manufactured on the through hole plate, and through the design of the through hole plate cavity separation ribs, mutual interference of signals in each cavity is isolated, and finally, a signal shielding function is achieved. Through the design, the design of the shielding case on the bottom surface of the first circuit board is reduced, the product cost is greatly reduced, and meanwhile, the volume of the combined circuit board is smaller and more ingenious. In addition, through drilling shielding holes on the spacing ribs of the adjacent avoidance areas on the second circuit board, signals of all sub-cavities can be effectively isolated, and better shielding effects can be achieved on electronic components in the stacking areas of the electronic components of the first circuit board.

Referring to fig. 11, fig. 11 is a schematic cross-sectional structure diagram of a combined circuit board 10 according to another embodiment of the present application, which is different from the foregoing embodiments in that the combined circuit board 10 further includes a metal shielding sheet 300, and the metal shielding sheet 300 is connected to the second circuit board 200 and covers the avoiding region 210 of the second circuit board 200. The avoidance region 210 in this embodiment is a structure penetrating the second circuit board 200. The maximum height of the electronic components 111 in the electronic component stacking area 110 of the first circuit board 100 is not greater than the thickness T of the second circuit board 200, and the design structure can ensure that the electronic components in the electronic component stacking area 110 can be completely located in the avoidance area 210, so that a better shielding effect is achieved.

Optionally, the metal shielding plate 300 and the first circuit board 100 are respectively disposed on two opposite sides of the second circuit board 200, so as to shield and seal the electronic component stacking area 110 of the first circuit board 100. The metal shielding plate 300 and the second circuit board 200 may be connected by soldering, adhering, or snapping, and the like, which is not limited herein.

In the combined circuit board in this embodiment, by designing the structure of the metal shielding plate, the metal shielding plate and the first circuit board are respectively disposed on the two opposite sides of the second circuit board, and the first circuit board and the metal shielding plate are respectively sealed from the two sides to avoid the region, so as to seal the electronic component stacking region of the first circuit board for better shielding.

Further, an electronic device is provided in an embodiment of the present application, please refer to fig. 12 and 13 together, fig. 12 is a schematic structural diagram of an embodiment of the electronic device of the present application, and fig. 13 is a schematic structural cross-sectional diagram of the electronic device at a position C-C in the embodiment of fig. 12, where the electronic device in the embodiment may include a display module 30, a housing 20, and a combined circuit board 10.

Optionally, the display screen module 30 and the housing 20 cooperate to form an accommodating space 1000, and the control circuit board 10 is disposed in the accommodating space 1000. The control circuit board 10 is connected to the display module 30 and is used for controlling the operating status of each electronic component of the electronic device including the display module 30. The detailed technical features of other parts of the electronic device are within the understanding of those skilled in the art, and are not described herein.

Referring to fig. 14, fig. 14 is a block diagram illustrating a structural composition of an embodiment of an electronic device according to the present application, where the electronic device may be a mobile phone, a tablet computer, a notebook computer, a wearable device, and the like, and the embodiment illustrates a mobile phone as an example. The electronic device may include an RF circuit 910, a memory 920, an input unit 930, a display unit 940 (i.e., the display screen module 30 in the above embodiment), a sensor 950, an audio circuit 960, a wifi module 970, a processor 980 (which may be the control circuit board 10 in the above embodiment), a power supply 990, and the like. Wherein the RF circuit 910, the memory 920, the input unit 930, the display unit 940, the sensor 950, the audio circuit 960, and the wifi module 970 are respectively connected with the processor 980; power supply 990 is used to provide power to the entire electronic device.

Specifically, the RF circuit 910 is used for transmitting and receiving signals; the memory 920 is used for storing data instruction information; the input unit 930 is used for inputting information, and may specifically include a touch panel 931 and other input devices 932 such as operation keys; the display unit 940 may include a display panel 941; the sensor 950 includes an infrared sensor, a laser sensor, etc. for detecting a user approach signal, a distance signal, etc.; a speaker 961 and a microphone 962 are connected to the processor 980 through the audio circuit 960 for emitting and receiving sound signals; the wifi module 970 is used for receiving and transmitting wifi signals, and the processor 980 is used for processing data information of the electronic device. For specific structural features of the electronic device, please refer to the related description of the above embodiments, and detailed descriptions thereof will not be provided herein.

In the electronic device in this embodiment, the combined circuit board is designed by matching the HDI board (the first circuit board) and the through-hole board PCB (the second circuit board), and a plurality of cavities are formed in the through-hole board. Through the design, the design of the shielding case on the bottom surface of the HDI board (the first circuit board) is reduced, the product cost is greatly reduced, meanwhile, the combined circuit board is smaller and more ingenious in volume, and the electronic equipment can be designed to be thinner and thinner integrally.

The above description is only a part of the embodiments of the present invention, and not intended to limit the scope of the present invention, and all equivalent devices or equivalent processes performed by the present invention through the contents of the specification and the drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims

1. The combined circuit board is characterized by comprising a first circuit board and a second circuit board which are connected in a welding mode;

2. The combined circuit board of claim 1, wherein a first bonding pad for isolating adjacent stacked electronic components is disposed between the stacked electronic components of the first circuit board, a spacing rib is formed at a position between adjacent avoidance areas of the second circuit board, a second bonding pad corresponding to the first bonding pad is disposed on the spacing rib, and the first bonding pad is connected to the second bonding pad by welding.

3. The assembled circuit board of claim 2, wherein the first bonding pad surrounds each of the electronic component stacking sections.

4. The assembled circuit board of claim 2, wherein the second circuit board spacer rib is provided with a plurality of shielding holes arranged in a direction along which the spacer rib extends.

5. The assembled circuit board of claim 4, wherein the shielding holes are respectively arranged along two sides of the second bonding pad in sequence.

6. The modular circuit board of claim 1 wherein the first circuit board has an integration density greater than the integration density of the second circuit board.

7. The assembled circuit board of claim 6, wherein a second stacking area is disposed on a surface of the first circuit board opposite to the stacking area.

8. The modular circuit board of claim 1 wherein the relief area on the second circuit board extends through the second circuit board; the maximum height of the electronic components in the electronic component stacking area of the first circuit board is not larger than the thickness of the second circuit board.

9. The assembled circuit board of claim 8, further comprising a metal shielding plate, wherein the metal shielding plate is connected to the second circuit board and covers the avoiding area of the second circuit board, and the metal shielding plate and the first circuit board are respectively disposed on two opposite sides of the second circuit board to shield and seal the stacking area of the electronic components of the first circuit board.

10. An electronic device comprising a housing and the modular circuit board of any of claims 1-9, the modular circuit board being disposed within the housing.