CN219226292U

CN219226292U - Packaging module and electronic equipment

Info

Publication number: CN219226292U
Application number: CN202320144112.9U
Authority: CN
Inventors: 刘挺
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2023-02-01
Filing date: 2023-02-01
Publication date: 2023-06-20
Anticipated expiration: 2033-02-01

Abstract

The application discloses a packaging module and electronic equipment, and relates to the technical field of electronic equipment. In the application, the first electronic device and the second electronic device are arranged at intervals; the plastic package body encapsulates the first electronic device and the second electronic device; the isolation assembly is arranged in the plastic package body and is positioned between the first electronic device and the second electronic device so as to weaken electromagnetic interference between the first electronic device and the second electronic device, the isolation assembly comprises a first isolation piece and a second isolation piece, and the second isolation piece is arranged on at least part of the surface of the first isolation piece so as to fill a gap between the first isolation piece and the plastic package body and connect the first isolation piece and the plastic package body. This application weakens through two kinds of separators electromagnetic interference, and the higher material of cost in adopting two kinds of separators alone is as the separator, and the cost is reduced on the whole, still can not reduce electromagnetic interference's weakening effect.

Description

Packaging module and electronic equipment

Technical Field

The application relates to the technical field of electronic equipment, in particular to a packaging module and electronic equipment.

Background

System in package (System In a Package, SIP) is the integration of multiple different types of chips into one package to achieve high integration requirements. For complex system-in-package, the electronic devices within the package also interfere with each other, and thus electromagnetic isolation is also required within the package. The materials used for electromagnetic isolation are mostly silver paste, so that the material cost is higher.

Disclosure of Invention

In one aspect, an embodiment of the present application provides a package module, including:

the first electronic device and the second electronic device are arranged at intervals;

the plastic package body is used for packaging the first electronic device and the second electronic device;

the isolation assembly is arranged in the plastic package body and is positioned between the first electronic device and the second electronic device so as to weaken electromagnetic interference between the first electronic device and the second electronic device, the isolation assembly comprises a first isolation piece and a second isolation piece, and the second isolation piece is arranged on at least part of the surface of the first isolation piece so as to fill a gap between the first isolation piece and the plastic package body and connect the first isolation piece and the plastic package body.

In one aspect, an embodiment of the present application provides an electronic device, including:

a circuit board; and

the packaging module is arranged on the circuit board and is electrically connected with the circuit board.

This application weakens through two kinds of separators electromagnetic interference, and the higher material of cost in adopting two kinds of separators alone is as the separator, and the cost is reduced on the whole, still can not reduce electromagnetic interference's weakening effect.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following description will briefly explain the drawings needed in the description of the embodiments, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

FIG. 2 is a schematic diagram of a circuit board according to an embodiment of the present disclosure;

FIG. 3 is a schematic cross-sectional view of the package module of the embodiment of FIG. 2;

FIG. 4 is a schematic diagram of the circuit board in another embodiment of the embodiment shown in FIG. 2;

FIG. 5 is a schematic diagram showing the configuration of the circuit board and the metal shielding case in the embodiment shown in FIG. 4;

fig. 6 is a schematic structural diagram of an electronic device in another embodiment of the present application.

Detailed Description

The present application is described in further detail below with reference to the drawings and examples. It is specifically noted that the following examples are only for illustration of the present application, but do not limit the scope of the present application. Likewise, the following embodiments are only some, but not all, of the embodiments of the present application, and all other embodiments obtained by a person of ordinary skill in the art without making any inventive effort are within the scope of the present application.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.

As used herein, "electronic equipment" (which may also be referred to as a "terminal" or "mobile terminal" or "electronic device") includes, but is not limited to, devices configured to receive/transmit communication signals via a wireline connection, such as via a public-switched telephone network (PSTN), a Digital Subscriber Line (DSL), a digital cable, a direct cable connection, and/or another data connection/network, and/or via a wireless interface, such as for a cellular network, a Wireless Local Area Network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and/or another communication terminal. A communication terminal configured to communicate through a wireless interface may be referred to as a "wireless communication terminal," "wireless terminal," or "mobile terminal. Examples of mobile terminals include, but are not limited to, satellites or cellular telephones; a Personal Communications System (PCS) terminal that may combine a cellular radiotelephone with data processing, facsimile and data communications capabilities; a PDA that can include a radiotelephone, pager, internet/intranet access, web browser, organizer, calendar, and/or a Global Positioning System (GPS) receiver; and conventional laptop and/or palmtop receivers or other electronic devices that include a radiotelephone transceiver. The mobile phone is the electronic equipment provided with the cellular communication module.

An electronic device is described next. Referring to fig. 1, fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application. The electronic device 100 may include a housing 10 and a display screen 20. Wherein the housing 10 is used for carrying and mounting the display screen 20. Of course, the housing 10 may also be used to carry electronic components such as cameras, batteries, circuit boards 30 (shown in fig. 2), processors, and various types of sensors in the electronic device 100. The display 20 is used to display information. The display screen 20 is mounted on the housing 10. In an embodiment, the housing 10 may be a housing-like structure, and may have a receiving space therein for receiving electronic components such as a camera module, a battery, a circuit board 30, a processor, and various types of sensors. In an embodiment, the display 20 may be an AMOLED (Active-matrix organic light emitting diode, active matrix organic light emitting diode or Active matrix organic light emitting diode) display module, a Micro LED (Micro light emitting diode) display module, or even a LCD (Liquid Crystal Display) display module or a QLED (quantum dot electroluminescent diode) display module.

Referring to fig. 2, fig. 2 is a schematic structural diagram of a circuit board 30 according to an embodiment of the present application. The circuit board 30 may be disposed within the housing 10. The type of the circuit board 30 may not be limited.

A package module 40 may be disposed on the circuit board 30. The package module 40 may be disposed within the housing 10 along with the circuit board 30. The package module 40 may employ a system in package to integrate multiple functional chips and components into one package, thereby achieving a complete function. The package module 40 may be electrically connected with the circuit board 30.

The package module 40 may be a combination of one or more of a radio frequency power amplification circuit package module, a bluetooth circuit package module, a satellite navigation circuit package module, a Wi-Fi circuit package module, an audio circuit package module, a memory circuit package module, a power circuit package module, etc. The package module 40 may not be limited in particular.

Referring to fig. 3, fig. 3 is a schematic cross-sectional view of the package module 40 in the embodiment shown in fig. 2. The encapsulation module 40 may include a carrier 41 disposed on the circuit board 30, first and second

electronic devices

42 and 43 disposed on a side of the carrier 41 away from the circuit board 30, a molding body 44 encapsulating the first and second

electronic devices

42 and 43, an isolation assembly 45 disposed within the molding body 44, and an electromagnetic shielding layer 46 disposed on an outer surface of the molding body 44. The carrier 41 is used for carrying the first electronic device 42, the second electronic device 43 and the plastic package 44. The plastic package body 44 is located at one side of the carrier 41, and is connected to the plastic package body 44. The plastic package 44 can encapsulate the first electronic device 42 and the second electronic device 43, so as to integrate the first electronic device 42 and the second electronic device 43 together, thereby realizing a complete function. The isolation assembly 45 is used to attenuate electromagnetic interference (Electromagnetic Interference, EMI) between the first electronic device 42 and the second electronic device 43, which can cause interference to other electronic products such as electronic devices in the vicinity when the electronic products such as electronic devices are in operation, and electromagnetic interference types include conducted interference and radiated interference. The electromagnetic shielding layer 46 may be used to shield the package module 40 from electromagnetic interference between other electronic devices and the package module 40.

The carrier 41 may be a circuit board and the type of carrier 41 may not be limited. In some embodiments, carrier 41 may be a printed circuit board (Printed Circuit Board, PCB). In some embodiments, solder joints are provided on the carrier 41 to solder with the first electronic device 42 and the second electronic device 43 to make electrical connection. For example, carrier 41 may be soldered to first and second

electronic devices

42, 43 on a side remote from circuit board 30. In some embodiments, solder joints are provided on carrier 41 to solder with circuit board 30 to make electrical connection. For example, carrier 41 may be soldered to first and second

electronic devices

42, 43 on a side remote from first and second

electronic devices

42, 43.

The first electronic device 42 and the second electronic device 43 are arranged on the carrier 41 at a distance. The first electronic device 42 and/or the second electronic device 43 may be a radio frequency power amplification circuit, a bluetooth circuit, a satellite navigation circuit, a Wi-Fi circuit, an audio circuit, a memory circuit, a power supply circuit, etc. In some embodiments, the first electronic device 42 and the second electronic device 43 may belong to devices of different functional circuits, respectively, for example, the first electronic device 42 belongs to a device of a baseband circuit, and the second electronic device 43 is a device of a radio frequency circuit. In some embodiments, the first electronic device 42 and the second electronic device 43 may also be devices of different frequency band modules of the same functional circuit, for example, the first electronic device 42 may be a device of a 3G radio frequency circuit, and the second electronic device 43 is a device of a 4G radio frequency circuit.

The plastic package body 44 is disposed on the carrier 41 to cover the carrier 41 on a side of the carrier 41 away from the circuit board 30, and also cover the first electronic device 42 and the second electronic device 43, so as to realize packaging of the first electronic device 42 and the second electronic device 43.

The isolation assembly 45 is disposed in the plastic package 44 and located between the first electronic device 42 and the second electronic device 43, so as to attenuate electromagnetic interference between the first electronic device 42 and the second electronic device 43. In some embodiments, to accommodate the installation of the isolation assembly 45 within the molding 44, a through slot 431 may be provided within the molding 44 to accommodate the isolation assembly 45. In some embodiments, the through groove 431 is disposed such that the carrier 41 is exposed on a side of the molding body 44 away from the carrier 41 through the through groove 431. That is, the extending direction of the through groove 431 is from the side close to the carrier 41 to the side far from the carrier 41. It will be appreciated that the through slots 431 may be configured in other types of grooves, cavities, etc. according to the electromagnetic interference attenuating effect. In some embodiments, the isolation assembly 45 is disposed in the through slot 431, so that the isolation assembly 45 is electrically connected to the ground system on the carrier 41 to achieve the grounding effect, and thus the electromagnetic interference attenuation effect of the isolation assembly 45 is enhanced.

In some embodiments, the isolation assembly 45 may include a first isolator 451 and a second isolator 452. The second spacer 452 may be disposed on at least a portion of the surface of the first spacer 451 to fill a gap between the first spacer 451 and the molding body 44, thereby achieving the effect of connecting the first spacer 451 and the molding body 44. This application weakens electromagnetic interference through two kinds of separators such as first separator 451 and second separator 452, and the higher material of cost in adopting two kinds of separators alone is as the separator, but cost reduction on the whole still can not reduce electromagnetic interference's weakening effect.

In some embodiments, the first spacer 451 and the second spacer 452 are both formed using an electromagnetic shielding material.

In some embodiments, the first separator 451 can be filled as a solid and the second separator 452 can be filled as a liquid. That is, when the isolation assembly 45 is filled into the through groove 431, the solid first isolation member 451 is filled into the through groove 431, and then the liquid first isolation member 451 is filled into the through groove 431 to be solidified, so that the second isolation member 452 can wrap at least part of the surface of the first isolation member 451 to fill the gap between the first isolation member 451 and the surface of the through groove 431, and further connect the first isolation member 451 and the plastic package 44. In some embodiments, the first spacer 451 may abut against the surface of the through groove 431 such that the second spacer 452 may wrap around a portion of the surface of the first spacer 451. In some embodiments, the second spacer 452 may wrap around the entire first spacer 451.

In some embodiments, the first separator 451 can be copper foil or other solid electromagnetic shielding material. In some embodiments, the second spacer 452 may be silver paste when filled into the through groove 431, and may be cured to form a silver paste cured product when filled.

It can be appreciated that when the first spacer 451 is copper foil and the second spacer 452 is silver paste, the cooperation of the first spacer 451 and the second spacer 452 can reduce the use of silver paste, thereby saving the material cost.

In some embodiments, in order to achieve the circulation of the liquid second spacer 452, the first spacer 451 may be provided with a through hole or a mesh structure, so as to reduce the gap between the first spacer 451 and the second spacer 452, and also reduce the gap between the first spacer 451 and the second spacer 452 and the plastic package 44, so as to enhance the attenuation effect of electromagnetic interference.

The electromagnetic shielding layer 46 is disposed on the surface of the plastic package body 44 to form a shielding effect on the surface of the plastic package body 44. The electromagnetic shielding layer 46 may be made of an electromagnetic shielding material. In some embodiments, the electromagnetic shielding layer 46 may be formed by forming a plating layer on the surface of the plastic package body 44 using an electromagnetic shielding material.

In some embodiments, electromagnetic shield 46 may be formed on plastic encapsulant 44 except on the outer surface to which carrier 41 is attached.

In some embodiments, an electromagnetic shielding layer 46 may be formed on the isolation assembly 45 to electrically connect with the isolation assembly 45, enhancing the shielding effect of the electromagnetic shielding layer 46.

Referring to fig. 4, fig. 4 is a schematic structural diagram of the circuit board 30 in another embodiment in the embodiment shown in fig. 2. A metal shield 50 may be provided on the circuit board 30 to shield the electronic devices within the metal shield 50. In some embodiments, the metallic shield 50 may be soldered or bonded to the circuit board 30. In some embodiments, the metallic shield 50 may be electrically connected to a ground system on the circuit board 30 to achieve grounding of the metallic shield 50 and enhance the shielding effect of the metallic shield 50.

Referring to fig. 5, fig. 5 is a schematic structural diagram of the circuit board 30 and the metal shielding case 50 in the embodiment shown in fig. 4. A third electronic device 60 may be disposed within the metallic shield 50. A gap exists between the metallic shield 50 and the third electronic device 60. The third electronic device 60 may be a combination of one or more of radio frequency, bluetooth, navigation, etc. circuits.

Next, an electronic device is described, referring to fig. 6, fig. 6 is a schematic structural diagram of another embodiment of the electronic device in the present application. The electronic device 200 may be a mobile phone, a tablet computer, a notebook computer, a wearable device, etc. The present embodiment is illustrated using a mobile phone as an example. The structure of the electronic device 200 may include an RF circuit 210, a memory 220, an input unit 230, a display unit (i.e., the display 20 in the above-described embodiments) 240, a sensor 250, an audio circuit 260, a Wi-Fi module 270, a processor 280, a power supply, and the like. The RF circuit 210, the memory 220, the input unit 230, the display unit 240, the sensor 250, the audio circuit 260, and the Wi-Fi module 270 are respectively connected to the processor 280. The power supply 290 is used to provide power to the entire electronic device 200.

Specifically, RF circuit 210 is used to send and receive signals. Memory 220 is used to store data instruction information. The input unit 230 is used for inputting information, and may specifically include a touch panel 231 and other input devices 232 such as operation keys. The display unit 240 may include a display panel 241, etc. The sensor 250 includes an infrared sensor, a laser sensor, etc., for detecting a user proximity signal, a distance signal, etc. The speaker 261 and microphone (or microphone, or receiver assembly) 262 are coupled to the processor 280 through the audio circuit 260 for receiving and transmitting sound signals. Wi-Fi module 270 is configured to receive and transmit Wi-Fi signals. The processor 280 is used to process data information of the electronic device.

The foregoing description is only a partial embodiment of the present application, and is not intended to limit the scope of the present application, and all equivalent devices or equivalent process transformations made by using the descriptions and the drawings of the present application, or direct or indirect application to other related technical fields, are included in the scope of patent protection of the present application.

Claims

1. A packaging module, comprising:

2. The packaging module of claim 1, further comprising:

the first electronic device, the second electronic device and the plastic package body are arranged on the surface of the same side of the supporting body, and the isolation assembly is connected with the supporting body.

3. The packaging module according to claim 2, wherein the plastic package body is provided with a through groove, the extending direction of the through groove is from a side close to the carrier to a side far away from the carrier, the isolation assembly is arranged in the through groove, and the second isolation member fills a gap between the first isolation member and the surface of the through groove.

4. A packaging module according to claim 2 or 3, wherein the isolation assembly is connected to a ground system on the carrier.

5. The packaging module of claim 2, wherein the plastic package body is provided with an electromagnetic shielding layer on an outer surface other than the outer surface connected with the carrier, the electromagnetic shielding layer being connected with the isolation assembly.

6. The package module of claim 1, wherein the second spacer is a silver paste cured.

7. The packaging module of claim 1, wherein the first spacer is copper foil.

8. The package module of claim 1, wherein the second spacer is disposed on an entire surface of the first spacer to fill a gap between the first spacer and the molding body and connect the first spacer and the molding body.

9. An electronic device, comprising:

a circuit board; and

the package module of any of claims 1-8, disposed on and electrically connected to the circuit board.

10. The electronic device of claim 9, further comprising:

a third electronic device disposed on the circuit board;

and the metal shielding cover is covered on the third electronic device.