CN220066095U

CN220066095U - Antenna packaging structure and terminal equipment

Info

Publication number: CN220066095U
Application number: CN202321568986.3U
Authority: CN
Inventors: 关一凡; 王荣书; 高婷婷; 张宁
Original assignee: Beijing Xiaomi Mobile Software Co Ltd
Current assignee: Beijing Xiaomi Mobile Software Co Ltd
Priority date: 2023-06-19
Filing date: 2023-06-19
Publication date: 2023-11-21
Anticipated expiration: 2033-06-19

Abstract

The present disclosure relates to an antenna packaging structure and a terminal device, the antenna packaging structure comprising: a circuit board structure having a feed source portion; at least one metal connection post; the antenna body is arranged at two ends of the metal connecting column at intervals with the circuit board structure and is fixed on the circuit board structure through the metal connecting column; the antenna body is provided with a feed point, and the feed point is electrically connected with the feed source part of the circuit board structure through the metal connecting column.

Description

Antenna packaging structure and terminal equipment

Technical Field

The disclosure relates to the field of electronic equipment, and in particular relates to an antenna packaging structure and terminal equipment.

Background

Currently, the terminal device is being miniaturized and integrated, which requires that the antenna package structure in the terminal device is also being miniaturized and integrated.

In the related art, the antenna is directly mounted on the surface of the circuit board structure, or the antenna is lifted by a lifting plate and then connected with the circuit board structure, so that the antenna is packaged, but the antenna performance is poor due to insufficient manufacturing level in the former two packaging modes, and the latter needs to occupy a larger space on the circuit board structure.

Disclosure of Invention

In order to overcome the problems in the related art, the present disclosure provides an antenna package structure and a terminal device.

In a first aspect, the present disclosure provides an antenna package structure, comprising:

a circuit board structure having a feed source portion;

at least one metal connection post;

the antenna body is arranged at two ends of the metal connecting column at intervals with the circuit board structure and is fixed on the circuit board structure through the metal connecting column;

the antenna body is provided with a feed point, and the feed point is electrically connected with the feed source part of the circuit board structure through the metal connecting column.

Optionally, a heat dissipation gap is formed between the antenna body and the circuit board structure; the gap width of the heat dissipation gap depends on the length of the metal connecting column.

Optionally, the antenna packaging structure further includes:

an antenna matching circuit having at least one matching element;

the at least one matching element is fixed on the circuit board structure, and the at least one matching element is close to and/or located in the heat dissipation gap.

Optionally, the antenna body is provided with a plurality of first bonding pads, and the plurality of first bonding pads are arranged around the periphery of the antenna body and are used for fixing the metal connecting column and the antenna body;

the circuit board structure is provided with a plurality of second bonding pads corresponding to the first bonding pads and used for fixing the metal connecting columns and the circuit board structure.

Optionally, the antenna packaging structure further includes:

the shielding wall is fixed on the circuit board structure and surrounds the periphery of the antenna body.

Optionally, the antenna packaging structure further includes:

the shielding cover is fixedly arranged on the circuit board structure and surrounds the antenna body;

the shielding case is provided with at least one opening, wherein the projection of the antenna body towards the circuit board structure is positioned in the projection of the opening towards the circuit board structure.

Optionally, the antenna body is flush with a plane in which the opening of the shielding case is located, or at least part of the antenna body extends out of the shielding case through the opening.

Optionally, the antenna packaging structure further includes:

the sealing colloid is filled between the shielding wall or the shielding cover and the circuit board structure and is wrapped outside the matching element;

the maximum filling thickness of the sealing colloid is smaller than or equal to the length of the metal connecting column.

Optionally, the length of the metal connecting column is 0.3mm to 0.6mm.

In a second aspect, the present disclosure provides a terminal device, including:

an antenna package structure as in any of the embodiments of the first aspect.

The technical scheme provided by the embodiment of the disclosure can comprise the following beneficial effects:

in this disclosed embodiment, antenna body and circuit plate structure interval set up in the both ends of metal spliced pole, through fixed antenna body and metal spliced pole to on being fixed in the circuit plate structure with metal spliced pole, can enough realize the fixed connection between antenna body and the circuit plate structure, can realize backing up the antenna body again, effectively promote antenna body to antenna signal receiving ability. Meanwhile, the feed point of the antenna body is electrically connected with the feed source part of the circuit board structure through the metal connecting column, so that electric signals can be transmitted by utilizing the conductivity of the metal connecting column, the power consumption of the antenna body can be reduced, and the service performance of the antenna body is improved.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure.

Fig. 1 is a schematic cross-sectional view of an antenna package structure according to an exemplary embodiment of the present disclosure.

Fig. 2 is a schematic diagram illustrating a cross-sectional structure of an antenna package according to an exemplary embodiment of the present disclosure.

Fig. 3 is a schematic diagram one of arrangement positions of a first pad according to an exemplary embodiment of the present disclosure.

Fig. 4 is a second schematic diagram showing arrangement positions of first pads according to an exemplary embodiment of the present disclosure.

Fig. 5 is a schematic diagram of a cross-sectional structure of an antenna package structure according to an exemplary embodiment of the present disclosure.

Fig. 6 is a schematic diagram of a cross-sectional structure of an antenna package structure according to an exemplary embodiment of the present disclosure.

Fig. 7 is a block diagram of a terminal device according to an exemplary embodiment of the present disclosure.

In the above figures: 100. an antenna package structure; 101. a circuit board structure; 1011. a second bonding pad; 102. a metal connection column; 103. an antenna body; 1031. a first bonding pad; 104. a heat dissipation gap; 105. a matching element; 106. solder paste; 107. a shielding wall; 108. a shield; 109. an opening; 110. sealing colloid; 111. solder balls; 112. a welding member; 113. a first circuit board;

800. a terminal device; 802. a processing assembly; 804. a memory; 806. a power supply assembly; 808. a multimedia component; 810. an audio component; 812. an input/output interface; 814. a sensor assembly; 816. a communication component; 820. a processor.

Detailed Description

Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples are not representative of all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus consistent with some aspects of the disclosure as detailed in the accompanying claims.

The packaging of antennas is generally achieved in the related art by the following two ways:

in the first mode, the antenna is directly attached to the surface of the circuit board structure; specifically, the antenna is soldered to the circuit board structure in the form of a solder paste patch reflow. However, this method has a problem that the welding is not uniform due to the insufficient manufacturing level, and the performance of the antenna is affected to some extent. Especially when the antenna is a high frequency antenna, the welding quality directly affects the reception and feedback of the signal.

In the second mode, the antenna is raised by the raised plate and then connected with the circuit board structure; specifically, the antenna is fixed on the circuit board structure in a manner of being supported by the whole insulating raised plate, and the electric connection with the circuit board structure is completed by utilizing the wiring in the raised plate. However, the use of the raised plate in this manner occupies a relatively large space on the circuit board structure, which is disadvantageous in terms of miniaturization of the terminal device. And the elevating plate is attached to the antenna, which is unfavorable for heat dissipation of the antenna, thereby increasing power consumption of the antenna.

An embodiment of the present disclosure provides an antenna package structure, fig. 1 is a schematic cross-sectional structure diagram of an antenna package structure according to an exemplary embodiment of the present disclosure, and as shown in fig. 1, the antenna package structure 100 includes:

a circuit board structure 101 having a feed source portion;

at least one metal connection post 102;

the antenna body 103 is arranged at two ends of the metal connecting column 102 at intervals with the circuit board structure 101 and is fixed on the circuit board structure 101 through the metal connecting column 102;

the antenna body 103 has a feeding point electrically connected to the feed portion of the circuit board structure 101 through the metal connection post 102.

In an embodiment of the present disclosure, the antenna package structure includes: the antenna comprises a circuit board structure, at least one metal connecting post and an antenna body.

The circuit board structure can be a single-layer printed circuit board, and a feed source part is designed on a printed circuit of the circuit board structure; alternatively, the circuit board structure may be a double-layer printed circuit board or a multi-layer printed circuit board, and at least one layer of printed circuit board is provided with a feed source part.

The feed source part is used for electrically connecting the antenna body, and inputting an electric signal to the antenna body so as to excite the antenna body to radiate the signal.

The antenna body comprises a feed point and an antenna radiator, the feed point is arranged on the antenna radiator, and the feed point is electrically connected with the feed source part; the feed point is used for receiving an electric signal input by the circuit board structure and transmitting the electric signal to the antenna radiator; under the excitation of the electric signal, the antenna radiator radiates a wireless signal; or the antenna radiator receives the wireless signal, converts the wireless signal into an electric signal and transmits the electric signal to the feed point; the feed point is used for transmitting the electric signal to the circuit board structure for receiving, thereby realizing the radiation of the antenna body and the receiving of the wireless signal.

The antenna radiator can be made of a material with a high dielectric constant, such as ceramic, so that on one hand, the size of the antenna body can be reduced, and the space requirement of the antenna body when the antenna body is used in terminal equipment can be met; on the other hand, the antenna body can be ensured to acquire weak antenna radiation signals, and the performance requirement of the antenna body in the use of terminal equipment is met.

The metal connecting column is of a columnar structure, is provided with a first end and a second end which are oppositely arranged, and is also provided with sections of various shapes such as a circle, a square, a triangle and the like.

The metal connecting column has conductivity and can be made of various materials such as metal, alloy and the like. Optionally, the metal connection column is a copper column.

The antenna body with circuit plate structure interval set up in metal spliced pole's first end and second end, through the antenna body with metal spliced pole's first end is connected, and circuit plate structure with metal spliced pole's second end is connected, can make the antenna body pass through metal spliced pole is fixed in on the circuit plate structure.

Here, the antenna body with the first end of metal spliced pole accessible welded connection realizes fixed connection, circuit plate structure with the second end of metal spliced pole also accessible welded connection to can guarantee that the antenna body with the relative position of circuit plate structure is fixed, be favorable to the encapsulation of antenna.

The antenna body with circuit plate structure interval sets up, can lengthen the antenna body to the distance between the circuit plate structure reduces the influence of circuit plate structure to the antenna body, improves the performance of antenna body.

The antenna packaging structure is provided with at least one metal connecting column, and when the antenna body and the circuit board structure are fixed through the at least one metal connecting column, the at least one metal connecting column can electrically connect a feed point in the antenna body with a feed source part in the circuit board structure according to performance parameters of the antenna body.

Here, the performance parameters of the antenna body include at least: the number of feed points.

In some embodiments, the antenna body has only one feed point thereon. The antenna package structure may have one or more of the metal connection posts. The antenna body is fixed on the circuit board structure by the one or more metal connecting columns, the first end and the second end of any one of the one or more metal connecting columns are further required to be electrically connected with a feed point of the antenna body and a feed source part of the circuit board structure respectively, and the feed point of the antenna body is electrically connected with the feed source part of the circuit board structure through the metal connecting columns.

In other embodiments, the antenna body has a plurality of feed points thereon. The antenna package structure may have a plurality of the metal connection posts. The number of the metal connection posts is greater than or equal to the number of the feed points.

When the number of the metal connecting columns is equal to the number of the feed points, the plurality of metal connecting columns are all used for fixing the antenna body on the circuit board structure, and the first ends and the second ends of the plurality of metal connecting columns are also respectively and electrically connected with different feed points and different feed source parts, so that the plurality of feed points of the antenna body are electrically connected with the feed source parts of the circuit board structure through the metal connecting columns.

When the number of the metal connecting columns is larger than that of the feeding points, the plurality of the metal connecting columns are all used for fixing the antenna body on the circuit board structure, the plurality of the metal connecting columns with the same number as that of the feeding points are used for respectively and electrically connecting different feeding points and different feeding source parts, and the plurality of feeding points of the antenna body are electrically connected with the feeding source parts of the circuit board structure through the metal connecting columns. The other metal connecting posts except the plurality of metal connecting posts only fix the antenna body, and the feed point and the feed source part are not connected.

It should be noted that, in the above embodiment, the position of the metal connection post may be selected according to actual requirements, except for meeting the use requirement of the antenna body, which is not specifically limited in the embodiments of the present disclosure.

Optionally, as shown in fig. 1, a heat dissipation gap 104 is formed between the antenna body 103 and the circuit board structure 101; wherein, the gap width of the heat dissipation gap 104 depends on the length of the metal connection post 102.

In the embodiment of the disclosure, the antenna body and the circuit board structure are spaced at two ends of the metal connecting post, so that a heat dissipation gap is formed between the antenna body and the circuit board structure. Typically, the width of the heat dissipation gap is dependent on the length of the metal connection post, i.e. the distance from the first end to the second end of the metal connection post.

It should be noted that the length of the metal connection post should be matched with the actual requirement, so that on one hand, the clearance between the antenna body and the circuit board structure needs to be ensured to be enough for the antenna body to dissipate heat, and on the other hand, the loss of the electrical connection between the antenna body and the circuit board structure needs to be ensured to be less.

Optionally, the length of the metal connecting column is 0.3mm to 0.6mm.

In the embodiment of the disclosure, the efficiency of transmitting heat to the outside by the antenna body can be increased by the existence of the heat dissipation gap, so that the power consumption of the antenna is reduced.

Optionally, as shown in fig. 1, the antenna packaging structure 100 further includes:

an antenna matching circuit having at least one matching element 105;

the at least one matching element 105 is fixed to the circuit board structure 101, and the at least one matching element 105 is located close to and/or within the heat dissipation gap 104.

In an embodiment of the present disclosure, the antenna package structure further includes: an antenna matching circuit.

The antenna matching circuit at least comprises: an antenna impedance matching circuit, an antenna switch control circuit and the like.

The antenna matching circuit has at least one matching element, where the matching element is, for example, a basic element such as inductance, resistance, capacitance, etc.; or an integrated circuit element such as a chip.

The at least one matching element is fixed on the circuit board structure, and the at least one matching element is close to a heat dissipation gap between the antenna body and the circuit board structure and/or is located inside the heat dissipation gap.

Here, the mating element is typically secured to the circuit board structure by soldering, however, it will be appreciated that other connection means may be used with the disclosed embodiments to secure the mating element to the circuit board structure.

Illustratively, as shown in fig. 1, the antenna package structure 100 has two antenna bodies 103 and five matching elements 105. Two matching elements 105 are positioned inside the heat dissipation gap 104 and are fixed on the circuit board structure 101 by means of connecting the welding pieces 112; three matching elements 105 are located close to the heat dissipation gap 104 and are fixed to the circuit board structure 101 by pads.

In the embodiment of the disclosure, the matching element in the antenna matching circuit in the antenna packaging structure can be arranged in the heat dissipation gap and/or near the heat dissipation gap, so that on one hand, the space layout of elements on the circuit board structure can be optimized, and the space occupied by the antenna body on the circuit board structure is saved; on the other hand, the matching element is provided inside the heat radiation gap, and the matching element can be effectively protected.

Alternatively, fig. 2 is a schematic diagram of a cross-sectional structure of an antenna package structure according to an exemplary embodiment of the present disclosure, as shown in fig. 2, the antenna body 103 has a plurality of first bonding pads 1031, and the plurality of first bonding pads 1031 are disposed around a peripheral side of the antenna body 103, for fixing the metal connection post 102 and the antenna body 103;

the circuit board structure 101 has a plurality of second pads 1011 corresponding to the first pads 1031 for fixing the metal connection posts 102 and the circuit board structure 101.

In an embodiment of the disclosure, the antenna body has a first surface facing the circuit board structure. The first surface may have any geometric shape.

The first surface is available for connection with the metal connection post. Specifically, the plurality of first bonding pads are disposed on the first surface, and the plurality of first bonding pads may be arranged around the peripheral edge portion of the first surface. A plurality of first bonding pads are welded with the metal connecting columns.

In an embodiment, fig. 3 is a schematic diagram illustrating an arrangement position of first pads according to an exemplary embodiment of the present disclosure, as shown in fig. 3, two first pads 1031 may be provided, a first surface of the antenna body 103 may be circular, and the two first pads 1031 may be respectively located near two opposite ends of the first surface.

In still another embodiment, fig. 4 is a schematic diagram two of an arrangement position of first pads, as shown in fig. 4, where the first pads 1031 may have four, the first surface of the antenna body 103 may have a rectangular shape, and the four first pads 1031 may be respectively located near four corners on the first surface.

And the plurality of metal connecting columns are respectively welded with the plurality of first bonding pads, so that the plurality of metal connecting columns and the antenna body are fixed together. Here, the metal connection post and the first pad may be connected by fusion welding, pressure welding, or the like, however, it is understood that the connection of the metal connection post and the first pad may be realized by other welding methods according to the embodiments of the present disclosure.

Based on the arrangement positions of the plurality of first bonding pads, after the metal connecting columns are welded with the first bonding pads, the plurality of first bonding pads can be arranged around the periphery of the antenna body, so that the middle part of the antenna body is free, a continuous heat dissipation gap is formed, and other matching elements can be contained conveniently.

The circuit board structure is provided with a second surface facing the first surface, and a plurality of second bonding pads corresponding to the positions of the first bonding pads are arranged on the second surface. The plurality of second bonding pads are soldered to the metal connection posts so that the metal connection posts and the circuit board structure can be fixed together.

Illustratively, as shown in fig. 2, the metal connection post 102 is connected to the first pad 1031 by soldering, and the first pad 1031 and/or the metal connection post 102 may be soldered together after soldering with the solder paste 106. The metal connection post 102 is connected with the second bonding pad 1011 in a welding manner, and the second bonding pad 1011 and/or the metal connection post 102 can be soldered together after being soldered with solder paste 106.

The antenna body 103 and the metal connection post 102 are fixed on one side of the circuit board structure 101, and the other side of the circuit board structure may further be soldered with a first circuit board 113 through a solder ball 111. The first circuit board 113 may be a hard circuit board or a flexible circuit board, and other components may be fixed on the first circuit board to implement more circuit requirements in the terminal device.

In the embodiment of the disclosure, the first end of the metal connecting post is welded with the first bonding pad on the antenna body, and the second end is welded with the second bonding pad on the circuit board structure, so that the antenna body and the circuit board structure are fixed together. Through a plurality of first bonding pads around setting up the week side of antenna body can realize forming continuous heat dissipation clearance between a plurality of metal connecting columns, is favorable to the heat dissipation of antenna body.

Optionally, fig. 5 is a schematic cross-sectional view of a third antenna package structure according to an exemplary embodiment of the present disclosure, and as shown in fig. 5, the antenna package structure 100 further includes:

a shielding wall 107 fixed on the circuit board structure 101, and the shielding wall 107 surrounds the periphery of the antenna body 103.

In an embodiment of the present disclosure, the antenna package structure further includes: and a shielding wall.

The shielding wall is of a plate-shaped structure, a first end of the shielding wall is fixed on the circuit board structure, and a second end of the shielding wall extends in a direction away from the second surface of the circuit board structure. Typically, the second end of the shielding wall may extend in a direction perpendicular to the second surface. The extension height of the shielding wall on the circuit board structure can be set according to actual requirements, and in general, the extension height of the shielding wall is determined by the distance between the antenna body and the circuit board structure.

The second end of the shielding wall can be fixed on the second surface of the circuit board structure through the third bonding pad; the shielding wall can be electrically connected with a grounding layer in the circuit board structure through the third bonding pad.

The shielding walls are connected end to form a closed shape. The shielding wall surrounds the periphery of the antenna body, so that the projection of the antenna body towards the circuit board structure is positioned in the shielding wall.

The shielding wall can be made of various materials, and different materials enable the shielding wall to have at least two functions:

first, the shielding wall is metal material or contains the composite material of metal, the shielding wall encircles the antenna body, can prevent electromagnetic noise to the interference of antenna body.

Second, the shielding wall is inorganic nonmetallic material or glue material, the shielding wall encircles the antenna body, can at least with the antenna body with other components in the circuit board structure separate, form independent encapsulation area.

In the embodiment of the disclosure, the shielding wall may be made of multiple different materials, and the shielding wall made of different materials is fixed on the circuit board structure to separate the antenna body from the external element or prevent electromagnetic noise from interfering with the antenna body.

Optionally, fig. 6 is a schematic cross-sectional view of an antenna package structure according to an exemplary embodiment of the present disclosure, and as shown in fig. 6, the antenna package structure 100 further includes:

a shielding cover 108 fixedly arranged on the circuit board structure 101, wherein the shielding cover 108 surrounds the antenna body 103;

the shielding cover 108 has at least one opening 109, wherein the projection of the antenna body 103 towards the circuit-board structure 101 is located within the projection of the opening 109 towards the circuit-board structure 101.

In an embodiment of the present disclosure, the antenna package structure further includes: and a shielding case.

The shield cover includes: the circuit board comprises a top cover and a side plate, wherein the first end of the side plate is connected with the top cover, and the second end of the side plate is fixedly arranged on the circuit board structure. The side plate surrounds the periphery of the antenna body, so that the shielding cover surrounds the antenna body.

A fourth bonding pad is arranged on the second surface of the circuit board structure, and the second end of the side plate of the shielding cover can be fixed on the second surface of the circuit board structure through the fourth bonding pad; the shield can also be electrically connected to a ground plane in the circuit board structure through the fourth bond pad.

The shield has at least one opening for the antenna body to radiate wireless signals to the outside or to receive wireless signals. The position and size of the opening may be set according to the size and position of the antenna body, which is not particularly limited in the embodiments of the present disclosure.

Typically, the opening may be located in the top cover, and the projection of the antenna body towards the circuit board structure is located within the projection of the opening towards the circuit board structure.

The shielding cover can be made of various materials, and the different materials enable the shielding cover to have at least two functions:

first, the shield cover is metal material or contains the composite material of metal, the shield cover surrounds the antenna body, can prevent electromagnetic noise to the interference of antenna body.

Secondly, the shielding cover is made of inorganic nonmetallic materials or glue materials, and surrounds the antenna body, so that the antenna body can be separated from other elements in the circuit board structure to form an independent packaging area; and the antenna body can be protected, and the damage of the antenna packaging structure to the antenna body during processing and use is reduced.

In the embodiment of the disclosure, the shielding cover may be made of multiple different materials, and the shielding cover made of different materials is fixed on the circuit board structure to protect the antenna body or prevent electromagnetic noise from interfering with the antenna body.

Optionally, as shown in fig. 5, the antenna body 103 is flush with the plane of the opening 109 of the shielding case 108, or at least part of the antenna body 103 protrudes out of the shielding case 108 through the opening 109.

In the embodiment of the disclosure, in order to reduce the influence of the shielding case on the performance of the antenna body, the relative positional relationship between the antenna body and the opening may be adjusted.

The antenna body also has a third surface, which may be a top surface of the antenna body, and the third surface may be flush with a top cover of the shield, that is, the antenna body is flush with a plane in which the opening of the shield is located; alternatively, the third surface may be slightly higher than a plane in which a top cover of the shield case is located, such that at least a portion of the antenna body protrudes out of the shield case through the opening.

Optionally, as shown in fig. 5 to 6, the antenna package structure 100 further includes:

a sealing colloid 110 filled between the shielding wall 107 or the shielding cover 108 and the circuit board structure 101 and wrapped outside the matching element 105;

wherein the maximum filling thickness of the sealing compound 110 is less than or equal to the length of the metal connection post 102.

In an embodiment of the present disclosure, the antenna package structure further includes: and (5) sealing the colloid.

The antenna packaging structure comprises a shielding wall or a shielding cover, and the sealing colloid is filled between the shielding wall or the shielding cover and the circuit board structure.

The sealing colloid is glue, and the glue can be various types of glue such as instant glue, epoxy resin bonding glue, UV glue (ultraviolet light curing glue) and the like.

In some embodiments, the antenna structure is filled with the encapsulant that self-levels on the second surface of the circuit board structure, is confined by the shield wall inside the shield wall, or is confined by the shield can inside the shield can. The sealing colloid is wrapped outside the matching element inside the shielding wall or the shielding cover.

In other embodiments, the antenna structure is filled with the sealing colloid, and the matching element located inside the shielding wall or the shielding cover is subjected to dispensing, so that the sealing colloid wraps the outside of the matching element.

The maximum filling thickness of the sealing colloid should not affect the operation of the antenna body, therefore, the maximum filling thickness of the sealing colloid is generally smaller than or equal to the length of the metal connecting post, so that when the sealing colloid is at the maximum filling thickness, the sealing colloid is at most flush with the first surface of the antenna body, and the antenna body is not affected to radiate wireless signals outwards or receive wireless signals.

In the embodiment of the disclosure, the matching element at the periphery of the heat dissipation gap or inside the heat dissipation gap is encapsulated by the sealing glue, so that on one hand, mechanical impact and moisture invasion can be resisted, and the safety of the matching element in the use process is effectively protected; on the other hand, the matching element can be corrosion-resistant, the working reliability of the matching element in a severe environment is effectively improved, and the service life is prolonged.

An embodiment of the present disclosure provides a terminal device, including: the antenna package structure is described in the embodiments of fig. 1 to 6.

The antenna packaging structure can be arranged in terminal equipment such as a smart phone, wearable equipment, a tablet personal computer and the like.

It should be noted that, the specific structure of the antenna package structure may refer to the descriptions in the embodiments corresponding to fig. 1 to 6, and for brevity of description, details are not repeated here.

Fig. 7 is a block diagram of a terminal device according to an exemplary embodiment of the present disclosure. For example, the terminal device 800 may be a mobile phone, a mobile computer, a smart wearable device, etc.

Referring to fig. 7, a terminal device 800 may include one or more of the following components: a processing component 802, a memory 804, a power component 806, a multimedia component 808, an audio component 810, an input/output (I/O) interface 812, a sensor component 814, and a communication component 816.

The processing component 802 generally controls overall operation of the terminal device 800, such as operations associated with display, telephone calls, data communications, camera operations, and recording operations. The processing component 802 may include one or more processors 820 to execute instructions to perform all or part of the steps of the methods described above. Further, the processing component 802 can include one or more modules that facilitate interactions between the processing component 802 and other components. For example, the processing component 802 can include a multimedia module to facilitate interaction between the multimedia component 808 and the processing component 802.

The memory 804 is configured to store various types of data to support operations at the terminal device 800. Examples of such data include instructions for any application or method operating on terminal device 800, contact data, phonebook data, messages, pictures, video, and the like. The memory 804 may be implemented by any type or combination of volatile or nonvolatile memory devices such as Static Random Access Memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic or optical disk.

The power supply component 806 provides power to the various components of the terminal device 800. The power components 806 may include a power management system, one or more power sources, and other components associated with generating, managing, and distributing power for the terminal device 800.

The multimedia component 808 includes a screen between the terminal device 800 and the user that provides an output interface. In some embodiments, the screen may include a Liquid Crystal Display (LCD) and a Touch Panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive input signals from a user. The touch panel includes one or more touch sensors to sense touches, swipes, and gestures on the touch panel. The touch sensor may sense not only the boundary of a touch or slide action, but also the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component 808 includes a front camera and/or a rear camera. The front camera and/or the rear camera may receive external multimedia data when the terminal device 800 is in an operation mode, such as a photographing mode or a video mode. Each front camera and rear camera may be a fixed optical lens system or have focal length and optical zoom capabilities.

The audio component 810 is configured to output and/or input audio signals. For example, the audio component 810 includes a Microphone (MIC) configured to receive external audio signals when the terminal device 800 is in an operational mode, such as a call mode, a recording mode, and a voice recognition mode. The received audio signals may be further stored in the memory 804 or transmitted via the communication component 816. In some embodiments, audio component 810 further includes a speaker for outputting audio signals.

The I/O interface 812 provides an interface between the processing component 802 and peripheral interface modules, which may be a keyboard, click wheel, buttons, etc. These buttons may include, but are not limited to: homepage button, volume button, start button, and lock button.

The sensor assembly 814 includes one or more sensors for providing status assessment of various aspects of the terminal device 800. For example, the sensor assembly 814 may detect an on/off state of the terminal device 800, a relative positioning of the components, such as a display and keypad of the terminal device 800, the sensor assembly 814 may also detect a change in position of the terminal device 800 or a component of the terminal device 800, the presence or absence of a user's contact with the terminal device 800, an orientation or acceleration/deceleration of the terminal device 800, and a change in temperature of the terminal device 800. The sensor assembly 814 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. The sensor assembly 814 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly 814 may also include an acceleration sensor, a gyroscopic sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.

The communication component 816 is configured to facilitate communication between the terminal device 800 and other devices, either wired or wireless. The terminal device 800 may access a wireless network based on a communication standard, such as Wi-Fi,2G, or 3G, or a combination thereof. In one exemplary embodiment, the communication component 816 receives broadcast signals or broadcast related information from an external broadcast management system via a broadcast channel. In one exemplary embodiment, the communication component 816 further includes a Near Field Communication (NFC) module to facilitate short range communications. For example, the NFC module may be implemented based on Radio Frequency Identification (RFID) technology, infrared data association (IrDA) technology, ultra Wideband (UWB) technology, bluetooth (BT) technology, and other technologies.

In an exemplary embodiment, the terminal device 800 can be implemented by one or more Application Specific Integrated Circuits (ASICs), digital Signal Processors (DSPs), digital Signal Processing Devices (DSPDs), programmable Logic Devices (PLDs), field Programmable Gate Arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic elements for executing the methods described above.

In an exemplary embodiment, a non-transitory computer readable storage medium is also provided, such as memory 804 including instructions executable by processor 820 of terminal device 800 to perform the above-described method. For example, the non-transitory computer readable storage medium may be ROM, random Access Memory (RAM), CD-ROM, magnetic tape, floppy disk, optical data storage device, etc.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This disclosure is intended to cover any adaptations, uses, or adaptations of the disclosure following the general principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

It is to be understood that the present disclosure is not limited to the precise arrangements and instrumentalities shown in the drawings, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. An antenna package structure, comprising:

a circuit board structure having a feed source portion;

at least one metal connection post;

2. The antenna package of claim 1, wherein a heat dissipation gap is formed between the antenna body and the circuit board structure; the gap width of the heat dissipation gap depends on the length of the metal connecting column.

3. The antenna package of claim 2, further comprising:

an antenna matching circuit having at least one matching element;

4. The antenna package as claimed in claim 3, wherein,

the antenna body is provided with a plurality of first bonding pads, and the plurality of first bonding pads are arranged around the periphery of the antenna body and are used for fixing the metal connecting column and the antenna body;

5. The antenna package of claim 4, further comprising:

6. The antenna package of claim 4, further comprising:

7. The antenna package of claim 6, wherein the antenna body is flush with a plane in which the opening of the shield is located or at least a portion of the antenna body protrudes through the opening.

8. The antenna package according to any one of claims 5 to 7, further comprising:

9. The antenna package as claimed in claim 1, wherein,

the length of the metal connecting column is 0.3mm to 0.6mm.

10. A terminal device, comprising: the antenna package of any one of claims 1 to 9.