CN105376938B - A kind of communication apparatus and its circuit board assemblies - Google Patents
A kind of communication apparatus and its circuit board assemblies Download PDFInfo
- Publication number
- CN105376938B CN105376938B CN201510780543.4A CN201510780543A CN105376938B CN 105376938 B CN105376938 B CN 105376938B CN 201510780543 A CN201510780543 A CN 201510780543A CN 105376938 B CN105376938 B CN 105376938B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- electronic component
- electro
- shielding cover
- board assemblies
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a kind of circuit board assemblies, the first electronic component, the second electronic component, third electronic component and electro-magnetic shielding cover including circuit board, on the circuit board, the electro-magnetic shielding cover covers at first electronic component wherein, and second electronic component and the third electronic component are located at the two sides of first electronic component and are electrically connected by conducting wire.The invention also discloses a kind of communication apparatus.Circuit board assemblies of the invention reduce the wiring of the printed wire on circuit board, and reduce the layout area on circuit board, make full use of existing wiring space, do not influence PCB aesthetics and electromagnetic susceptibility electronic component electromagnetic shielding performance, reduce circuit board cost.
Description
Technical field
The present invention relates to the design field more particularly to a kind of communication apparatus of circuit board and its cabling and its circuit board groups
Part.
Background technique
For pursue electronic product compact design, in board design, since the component on circuit board is more, and
The area of circuit board is smaller, so that the space very little of circuit trace.It needs to add by circuit board if circuit trace insufficient space
The approach of layer solves, and such design is unfavorable for reducing product cost and manufacture difficulty.
Currently, some pairs of electromagnetic susceptibility electronic components need to be arranged shield shell to prevent electromagnetic interference, for as far as possible
Reduce influence to the electronic component, other electronic components and circuit trace must get around this electronic component or it is separately distributed
On other one layer of circuit board.This results in the increase of the length of arrangement wire on circuit board and the increase of circuit board fabrication cost, greatly
The metal routing of amount is printed on circuit board surface, across the neighboring area of entire shielding case covering, occupies a large amount of PCB internal layer
Space, cabling is complicated, space utilization rate is small, and aesthetics is also had a greatly reduced quality.
Summary of the invention
In view of the shortcomings of the prior art, that the present invention provides a kind of wiring spaces is few, reduces circuit board cost and not
Influence the communication apparatus and its circuit board assemblies of PCB aesthetics and electromagnetic susceptibility electronic component electromagnetic shielding performance.
In order to achieve the above purpose, present invention employs the following technical solutions:
A kind of circuit board assemblies, the first electronic component, the second electronics member including circuit board, on the circuit board
Part, third electronic component and electro-magnetic shielding cover, the electro-magnetic shielding cover covers at first electronic component wherein, described
Second electronic component and the third electronic component are located at the two sides of first electronic component and are electrically connected by conducting wire.
Wherein, the conducting wire is FPC.
Wherein, the conducting wire is formed in the face side of the not set electronic component of the circuit board, and both ends are each passed through institute
Circuit board is stated to connect with second electronic component and the third electronic component.
Alternatively, the conductor part is set in the electro-magnetic shielding cover.
Wherein, the two side walls bottom of the electro-magnetic shielding cover is respectively equipped with pad, second electronic component and described
Third electronic component is electrically connected with pad described in one of them respectively.
Wherein, the pad is respectively arranged on the electro-magnetic shielding cover close to second electronic component and third electricity
The sidewall bottom of subcomponent.
Wherein, the conducting wire is pasted on the inner wall of the electro-magnetic shielding cover.
Wherein, the circuit board assemblies include circuit board described in muti-piece, and at least two pieces adjacent circuit boards are not set
The face for setting electronic component is close together.
Wherein, magnet ring is arranged on the conducting wire.
Another object of the present invention is to provide a kind of communication apparatus, including above-mentioned circuit board assemblies.
The present invention by the electro-magnetic shielding cover two sides of circuit board assemblies be arranged two electronic components, using conducting wire make this two
A electronic component electrical connection reduces the printed wire wiring on circuit board.And by the way that conducting wire is arranged to FPC (Flexible
Printed Circuit board, flexible print wiring board), which is arranged in electro-magnetic shielding cover, its both ends point are utilized
Not Lian Jie electro-magnetic shielding cover two sides two electronic components, reduce the layout area on circuit board, make full use of existing cloth
Space of lines does not influence PCB aesthetics and electromagnetic susceptibility electronic component electromagnetic shielding performance, reduces circuit board cost.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the circuit board assemblies of the embodiment of the present invention.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further described.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and do not have to
It is of the invention in limiting.
Refering to fig. 1, the circuit board assemblies of the embodiment of the present invention include circuit board 10, the first electronics on circuit board 10
Element 11, the second electronic component 12, third electronic component 13 and electro-magnetic shielding cover 14, electro-magnetic shielding cover 14 are first by the first electronics
Part 11 covers at wherein, and the second electronic component 12 and third electronic component 13 are located at the two sides of the first electronic component 11 and lead to
Cross the electrical connection of conducting wire 15.Preferably, conducting wire 15 is the FPC that surface has electro-magnetic screen layer, can be to avoid generation to the first electronics
The interference of element 11 and the interference for avoiding the first electronic component 11.
15 part of conducting wire of the present embodiment is set in electro-magnetic shielding cover 14, and both ends pass through pad 16 and the second electronic component
12 and third electronic component 13 be electrically connected, specifically, be respectively equipped with pad 16 in the two side walls bottom of electro-magnetic shielding cover 14, the
Two electronic components 12 and third electronic component 13 are electrically connected with one of pad 16 respectively.Preferably, two pads 16 are distinguished
Close to the bottom of the opposite side wall of a pair of the second electronic component 12 and third electronic component 13 on electro-magnetic shielding cover 14.Change
16 surface of pad can be coated with insulating materials, to insulate with the electro-magnetic shielding cover 14 of metal.
To improve the fixed reliability of FPC, conducting wire 15 is glued to the inner wall of electro-magnetic shielding cover 14, with electro-magnetic shielding cover 14
Shape it is almost the same, both ends are led by the second electronic component 12 and third electronic component 13 of the pad 16 respectively with two sides
It is logical.
To further decrease the anti-interference ability of conducting wire 15 and reducing its electromagnetic radiation, can be further arranged on conducting wire 15
Magnet ring.
In other embodiments, conducting wire 15 can also be formed in the face side of the not set electronic component of circuit board 10, and two
End is connect after circuit board 10 with the second electronic component 12 and third electronic component 13 respectively.
In addition, circuit board assemblies can also have muti-piece circuit board 10 and electro-magnetic shielding cover 14, by least two blocks of adjacent electricity
The face of the not set electronic component of road plate 10 is close together, and is conducive to the compactedness for improving circuit board assemblies, meanwhile, adjacent two
Two adjacent the first electronic components 11 can also be enclosed within wherein by a electro-magnetic shielding cover 14.
Circuit board assemblies of the invention can be widely used in the various communication apparatus with electro-magnetic screen function, structure letter
It is single and practical, reduce the layout area on circuit board, make full use of existing wiring space, does not influence PCB aesthetics
And electromagnetic susceptibility electronic component electromagnetic shielding performance, reduce circuit board cost.
The above is only the specific embodiment of the application, it is noted that for the ordinary skill people of the art
For member, under the premise of not departing from the application principle, several improvements and modifications can also be made, these improvements and modifications are also answered
It is considered as the protection scope of the application.
Claims (8)
1. a kind of circuit board assemblies, which is characterized in that including circuit board (10), the first electronics being set on the circuit board (10)
Element (11), the second electronic component (12), third electronic component (13) and electro-magnetic shielding cover (14), the electro-magnetic shielding cover
(14) first electronic component (11) is covered at wherein, second electronic component (12) and the third electronic component
(13) two sides of first electronic component (11) are located at and are electrically connected by conducting wire (15), the conducting wire (15) is surface
FPC with electro-magnetic screen layer is partially set in the electro-magnetic shielding cover (14).
2. circuit board assemblies according to claim 1, which is characterized in that the conducting wire (15) is formed in the circuit board
(10) the face side of not set electronic component, and both ends are each passed through the circuit board (10) and second electronic component (12)
It is connected with the third electronic component (13).
3. circuit board assemblies according to claim 1, which is characterized in that the two side walls bottom of the electro-magnetic shielding cover (14)
Portion is respectively equipped with pad (16), second electronic component (12) and the third electronic component (13) respectively with one of institute
State pad (16) electrical connection.
4. circuit board assemblies according to claim 3, which is characterized in that the pad (16) is respectively arranged on the electromagnetic screen
Cover the sidewall bottom on cover (14) close to second electronic component (12) and the third electronic component (13).
5. circuit board assemblies according to claim 1, which is characterized in that the conducting wire (15) is pasted on the electromagnetic shielding
Cover the inner wall of (14).
6. circuit board assemblies according to claim 1, which is characterized in that including circuit board described in muti-piece (10), at least two
The face of the adjacent circuit board (10) the not set electronic component of block is close together.
7. -6 any circuit board assemblies according to claim 1, which is characterized in that be arranged with magnetic on the conducting wire (15)
Ring.
8. a kind of communication apparatus, which is characterized in that including circuit board assemblies as claimed in claim 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510780543.4A CN105376938B (en) | 2015-11-12 | 2015-11-12 | A kind of communication apparatus and its circuit board assemblies |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510780543.4A CN105376938B (en) | 2015-11-12 | 2015-11-12 | A kind of communication apparatus and its circuit board assemblies |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105376938A CN105376938A (en) | 2016-03-02 |
| CN105376938B true CN105376938B (en) | 2018-12-04 |
Family
ID=55378616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510780543.4A Active CN105376938B (en) | 2015-11-12 | 2015-11-12 | A kind of communication apparatus and its circuit board assemblies |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105376938B (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107484405B (en) * | 2017-09-27 | 2020-01-03 | Oppo广东移动通信有限公司 | Mobile terminal and circuit board assembly thereof |
| CN116234286A (en) | 2018-02-21 | 2023-06-06 | 三星电子株式会社 | Mobile electronic device |
| KR102540241B1 (en) * | 2018-02-21 | 2023-06-08 | 삼성전자주식회사 | Electronic device comprising member for shielding at least portion of magnetic force generated by magnetic substance and connection part having properties of non-magnetic substance connected to member |
| CN109121296B (en) * | 2018-08-20 | 2020-07-28 | 维沃移动通信有限公司 | Circuit board, mobile terminal and circuit board wiring method |
| CN109195325A (en) * | 2018-09-29 | 2019-01-11 | 维沃移动通信有限公司 | A kind of board structure of circuit and electronic equipment |
| CN209593902U (en) * | 2018-12-29 | 2019-11-05 | 比亚迪股份有限公司 | A kind of vehicle power supply structure and its board layout's structure |
| CN111586970B (en) * | 2020-05-08 | 2023-12-12 | 维沃移动通信有限公司 | Signal transmission module and electronic equipment |
| CN113258228A (en) * | 2021-06-29 | 2021-08-13 | 成都市克莱微波科技有限公司 | Multichannel amplitude-phase consistent microwave assembly |
| CN115003022A (en) * | 2021-10-09 | 2022-09-02 | 荣耀终端有限公司 | Printed Circuit Board (PCB) assembly, electronic equipment and power supply wiring method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6958445B1 (en) * | 2004-12-16 | 2005-10-25 | Hewlett-Packard Development Company, L.P. | Electromagnetic interference shield for electronic devices on a circuit board |
| CN201947598U (en) * | 2009-12-24 | 2011-08-24 | 三星电子株式会社 | Shielding cover of portable terminal |
| CN104347535A (en) * | 2013-07-31 | 2015-02-11 | 环旭电子股份有限公司 | Electronic packaging module and manufacturing method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002258067A (en) * | 2001-02-28 | 2002-09-11 | Mitsubishi Cable Ind Ltd | Optical fiber wiring board |
| CN101065005A (en) * | 2006-04-28 | 2007-10-31 | 佛山市顺德区顺达电脑厂有限公司 | Electronic equipment having wiring mode for suppressing electromagnetic interference |
-
2015
- 2015-11-12 CN CN201510780543.4A patent/CN105376938B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6958445B1 (en) * | 2004-12-16 | 2005-10-25 | Hewlett-Packard Development Company, L.P. | Electromagnetic interference shield for electronic devices on a circuit board |
| CN201947598U (en) * | 2009-12-24 | 2011-08-24 | 三星电子株式会社 | Shielding cover of portable terminal |
| CN104347535A (en) * | 2013-07-31 | 2015-02-11 | 环旭电子股份有限公司 | Electronic packaging module and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105376938A (en) | 2016-03-02 |
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Effective date of registration: 20230627 Address after: Room B027, Block B, Building 1301-1, 13th Floor, Wanjiali International Mall Project, No. 99, Section 1, Wanjiali Middle Road, Dongtundu Street, Furong District, Changsha City, Hunan Province, 410000 Patentee after: Changsha Yingrui Intellectual Property Operation Co.,Ltd. Address before: 516003 No.86, hechangqi Road West, Zhongkai high tech Zone, Huizhou City, Guangdong Province Patentee before: HUIZHOU TCL MOBILE COMMUNICATION Co.,Ltd. |