CN115003022A

CN115003022A - Printed Circuit Board (PCB) assembly, electronic equipment and power supply wiring method

Info

Publication number: CN115003022A
Application number: CN202111177253.2A
Authority: CN
Inventors: 蒋再冉
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2021-10-09
Filing date: 2021-10-09
Publication date: 2022-09-02

Abstract

The embodiment of the application is suitable for the technical field of terminals, and provides a Printed Circuit Board (PCB) assembly, an electronic device and a power wiring method, the PCB assembly comprises a PCB, a power supply, an electric appliance and a connecting device, wherein the power supply and the electric appliance are arranged on the PCB, the connecting device is used for connecting the power supply and the electric appliance, the connecting device is in a bridge-shaped structure, the connecting device adopting the bridge-shaped structure replaces a power line between traditional PCBs, an area for avoiding the power line in the traditional method can be released to arrange a hardware circuit, and the area for arranging the hardware circuit in the PCB is increased.

Description

Printed Circuit Board (PCB) assembly, electronic equipment and power supply wiring method

Technical Field

The embodiment of the application relates to the technical field of terminals, in particular to a Printed Circuit Board (PCB) assembly, electronic equipment and a power supply wiring method.

Background

With the development of electronic devices, the number of hardware circuits integrated on a Printed Circuit Board (PCB) of the electronic device is increasing to realize more abundant functions. Due to the demand for miniaturization of electronic devices, the total area of the PCB cannot be increased, and thus the number of hardware circuits per unit area needs to be increased to meet the development of electronic devices.

As the number of hardware circuits per unit area increases, higher demands are made on the heat dissipation of the PCB. Heat dissipation of PCBs usually relies on fans to dissipate the heat. The bigger the fan or the more the fans are, the better the heat dissipation effect of the PCB is. However, if the area occupied by the fan is increased on the PCB, the area for laying out the hardware circuit in the PCB is further reduced.

Therefore, how to increase the area of the PCB for laying out the hardware circuit becomes a problem to be solved urgently.

Disclosure of Invention

The embodiment of the application provides a Printed Circuit Board (PCB) assembly, electronic equipment and a power supply wiring method, and the area of a Printed Circuit Board (PCB) which can be used for layout of hardware circuits is increased.

In a first aspect, a printed circuit board, PCB, assembly is provided, the PCB assembly comprising a PCB, a power supply, an electrical device and a connecting means;

the power supply and the electrical appliance are arranged on the PCB;

the connecting device is used for connecting a power supply and an electrical appliance, and the structure of the connecting device is a bridge-shaped structure.

In the embodiment of the application, the PCB assembly comprises a PCB, a power supply, an electric appliance and a connecting device, wherein the power supply and the electric appliance are arranged on the PCB, the power supply is used for supplying electric energy to the electric appliance, the connecting device is used for connecting the power supply and the electric appliance, the connecting device is in a bridge-shaped structure, the connecting device adopting the bridge-shaped structure replaces a power line between traditional PCBs, an area for avoiding the power line in a traditional method can be released to arrange a hardware circuit, and the area which can be used for arranging the hardware circuit in the PCB is increased.

In one embodiment, the height of the connection means is above a preset height threshold.

In the embodiment of the application, the height of the connecting device is higher than the preset height threshold value, other electronic devices arranged on the PCB can be avoided, the other electronic devices on the PCB are prevented from contacting the connecting device, and then the short circuit of the devices caused by the fact that the electronic devices contact the connecting device is avoided.

In one embodiment, the PCB assembly further comprises a first device disposed in a first area, the first area being an area on the PCB onto which the connecting means is projected; the preset height threshold is determined based on the height of the first device.

In the embodiment of the application, the height of the connecting device can be more accurately avoided from the first device according to the preset height threshold determined by the height of the first device, so that the contact between other electronic devices on the PCB and the connecting device is further avoided, and the condition of short circuit of other electronic devices caused by the contact between other electronic devices and the connecting device is further avoided.

In one embodiment, the surface of the connecting means is coated with an insulating material.

In the embodiment of the application, the surface of the connecting device is coated with the insulating material, so that the short circuit of the connecting device can be effectively avoided, and the reliability of connecting the power supply and the electric device by using the connecting device is improved.

In one embodiment, the resistance of the connection device is less than a preset impedance threshold.

In the embodiment of the application, the resistance of the connecting device is smaller than the preset impedance threshold value, the current carrying capacity of the connecting device can be improved, and the voltage drop on the connecting device is reduced, so that when the power supply provides electric energy for an electric appliance through the connecting device, the electric energy lost on the connecting device is small, and the power supply efficiency of the connecting device is improved.

In one embodiment, the width of the connection means is less than a preset width threshold.

In the embodiment of the application, when the width of the connection device is smaller than the preset width threshold, correspondingly, the first area of the connection device projected onto the PCB is smaller, so that the number of the first devices in the first area is smaller, that is, the number of the devices affected by the connection device is smaller, and the influence of the connection device on the PCB assembly is reduced.

In one embodiment, the connecting device is connected with the power supply and the electrical appliance through a welding method.

In the embodiment of the application, the connecting device is connected with the power supply and the electrical appliance by adopting a welding method, so that the connecting device can be more firmly connected with the power supply and the electrical appliance.

In one embodiment, the connection device is connected with the power supply and the electrical appliance by a plug-in method.

In the embodiment of the application, adopt the grafting mode with connecting device and power, with electrical apparatus connected, can improve the convenience of fixing connecting device on PCB, and then improved the convenience of equipment including connecting device's PCB subassembly.

In one embodiment, the connecting means is made of steel.

In the embodiment of the application, because the hardness of steel is higher, so the connecting device that the material is steel is not easy to deform, has reduced the connecting device and has warp the possibility of the contact between the shell of other electron device or electronic equipment and the connecting device that arouses, and then has avoided the short circuit condition that the contact between the shell of connecting device and other electron device or electronic equipment arouses, has improved the reliability of PCB subassembly.

In a second aspect, there is provided an electronic device comprising a printed circuit board, PCB, assembly as described in the first aspect.

In a third aspect, a power routing method is applied to a PCB assembly of a printed circuit board, where the PCB assembly includes a PCB, a power supply, an electrical device and a connecting device, and includes:

determining the installation position of a power supply and the installation position of an electric device;

according to the installation position of the power supply and the installation position of the electrical appliance, the power supply is connected with the electrical appliance through the connecting device; the structure of the connecting device is a bridge-shaped structure.

Drawings

FIG. 1 is a schematic diagram of a PCB assembly;

FIG. 2 is a schematic diagram of a power line in a PCB assembly;

FIG. 3 is a diagram illustrating an application scenario of a PCB assembly according to an embodiment of the present application;

FIG. 4 is a schematic diagram of a PCB assembly according to an embodiment of the present application;

FIG. 5 is a schematic view of a coupling device according to an embodiment of the present application;

FIG. 6 is a schematic view of a first region in one embodiment of the present application;

FIG. 7 is a schematic diagram of a PCB assembly according to another embodiment of the present application;

FIG. 8 is a schematic diagram of a PCB assembly in another embodiment of the present application;

FIG. 9 is a schematic diagram of a PCB assembly according to another embodiment of the present application;

FIG. 10 is a schematic diagram of a PCB assembly according to another embodiment of the present application;

FIG. 11 is a schematic diagram of a PCB assembly according to another embodiment of the present application;

FIG. 12 is a schematic view of a PCB assembly according to another embodiment of the present application;

FIG. 13 is a schematic view of a PCB assembly according to another embodiment of the present application;

FIG. 14 is a schematic flowchart illustrating a power routing method according to an embodiment of the present application;

FIG. 15 is a diagram of an electronic device in one embodiment of the application.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application. In the description of the embodiments herein, "/" means "or" unless otherwise specified, for example, a/B may mean a or B; "and/or" herein is merely an association describing an associated object, and means that there may be three relationships, e.g., a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, in the description of the embodiments of the present application, "a plurality" means two or more than two.

In the following, the terms "first", "second" and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", "third" may explicitly or implicitly include one or more of the features.

The PCB assembly provided by the embodiment of the application can be applied to electronic equipment. Alternatively, the electronic device may be a notebook computer, a tablet computer, a palm computer, a vehicle-mounted terminal, a sales terminal, a wearable device, a mobile phone, and the like.

With the increase of the number of hardware circuits in the unit area of the PCB in the electronic device, higher requirements are put forward on the heat dissipation of the electronic device. The heat dissipation of the electronic device usually depends on a fan, and the larger the fan or the more the fans are, the better the heat dissipation effect is. To increase the area occupied by the fan, the area of the PCB for layout of the hardware circuit is reduced.

Exemplarily, as shown in fig. 1, two fans for dissipating heat, namely a fan 1 and a fan 2, are disposed on the PCB of the electronic device. The PCB of the electronic equipment is also provided with a power supply A, a power supply B, a load A and a load B. The power supply A provides electric energy to the load A through the power supply line wired in the PCB, and the power supply B provides electric energy to the load B through the power supply line wired in the PCB. For example, as shown in fig. 2, the power cord is in the board of the PCB, and the surface of the PCB may be provided with power supplies, consumer devices, and other electronic devices. If the area occupied by the fan is increased on the PCB of the electronic device, the area for laying out power and loads (electrical devices) is compressed. Generally, the distance between the power supply and the load is relatively long, and in order to improve the current carrying capacity of the power supply line and reduce voltage drop on the power supply line, the area occupied by the power supply line is often relatively large, so that the area for laying out a hardware circuit in the PCB is reduced. Taking the power line from the power supply A to the load A as an example, the minimum width of the power line is 20mm, and the maximum width of the power line is 100 mm. It will be appreciated that some electronic devices may be affected by electromagnetic radiation from the power lines and may have degraded performance, and therefore, the power lines between boards are typically not provided in the areas of the PCB surface corresponding to the power lines. For example, as shown in fig. 1, the surface area of the PCB corresponding to the power line for the power source a to output power to the load a is not provided with electronic devices, which further reduces the area of the PCB for laying out the hardware circuits, resulting in a lower area of the PCB available for laying out the hardware circuits.

The following provides a brief description of an application scenario of the embodiments of the present application.

The PCB assembly provided by the embodiments of the present application can be applied to electronic devices, such as a Personal Computer (PC). The display screen of the PC can be connected with the host machine through a rotating shaft, the PCB assembly can be arranged in the shell of the host machine, and a gap space exists between the PCB assembly and the shell, as shown in figure 3. The PCB assembly provided by the embodiment of the application utilizes the gap space (the shaded part shown in figure 3) between the PCB assembly and the shell, the position of a connecting device (power supply wire) for connecting a power supply and an electric device is changed from the PCB to the gap space, and the power supply wire is prevented from occupying the area of the PCB.

It should be understood that the above description is illustrative of the application scenario and does not limit the application scenario of the present application in any way.

The PCB assembly provided by the embodiments of the present application is described in detail below with reference to fig. 4 to 10.

As shown in fig. 4, an embodiment of the present application provides a PCB assembly 1000, which includes a PCB 1100, a power supply 1200, a consumer device 1300, and a connection device 1400, wherein the power supply 1200 and the consumer device 1300 are disposed on the PCB 1100, the power supply 1200 is used for supplying power to the consumer device 1300, the connection device 1400 is used for connecting the power supply 1200 and the consumer device 1300, and the connection device 1300 has a bridge structure.

It should be understood that the number of the power supplies 1200 may be one, or may be multiple, and this is not limited by the embodiment of the present application. Correspondingly, the number of the electrical appliances 1300 may be one or multiple, and the embodiment of the present application does not limit this.

The power supply 1200 and the consumer device 1300 are typically disposed on a surface of the PCB 1100. Where a PCB is typically formed by stacking multiple boards, the surface of PCB 1100 is typically the surface of the outermost board.

The powered device 1300 may be a Double Data Rate (DDR), and/or a Graphics Double Data Rate (GDDR). DDR and/or GDDR (electrical devices 1300) are disposed on the PCB 1100 at an area that is generally remote from the area on the PCB 1100 where the power supply 1200 is disposed. That is, the power supply 1200 is located at a relatively large distance from the consumer device 1300.

The power supply 1200 and the consumer device 1300 may be connected by a connection 1400. Wherein the connecting device 1400 may have a bridge structure as shown in fig. 4, and as shown in fig. 4, the connecting device 1400 is perpendicular to the plane of the PCB 1100, rather than horizontally attached to the PCB 1100, so that a gap space as shown in fig. 4 may exist between the connecting device 1400 and the PCB 1100.

Optionally, the height of the connection device 1400 is above a preset height threshold.

The height of the connecting device 1400 generally refers to the distance d from the bottom of the pier to the bridge body of the bridge-shaped structure, as shown in fig. 5. The height of the connection device 1400 is typically above a predetermined height threshold for avoiding other electronic components disposed on the PCB 1100. The preset height threshold may be set by a user according to experience, or may be determined according to the height of the electronic device, which is not limited in the embodiment of the present application.

Optionally, the PCB assembly 1000 further comprises a first component 1500, the first component 1500 is disposed in a first area, the first area is an area where the connecting device 1400 is projected onto the PCB 1100; the preset height threshold is determined according to the height of the first device 1500.

It should be understood that the first device 1500 may be one electronic device or a plurality of electronic devices, which is not limited in this embodiment. When the first device 1500 is a plurality of electronic devices, the preset height threshold is determined according to the highest height of the first device 1500.

As shown in fig. 6, the first region may be a region where the connection device 1400 is projected onto the PCB 1100. First device 1500 may be a device disposed in first region 1102. The preset height threshold may be determined according to the height of the first device 1500.

Illustratively, as shown in FIG. 7, the first device 1500 is an 0402 packaged device, having a height of 0.5mm and the connecting device 1400 itself having a thickness of 0.2 mm. In order to avoid contact between the connection device 1400 and the first component 1500, a safety distance of 0.25mm is typically reserved between the connection device 1400 and the first component 1500. Correspondingly, the preset height threshold may be the sum of the height of the first component, the safety distance, and the thickness of the connection device itself, that is, 0.5+0.25+ 0.2-0.95 mm.

It should be noted that, besides the PCB assembly 1000 in the electronic device, a housing is usually provided to protect the PCB assembly from being collided. Therefore, when determining the height of the connection device 1400 according to the preset height threshold, the distance between the connection device 1400 and the housing needs to be considered to avoid the connection device 1400 contacting the housing. For example, as shown in fig. 8, the first device 1500 is an 0402 packaged device with a height of 0.5mm, the first safety distance between the connection apparatus 1400 and the first device 1500 is 0.25mm, and the connection apparatus 1400 itself has a thickness of 0.2 mm. If the distance between the PCB 1100 and the housing is 2mm, the preset height threshold may be 0.5+0.25+ 0.2-0.95 mm. If the distance between the PCB 1100 and the housing is 1.3mm, a second safety distance of 0.25mm should be reserved between the connection device 1400 and the housing. The highest height of the connecting device 1400 cannot exceed 1.3-0.25-1.05 mm. That is, the height of the connection device 1400 may be set to any one of values of 0.95mm to 1.05 mm.

Optionally, the PCB assembly 1000 further includes a second device 1600, the second device 1600 is disposed in the first region, the height of the first device 1500 is greater than that of the second device 1600, and the connecting device 1400 is a stepped bridge structure.

The second device 1600 may be a device with the same height, or may be multiple devices with different heights, which is not limited in this embodiment of the application. The connection device 1400 can be adjusted to have different step-like bridge structures in the height, number and area of the second device 1600.

For example, when the second device 1600 is a device with a smaller height than the first device 1500, the connection device 1400 may be configured as a stepped bridge structure as shown in fig. 9. The connection device 1400 may be adjusted to a stepped bridge structure as shown in fig. 9 according to the positions and heights of the first device 1500 and the second device 1600 so as not to collide with the first device 1500 and the second device 1600.

In the embodiment of the application, under the condition that the first region of the PCB assembly further comprises the second device, the connecting device is of a stepped bridge structure, so that the connecting device can accurately avoid various devices in the first region, and the condition that the short circuit is caused by contact between the devices in the first region and the connecting device is further avoided.

Optionally, when the height of the first component 1500 is greater than a second preset height threshold, and the sum of the height of the first component 1500, the safety distance, and the thickness of the connection device itself is greater than the distance between the PCB 1100 and the housing, the first region further includes a trench area, and the first component 1500 is installed in the trench area.

Illustratively, as shown in fig. 10, if the distance between the PCB 1100 and the housing is 1.3mm, a safety distance of 0.25mm is reserved between the connection device 1400 and the housing, the height of the first component 1500 is 0.7mm, the safety distance between the connection device 1400 and the first component 1500 is 0.25mm, and the thickness of the connection device 1400 is 0.2 mm. The sum of the height of the first device 1500, the safety distance between the connection device 1400 and the housing, the safety distance between the connection device 1400 and the first device 1500, and the thickness of the connection device itself is 1.4mm, which is 0.7mm +0.25mm +0.25mm +0.2mm, exceeding the distance 1.3mm between the PCB 1100 and the housing. When the safety distance between the first device 1500 and the connection apparatus 1400 is 0.25mm, the distance between the connection apparatus 1400 and the housing is 0.15mm, and the safety distance between the connection apparatus 1400 and the housing cannot be satisfied. Accordingly, a 0.1mm dug region may be dug on the first region of the PCB 1100, as shown in fig. 11, and the first device 1500 is disposed on the dug region, so that the connection device 1400 can satisfy a safety distance from the housing and a safety distance from the first device 1500 at the same time.

In the embodiment of the application, when the sum of the height of the first device, the safety distance and the thickness of the connecting device is larger than the distance from the PCB to the shell, the first region further comprises a groove digging region, and the first device is installed in the groove digging region, so that the connecting device can meet the safety distance between the shells and the safety distance between the connecting device and the first device, the risk of contact between the connecting device and the shell and the risk of contact between the connecting device and the first device are avoided, and the safety of the connecting device is improved.

Optionally, the connection device 1400 is connected with the power supply 1200 and the consumer device 1300 by a welding method.

The connection between the connection device 1400 and the power supply 1200 and the electrical appliance 1300 may be achieved by fixing the connection device 1400 on the PCB 1100 by welding, and then connecting the connection device 1400 with the power supply 1200 and the electrical appliance 1300 respectively by the way of the wires between the welding point position on the PCB 1100 and the power supply 1200 and the electrical appliance 1300.

When the connection device 1400 is fixed to the PCB 1100 by soldering, the temperature needs to be raised above the melting point of the solder so that the connection device 1400 is placed at a corresponding position on the PCB 1100 when the solder is molten. After the solder is cooled and solidifies, the connector 1400 is secured to the PCB 1100. The solder build-up is at a certain height due to the need for more solder build-up to securely secure the connection 1400. Therefore, the solder height at which the connection device 1400 is fixed to the PCB 1100 needs to be considered when determining the height of the connection device 1400. Illustratively, as shown in fig. 12, the first device 1500 is an 0402 packaged device with a height of 0.5mm and a safety distance of 0.25mm between the connection apparatus 1400 and the first device 1500. The thickness of the connection device 1400 is 0.2mm, and the preset height threshold is 0.5+0.25+ 0.2-0.95 mm. The solder 1600 required for soldering the connection device 1400 to the PCB 1100 has a height of 0.05mm, and if the distance between the PCB 1100 and the housing is 1.3mm, a safety distance of 0.25mm should be reserved between the connection device 1400 and the housing. The maximum height of the connecting device 1400 cannot exceed 1.3-0.25-0.05-1 mm. That is, the height of the connection device 1400 may be set to any one of values of 0.95mm to 1.05 mm.

Optionally, the connection device 1400 is connected to the power supply 1200 and the consumer device 1300 by a plug-in method.

As shown in fig. 13, a pin 1401 may be disposed on the connection device 1400, and a socket 1101 for fixing the pin 1401 may be disposed on the PCB 1100. Pins 1401 on the connection device 1400 may be inserted into sockets 1101 on the PCB 1100. It should be understood that after the pins on the connecting device 1400 are inserted into the holes 1101 on the PCB 1100, the pins 1401 may be further fixed to the PCB by soldering. After the connecting device 1400 is fixed on the PCB 1100, the connection between the connecting device 1400 and the power supply 1200 and the electrical appliance 1300 can be realized through the wires between the jack 1101 on the PCB 1100 and the power supply 1200 and the electrical appliance 1300, respectively.

In the embodiment of the application, adopt the grafting mode with connecting device and power, with electric appliances connected, can improve the convenience of fixing connecting device on PCB, and then improved the convenience of equipment including connecting device's PCB subassembly.

Optionally, the surface of the connecting means is coated with an insulating material.

It is understood that insulating material may refer to materials that are not electrically conductive at the allowable voltage, but not absolutely electrically non-conductive, and that generally the resistance of insulating materials is high, at 10 ¹⁰ ～10 ²² Omega is between.

Optionally, the connecting device 1400 is made of steel.

In the embodiment of the application, because the hardness of steel is higher, so the connecting device that the material is steel is difficult to deform, has reduced the connecting device and has warp the possibility of the contact between the shell of other electron device or electronic equipment and the connecting device that arouses, and then has avoided the short circuit condition that the contact between the shell of connecting device and other electron device or electronic equipment arouses, has improved the reliability of PCB subassembly.

Optionally, the resistance of the connection device 1400 is less than a preset impedance threshold.

To increase the current carrying capacity of the connection device while reducing voltage droop on the connection device, it is therefore desirable that the impedance of the connection device 1400 be less than a predetermined impedance threshold. The preset impedance threshold may be a numerical value set by a user according to actual needs or experience, or may be determined according to an equivalent impedance value of a power line between PCBs, which is not limited in the embodiment of the present application. The power line between the PCBs may be a power line used to connect the power supply 1200 and the electrical device 1300 in the prior art. For example, the preset impedance threshold may be an equivalent impedance value plus a tolerance. Illustratively, when the power line between the PCBs connects the power supply 1200 and the consumer device 1300, the power line may be a copper foil with a thickness of 17 μm and a width of about 20mm, wherein the copper has a resistivity of 1.75x10 ^-8 ohm/m. When the connecting device 1400 made of steel material is used to replace the power line between the PCBs, the resistivity of the steel material is 9.8x10 ^-8 ohm/m, about 5.6 times the resistivity of copper. The resistance of the connection device 1400 is equivalent to the resistance value equivalent to the power line between the PCB 1100 boards in the related art when the thickness is 0.2mm and the width is 9.5 mm. Wherein the predetermined impedance threshold is the equivalent impedance value plus the tolerance, i.e. the resistance of the connection device 1400 is smaller than the predetermined resistanceResistance threshold.

Optionally, the width of the connection device 1400 is less than a preset width threshold.

The preset width threshold may be a numerical value set by a user according to actual requirements or experience, or may be a width of a power line between PCBs in the prior art, which is not limited in the embodiment of the present application. The power cord may be used to connect the power source 1200 and the consumer device 1300. When the connecting device 1400 is made of a material with a resistivity greater than that of copper, the width of the connecting device 1400 is usually smaller than a predetermined width threshold. When the width of the connection device 1400 is less than the preset width threshold, the first area of the connection device 1400 projected on the PCB 1100 is correspondingly smaller.

In the embodiment of the present application, when the width of the connecting device is smaller than the preset width threshold, correspondingly, the first area of the connecting device projected onto the PCB is smaller, so that the number of the first devices in the first area is set to be smaller, that is, the number of the devices affected by the connecting device is smaller, and the influence of the connecting device on the PCB assembly is reduced.

Fig. 14 is a schematic flow chart of a power routing method in an embodiment of the present application, which is applied to a PCB assembly shown in the embodiment of fig. 4 to 13, where the PCB assembly includes a PCB, a power supply, an electric device, and a connection device, and the method includes:

and S101, determining the installation position of a power supply and the installation position of an electric device.

Wherein, the installation position of the power supply and the installation position of the electric device can be determined by users according to actual requirements.

S102, connecting the power supply with an electrical appliance through a connecting device according to the installation position of the power supply and the installation position of the electrical appliance; the structure of the connecting device is a bridge-shaped structure.

The implementation principle and the beneficial effect of the method embodiment are similar to those of the PCB assembly, and are not described herein again.

It should be understood that, although the steps in the flowcharts in the above embodiments are shown in sequence as indicated by the arrows, the steps are not necessarily performed in sequence as indicated by the arrows. The steps are not performed in the exact order shown and described, and may be performed in other orders, unless explicitly stated otherwise. Moreover, at least a portion of the steps in the flowchart may include multiple sub-steps or multiple stages, which are not necessarily performed at the same time, but may be performed at different times, and the order of performing the sub-steps or stages is not necessarily sequential, but may be performed alternately or alternately with other steps or at least a portion of the sub-steps or stages of other steps.

In one possible case, the present application further provides an electronic device including the PCB assembly provided in the above embodiment.

The embodiment of the present application does not limit the type of the electronic device. Illustratively, the electronic device may be, but is not limited to, a mobile phone, a tablet computer, a smart speaker, a smart large screen (also referred to as a smart television), or a wearable device.

Illustratively, fig. 15 shows a schematic structural diagram of the electronic device 100. The electronic device 100 may include a processor 110, an external memory interface 120, an internal memory 121, a Universal Serial Bus (USB) interface 130, a charging management module 140, a power management module 141, a battery 142, an antenna 1, an antenna 2, a mobile communication module 150, a wireless communication module 160, an audio module 170, a speaker 170A, a receiver 170B, a microphone 170C, an earphone interface 170D, a sensor module 180, a key 190, a motor 191, an indicator 192, a camera 193, a display screen 194, a Subscriber Identification Module (SIM) card interface 195, and the like. The sensor module 180 may include a pressure sensor 180A, a gyroscope sensor 180B, an air pressure sensor 180C, a magnetic sensor 180D, an acceleration sensor 180E, a distance sensor 180F, a proximity light sensor 180G, a fingerprint sensor 180H, a temperature sensor 180J, a touch sensor 180K, an ambient light sensor 180L, a bone conduction sensor 180M, and the like.

It is to be understood that the illustrated structure of the embodiment of the present application does not specifically limit the electronic device 100. In other embodiments of the present application, electronic device 100 may include more or fewer components than shown, or some components may be combined, some components may be split, or a different arrangement of components. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

Processor 110 may include one or more processing units, such as: the processor 110 may include an Application Processor (AP), a modem processor, a Graphics Processing Unit (GPU), an Image Signal Processor (ISP), a controller, a memory, a video codec, a Digital Signal Processor (DSP), a baseband processor, and/or a neural-Network Processing Unit (NPU), etc. The different processing units may be separate devices or may be integrated into one or more processors.

The controller may be, among other things, a neural center and a command center of the electronic device 100. The controller can generate an operation control signal according to the instruction operation code and the timing signal to complete the control of instruction fetching and instruction execution.

A memory may also be provided in processor 110 for storing instructions and data. In some embodiments, the memory in the processor 110 is a cache memory. The memory may hold instructions or data that have just been used or recycled by the processor 110. If the processor 110 needs to reuse the instruction or data, it can be called directly from the memory. Avoiding repeated accesses reduces the latency of the processor 110, thereby increasing the efficiency of the system.

In some embodiments, processor 110 may include one or more interfaces. The interface may include an integrated circuit (I2C) interface, an integrated circuit built-in audio (I2S) interface, a Pulse Code Modulation (PCM) interface, a universal asynchronous receiver/transmitter (UART) interface, a Mobile Industry Processor Interface (MIPI), a general-purpose input/output (GPIO) interface, a Subscriber Identity Module (SIM) interface, and/or a Universal Serial Bus (USB) interface, etc.

The I2C interface is a bi-directional synchronous serial bus that includes a serial data line (SDA) and a Serial Clock Line (SCL). In some embodiments, processor 110 may include multiple sets of I2C buses. The processor 110 may be coupled to the touch sensor 180K, the charger, the flash, the camera 193, etc. through different I2C bus interfaces, respectively. For example: the processor 110 may be coupled to the touch sensor 180K via an I2C interface, such that the processor 110 and the touch sensor 180K communicate via an I2C bus interface to implement the touch functionality of the electronic device 100.

The I2S interface may be used for audio communication. In some embodiments, processor 110 may include multiple sets of I2S buses. The processor 110 may be coupled to the audio module 170 via an I2S bus to enable communication between the processor 110 and the audio module 170. In some embodiments, the audio module 170 may communicate audio signals to the wireless communication module 160 via the I2S interface, enabling answering of calls via a bluetooth headset.

The PCM interface may also be used for audio communication, sampling, quantizing and encoding analog signals. In some embodiments, the audio module 170 and the wireless communication module 160 may be coupled by a PCM bus interface. In some embodiments, the audio module 170 may also transmit audio signals to the wireless communication module 160 through the PCM interface, so as to implement a function of answering a call through a bluetooth headset. Both the I2S interface and the PCM interface may be used for audio communication.

The UART interface is a universal serial data bus used for asynchronous communications. The bus may be a bidirectional communication bus. It converts the data to be transmitted between serial communication and parallel communication. In some embodiments, a UART interface is generally used to connect the processor 110 with the wireless communication module 160. For example: the processor 110 communicates with a bluetooth module in the wireless communication module 160 through a UART interface to implement a bluetooth function. In some embodiments, the audio module 170 may transmit the audio signal to the wireless communication module 160 through a UART interface, so as to realize the function of playing music through a bluetooth headset.

MIPI interfaces may be used to connect processor 110 with peripheral devices such as display screen 194, camera 193, and the like. The MIPI interface includes a Camera Serial Interface (CSI), a Display Serial Interface (DSI), and the like. In some embodiments, processor 110 and camera 193 communicate through a CSI interface to implement the capture functionality of electronic device 100. The processor 110 and the display screen 194 communicate through the DSI interface to implement the display function of the electronic device 100.

The GPIO interface may be configured by software. The GPIO interface may be configured as a control signal and may also be configured as a data signal. In some embodiments, a GPIO interface may be used to connect the processor 110 with the camera 193, the display 194, the wireless communication module 160, the audio module 170, the sensor module 180, and the like. The GPIO interface may also be configured as an I2C interface, an I2S interface, a UART interface, a MIPI interface, and the like.

The USB interface 130 is an interface conforming to the USB standard specification, and may specifically be a Mini USB interface, a Micro USB interface, a USB Type C interface, or the like. The USB interface 130 may be used to connect a charger to charge the electronic device 100, and may also be used to transmit data between the electronic device 100 and a peripheral device. And the earphone can also be used for connecting an earphone and playing audio through the earphone. The interface may also be used to connect other electronic devices, such as AR devices and the like.

It should be understood that the interface connection relationship between the modules illustrated in the embodiments of the present application is only an illustration, and does not limit the structure of the electronic device 100. In other embodiments of the present application, the electronic device 100 may also adopt different interface connection manners or a combination of multiple interface connection manners in the above embodiments.

The charging management module 140 is configured to receive charging input from a charger. The charger may be a wireless charger or a wired charger. In some wired charging embodiments, the charging management module 140 may receive charging input from a wired charger via the USB interface 130. In some wireless charging embodiments, the charging management module 140 may receive a wireless charging input through a wireless charging coil of the electronic device 100. The charging management module 140 may also supply power to the electronic device 100 through the power management module 141 while charging the battery 142.

The power management module 141 is used to connect the battery 142, the charging management module 140 and the processor 110. The power management module 141 receives input from the battery 142 and/or the charge management module 140 and provides power to the processor 110, the internal memory 121, the external memory, the display 194, the camera 193, the wireless communication module 160, and the like. The power management module 141 may also be used to monitor parameters such as battery capacity, battery cycle count, battery state of health (leakage, impedance), etc. In some other embodiments, the power management module 141 may also be disposed in the processor 110. In other embodiments, the power management module 141 and the charging management module 140 may be disposed in the same device.

The wireless communication function of the electronic device 100 may be implemented by the antenna 1, the antenna 2, the mobile communication module 150, the wireless communication module 160, a modem processor, a baseband processor, and the like.

The antennas 1 and 2 are used for transmitting and receiving electromagnetic wave signals. Each antenna in the electronic device 100 may be used to cover a single or multiple communication bands. Different antennas can also be multiplexed to improve the utilization of the antennas. For example: the antenna 1 may be multiplexed as a diversity antenna of a wireless local area network. In other embodiments, the antenna may be used in conjunction with a tuning switch.

The mobile communication module 150 may provide a solution including wireless communication of 2G/3G/4G/5G, etc. applied to the electronic device 100. The mobile communication module 150 may include at least one filter, a switch, a power amplifier, a Low Noise Amplifier (LNA), and the like. The mobile communication module 150 may receive the electromagnetic wave from the antenna 1, filter, amplify, etc. the received electromagnetic wave, and transmit the electromagnetic wave to the modem processor for demodulation. The mobile communication module 150 may also amplify the signal modulated by the modem processor, and convert the signal into electromagnetic wave through the antenna 1 to radiate the electromagnetic wave. In some embodiments, at least some of the functional modules of the mobile communication module 150 may be disposed in the processor 110. In some embodiments, at least some of the functional modules of the mobile communication module 150 may be disposed in the same device as at least some of the modules of the processor 110.

The modem processor may include a modulator and a demodulator. The modulator is used for modulating a low-frequency baseband signal to be transmitted into a medium-high frequency signal. The demodulator is used for demodulating the received electromagnetic wave signal into a low-frequency baseband signal. The demodulator then passes the demodulated low frequency baseband signal to a baseband processor for processing. The low frequency baseband signal is processed by the baseband processor and then passed to the application processor. The application processor outputs a sound signal through an audio device (not limited to the speaker 170A, the receiver 170B, etc.) or displays an image or video through the display screen 194. In some embodiments, the modem processor may be a stand-alone device. In other embodiments, the modem processor may be provided in the same device as the mobile communication module 150 or other functional modules, independent of the processor 110.

The wireless communication module 160 may provide a solution for wireless communication applied to the electronic device 100, including Wireless Local Area Networks (WLANs) (e.g., wireless fidelity (Wi-Fi) networks), bluetooth (bluetooth, BT), Global Navigation Satellite System (GNSS), Frequency Modulation (FM), Near Field Communication (NFC), Infrared (IR), and the like. The wireless communication module 160 may be one or more devices integrating at least one communication processing module. The wireless communication module 160 receives electromagnetic waves via the antenna 2, performs frequency modulation and filtering processing on electromagnetic wave signals, and transmits the processed signals to the processor 110. The wireless communication module 160 may also receive a signal to be transmitted from the processor 110, perform frequency modulation and amplification on the signal, and convert the signal into electromagnetic waves through the antenna 2 to radiate the electromagnetic waves.

In some embodiments, antenna 1 of electronic device 100 is coupled to mobile communication module 150 and antenna 2 is coupled to wireless communication module 160 so that electronic device 100 can communicate with networks and other devices through wireless communication techniques. The wireless communication technology may include global system for mobile communications (GSM), General Packet Radio Service (GPRS), code division multiple access (code division multiple access, CDMA), Wideband Code Division Multiple Access (WCDMA), time-division code division multiple access (time-division code division multiple access, TD-SCDMA), Long Term Evolution (LTE), fifth Generation wireless communication systems (5G, the 5th Generation of wireless communication systems), BT, GNSS, WLAN, NFC, FM, and/or IR technology, etc. The GNSS may include a Global Positioning System (GPS), a global navigation satellite system (GLONASS), a beidou satellite navigation system (BDS), a quasi-zenith satellite system (QZSS), and/or a Satellite Based Augmentation System (SBAS).

The electronic device 100 implements display functions via the GPU, the display screen 194, and the application processor. The GPU is a microprocessor for image processing, and is connected to the display screen 194 and an application processor. The GPU is used to perform mathematical and geometric calculations for graphics rendering. The processor 110 may include one or more GPUs that execute program instructions to generate or alter display information.

The display screen 194 is used to display images, video, and the like. The display screen 194 includes a display panel. The display panel may adopt a Liquid Crystal Display (LCD), an organic light-emitting diode (OLED), an active-matrix organic light-emitting diode (active-matrix organic light-emitting diode, AMOLED), a flexible light-emitting diode (FLED), a miniature, a Micro-oeld, a quantum dot light-emitting diode (QLED), and the like. In some embodiments, the electronic device 100 may include 1 or N display screens 194, with N being a positive integer greater than 1.

The electronic device 100 may implement a shooting function through the ISP, the camera 193, the video codec, the GPU, the display 194, the application processor, and the like.

The ISP is used to process the data fed back by the camera 193. For example, when a photo is taken, the shutter is opened, light is transmitted to the camera photosensitive element through the lens, the optical signal is converted into an electrical signal, and the camera photosensitive element transmits the electrical signal to the ISP for processing and converting into an image visible to naked eyes. The ISP can also carry out algorithm optimization on the noise, brightness and skin color of the image. The ISP can also optimize parameters such as exposure, color temperature and the like of a shooting scene. In some embodiments, the ISP may be provided in camera 193.

The camera 193 is used to capture still images or video. The object generates an optical image through the lens and projects the optical image to the photosensitive element. The photosensitive element may be a Charge Coupled Device (CCD) or a complementary metal-oxide-semiconductor (CMOS) phototransistor. The light sensing element converts the optical signal into an electrical signal, which is then passed to the ISP where it is converted into a digital image signal. And the ISP outputs the digital image signal to the DSP for processing. The DSP converts the digital image signal into an image signal in a standard RGB, YUV and other formats. In some embodiments, electronic device 100 may include 1 or N cameras 193, N being a positive integer greater than 1.

The digital signal processor is used for processing digital signals, and can process digital image signals and other digital signals. For example, when the electronic device 100 selects a frequency bin, the digital signal processor is used to perform fourier transform or the like on the frequency bin energy.

Video codecs are used to compress or decompress digital video. The electronic device 100 may support one or more video codecs. In this way, the electronic device 100 may play or record video in a variety of encoding formats, such as: moving Picture Experts Group (MPEG) 1, MPEG2, MPEG3, MPEG4, and the like.

The NPU is a neural-network (NN) computing processor that processes input information quickly by using a biological neural network structure, for example, by using a transfer mode between neurons of a human brain, and can also learn by itself continuously. Applications such as intelligent recognition of the electronic device 100 can be implemented by the NPU, for example: image recognition, face recognition, speech recognition, text understanding, and the like.

The external memory interface 120 may be used to connect an external memory card, such as a Micro SD card, to extend the memory capability of the electronic device 100. The external memory card communicates with the processor 110 through the external memory interface 120 to implement a data storage function. For example, files such as music, video, etc. are saved in an external memory card.

The internal memory 121 may be used to store computer-executable program code, which includes instructions. The processor 110 executes various functional applications of the electronic device 100 and data processing by executing instructions stored in the internal memory 121. The internal memory 121 may include a program storage area and a data storage area. The storage program area may store an operating system, an application program (such as a sound playing function, an image playing function, etc.) required by at least one function, and the like. The storage data area may store data (such as audio data, phone book, etc.) created during use of the electronic device 100, and the like. In addition, the internal memory 121 may include a high-speed random access memory, and may further include a nonvolatile memory, such as at least one magnetic disk storage device, a flash memory device, a universal flash memory (UFS), and the like.

The electronic device 100 may implement audio functions via the audio module 170, the speaker 170A, the receiver 170B, the microphone 170C, the headphone interface 170D, and the application processor. Such as music playing, recording, etc.

The audio module 170 is used to convert digital audio information into an analog audio signal output and also to convert an analog audio input into a digital audio signal. The audio module 170 may also be used to encode and decode audio signals. In some embodiments, the audio module 170 may be disposed in the processor 110, or some functional modules of the audio module 170 may be disposed in the processor 110.

The speaker 170A, also called a "horn", is used to convert the audio electrical signal into a sound signal. The electronic apparatus 100 can listen to music through the speaker 170A or listen to a handsfree call.

The receiver 170B, also called "earpiece", is used to convert the electrical audio signal into an acoustic signal. When the electronic apparatus 100 receives a call or voice information, it can receive voice by placing the receiver 170B close to the ear of the person.

The microphone 170C, also referred to as a "microphone," is used to convert sound signals into electrical signals. When making a call or sending voice information, the user can input a voice signal into the microphone 170C by uttering a voice signal by the mouth of the user near the microphone 170C. The electronic device 100 may be provided with at least one microphone 170C. In other embodiments, the electronic device 100 may be provided with two microphones 170C to achieve a noise reduction function in addition to collecting sound signals. In other embodiments, the electronic device 100 may further include three, four or more microphones 170C to collect sound signals, reduce noise, identify sound sources, perform directional recording, and so on.

The headphone interface 170D is used to connect a wired headphone. The headset interface 170D may be the USB interface 130, or may be a 3.5mm open mobile electronic device platform (OMTP) standard interface, a cellular telecommunications industry association (cellular telecommunications industry association of the USA, CTIA) standard interface.

The pressure sensor 180A is used for sensing a pressure signal, and converting the pressure signal into an electrical signal. In some embodiments, the pressure sensor 180A may be disposed on the display screen 194. The pressure sensor 180A can be of a wide variety, such as a resistive pressure sensor, an inductive pressure sensor, a capacitive pressure sensor, and the like. The capacitive pressure sensor may be a sensor comprising at least two parallel plates having an electrically conductive material. When a force acts on the pressure sensor 180A, the capacitance between the electrodes changes. The electronic device 100 determines the strength of the pressure from the change in capacitance. When a touch operation is applied to the display screen 194, the electronic apparatus 100 detects the intensity of the touch operation according to the pressure sensor 180A. The electronic apparatus 100 may also calculate the touched position from the detection signal of the pressure sensor 180A. In some embodiments, the touch operations that are applied to the same touch position but different touch operation intensities may correspond to different operation instructions. For example: and when the touch operation with the touch operation intensity smaller than the first pressure threshold value acts on the short message application icon, executing an instruction for viewing the short message. And when the touch operation with the touch operation intensity larger than or equal to the first pressure threshold value acts on the short message application icon, executing an instruction of newly building the short message.

The gyro sensor 180B may be used to determine the motion attitude of the electronic device 100. In some embodiments, the angular velocity of electronic device 100 about three axes (i.e., x, y, and z axes) may be determined by gyroscope sensor 180B. The gyro sensor 180B may be used for photographing anti-shake. Illustratively, when the shutter is pressed, the gyro sensor 180B detects a shake angle of the electronic device 100, calculates a distance to be compensated for the lens module according to the shake angle, and allows the lens to counteract the shake of the electronic device 100 through a reverse movement, thereby achieving anti-shake. The gyroscope sensor 180B may also be used for navigation, somatosensory gaming scenes.

The air pressure sensor 180C is used to measure air pressure. In some embodiments, electronic device 100 calculates altitude, aiding in positioning and navigation, from barometric pressure values measured by barometric pressure sensor 180C.

The magnetic sensor 180D includes a hall sensor. The electronic device 100 may detect the opening and closing of the flip holster using the magnetic sensor 180D. In some embodiments, when the electronic device 100 is a flip, the electronic device 100 may detect the opening and closing of the flip according to the magnetic sensor 180D. And then according to the opening and closing state of the leather sheath or the opening and closing state of the flip cover, the automatic unlocking of the flip cover is set.

The acceleration sensor 180E may detect the magnitude of acceleration of the electronic device 100 in various directions (typically three axes). The magnitude and direction of gravity can be detected when the electronic device 100 is stationary. The method can also be used for recognizing the posture of the electronic equipment, and is applied to horizontal and vertical screen switching, pedometers and other applications.

A distance sensor 180F for measuring a distance. The electronic device 100 may measure the distance by infrared or laser. In some embodiments, taking a picture of a scene, the electronic device 100 may utilize the distance sensor 180F to range to achieve fast focus.

The proximity light sensor 180G may include, for example, a Light Emitting Diode (LED) and a light detector, such as a photodiode. The light emitting diode may be an infrared light emitting diode. The electronic device 100 emits infrared light to the outside through the light emitting diode. The electronic device 100 detects infrared reflected light from nearby objects using a photodiode. When sufficient reflected light is detected, it can be determined that there is an object near the electronic device 100. When insufficient reflected light is detected, the electronic device 100 may determine that there are no objects near the electronic device 100. The electronic device 100 can utilize the proximity light sensor 180G to detect that the user holds the electronic device 100 close to the ear for talking, so as to automatically turn off the screen to achieve the purpose of saving power. The proximity light sensor 180G may also be used in a holster mode, a pocket mode automatically unlocks and locks the screen.

The ambient light sensor 180L is used to sense the ambient light level. Electronic device 100 may adaptively adjust the brightness of display screen 194 based on the perceived ambient light level. The ambient light sensor 180L may also be used to automatically adjust the white balance when taking a picture. The ambient light sensor 180L may also cooperate with the proximity light sensor 180G to detect whether the electronic device 100 is in a pocket to prevent accidental touches.

The fingerprint sensor 180H is used to collect a fingerprint. The electronic device 100 can utilize the collected fingerprint characteristics to unlock the fingerprint, access the application lock, photograph the fingerprint, answer an incoming call with the fingerprint, and so on.

The temperature sensor 180J is used to detect temperature. In some embodiments, electronic device 100 implements a temperature processing strategy using the temperature detected by temperature sensor 180J. For example, when the temperature reported by the temperature sensor 180J exceeds a threshold, the electronic device 100 performs a reduction in performance of a processor located near the temperature sensor 180J, so as to reduce power consumption and implement thermal protection. In other embodiments, the electronic device 100 heats the battery 142 when the temperature is below another threshold to avoid the low temperature causing the electronic device 100 to shut down abnormally. In other embodiments, when the temperature is lower than a further threshold, the electronic device 100 performs boosting on the output voltage of the battery 142 to avoid abnormal shutdown due to low temperature.

The touch sensor 180K is also referred to as a "touch panel". The touch sensor 180K may be disposed on the display screen 194, and the touch sensor 180K and the display screen 194 form a touch screen, which is also called a "touch screen". The touch sensor 180K is used to detect a touch operation applied thereto or nearby. The touch sensor can communicate the detected touch operation to the application processor to determine the touch event type. Visual output associated with the touch operation may be provided through the display screen 194. In other embodiments, the touch sensor 180K may be disposed on a surface of the electronic device 100, different from the position of the display screen 194.

The bone conduction sensor 180M may acquire a vibration signal. In some embodiments, the bone conduction sensor 180M may acquire a vibration signal of the human vocal part vibrating the bone mass. The bone conduction sensor 180M may also contact the human pulse to receive the blood pressure pulsation signal. In some embodiments, the bone conduction sensor 180M may also be disposed in a headset, integrated into a bone conduction headset. The audio module 170 may analyze a voice signal based on the vibration signal of the bone mass vibrated by the sound part acquired by the bone conduction sensor 180M, so as to implement a voice function. The application processor can analyze heart rate information based on the blood pressure beating signal acquired by the bone conduction sensor 180M, so that the heart rate detection function is realized.

The keys 190 include a power-on key, a volume key, and the like. The keys 190 may be mechanical keys. Or may be touch keys. The electronic apparatus 100 may receive a key input, and generate a key signal input related to user setting and function control of the electronic apparatus 100.

The motor 191 may generate a vibration cue. The motor 191 may be used for incoming call vibration cues, as well as for touch vibration feedback. For example, touch operations applied to different applications (e.g., photographing, audio playing, etc.) may correspond to different vibration feedback effects. The motor 191 may also respond to different vibration feedback effects for touch operations applied to different areas of the display screen 194. Different application scenes (such as time reminding, receiving information, alarm clock, game and the like) can also correspond to different vibration feedback effects. The touch vibration feedback effect may also support customization.

Indicator 192 may be an indicator light that may be used to indicate a state of charge, a change in charge, or a message, missed call, notification, etc.

The SIM card interface 195 is used to connect a SIM card. The SIM card can be brought into and out of contact with the electronic apparatus 100 by being inserted into the SIM card interface 195 or being pulled out of the SIM card interface 195. The electronic device 100 may support 1 or N SIM card interfaces, N being a positive integer greater than 1. The SIM card interface 195 may support a Nano SIM card, a Micro SIM card, a SIM card, etc. The same SIM card interface 195 can be inserted with multiple cards at the same time. The types of the plurality of cards may be the same or different. The SIM card interface 195 is also compatible with different types of SIM cards. The SIM card interface 195 is also compatible with external memory cards. The electronic device 100 interacts with the network through the SIM card to implement functions such as communication and data communication. In some embodiments, the electronic device 100 employs esims, namely: an embedded SIM card. The eSIM card can be embedded in the electronic device 100 and cannot be separated from the electronic device 100.

It should be noted that any electronic device mentioned in the embodiments of the present application may include more or less modules in the electronic device 100.

In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and reference may be made to the related descriptions of other embodiments for parts that are not described or illustrated in a certain embodiment. It should be understood that, the sequence numbers of the steps in the foregoing embodiments do not imply an execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present application. Furthermore, in the description of the present application and the appended claims, the terms "first," "second," "third," and the like are used for distinguishing between descriptions and not necessarily for describing a relative importance or importance. Reference throughout this specification to "one embodiment" or "some embodiments," or the like, means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," or the like, in various places throughout this specification are not necessarily all referring to the same embodiment, but rather "one or more but not all embodiments" unless specifically stated otherwise.

Finally, it should be noted that: the above description is only an embodiment of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions within the technical scope of the present disclosure should be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A PCB assembly of a printed circuit board is characterized in that the PCB assembly comprises a PCB, a power supply, an electric device and a connecting device;

the power supply and the electric device are arranged on the PCB;

the connecting device is used for connecting the power supply and the electric device, and the structure of the connecting device is a bridge-shaped structure.

2. The PCB assembly of claim 1, wherein the height of the connection device is above a preset height threshold.

3. The PCB assembly of claim 2, further comprising a first device disposed in a first area, the first area being an area on the PCB onto which the connection device projects; the preset height threshold is determined based on the height of the first device.

4. A PCB assembly according to any of claims 1 to 3, wherein the surface of the connecting means is coated with an insulating material.

5. A PCB assembly as in any of claims 1-4 wherein the resistance of the connection means is less than a preset impedance threshold.

6. A PCB assembly as in any of claims 1-5 wherein the width of the connection means is less than a preset width threshold.

7. A PCB assembly as in any of claims 1-6 wherein the connection means is connected to the power supply and the power consuming device by a soldering process.

8. A PCB assembly as in any of claims 1-6 wherein the connection means is connected to the power supply and the power consuming device by a plug-in method.

9. A PCB assembly as in any of claims 1 to 8 wherein the connecting means is of steel.

10. An electronic device, characterized in that the electronic device comprises a printed circuit board, PCB, assembly according to any of claims 1-9.

11. A power routing method applied to a Printed Circuit Board (PCB) assembly including a PCB, a power source, a power utilization device, and a connection device, the method comprising:

determining the installation position of the power supply and the installation position of the electric device;

according to the installation position of the power supply and the installation position of the electric appliance, the power supply is connected with the electric appliance through the connecting device; the structure of the connecting device is a bridge-shaped structure.

12. The method of claim 11, wherein the height of the connection device is above a preset height threshold.

13. The method of claim 12, wherein the PCB assembly further comprises a first device disposed in a first area, the first area being an area on the PCB onto which the connection device is projected; the preset height threshold is determined according to the height of the first device.

14. A method according to any of claims 11-13, characterized in that the surface of the connecting device is coated with an insulating material.

15. The method according to any of claims 11-14, wherein the resistance of the connection device is less than a preset impedance threshold.

16. The method according to any one of claims 11-15, wherein the width of the connection device is less than a preset width threshold.

17. The method according to any one of claims 11 to 16, wherein the connecting means is connected to the power source and the power consuming device by a welding method.

18. A method according to any of claims 11-16, wherein the connection device is connected to the power source, the consumer by a plug-in method.

19. A method according to any one of claims 11 to 17, wherein the connecting means is made of steel.