KR102540241B1 - Electronic device comprising member for shielding at least portion of magnetic force generated by magnetic substance and connection part having properties of non-magnetic substance connected to member - Google Patents

Abstract

Various embodiments of the present disclosure disclose an electronic device having a shielding structure for shielding magnetic force between electronic components. According to various embodiments of the present disclosure, in an electronic device, among a first device including a first magnetic body, a second device including a second magnetic body, and a magnetic force generated between the first magnetic body and the second magnetic body and a shielding structure for shielding at least some magnetic force, the shielding structure being disposed between the first device and the second device, a shielding member having a property of a magnetic body, and physically attached to at least a portion of the shielding member. It may be connected and include a connection member having a non-magnetic property, and at least a part of the connection member may be configured to be physically connected to the circuit board. Various embodiments are possible.

Description

An electronic device including a shielding member for shielding at least a portion of magnetic force generated from a magnetic body and a connection portion having a non-magnetic property connected to the shielding member HAVING PROPERTIES OF NON-MAGNETIC SUBSTANCE CONNECTED TO MEMBER}

Various embodiments of the present disclosure disclose an electronic device having a structure for shielding a magnetic force between electronic components.

With the recent development of digital technology, mobile communication terminals, smart phones, tablet PCs (personal computers), notebooks, PDAs (personal digital assistants), wearable devices, or digital cameras Various types of electronic devices such as (digital cameras) are widely used.

Electronic devices (e.g., smartphones) include various electronic components (e.g., receivers, speakers, cameras, magnetic sensors, an acceleration sensor, etc.). For example, the receiver may include a coil and a magnet as actuators of the diaphragm. As another example, a camera may include a coil and a magnet as an actuator for moving a lens. As electronic components including magnetic materials are mounted within a limited space of an electronic device, they may affect other adjacent electronic components by magnetic force. For example, electronic components each including a magnetic material may be disposed adjacent to each other in an internal space of an electronic device, and in this case, the magnetic materials influence each other, causing an error in the operation of the corresponding electronic component. According to an embodiment, an error may occur in the operation of another electronic component adjacent to the magnetic force radiated from the magnetic body of the electronic component.

In various embodiments, an electronic device capable of operating without errors due to magnetic force even when electronic components including magnetic materials are installed adjacent to each other is disclosed.

In various embodiments, an electronic device capable of effectively shielding a magnetic force between two adjacent magnetic bodies within an electronic device is disclosed.

In various embodiments, in designing a shielding structure for shielding magnetic force between two adjacent magnetic bodies in an electronic device, a minimum shielding structure (magnetic shielding member) can be designed at least based on the driving method of the electronic component. An electronic device is disclosed.

In various embodiments, an electronic device having a shielding structure capable of enhancing a magnetic shielding effect while minimizing a separation distance between electronic components including magnetic materials is disclosed.

In various embodiments, having a shielding structure capable of shielding magnetic force between adjacent magnetic bodies by disposing a non-magnetic material and a magnetic shielding material, which is a magnetic body, on a circuit board constructed between electronic components mounted inside an electronic device. An electronic device is disclosed.

An electronic device according to various embodiments of the present disclosure includes a first device including a first magnetic body, a second device including a second magnetic body, and at least some of magnetic force generated between the first magnetic body and the second magnetic body. A shielding structure for shielding magnetic force, the shielding structure disposed between the first device and the second device, and physically connected to a shielding member having a magnetic property and at least a portion of the shielding member, , and a connecting member having a non-magnetic property, and at least a part of the connecting member may be physically connected to the circuit board.

An electronic device according to various embodiments of the present disclosure includes a circuit board, a first device including a first magnetic body, a second device including a second magnetic body, and a magnetic force generated between the first magnetic body and the second magnetic body. a shielding structure for shielding at least some of the magnetic force, wherein the shielding structure is disposed between the first device and the second device and has properties of a magnetic material capable of shielding at least some of the magnetic force; and a connecting member physically connected to at least a portion of the shielding member and fixed to the circuit board, wherein the connecting member may have properties of a non-magnetic substance capable of being magnetically separated from at least some magnetic force.

An electronic device according to various embodiments of the present disclosure includes a device including a magnetic material, a circuit board, and a shielding structure for shielding at least some of a magnetic field generated from the magnetic material, and the shielding structure includes the device and the shielding structure. A shielding member disposed between other devices included in the electronic device and having a ferromagnetic property capable of shielding at least a portion of the magnetic field, and a connecting member physically connected between at least a portion of the shielding member and the circuit board. And, the connection member may have a property of a non-magnetic material that can be magnetically separated from the at least part of the magnetic field.

According to an electronic device according to various embodiments, a non-magnetic material (eg nickel silver) and a magnetic shielding material (eg SMD (surface mount device) method) are disposed on a circuit board configured between electronic components of the electronic device. formed) to form a shielding structure (shielding member). Through this, according to various embodiments, a contact structure may be implemented without limitation while minimizing a separation distance between electronic components.

Through a shielding structure (shielding member) composed of a heterogeneous material capable of shielding a magnetic force between two adjacent magnetic bodies according to various embodiments, the degree of freedom for mounting positions between electronic components including magnetic bodies may be increased, and the magnetic body It is possible to prevent an operation (function) error due to the influence (interference) of magnetic force between electronic parts by maximizing the shielding performance between the electronic parts.

According to various embodiments of the present disclosure, even when electronic components each including a magnetic substance are disposed adjacent to each other, the electronic component may operate without error while shielding the effect of magnetic force on the other electronic component. According to various embodiments, by simplifying the configuration of the shielding structure, it is possible to easily manufacture the shielding structure without being separated from a fixing member (eg, a circuit board) and to facilitate installation.

1 is a front perspective view of a mobile electronic device according to various embodiments.
2 is a rear perspective view of the electronic device of FIG. 1;
FIG. 3 is an exploded perspective view of the electronic device of FIG. 1 .
4 is a combined plan view of some components of the electronic device of FIG. 3 .
5 is a diagram for explaining a shielding structure for shielding magnetic force from a device having a magnetic body in an electronic device according to various embodiments.
6 is a plan perspective view in which a shielding structure is coupled to a circuit board according to various embodiments of the present disclosure;
FIG. 7 is a cutaway perspective view taken along line BB' in FIG. 6;
FIG. 8 is a perspective view illustrating a form in which the shielding structure contacts the circuit board in FIG. 6 .
FIG. 9 is a rear perspective view illustrating a form in which the shielding structure contacts the circuit board in FIG. 6 .
10 is a rear perspective view illustrating another form in which a shielding structure contacts a circuit board according to various embodiments of the present disclosure.
11 is a rear perspective view illustrating another form in which a shielding structure contacts a circuit board according to various embodiments of the present disclosure;
12 is a rear perspective view illustrating another form in which a shielding structure contacts a circuit board according to various embodiments of the present disclosure.
13 and 14 are views for explaining a shielding structure for shielding magnetic force from a device having a magnetic body in an electronic device according to various embodiments.
15, 16, and 17 are views for explaining a structure in which a shielding structure shields magnetic forces between devices according to various embodiments.

Hereinafter, various embodiments of this document will be described with reference to the accompanying drawings. Examples and terms used therein are not intended to limit the technology described in this document to specific embodiments, but are intended to include various modifications, equivalents, and/or alternatives of the embodiments. It should be understood. In connection with the description of the drawings, like reference numerals may be used for like elements. And the embodiments disclosed in the present invention are presented for explanation and understanding of the disclosed technical content, and do not limit the scope of the technology described in the present invention. Therefore, the scope of the present invention should be construed as including all changes or various other embodiments based on the technical spirit of the present invention.

1 is a front perspective view of an electronic device according to various embodiments. 2 is a rear perspective view of the electronic device of FIG. 1;

Referring to FIGS. 1 and 2 , an electronic device 100 according to various embodiments includes a first plate (or front side) 110A, a second plate (or back side) 110B, and a first plate It may include a housing 110 including a side surface 110C surrounding a space between 110A and the second plate 110B. According to one embodiment (not shown), the housing 110C may refer to a structure forming some of the first plate 110A, the second plate 110B, and the side surface 110C of FIG. 1 . According to one embodiment, the first plate 110A is a front plate 102 at least partially transparent (eg, a glass plate including various coating layers, a polymer plate, etc.) ) can be formed by The second plate 110B may be formed by the substantially opaque back plate 111 . Back plate 111 may be formed, for example, of coated or tinted glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing. can The side surface 110C may be formed by a side bezel structure (or "side member") 118 coupled to the front plate 102 and the back plate 111 and including metal and/or polymer. In some embodiments, the back plate 111 and the side bezel structure 118 may be integrally formed and include the same material (eg, a metal material such as aluminum).

According to an embodiment, the electronic device 100 includes a display 101, audio modules 103, 107 and 114, sensor modules 104 and 119, camera modules 105, 112 and 113, and a key input device ( 115, 116, 117), an indicator 106, and connector holes 108 and 109. In some embodiments, the electronic device 100 may omit at least one of the components (eg, the key input devices 115, 116, and 117, or the indicator 106) or may additionally include other components. .

The display 101 may be exposed through a substantial portion of the front plate 102, for example. The display 101 may be combined with or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field type stylus pen.

The audio modules 103 , 107 , and 114 may include microphone holes 103 and speaker holes 107 and 114 . A microphone for acquiring external sound may be disposed inside the microphone hole 103, and in some embodiments, a plurality of microphones may be disposed to detect the direction of sound. The speaker holes 107 and 114 may include an external speaker hole 107 and a receiver hole 114 for communication. In some embodiments, the speaker holes 107 and 114 and the microphone hole 103 may be implemented as one hole, or a speaker may be included without the speaker holes 107 and 114 (eg, a piezo speaker).

The sensor modules 104 and 119 may generate electrical signals or data values corresponding to an internal operating state of the electronic device 100 or an external environmental state. The sensor modules 104 and 119 may include, for example, a first sensor module 104 (eg, a proximity sensor) and/or a second sensor module (not shown) disposed on the first plate 110A of the housing 110. ) (eg, a fingerprint sensor), and/or a third sensor module 119 (eg, a heart rate monitoring (HRM) sensor) disposed on the second plate 110B of the housing 110. The fingerprint sensor may be disposed on the second surface 110B of the housing 110 as well as the first surface 110A (eg, the home key button 115). The electronic device 100 includes a sensor module not shown, for example, a gesture sensor, a gyro sensor, a barometer sensor, a magnetic sensor, and an acceleration sensor. ), grip sensor, proximity sensor, color sensor (e.g. RGB (red, green, blue) sensor), IR (infrared) sensor, medical sensor, biometric sensor ), a temperature sensor, a humidity sensor, or an illuminance sensor.

The camera modules 105, 112, and 113 include a first camera device 105 disposed on the first plate 110A of the electronic device 100 and a second camera device 112 disposed on the second plate 110B. , and/or flash 113. The first camera device 105 and the second camera device 112 may include one or a plurality of lenses, an image sensor, and/or an image signal processor (ISP). The flash 113 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 100 .

The key input devices 115, 116, and 117 include a home key button 115 disposed on the first plate 110A of the housing 110, a touch pad 116 disposed around the home key button 115, and / or may include a side key button 117 disposed on the side surface 110C of the housing 110. In another embodiment, the electronic device 100 may not include some or all of the above-mentioned key input devices 115, 116, and 117, and the key input devices 115, 116, and 117 that are not included It may be implemented in other forms such as soft keys on the display 101.

The indicator 106 may be disposed on, for example, the first plate 110A of the housing 110 . The indicator 106 may provide, for example, state information of the electronic device 100 in the form of light, and may include a light emitting diode (LED).

The connector holes 108 and 109 include a first connector hole 108 capable of accommodating a connector (eg, a universal serial bus (USB) connector) for transmitting and receiving power and/or data to and from an external electronic device, and/or Alternatively, a second connector hole (eg, an earphone jack) 109 capable of accommodating a connector for transmitting and receiving audio signals to and from an external electronic device may be included.

FIG. 3 is an exploded perspective view of the electronic device of FIG. 1 .

Referring to FIG. 3 , the electronic device 300 includes a side bezel structure 310, a first support member 311 (eg, a bracket), a front plate 320, a display 330, a printed circuit board (PCB), printed circuit board) 340, receiver 341 (or speaker), at least one front-facing camera 342 (or selfie camera), at least one back-facing camera 343 ), a battery 350, a second support member 360 (eg, a rear case), an antenna 370, and a rear plate 380.

In some embodiments, the first support member 311 , the printed circuit board 311 , and the second support member 360 may include a receiver 341 , at least one front camera 342 , and at least one rear camera 343 . ), etc. may be formed, and the receiver 341, at least one front camera 342, and at least one rear camera 343 may be formed on the printed circuit board 311 ) may be fixedly mounted inside the electronic device 300 at least based on the fixing groove. In some embodiments, the electronic device 300 may omit at least one of the components (eg, the first support member 311 or the second support member 360) or may additionally include other components. At least one of the components of the electronic device 300 may be the same as or similar to at least one of the components of the electronic device 100 of FIG. 1 or 2 , and duplicate descriptions will be omitted below.

The first support member 311 may be disposed inside the electronic device 300 and connected to the side bezel structure 310 or integrally formed with the side bezel structure 310 . The first support member 311 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material. The display 330 may be coupled to one side of the first support member 311 and the printed circuit board 340 may be coupled to the other side.

A processor, memory, and/or interface may be mounted on the printed circuit board 340 . Processors include, for example, a central processing unit (CPU), an application processor (AP), a graphic processing unit (GPU), an image signal processor, and a sensor hub processor. , or a communication processor (CP, communication processor) may include one or more.

The memory may include, for example, volatile memory or non-volatile memory.

The interface may include, for example, a high definition multimedia interface (HDMI), a USB interface, a secure digital (SD) card interface, and/or an audio interface. The interface may, for example, electrically or physically connect the electronic device 300 with an external electronic device, and may be a USB connector, an SD card/multi-media card (MMC) connector, or an audio connector. ) may be included.

The battery 350 is a device for supplying power to at least one component of the electronic device 300, and is, for example, a non-rechargeable primary battery (primary cell [battery]) or a rechargeable secondary battery (secondary cell [battery]). cell [battery]), or a fuel cell (fuel cell [battery]). At least a portion of the battery 350 may be disposed on a substantially coplanar surface with the printed circuit board 340 , for example. The battery 350 may be integrally disposed inside the electronic device 300 or may be disposed detachably from the electronic device 300 .

The antenna 370 may be disposed between the rear plate 380 and the battery 350 . The antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. The antenna 370 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging. In another embodiment, an antenna element may be formed by a part of the side bezel structure 310 and/or the first support member 311 or a combination thereof.

4 is a combined plan view of some components of the electronic device of FIG. 3 .

Referring to FIG. 4 , FIG. 4 shows an example of coupling two devices (or electronic components) that can be mounted on the electronic device 300 to a circuit board 430 . For example, in the electronic device 300, the first device 410 (or first electronic component) and the second device 420 (or second electronic component) are located at designated positions (eg, second electronic components) of the circuit board 430. An example of a structure fixed to (or coupled to) a groove for fixing each of the first device 410 and the second device 420 is shown.

In various embodiments, at least one electronic component may be provided on one surface of the circuit board 430 . For example, the circuit board 430 mechanically (or physically) connects the first device 410 and the second device 420 and various other electronic components (eg, a processor, memory, and/or interface). It may be the printed circuit board 340 of FIG. 3 that can be fixed and configured to be connected circuitically (or electrically) based on a circuit design between each electronic component.

In various embodiments, each of the first device 410 and the second device 420 may be an electronic component mounted inside a housing (eg, side bezel structure 310) of the electronic device 300 and including a magnetic material. can According to an embodiment, the first device 410 may be an electronic component (eg, the receiver 341 of FIG. 3 ) including a first magnetic material in the electronic device 300 . According to an embodiment, the second device 420 may be an electronic component (eg, the rear camera 343 of FIG. 3 ) including a second magnetic material in the electronic device 300 . In various embodiments, the devices 410 and 420 may include the aforementioned electronic components as well as various other electronic components including magnetic materials (eg, magnetic sensors, acceleration sensors, speakers, etc.).

According to an embodiment, when the devices 410 and 420 are mounted adjacent to each other on the electronic device 300, the magnetic bodies of the devices 410 and 420 may affect each other, and thus the devices 410 , An error may occur in the operation of 420). To prevent such an error, electronic devices are designed to shield magnetic force with a shielding structure made of a conductive material (eg, SUS, ferrite, etc.) adjacent to the device or the device.

According to various embodiments of the present disclosure, the electronic device 300 generates a magnetic force between the first device 410 including the first magnetic body and the second device 420 including the second magnetic body by the first magnetic body or the second magnetic body. It may include a shielding structure for shielding. Hereinafter, a shielding method and structure using a shielding structure for shielding magnetic force will be described in detail.

Hereinafter, in various embodiments, for convenience of description, the first device (or first electronic component) and the second device (or second electronic component) are described as including each magnetic body, but the present invention is limited thereto It is not. For example, in various embodiments, in a structure in which one of the first device and the second device includes a magnetic material and the other device does not include a magnetic material, at least a portion of magnetic force generated from a device including a magnetic material is shielded structure can also be applied. According to an embodiment, in a structure in which the first device includes a magnetic material and the second device does not include the magnetic material, at least a portion of magnetic force generated by the magnetic material of the first device may be shielded.

5 is a diagram for explaining a shielding structure for shielding magnetic force from a device having a magnetic body in an electronic device according to various embodiments.

According to an embodiment, FIG. 5 may be a diagram schematically illustrating one side of electronic components cut along line A-A′ in FIG. 4 .

Referring to FIG. 5 , the electronic device 500 includes a first device 510 including a first magnetic body 515 (eg, the receiver 410 of FIG. 4 ) and a second magnetic body 525 including a second magnetic body 525 . Device 520 (eg, rear camera 420 in FIG. 4 ), circuit board 530 (eg, printed circuit board 430 in FIG. 4 ), between first magnetic body 515 and second magnetic body 525 It may include a shielding structure 560 for shielding at least some of the magnetic force generated in the magnetic force. In various embodiments, it is exemplified that each of the first device 510 and the second device 520 includes the magnetic materials 515 and 525, but is not limited thereto. Therefore, within the scope of the present invention, one device (eg, the first device 510) includes a magnetic body (eg, the first magnetic body 515), and another device (eg, the second device 520) may include a structure that does not include a magnetic body (eg, the second magnetic body 525). For example, in various embodiments, at least a portion of the magnetic force generated from the first magnetic body 515 of the first device 510 is shielded from affecting the second device 520 that does not include a magnetic body. can include

According to an embodiment, the shielding structure 560 includes a magnetic shielding member (or shielding part) 540 for shielding magnetic force and a connecting member (or shielding member) for physically fixing the shielding member 540 to the circuit board 530. A connection unit) 550 may be included.

In various embodiments, the shielding member 540 may be disposed between the first device 510 and the second device 520 . The shielding member 540 may be formed of a shielding material (or first material metal or magnetic material) capable of shielding at least some of the magnetic force generated between the first magnetic body 515 and the second magnetic body 525. . According to one embodiment, the shielding material may be a material (metal) having ferromagnetic properties. For example, the shielding material may be implemented with SUS (eg, composed of elements or alloys such as iron (Fe), cobalt (Co), and nickel (Ni)).

In various embodiments, the connecting member 550 contacts (or physically connects to) at least a portion of the shielding member 540 based on a portion of one side and connects to the circuit board 530 based on the other side. It can be fixed by contact (or physically connected). The connection member 550 may be made of a non-magnetic material (or a second material metal) that can be magnetically separated from at least some of the magnetic force generated between the first magnetic body 515 and the second magnetic body 525. there is. According to an embodiment, the non-magnetic material may be a material (metal) that is not affected by a magnetic field formed by a magnetic material (eg, a magnet). For example, the non-magnetic material can be implemented with nickel silver (or pure iron).

According to various embodiments, the shielding structure 560 (eg, the shielding member 540 and the connecting member 550) is disposed on the circuit board 530 in a specific way (eg, formed by a surface mount device (SMD) method). Thus, it may be brought into contact with the circuit board 530 . According to one embodiment, in implementing the shielding structure 560, a shielding member 540 (eg, a material for absorbing a magnetic field (eg, a magnetic material)) for shielding magnetic force, and a connection member 550 (eg, a magnetic material) A shielding structure may be realized by making a non-magnetized material (eg, a non-magnetic material) into a binary material and bonding between the two materials (eg, the shielding member 540 and the connecting member 550). In the case of a shielding structure according to various embodiments, in the case of a non-magnetic material (eg, the connecting member 550) to be SMD, it may be designed to secure only a minimum area to be SMD, and through this, the device (or the magnetic body of the device) and A contact structure and/or position between the circuit boards 530 may be designed more freely.

According to various embodiments, the shielding member 540 is between the first device 510 and the second device 520, the functional characteristics of the device (eg, the first device 510, the second device 520) ( Alternatively, the arrangement position (eg, position adjacent to either device) may be determined corresponding to whether the driving (operation method) is affected by or not affected by the magnet (or magnetic force or magnetic field). According to an embodiment, the shielding member 540 is a device (eg, a magnetic material that affects the operation of a counterpart device) based on at least the functional characteristics of the first device 510 and the second device 520. It may be disposed closer to (or biased to) the side of the first device 510 including the first device 510 . According to an embodiment, the shielding member 540 is disposed between the first magnetic body 515 and the second magnetic body 525, in response to the strength (or magnetic force) of each magnetic body, the distance and / Or it can be implemented to have a structure with a different thickness.

According to an embodiment, each of the magnetic bodies (eg, the first magnetic body 515) and the second magnetic body (eg, the first device 510 and the second device 520) of the electronic components (eg, the first device 510 and the second device 520) of the electronic device 500 ( 525)), the magnetic flux emitted from each may be different in its intensity. For example, the first magnetic body 515 provided in the first device 510 may have stronger magnetism than the second magnetic body 525 provided in the second device 520 . In addition, the device has a second driving method (or driving function) (eg, an auto focus (AF) function of a camera, a zoom in/out function, etc.) that is affected by the magnetic flux of a magnetic body of another device. Alternatively, the device may have a first driving method that is not affected by the magnetic flux of another device's magnetic body (eg, a device that is not affected by other magnetic flux in driving, such as a speaker). In one embodiment, a device having a first driving method and/or relatively strong magnetism is the first device 510, and a device having a second driving method and/or relatively weak magnetism is the second device 520. can be called as

According to an embodiment, the magnetic flux emitted from the second magnetic body 525 of the second device 520 may not have a significant effect on the operation of the first device 510, but relatively The magnetic flux emitted from the first magnetic material 515 may cause a serious error in the operation of the second device 520 . According to an embodiment, the shielding member 540 may absorb magnetic force of the first magnetic body 515 of the first device 510 to form a magnetic field with the first magnetic body 515 . Therefore, when the length B of the shield member 540 and the second device 520 (or the second magnetic body 525 of the second device 520) is short (or disposed adjacent to each other and falls within the magnetic field range) ), the magnetic flux emitted through the shield member 540 may affect the operation of the second device 520 .

Accordingly, among the devices 510 and 520, the shielding structure 560 of the electronic device 500 according to various embodiments is a device of the first driving method and/or a device radiating a relatively strong magnetic flux (eg: It may be disposed adjacent to the first device 510 .

According to one embodiment, as shown in FIG. 5 , the shielding structure 560 (particularly, the shielding member 540 ) may be disposed closer to the first device 510 than the second device 520 . Based on this, even within a fixed (or limited) length A between the first device 510 and the second device 520, the shield member 540 and the second magnetic body 525 (eg, subject to the influence of magnetic force) It is possible to secure the maximum separation distance (eg, length (B)) between non-shielding target magnetic materials) as much as possible (eg, maximum separation distance). According to one embodiment, the distance (eg, length A) between the first device 510 and the second device 520 includes a first radius (eg, about 15 mm, about 20 mm, etc.), and the shield member In the distance (eg, length B) between 540 and the second magnetic material 525, the second radius may include a radius shorter than the first radius (eg, about 10 mm, about 15 mm, etc.).

Hereinafter, the structure of the shielding structure 560 for shielding magnetic force in the electronic device 500 according to various embodiments will be described in detail. Hereinafter, for convenience of description, it is described that the first device 510 and the second device 520 each include a magnetic body, but only the first device 510 includes a magnetic body, and the second device 520 In a structure that does not include a magnetic material, may include a structure for shielding at least a portion of magnetic force generated by the magnetic material of the first device 510 .

6, 7, 8, and 9 are views for explaining a structure for shielding magnetic force from a device having a magnetic body in an electronic device according to various embodiments.

Specifically, in FIG. 6 , a shielding structure 560 (eg, the shielding member 540 and the connecting member 550) is disposed between two devices (eg, the first device 510 and the second device 520). It is a view showing a planar perspective view in contact with (or coupled to) the circuit board 530. FIG. 7 is a view showing a cutaway perspective view taken along line B-B′ in FIG. 6; FIG. 8 is a perspective view illustrating a form in which the shielding structure 560 contacts (or is connected to) the circuit board 530 in FIG. 6 . FIG. 9 is a rear perspective view illustrating a form in which the shielding structure 560 contacts the circuit board 530 in FIG. 6 .

Referring to FIG. 6 , a contact (connection) structure between the shielding structure 560 and the circuit board 530 will be described.

Referring to FIG. 6 , a first device 510 represents an electronic component including a first magnetic material 515, and may correspond to a receiver or a speaker in one embodiment. The second device 520 represents an electronic component including the second magnetic material 525, and may correspond to a camera in one embodiment. In various embodiments, a device may correspond to various electronic components (eg, a magnetic sensor, an acceleration sensor, etc.) including a magnetic material in addition to the above electronic components.

According to an embodiment, when at least two devices (eg, the first device 510 and the second device 520) are mounted adjacent to each other in the electronic device 500, at least two of the devices 510 and 520 The magnetic bodies (eg, the first magnetic body 515 and the second magnetic body 525) may affect the counterpart device in one direction or in both directions. Accordingly, an error may occur in the operation of the devices 510 and 520 . To prevent such an error, a shielding member made of a conductive material (eg, SUS, ferrite, etc.) (eg, the shielding member 540 in FIGS. 6 to 9 ) may be disposed between the devices 510 and 520 .

According to one embodiment, the circuit board 530 has a connecting member (eg, the connecting member 550 in FIGS. 6 to 9) on one side (eg, the left side of the circuit board 530 in the direction of looking at FIG. 6). ) of the first groove 630 to which one end (eg, the first member (or first reinforcing member) 610) can come into contact, and the other side in the direction opposite to one side (eg, looking at FIG. 6). A second groove 640 to which the other end of the connecting member 550 (eg, the second member (or second reinforcing member) 620) can come into contact is formed on the right side of the circuit board 530 in the viewing direction. can do.

According to an embodiment, the first groove 630 and the second groove 640 may be implemented in a structure having different widths (or widths). For example, one end (eg, the first reinforcing member 610) and the other end (eg, the second reinforcing member (eg, the second reinforcing member ( 620)). According to one embodiment, the first groove 630 has a width corresponding to one end (eg, the first reinforcing member 610) of the connection member 550 (eg, a width in which the first reinforcing member 610 can be seated). ), and the second groove 640 has a width (eg, a width in which the second member 620 can be seated) corresponding to the other end (eg, the second reinforcing member 620) of the connecting member 550. may be a rescue. For example, in FIGS. 6 to 9, the first groove 630 is relatively narrower than the second groove 640, and the second groove 640 has a relatively wider width than the first groove 630. It may be a branch structure. According to some embodiments, the circuit board 530 does not include the first groove 630 and the second groove 640, and the connection member 550 and the connecting member 550 are connected through a lower surface of the circuit board 530. It can be implemented as a contact (or adhesion) structure.

The structure of the shielding structure 560 will be described with reference to FIGS. 6 to 9 .

6 to 9 , the shielding structure 560 may have a structure including a shielding member 540 having a magnetic property and a connection member 550 having a non-magnetic property. According to one embodiment, the shielding structure 560 may include a shielding member 540 (eg, a magnetic material) for shielding magnetic force and a connecting member 550 for fixing the shielding member 540 to the circuit board 530. can According to one embodiment, the shielding structure 560 is composed of different materials, such as the shielding member 540 which is a magnetic material and the connection member 550 which is a non-magnetic material, and the different materials are bonded to the circuit board 530 using the SMD method. can For example, the shielding member 540 may have properties of a ferromagnetic material capable of shielding magnetic force, and the connecting member 550 may have properties of a ferromagnetic material capable of being magnetically separated from magnetic force.

Referring to FIG. 7 , the shielding member 540 has a plate-like structure and may be contacted (physically fixed) on one side of the circuit board 530 through the connecting member 550 . According to one embodiment, the shielding member 540 includes a first bending portion 740 (eg, an upper portion in the longitudinal direction in the drawing) and/or a second bending portion (eg, a lower portion in the longitudinal direction in the drawing). It can be formed into a bending structure that does. For example, at least a portion of the shielding member 540 may be formed in a bent state.

According to an embodiment, the bending portion (eg, the first bending portion 740) of the shielding member 540 may be bent in a predetermined direction. According to one embodiment, the bending structure of the shielding member 540 is designed in an 'a' shape or 'b' shape by bending the upper or lower side, or in a 'c' shape by bending the upper and lower sides. can design For example, the number of bending parts of the shielding member 540 may be plural. 6 to 9 may show an example in which the upper portion of the shielding member 540 is designed as a bending structure.

According to an embodiment, a bending portion (eg, the first bending portion 740) bent in the shielding member 540 is directed outward of the circuit board 530, for example, a device to be shielded (or a device of the device). magnetic body) direction. According to an embodiment, the bending angle and direction of the bending part may be implemented in various ways according to the strength (magnetic force) and/or size (eg, height) of the magnetic material to be shielded. According to one embodiment, the shielding member 540 may not include a bending portion or may be implemented to have a curve at a predetermined angle (eg, 90 degrees, 120 degrees, 150 degrees, etc.) (or a radius of curvature). According to an embodiment, the entire height (or length) and/or area of the shielding member 540 is formed in a structure that is equal to or relatively larger than the size (eg, height and/or area) of a magnetic body to be shielded. can do. Through this, a more effective effect can be expected in forming a magnetic field with the magnetic body of the shielding target and shielding the magnetic force.

According to an embodiment, the shielding member 540 may be designed to have a variable thickness according to the magnetic force of a magnetic material to be shielded. For example, the thickness of the shielding member 540 may be designed to a thickness capable of sufficiently digesting the magnetism of the magnetic material to be shielded. According to one embodiment, the shielding member 540 may include a thickness of about 0.15 mm.

According to an embodiment, the shielding member 540 may be contacted (connected) to the circuit board 530 through the SMD method based on the connecting member 550 .

Referring to FIGS. 7, 8, and 9 , the circuit board 530 has at least one electronic component provided on one surface (eg, upper surface), and the other surface (eg, lower surface) of the circuit board 530. The connecting member 550 may be in contact with (655). According to an embodiment, the connection member 550 may include a shape surrounding the circuit board 530 in a 'Yaw' shape (or 'U' shape). According to an embodiment, the connecting member 550 may include fixing grooves (eg, first grooves 630) on both sides of the circuit board 530 (eg, the left side part 635 and the right side part 645). ), the second groove 640) and a part of the lower surface 655 of the circuit board 530.

According to one embodiment, the connection member 550 is, for example, a reinforcing member composed of a plurality of parts (eg, a first part, a second part, and a third part) that are divided according to their shape and/or function. can be explained by According to an embodiment, the connecting member 550 is a first part of the reinforcing member, and is a first reinforcing member 710 (eg: a vertical member, a bar member), a second reinforcing member 720 for fixing to the circuit board 530 through the second groove 640 on the other side of the circuit board 530 as a second part of the reinforcing member, or As the third portion of the reinforcing member, it may be divided into a third reinforcing member 730 (eg, a bottom member) that contacts the lower surface 655 of the circuit board 530 . According to an embodiment, the first reinforcing member 710 (eg, the first part of the reinforcing member) and the second reinforcing member 720 (eg, the second part of the reinforcing member) are the third reinforcing member 730 (eg, the second part of the reinforcing member). Example: the third part of the reinforcing member) may be formed to be vertically fixed to both sides. For example, the connecting member 550 has a first portion (first region) disposed to correspond to the first groove 630 of the circuit board 530, and a second portion (second region) to the circuit board ( 530) to correspond to the second groove 640, and a third portion (third region) may be formed to contact the lower surface of the circuit board 530. According to an embodiment, the connection member 550 includes a first reinforcing member 710 (eg, a first portion of the reinforcing member), a second reinforcing member 720 (eg, a second portion of the reinforcing member), and a third reinforcing member 710 (eg, a second portion of the reinforcing member). The reinforcing member 730 (eg, the third part of the reinforcing member) may be formed to have each function (or to have a different shape).

According to an embodiment, in the connection member 550, one surface 810 (eg, an inner surface) of one end of the first reinforcing member 710 is in contact with the first groove 630 of the circuit board 530. , at least one surface 820 (eg, a partial area of the inner surface) of the second reinforcing member 720 at the other end may come into contact with the second groove 640 of the circuit board 530 . According to an embodiment, the shield member 540 may be in contact with the entire other surface 830 (eg, the outer surface) of the second reinforcing member 720 . For example, one surface of the connection member 550 may contact the other surface 830 of the second reinforcing member 720 .

According to an embodiment, the first reinforcing member 710 and the second reinforcing member 720 may be formed in a structure having different sizes of width (or width) and length (or height). According to one embodiment, in FIGS. 6 to 9 , the first reinforcing member 710 has a relatively smaller width and length than the second reinforcing member 720, and the second reinforcing member 720 has a first reinforcing member. Compared to 710, it may be provided in a structure with a relatively large width and length (eg, a structure with a wide width and a long length). For example, the second reinforcing member 720 may be formed to contact a larger area in consideration of bending prevention of the shielding member 540 and contact force.

According to an embodiment, the first reinforcing member 710 may be provided at a height corresponding to (or equal to) a height of the circuit board 530 (eg, an upper surface of the circuit board 530). The second reinforcing member 720 may be provided to protrude higher than the height of the circuit board 530 (eg, a structure protruding from the upper surface of the circuit board 530). For example, the second reinforcing member 720 may be formed to have a relatively large area compared to the first reinforcing member 710 in consideration of the contact area with the shielding member 540 . Through this structural shape, one surface (eg, the inner surface) of the second reinforcing member 720 is in fixed contact with the circuit board 530, and the other surface (eg, the outer surface) makes the shield member 540 more stable. can be in fixed contact.

According to an embodiment, the third reinforcing member 730 may be provided in a shape in which an entire upper surface 830 (or an inner surface) contacts the circuit board 530 .

In FIGS. 10 to 14 , various embodiments of a shielding structure according to various embodiments will be described. According to an embodiment, a circuit board (eg, PCB) has a relatively narrow width (w) between at least two devices (eg, a first device and a second device) (eg, a weak part). may be formed, and the risk of damage may be higher than that of other parts of the circuit board. In various embodiments, it may be formed to reinforce a narrowly formed part (eg, a wick part) between devices using a shielding structure (eg, a shielding member, a connecting member). According to one embodiment, the shielding structure may be disposed in a portion (eg, a wick part) requiring reinforcement on the circuit board, and the shielding structure is based on an extended plate-like structure or a bending structure bent at a predetermined angle (eg, about 90 degrees). It may be formed to reinforce the wick part. According to one embodiment, the connection member of the shielding structure may be formed to function as a member for reinforcing strength.

10 is a rear perspective view illustrating another form in which a shielding structure contacts a circuit board according to various embodiments of the present disclosure.

As shown in FIG. 10, FIG. 10 shows another form of the shielding structure 560 (eg, the shielding member 540 and the connecting member 550) as described in the description with reference to FIGS. 5 to 9 above. can indicate According to one embodiment, the shielding structure 1060 (eg, the shielding member 1040 and the connecting member 1050) in FIG. 10 has a shape (or structure) corresponding to the shielding structure 560 according to the above-described example. It may be formed, and an example formed to further include a function (eg, a strength reinforcing member) for reinforcing the strength of the circuit board 1030 using the connecting member 1050 may be shown.

Referring to FIG. 10 , a circuit board 1030 includes one side of the circuit board 1030 between at least two devices (eg, a first device (not shown) and a second device (not shown)) opposite to one side. One end and the other end of the connecting member 1050 may be in contact with each other through the other side of the . According to an embodiment, the circuit board 1030 has a groove for fixing the connecting member 1050 to one side or at least one side of the other side (eg, the first groove 630 of FIG. 2 grooves 640) may be further formed. According to an embodiment, in FIG. 10 , one end (eg, the second side of the circuit board 1030) of the connecting member 1050 is attached to one side (eg, the left side of the circuit board 1030 in the direction of looking at FIG. 10). An example in which a groove 1015 to which one member 1010 can come into contact may be formed may be shown.

According to an embodiment, the shielding member 1040 of the shielding structure 1060 may correspond to the description of the shielding member 540 in the description with reference to FIGS. 5 to 9, and a detailed description thereof will be omitted.

According to one embodiment, the connecting member 1050 of the shielding structure 1060 has a longer length than the connecting member 550 described in the description with reference to FIGS. 5 to 9 described above. ) It may be formed to have a longer length (or width) than the length of. According to an embodiment, the circuit board 1030 has a narrow portion (hereinafter, referred to as a 'weak part') between two devices (eg, a first device (not shown) and a second device (not shown)). Due to the width w, its strength may be relatively weak compared to that of other parts of the circuit board 1030 . In various embodiments, the connection member 1050 of the shield structure 1060 may be used as a reinforcing member for reinforcing the strength of the wick part of the circuit board 1030 . For example, the connecting member 1050 may be formed to function as a member for reinforcing strength.

According to an embodiment, as shown in the example of FIG. 10 , the connecting member 1050 is formed long in a direction corresponding to the longitudinal direction of the wick part of the circuit board 1030, and at least a portion (eg, all or part of the wick part) of the wick part. ) can be formed in a shape covering. In the example of FIG. 10 , the connecting member 1050 extends inward by the width of the groove 1015 to which one end (eg, the first member 1010) of the connecting member 1050 can come into contact with the circuit board 1030. It may be formed (for example, the wick part and the connection member 1050 have a stepped shape) to have a narrower width w' (or width) than the width w (or width) of the wick part. According to one embodiment, the length of the connecting member 1050 corresponds to the length of the wick part, or may be formed shorter than or longer than the length of the wick part according to the fastening structure of the connecting member 1050. According to one embodiment, the connection member 1050 may be formed to have a shape corresponding to the shape of the wick part.

According to various embodiments, the connection member 1050 may be disposed on the circuit board 1030 in a specific way (eg, formed using a surface mount device (SMD) method) to contact the circuit board 1030 . In the case of a shielding structure according to various embodiments, a non-magnetic material (eg, connecting member 1050) to be SMD may be designed to secure a maximum area (or a larger area) to be SMD, and through this, the circuit board ( In step 1030), the strength of the wick part between the devices may be reinforced.

11 is a rear perspective view illustrating another form in which a shielding structure contacts a circuit board according to various embodiments of the present disclosure;

As shown in FIG. 11, FIG. 11 may represent another form of the shielding structure 1060 as described in the description section with reference to FIG. 10 above. For example, in FIG. 11 , an example of another structure of the connecting member 1150 of the shielding structure 1160 will be described.

Referring to FIG. 11 , a circuit board 1130 is formed between at least two devices (eg, a first device (not shown) and a second device (not shown)) between one side of the circuit board 1130 and one side opposite to each other. One end and the other end of the connecting member 1150 may be in contact with each other through the other side of the . According to an embodiment, FIG. 11 may show an example of a structure in which the circuit board 1130 contacts the connecting member 1150 through one side and the other side without forming a groove on one side and the other side.

According to one embodiment, the shielding member 1140 of the shielding structure 1160 may correspond to what has been described in the description section with reference to FIGS. 5 to 10 described above, and a detailed description thereof will be omitted.

According to one embodiment, the connecting member 1150 of the shielding structure 1160 has a width longer than that of the connecting member 1050 described in the description with reference to FIG. The first member 1110 formed to have a wider width than the width and contacts one side of the circuit board 1130 (eg, the left side of the circuit board 1130 in the direction of looking at FIG. 11) is a connecting member. It may be formed to have a length corresponding to the length of (1150). According to an embodiment, the first member 1110 may have a shape in which the connecting member 1150 extends from one end of the wick part of the circuit board 1130 to the height of the side surface of the circuit board 1130. . According to an embodiment, the first member 1110 may include a structure in which an extended portion of the connecting member 1150 is bent at an end (or edge portion) of the width w of the wick part.

According to an embodiment, as shown in the example of FIG. 11 , the connecting member 1150 is formed to have a length corresponding to the length of the wick part of the circuit board 1130 and to have a width corresponding to the width w of the wick part. Thus, it may be formed in a shape having an area (or width) corresponding to the wick part (or covering all of the wick part).

12 is a rear perspective view illustrating another form in which a shielding structure contacts a circuit board according to various embodiments of the present disclosure;

As shown in FIG. 12 , FIG. 12 may represent another form of the shielding structure 1160 as described in the description section with reference to FIG. 11 described above. For example, in FIG. 12 , an example of another structure of the connecting member 1250 of the shielding structure 1260 will be described.

Referring to FIG. 12 , the circuit board 1230 includes at least one circuit terminal (or contact part) (eg, a first device (not shown) and a second device (not shown)) related to at least one device (eg, a first device (not shown) and a second device (not shown)). GND terminal). According to an embodiment, the circuit board 1230 may include a circuit terminal for electrically connecting a specific device (eg, a speaker) to the wick part. In FIG. 12 , an example of forming a hole 1203 for electrical wiring connection at a position corresponding to a circuit terminal formed in a wick part in the connection member 1250 may be shown.

According to one embodiment, FIG. 12 may show an example in which two circuit terminals (eg, GND terminals) for electrical connection with a device are formed on the weak part of the circuit board 1230 . According to an embodiment, the connecting member 1250 may form two holes 1203 at positions corresponding to respective positions of the circuit terminals. According to an embodiment, a connection wire from the device may be connected to a circuit terminal of the circuit board 1230 exposed through the two holes 1203 of the connection member 1250 . According to an embodiment, when the area of the connecting member 1250 is relatively small to avoid circuit terminals as in the example of FIG. 12, as in the example of FIG. 11 or 12, the first of the connecting member 1250 A structure in which the member 1210 is extended by the height of the circuit board 1230 (or the wick part), and the portion (eg, the first member 1210) extended by the height is bent at the end of the wick part in the width direction. , the strength of the wick part can be reinforced.

13 and 14 are views for explaining a shielding structure for shielding magnetic force from a device having a magnetic body in an electronic device according to various embodiments.

According to an embodiment, FIG. 13 may be a diagram schematically illustrating one side of electronic components cut in one direction in a state in which the device is seated in FIGS. 10 to 12 described above.

Referring to FIG. 13 , an electronic device 1300 includes a first device 1301 including a magnetic material 1305 (eg, the receiver 410 of FIG. 4 ) and a second device not including (or not including) a magnetic material. 1302 (eg, the rear camera 420 in FIG. 4 ), the circuit board 1330 (eg, the printed circuit board 430 in FIG. 4 ), and between the first device 1301 and the second device 1302 It may include a shielding structure 1360 for shielding at least a portion of the generated magnetic force. In various embodiments, the first device 1301 includes the magnetic material 1305 as an example, but is not limited thereto. According to various embodiments, each of the first device 1301 and the second device 1302 may include a structure including a magnetic material. For example, the scope of the present invention includes a structure in which one device (eg, the first device 1301) includes a magnetic material and another device (eg, the second device 1302) does not include a magnetic material; Alternatively, a structure including a magnetic material may be included in each of one device and at least one other device. In various embodiments, at least a portion of the magnetic force generated from the magnetic body 1305 of the first device 1301 is shielded from affecting at least one second device 1302 affected by the magnetic body 1305. structure may be included.

According to an embodiment, the shielding structure 1360 may include a shielding member 1340 for shielding magnetic force and a connection member 1350 for physically fixing the shielding member 1340 to the circuit board 1330. .

In various embodiments, the shielding member 1340 may be disposed between the first device 1301 and the second device 1302 . The shielding member 1340 is a shielding material (or first material) capable of shielding at least some magnetic force between the first device 1301 (or the magnetic body 1305 of the first device 1301) and the second device 1302. metal, magnetic material). According to one embodiment, the shielding material may be a material (metal) having ferromagnetic properties. For example, the shielding material may be implemented with SUS (eg, composed of elements or alloys such as iron (Fe), cobalt (Co), and nickel (Ni)).

In various embodiments, the connection member 1350 contacts (or is physically connected to) at least a portion of the shield member 1340 based on a portion of one surface (eg, an outer surface), and the other surface (eg, an inner surface). Based on this, it may be contacted (or physically connected) to and fixed to the circuit board 1330 . According to an embodiment, the connection member 1350 includes at least some of the magnetic force and magnetic force generated between the first device 1301 (or the magnetic body 1305 of the first device 1301) and the second device 1302. It can be composed of a non-magnetic material (or a second material metal) that can be separated in isolation. According to an embodiment, the non-magnetic material may be a material (metal) that is not affected by a magnetic field formed by a magnetic material (eg, a magnet). For example, the non-magnetic material can be implemented with nickel silver (or pure iron).

According to various embodiments, the shielding structure 1360 (eg, the shielding member 1340 and the connecting member 1350) is disposed on the circuit board 1330 in a specific way (eg, formed in an SMD method), so that the circuit board ( 1330). According to an embodiment, in implementing the shielding structure 1360, a shielding member 1340 (eg, a material for absorbing a magnetic field (eg, a magnetic material)) for shielding magnetic force, and a connection member 1350 (eg, a magnetic material) A shielding structure may be implemented by making a non-magnetized material (eg, a non-magnetic material) into a binary material and bonding between the two materials (eg, the shielding member 1340 and the connecting member 1350). In the case of a shielding structure according to an embodiment, in the case of a non-magnetic material (eg, the connecting member 1350) to be SMD, it may be designed to secure a minimum area to be SMD, and through this, the device (or the magnetic body of the device) and A contact structure and/or position between the circuit boards 530 may be designed more freely. In the case of the shielding structure according to an embodiment, in the case of a non-magnetic material (eg, connecting member 1350) to be SMD, it is designed to secure the maximum area to be SMD (eg, the junction area to be SMD to the circuit board 1330) It can be. Through this, in various embodiments, the strength of the wick part of the circuit board 1330 is reinforced (eg, twist reinforcement, etc.), and the connection member 1350 is bonded to the circuit board 1330 over a wider area to form a shielding structure ( It is possible to prevent separation (or falling, etc.) of the circuit board 1360 from the circuit board 1330 .

According to various embodiments, the shielding member 1340 is provided between the first device 1301 and the second device 1302, the functional characteristics of the devices (eg, the first device 1301 and the second device 1302) ( Alternatively, the arrangement position (eg, position adjacent to either device) may be determined corresponding to whether the driving (operation method) is affected by or not affected by the magnet (or magnetic force or magnetic field). According to an embodiment, the shielding member 1340 is a magnetic material that affects the operation of one device (eg, a counterpart device) based on at least the functional characteristics of the first device 1301 and the second device 1302. It may be disposed close to (or biasedly) to the side of the included first device 1301 . According to an embodiment, the shielding member 1340 is formed between the magnetic body 1305 of the first device 1301 and the second device 1302 (or the magnetic body of the second device 1302 (not shown)), Corresponding to the intensity (or magnetic force), it may be implemented to have a structure having a different thickness and/or distance from the device whose arrangement position is determined.

Among the devices 1301 and 1302, the shielding structure 1360 of the electronic device 1300 according to various embodiments is disposed adjacent to a device that emits a relatively strong magnetic flux (eg, the first device 1301) can do. According to an embodiment, as shown in FIG. 13 , the shielding structure 1360 (particularly, the shielding member 1340) may be disposed closer to the first device 1301 than the second device 1302.

According to various embodiments, the shielding member 1340 has a plate-like structure and may be contacted (physically fixed) on one side of the circuit board 1330 through the connecting member 1350 . According to an embodiment, at least one of both ends of the shield member 1340 (eg, an upper or lower portion in the length (or height) direction in the drawing) may be formed in a bending structure. For example, at least a portion of the shielding member 1340 may be formed in a bent state.

According to an embodiment, the bending portion of the shielding member 1340 may be bent in a predetermined direction. According to an embodiment, the bending structure of the shielding member 1340 is designed in an 'L' shape or 'L' shape by bending the upper or lower side, or in a 'C' shape by bending the upper and lower sides. can design For example, the number of bending parts of the shielding member 1340 may be plural. According to an embodiment, the shielding member 1340 may not include a bending portion and may be formed in a plate-like structure (or flat plate structure, or 'ㅡ' shape) as in the example of FIG. 13 .

According to an embodiment, the entire height (or length) and/or area of the shielding member 1340 is formed in a structure that is equal to or relatively larger than the size (eg, height and/or area) of a magnetic body to be shielded. can do. Through this, a more effective effect can be expected in forming a magnetic field with the magnetic body of the shielding target and shielding the magnetic force.

According to an embodiment, the shielding member 1340 may be designed to have a variable thickness according to the magnetic force of a magnetic material to be shielded. For example, the thickness of the shielding member 1340 may be designed to sufficiently absorb the magnetism of the magnetic material to be shielded. According to one embodiment, the shielding member 1340 may have a thickness of about 0.15 mm. According to an embodiment, the shielding member 1340 may be contacted (connected) to the circuit board 530 using the SMD method based on the connecting member 1350 .

According to various embodiments, at least one electronic component is provided on one surface (eg, the upper surface in the drawing) of the circuit board 1330 and connected to the other surface (eg, the lower surface in the drawing) of the circuit board 530. Member 1350 can be contacted.

According to an embodiment, at least a portion of the circuit board 1330 is formed with a narrow width (w) between the first device 1301 and the second device 1302, so that a relatively weak portion (eg, a wick) part) may be included. In various embodiments, the connection member 1350 of the shield structure 1360 may be used as a reinforcing member for reinforcing the strength of the wick part of the circuit board 1330 . For example, the connecting member 1350 may be formed to function as a member for reinforcing strength. According to an embodiment, the connecting member 1350 of the shielding structure 1360 may be formed to surround the wick part corresponding to the width w of the wick part. According to an embodiment, the connecting member 1350 has a 'yaw' shape (or 'c' shape) and surrounds the circuit board 1330 (eg, a weak part of the circuit board 1330). can include According to an exemplary embodiment, the connecting member 1350 may include fixing grooves on both sides of the circuit board 1330 (eg, at least a portion of a left side and at least a portion of a right side) or both sides of the circuit board 1330 and a lower surface of the circuit board 1330. It can be in contact with at least a part of. According to one embodiment, the connection member 1350 may include a shape of a 'b' shape (or a 'b' shape depending on the viewing direction) of a bent structure.

According to one embodiment, the connection member 1350 may be described as a reinforcing member composed of a plurality of parts (eg, a first part, a second part, and a third part) that are divided according to their shape and/or function. . According to an embodiment, the connecting member 1350 is a first part of the reinforcing member, and the first surface of the circuit board 1330 (eg, the left side of the weak part of the circuit board 1330 in a direction facing FIG. 13 ) surface, or a groove on the left side) of the first reinforcing member 1351 (eg, a vertical member, a rod member), a second part of the reinforcing member, and a second surface of the circuit board 1330 (eg, a figure As a second reinforcing member 1352 for fixing to the circuit board 1330 through the right side of the wick part of the circuit board 1330 in the direction facing 13, or a groove on the right side), or a third part of the reinforcing member, It can be divided into a third reinforcing member 1353 (eg, a bottom member) in contact with the lower surface of the circuit board 1330 . According to an embodiment, the first reinforcing member 1351 (eg, the first part of the reinforcing member) and the second reinforcing member 1352 (eg, the second part of the reinforcing member) are the third reinforcing member 1353 (eg, the second part of the reinforcing member). Example: the third part of the reinforcing member) may be formed to be vertically fixed to both sides. For example, the connecting member 1350 has a first portion (first region) disposed to correspond to a first surface (eg, a left side in the drawing) of the circuit board 1330, and a second portion (second region). ) may be disposed to correspond to the second surface (eg, the right side in the drawing) of the circuit board 1330, and a third portion (third region) may be formed to contact the lower surface of the circuit board 1330. According to an embodiment, the connection member 1350 may include a first reinforcing member 1351 (eg, a first portion of the reinforcing member), a second reinforcing member 1352 (eg, a second portion of the reinforcing member), or 3 The reinforcing member 1353 (eg, the third portion of the reinforcing member) may be formed to have respective functions (or have different shapes).

According to an embodiment, in the connecting member 1350, one surface (eg, an inner surface) of the first reinforcing member 1351 of one end contacts the first surface of the circuit board 1330, and the second end of the other end At least one surface (eg, a partial area of an inner surface) of the reinforcing member 1352 may contact the second surface of the circuit board 1330 . According to an embodiment, the shield member 1340 may come into contact with the other surface (eg, the outer surface) of the second reinforcing member 1352 .

According to an embodiment, the first reinforcing member 1351 and the second reinforcing member 1352 may be formed in a structure having a width (or width) or length (or height) that corresponds to each other or has a different size. there is. According to an embodiment, the second reinforcing member 1352 has a relatively smaller width and length than the first reinforcing member 1351, and the first reinforcing member 1351 has a relatively smaller width and length than the second reinforcing member 1352. It can be provided as a structure with a large width and length (eg, a structure that is wide and long). For example, the first reinforcing member 1351 may be formed to be in contact with a larger area in consideration of bending prevention of the shielding member 1340 and contact force.

According to an embodiment, the second reinforcing member 1352 is provided at a height corresponding to (or equal to) the height of the circuit board 1330 (eg, the wick part) (eg, to the top surface of the circuit board 1330). It can be. The first reinforcing member 1351 may be provided to protrude higher than the height of the circuit board 1330 (eg, a structure protruding from the upper surface of the circuit board 1330). According to an embodiment, the entire upper surface (or inner surface) of the third reinforcing member 1353 may be provided in a shape in contact with the circuit board 1330 (eg, a wick part of the circuit board 1330). .

According to one embodiment, the connecting member 1350 is based on the first reinforcing member 1351, the second reinforcing member 1352, and the third reinforcing member 1353, and has a 'concave' shape ( Alternatively, it may include a shape surrounding the weak part of the circuit board 1330 in a 'C' shape) structure. According to an embodiment, the connecting member 1350 is based on all of the first reinforcing member 1351 and the third reinforcing member 1353, except for the second reinforcing member 1352, in an 'L' shape (or Depending on the viewing direction, 'b' shape) may include a shape of a bending structure.

Referring to FIG. 14, FIG. 14 shows a shielding structure 1360 (particularly, a connecting member 1350) and a circuit board 1330 when looking at the first device 1301 from the second device 1302 side of FIG. 13. ) It may be a diagram of a part (eg, the weak part 1410).

As shown in FIG. 14, in FIG. 14, the connecting member 1350 has a third reinforcing member 1353 laminated on the circuit board 1330, and at least a portion of the third reinforcing member 1353 is formed on the circuit board 1330. An example of a structure in which the second reinforcing member 1352 extending to a length corresponding to the height H of is bent may be shown.

According to an embodiment, the wick part 1410 of the circuit board 1330 may have a predetermined length (hereinafter referred to as 'length (L)'), and the third reinforcing member 1353 of the connecting member 1350 may be stacked in a shape having a length corresponding to the length L, a length shorter than the length L, or a length longer than the length L. In the example of FIG. 14 , an example in which the third reinforcing member 1353 is longer than the length L at which the wick part 1410 is formed may be shown.

According to one embodiment, the second reinforcing member 1352 of the connection member 1350 has a length corresponding to the length L of the wick part 1410, or a length shorter than the length L of the third booster cavity. It can be bent from member 1352. In the example of FIG. 14 , the second reinforcing member 1352 may be formed to have a length corresponding to the length L at which the wick part 1410 is formed. According to an embodiment, when a groove for fixing the second reinforcing member 1352 is formed in the wick part 1410 of the circuit board 1330, the second reinforcing member 1352 is formed in the groove of the wick part 1410. It may be formed to have a length corresponding to or shorter than the length (or width) of.

15, 16, and 17 are views for explaining a structure in which a shielding structure shields magnetic force between devices according to various embodiments.

15, a first device 1501, a second device 1502, and a third device 1503 are disposed on a circuit board (not shown), and the second device 1502 and An example in which the third devices 1503 are disposed adjacent to the first device 1501 and are affected by magnetic force generated from the magnetic body 1500 of the first device 1501 may be illustrated.

According to one embodiment, in FIG. 15 , the first device 1501 is a speaker (or receiver) including a magnetic material 1500, and the second device 1502 is disposed adjacently below the first device 1501. The third device 1503 is disposed adjacent to the side of the first device 1501 and the front camera affected by the magnetic flux of the magnetic body 1500 is disposed. example can be given. Although not shown in FIG. 15 , a wick part of the circuit board may be formed between the first device 1501 , the second device 1502 , or the third device 1503 , and a shielding structure may be formed on the wick part. . In FIG. 15 , the shielding member 1540 of the shielding structure may be schematically illustrated.

Referring to FIG. 15 , in various embodiments, a shielding member 1540 is provided between a first device 1501 and a second device 1502 (hereinafter referred to as a 'first shielding space'), and a first device 1501 ) and the third device 1503 (hereinafter, referred to as the 'second shielding space') so as not to affect the second device 1502 and the third device 1503 affected by the magnetic material 1500. A shielding structure may be included. According to an embodiment, the shielding member 1540 is the first device 1501 (or the magnetic body 1500 of the first device 1501) to shield the magnetic force of the magnetic body 1500 in the first shielding space and the second shielding space. For example, the shielding member 1540 may be formed in a structure that is bent around (or based on) For example, the shielding member 1540 is at least capable of shielding between devices (eg, the first shielding space and the second shielding space). A part may be formed in a bent state.

According to one embodiment, the shielding member 1540 may be bent in a predetermined direction. According to an embodiment, the bending structure of the shielding member 1540 may be designed in an 'L' shape or 'L' shape, or may be designed in a 'C' shape or 'ㅁ' shape. For example, the shielding member 1540 may be formed in a structure capable of being shielded in all shielding spaces according to the location (eg, arrangement relationship) of devices to be shielded and the number of devices to be shielded. According to an embodiment, magnetic force shielding of a plurality of peripheral devices may be possible with one shielding member 1540 through a bending structure of the shielding member 1540 . According to an embodiment, although not shown, the shielding member 1540 may be fixed through a connecting member (not shown) formed on one of the wick parts of the circuit board formed between the devices.

As shown in FIG. 16, a first device 1601, a second device 1602, and a third device 1603 are disposed on a circuit board (not shown), and the second device 1602 Arranged adjacent to the first device 1601, the third device 1603 is disposed adjacent to the second device 1602, by the magnetic force generated from the magnetic body 1600 of the first device 1601, An example in which the second device 1602 and the third device 1603 are affected may be shown.

According to one embodiment, in FIG. 16 , the first device 1601 is a speaker (or receiver) including a magnetic material 1600, and the second device 1602 is disposed adjacent to and below the first device 1601. The third device 1603 is disposed adjacent to the side of the second device 1602 but is affected by the magnetic flux of the magnetic body 1600. An example in which a camera is disposed may be shown. For example, FIG. 16 may show an example of a case in which the influence of the magnetic material 1600 reaches the third device 1603 . Although not shown in FIG. 16 , a wick part of the circuit board may be formed between the first device 1601 , the second device 1602 , or the third device 1603 , and a shielding structure may be formed on the wick part. . In FIG. 16 , the shielding member 1640 of the shielding structure may be schematically illustrated.

Referring to FIG. 16 , in various embodiments, a shielding member 1640 is provided between a first device 1601 and a second device 1602 (hereinafter referred to as a 'first shielding space'), and a first device 1601 ) and the third device 1603 (hereinafter referred to as 'second shielding space') so as not to affect the second device 1602 and the third device 1603 affected by the magnetic material 1600. A shielding structure may be included. According to an embodiment, the shielding member 1640 may be formed by extending the length of the shielding member 1640 to shield the magnetic force of the magnetic body 1600 in the first shielding space and the second shielding space. For example, the shielding member 1640 may be formed to be as long as the lengths of the second device 1602 and the third device 1603 so that both the second device 1602 and the third device 1603 can be shielded. . According to an embodiment, the shielding member 1640 may be formed in a flat plate structure (or 'ㅡ' shape) extending to a length capable of covering both the second device 1602 and the third device 1603. According to an embodiment, although not shown in FIG. 16, in the arrangement structure of the devices as in the example of FIG. 16, the shield member 1640 is formed in a bending structure as in the example of FIG. A shielding structure may be included so that the third device 1603 is not affected by the magnetic material 1600 .

Referring to FIG. 17, FIG. 17 shows a first device 1701, a second device 1702, and a third device 1703 disposed on a circuit board (not shown), wherein the second device 1702 Arranged adjacent to the device 1701, the third device 1703 is disposed adjacent to the second device 1702, by the magnetic force generated from the magnetic body 1700 of the first device 1601, the second device Only (1702) can show examples of being affected.

According to an embodiment, in FIG. 17 , the first device 1701 is a speaker (or receiver) including a magnetic material 1700, and the second device 1702 is disposed adjacent to and below the first device 1701. The third device 1703 is disposed next to the second device 1702 but is not affected by the magnetic flux of the magnetic body 1700. An example in which a rear camera is disposed may be shown. For example, FIG. 17 may show an example of a case in which the influence of the magnetic material 1700 does not extend to the third device 1603 .

Referring to FIG. 17 , in various embodiments, a shielding member 1740 is provided between the first device 1601 and the second device 1602 affected by the magnetic body 1700 (hereinafter, referred to as 'shielding space'). In , a shielding structure may be included so as not to affect the second device 1702 affected by the magnetic material 1700 . According to an embodiment, the shielding member 1740 may form the magnetic force of the magnetic material 1700 in the shielding space as long as it can shield. For example, the shielding member 1740 may be formed as long as the second device 1602 to shield only the second device 1602 compared to the shielding member 1640 of FIG. 16 . According to an embodiment, the shielding member 1740 may be formed in a flat plate structure (or 'ㅡ' shape) capable of covering the second device 1702 .

As described above, in the electronic device according to various embodiments, the first device 510 including the first magnetic body 515, the second device 520 including the second magnetic body 525, and the first It includes a shielding structure 560 for shielding at least some of the magnetic force generated between the first magnetic body 515 and the second magnetic body 525, and the shielding structure 560 includes the first device 510 and a shielding member 540 disposed between the second device 520 and having a magnetic property, and a connection member 550 physically connected to at least a part of the shielding member 540 and having a non-magnetic property. ), and at least a part of the connecting member 550 may be physically connected to the circuit board 530 .

According to various embodiments, the shielding member 540 may be formed of a magnetic material capable of shielding at least some of the magnetic force.

According to various embodiments, the shielding member 540 may be formed of SUS having ferromagnetic properties.

According to various embodiments, the connection member 550 may be formed of a non-magnetic material capable of being magnetically separated from at least some of the magnetic force.

According to various embodiments, the non-magnetic material may be formed of a metal that is not affected by a magnetic field.

According to various embodiments, the metal may include nickel silver.

According to various embodiments, the shielding member 540 and the connection member 550 may be in contact with each other in a surface mount device (SMD) method.

According to various embodiments, at least one end of the shielding member 540 may be formed in a bending structure.

According to various embodiments, the circuit board 530 may be formed with grooves (eg, first grooves 630 and second grooves 640) for fixing the connecting member 550. there is.

According to various embodiments, the connection member 550 has one surface of the first reinforcing members 610 and 710 contacting the first groove 630 of the circuit board 530 and one surface of the circuit board ( 530), including second reinforcing members 620 and 720 contacting the second groove 640, and a third reinforcing member 730 having an upper surface in contact with the lower surface 655 of the circuit board 530. can do.

According to various embodiments, the other surfaces of the second reinforcing members 620 and 720 may be formed to contact one surface of the shielding member 540 .

According to various embodiments, the first reinforcing members 610 and 710 and the second reinforcing members 720 and 720 may be formed to be vertically fixed to both sides of the third reinforcing member 730. .

According to various embodiments, the first reinforcing members 610 and 710 and the second reinforcing members 620 and 720 may be formed to have different widths and lengths.

According to various embodiments, the circuit board (eg, the circuit board 1030 of FIG. 10 ) includes a weak part requiring reinforcement between the first device and the second device, and the shielding structure (For example, the shielding structure 1060 of FIG. 10 ) may be disposed on the wick part, and the shielding structure may be formed to reinforce the wick part in an extended plate-like structure or a bending structure.

According to various embodiments, the connecting member (eg, the connecting member 1050 of FIG. 10 ) may be formed to function as a member for reinforcing the strength of the wick part.

According to various embodiments, the connecting member (eg, the connecting member 1050 of FIG. 10 ) may be formed with a length and width corresponding to the length and width of the wick part.

According to various embodiments, the shielding member 540 is a device (eg, the first device 510) based at least on the functional characteristics of the first device 510 and the second device 520. It may be characterized in that it is formed to be disposed closer to (or biased to) the side.

According to various embodiments, the functional characteristics may include characteristics depending on whether or not a driving method of the device is affected by magnetic force.

According to various embodiments, the shielding member 540 may be formed to be larger than or equal to the size of a magnetic body to be shielded (eg, the first magnetic body 515).

According to various embodiments, in the interval (eg, length A) between the first device 510 and the second device 520, the shielding member 540 and another magnetic material (eg, the first non-shielding target) The distance (for example, the length B) between the first magnetic materials 515 may be formed to have a maximum distance.

As described above, in the electronic device according to various embodiments, the circuit board 530, the first device 510 including the first magnetic body 515, and the second device including the second magnetic body 525 ( 520), and a shielding structure 560 for shielding at least some of the magnetic force generated between the first magnetic body 515 and the second magnetic body 525, the shielding structure 560 comprising: A shielding member 540 disposed between the first device 510 and the second device 520 and having a magnetic property capable of shielding at least some of the magnetic force, and at least a portion of the shielding member 540 It is physically connected and includes a connecting member 550 fixed to the circuit board 530, and the connecting member 550 has properties of a non-magnetic material that can be magnetically separated from the at least some magnetic force. can be done with

According to various embodiments, at least a portion of the connection member 550 may be physically connected to the circuit board 530, and at least a portion of the connection member 550 may be physically connected to the shielding member 540.

According to various embodiments, the shielding member 540 is a device (eg, the first device 510) based at least on the functional characteristics of the first device 510 and the second device 520. It is disposed close to (or biasedly) to the side, but the distance (eg, length (B)) between the shielding member 540 and another magnetic material (eg, second magnetic material 525) to be non-shielding has a maximum separation distance. disposed, and may be formed equal to or larger than the size of the magnetic body to be shielded.

As described above, in an electronic device according to various embodiments, a device including a magnetic material (eg, the first device 510), a circuit board 530, and a magnetic field generated by the magnetic material shield at least some of the magnetic fields. A shielding structure 560 is provided between the device (eg, a first device) and another device included in the electronic device (eg, a second device that does not include a magnetic material). A shielding member 540 disposed on and having a ferromagnetic property capable of shielding at least some of the magnetic field, and a connecting member 550 physically connected between at least a portion of the shielding member 540 and the circuit board 530. ), and the connection member 550 may be characterized in that it has a property of a non-magnetic material capable of being magnetically separated from at least some of the magnetic field.

According to various embodiments, the shielding member 540 and the connecting member 550 may be connected in a surface mount device (SMD) method.

According to various embodiments, at least a portion of the shielding member 540 may be formed in a bent state.

According to various embodiments, the connecting member 550 is disposed so that the first areas 610 and 710 correspond to the first groove 630 of the circuit board 530, and the second areas 620 and 720 is disposed to correspond to the second groove 640 of the circuit board 530, the third regions 630 and 730 are formed to contact the lower surface 655 of the circuit board 530, and the first The region 710 and the second region may be vertically fixed to both sides of the third region, and the second region may contact at least a portion of the shielding member 540 .

Various embodiments of the present invention disclosed in the present specification and drawings are only presented as specific examples to easily explain the technical content of the present invention and help understanding of the present invention, and are not intended to limit the scope of the present invention. Therefore, the scope of the present invention should be construed as including all changes or modifications derived based on the technical idea of the present invention in addition to the embodiments disclosed herein.

100, 300, 500: electronic device
410, 510: first device
515: first magnetic body
510, 520: second device
525: second magnetic body
430, 530: circuit board
560: shielding structure
540: shield member
550: connecting member

Claims (20)

In electronic devices,
circuit board;
a first device including a first magnetic material;
a second device including a second magnetic material; and
A shielding structure for shielding at least some of the magnetic force generated between the first magnetic body and the second magnetic body, the shielding structure comprising:
A shielding member disposed close to the device side of any one of the first device and the second device, having properties of a magnetic body and having a plate-like structure, and
A first surface is physically connected to at least a portion of the shield member and includes a connection member having a non-magnetic property, the connection member being physically connected to the circuit board at a second surface opposite to the first surface. electronic device.
The method of claim 1, wherein the shielding member,
An electronic device formed of a ferromagnetic material capable of shielding at least some of the magnetic force.
The method of claim 1, wherein the connecting member,
An electronic device formed of a non-magnetic material capable of being magnetically separated from the at least some magnetic force.
The method of claim 3, wherein the non-magnetic material,
An electronic device formed of metal that is impervious to magnetic fields.
According to claim 1,
The shielding member and the connecting member are in contact with each other in a surface mount device (SMD) method.
The method of claim 1, wherein the shielding member,
An electronic device formed with at least a portion bent.
The method of claim 1, wherein the circuit board,
An electronic device having a groove for fixing the connecting member.
The method of claim 1, wherein the connecting member,
A first region is disposed to correspond to the first groove of the circuit board;
A second region is disposed to correspond to the second groove of the circuit board, and
An electronic device formed such that the third region is in contact with the lower surface of the circuit board.
According to claim 8,
The electronic device formed so that the second area is in contact with at least a portion of the shielding member.
According to claim 8,
The first area and the second area are vertically formed on both sides of the third area.
According to claim 8,
The electronic device of claim 1 , wherein the first area and the second area have different widths and lengths.
The method of claim 1, wherein the circuit board,
A weak part requiring reinforcement between the first device and the second device, and the shielding structure,
An electronic device disposed on the wick part and configured to reinforce the wick part with a plate-like structure or a bending structure in which the shielding structure is extended.
The method of claim 12, wherein the connecting member,
An electronic device formed to function as a member for reinforcing the strength of the wick part.
The method of claim 13, wherein the connecting member,
An electronic device having a length and width corresponding to the length and width of the wick part.
The method of claim 1, wherein the shielding member,
An electronic device configured to be disposed closer to one of the devices, at least based on functional characteristics of the first device and the second device.
The method of claim 15, wherein the shielding member,
An electronic device formed to be larger than or equal to the size of the first magnetic body and the second magnetic body.
In electronic devices,
circuit board;
a first device including a first magnetic material;
a second device including a second magnetic material; and
A shielding structure for shielding at least some of the magnetic force generated between the first magnetic body and the second magnetic body, the shielding structure comprising:
A shielding member disposed close to any one of the first device and the second device, having a magnetic material property capable of shielding at least some of the magnetic force, and having a plate-like structure, and
a connecting member having a first surface physically connected to at least a portion of the shield member and fixed to the circuit board at a second surface opposite to the first surface; An electronic device having the properties of a non-magnetic substance that can be separated into
According to claim 17,
At least a portion of the connection member is physically connected to the circuit board, and at least a portion of the other connection member is physically connected to the shielding member.
The method of claim 17, wherein the shielding member,
An electronic device disposed closer to one of the devices and having a size greater than or equal to the size of the magnetic body, at least based on functional characteristics of the first device and the second device.
a device containing a magnetic body;
circuit board; and
And a shielding structure for shielding at least some of the magnetic fields generated by the magnetic body, the shielding structure,
a shielding member disposed between the device and other devices included in the electronic device and having a ferromagnetic property capable of shielding at least some of the magnetic field; and
A connecting member physically connected between at least a portion of the shielding member and the circuit board;
The connecting member has properties of a non-magnetic material that can be magnetically separated from the at least part of the magnetic field, and has a first surface directly connected to at least a part of the shield member, and a second surface opposite to the first surface. directly connected to the circuit board,
The shielding member is disposed close to any one of the device and other devices included in the electronic device and has a plate-like structure.

Images