KR20210100391A - An electronic device and a connector connecting the first printed circuit board and the second printed circuit board of the electronic device - Google Patents

Abstract

Disclosed is an electronic device, which comprises: a first printed circuit board (PCB) transmitting a first signal within a first frequency bandwidth as a designated frequency bandwidth; a second PCB including a first communication circuit for treating the first signal; and a connector connecting the first PCB and the second PCB, wherein the connector includes: a first connector having a first housing containing a first surface disposed on the first PCB to face a first direction and at least one second surface facing a second direction perpendicular to the first direction; and a second connector having a second housing containing a third surface disposed on the second PCB to face the first direction and at least one fourth surface facing the second direction. At least a part of the third surface includes a protrusion portion made of a conductive material to face the first direction and at least a part of the fourth surface includes a shielding member made of a conductive material. In addition, a ground terminal made of a conductive material is integrally formed in at least a part of the first surface and at least a part of the second surface, wherein the ground terminal comes in contact with the protrusion portion and the shielding member. Other various embodiments identified through the specification are possible. In accordance with the present invention, the electronic device includes a shielding structure, which can reduce radio frequency (RF) signal interference from high frequency bandwidth.

Description

An electronic device and a connector connecting the first printed circuit board and the second printed circuit board of the electronic device

Embodiments disclosed in this document relate to an electronic device and a technique for implementing a connector connecting a first printed circuit board and a second printed circuit board of the electronic device.

An electronic device supporting a wireless communication function may include a printed circuit board on which a communication circuit is disposed. The communication circuit may process a signal received from an antenna such as an antenna module or transmit a wireless communication signal using the antenna.

On the other hand, the printed circuit board of the electronic device may be provided with a connector such as a board to board connector (Board to board connector, BtoB connector). Board-to-board connectors can transmit circuit signals or low-frequency signals. The board-to-board connector may use a flexible printed circuit board (FPCB) to connect a rigid printed circuit board to each other or to electrically connect a rigid printed circuit board and an electronic component.

Current board-to-board connectors do not have a shielding structure that reduces interference between transmitted signals. When an RF signal is transmitted using a board-to-board connector, signal interference may occur at a connection portion of the board-to-board connector. In particular, when an RF signal in a high frequency band such as 5G mmWave is transmitted, signal interference may increase. It is not easy to transmit the RF signal in the high frequency band using a board-to-board connector due to the characteristics of the RF signal in the high frequency band, which is vulnerable to signal interference. In addition, when a board-to-board connector transmits an RF signal of a high frequency band, noise may be transmitted to circuits and/or electronic components disposed adjacent to the board-to-board connector.

Various embodiments disclosed in this document provide a board-to-board connector including a shielding structure capable of reducing RF signal interference in a high frequency band, and an electronic device including the same.

An electronic device according to an embodiment disclosed in this document includes a first printed circuit board for transmitting a first signal belonging to a first frequency band that is a designated frequency band, and a first communication circuit for processing the first signal a second printed circuit board, and a connector connecting the first printed circuit board and the second printed circuit board, wherein the connector is disposed on the first printed circuit board and faces a first direction A first connector including a first housing including a surface and at least one second surface facing a second direction perpendicular to the first direction, and disposed on the second printed circuit board, the first direction a second housing including a third surface facing the third surface and at least one fourth surface facing the second direction, wherein at least a portion of the third surface faces the first direction and includes a protrusion made of a conductive material, At least a portion of the fourth surface includes a second connector including a shielding member made of a conductive material, and a ground terminal made of a conductive material is integrally formed on at least a portion of the first surface and at least a portion of the second surface. and the ground terminal may contact the protrusion and the shielding member.

In addition, the connector connecting the first printed circuit board and the second printed circuit board of the electronic device according to an embodiment disclosed in this document includes a first surface facing a first direction and a second surface perpendicular to the first direction. a first connector including a first housing including at least one second surface facing in a direction, wherein at least a portion of the first housing includes a ground terminal made of a conductive material, and a third surface facing the first direction and a second housing including at least one fourth surface facing the second direction, wherein at least a portion of the third surface faces the first direction and includes a protrusion made of a conductive material, the fourth surface at least a portion of the second connector may include a second connector including a shielding member made of a conductive material, and the ground terminal of the first connector may be in contact with the protrusion of the second connector and the shielding member.

In addition, the connector connecting the first printed circuit board and the second printed circuit board of the electronic device according to another embodiment of the present disclosure includes a first surface facing a first direction and a second surface perpendicular to the first direction. a first connector including a first housing including at least one second surface facing a direction, at least a portion of the second surface including at least one ground terminal made of a conductive material, and facing the first direction A second connector comprising a second housing including a third surface and at least one fourth surface facing the second direction, wherein at least a portion of the fourth surface includes a shielding member made of a conductive material, The shielding member includes at least one contact portion at a position corresponding to the at least one ground terminal of the first connector in the first direction, and the at least one ground terminal of the first connector is the second connector. It may contact the at least one contact part.

According to the embodiments disclosed in this document, interference between RF signals of a high frequency band transmitted from a board-to-board connector is reduced, so that an RF signal of a high frequency band can be transmitted using the board-to-board connector.

In addition, according to the embodiments disclosed in this document, RF signals having different frequency bands may be transmitted through the board-to-board connector, thereby reducing the number and mounting area of connectors for connecting the printed circuit board.

In addition, according to the embodiments disclosed in this document, noise emitted to the outside from the board-to-board connector may be reduced, thereby reducing the effect of noise on circuits and/or electronic components disposed adjacent to the board-to-board connector. .

In addition, various effects directly or indirectly identified through this document may be provided.

1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure;
2 is a front perspective view of an electronic device according to an exemplary embodiment;
3 is a rear perspective view of an electronic device according to an exemplary embodiment;
4 is an exploded perspective view of an electronic device according to an embodiment.
5 is a diagram illustrating a first substrate, a second substrate, a plurality of antenna modules, a plurality of flexible substrates, and a plurality of connectors of an electronic device according to an exemplary embodiment.
6 is a diagram illustrating a first connector of a connector according to an embodiment.
7 is a diagram illustrating a ground terminal and a plurality of signal terminals of a first connector according to an exemplary embodiment.
8 is a view illustrating a first connector disposed on a first printed circuit board according to an exemplary embodiment.
9 is a diagram illustrating a second connector of a connector according to an exemplary embodiment.
10 is a view illustrating a second housing and a shielding member of a second connector according to an exemplary embodiment.
11 is a view illustrating that a second connector is disposed on a second printed circuit board according to an exemplary embodiment.
12 is a diagram illustrating a connector in which a first connector and a second connector are coupled according to an embodiment.
13 is a diagram illustrating a case in which a first printed circuit board is coupled to a second printed circuit board using a connector according to an exemplary embodiment.
14 is a view illustrating a plurality of regions included in a cross-section of a connector according to an exemplary embodiment.
15 is a diagram illustrating a plurality of ports included in a connector according to an embodiment.
16 is a diagram illustrating transmittance according to frequency of a connector according to an exemplary embodiment.
17 is a diagram illustrating a first connector of a connector according to another embodiment.
18 is a diagram illustrating a ground terminal and a plurality of signal terminals of a first connector according to another exemplary embodiment.
19 is a diagram illustrating a second connector of a connector according to another embodiment.
20 is a view illustrating a second housing and a shielding member of a second connector according to another exemplary embodiment.
21 is a diagram illustrating a connector in which a first connector and a second connector are coupled according to another embodiment.
22 is a diagram illustrating transmittance according to frequency of a connector according to an exemplary embodiment.
In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

Hereinafter, various embodiments of the present invention will be described with reference to the accompanying drawings. However, this is not intended to limit the present invention to specific embodiments, and it should be understood that various modifications, equivalents, and/or alternatives of the embodiments of the present invention are included.

1 is a block diagram of an electronic device 101 in a network environment 100 according to various embodiments. Referring to FIG. 1 , in a network environment 100 , an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120 , a memory 130 , an input device 150 , a sound output device 155 , a display device 160 , an audio module 170 , and a sensor module ( 176 , interface 177 , haptic module 179 , camera module 180 , power management module 188 , battery 189 , communication module 190 , subscriber identification module 196 , or antenna module 197 . ) may be included. In some embodiments, at least one of these components (eg, the display device 160 or the camera module 180 ) may be omitted or one or more other components may be added to the electronic device 101 . In some embodiments, some of these components may be implemented as one integrated circuit. For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented while being embedded in the display device 160 (eg, a display).

The processor 120, for example, executes software (eg, the program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120 . It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be loaded into the volatile memory 132 , process commands or data stored in the volatile memory 132 , and store the resulting data in the non-volatile memory 134 . According to an embodiment, the processor 120 includes a main processor 121 (eg, a central processing unit or an application processor), and a secondary processor 123 (eg, a graphics processing unit, an image signal processor) that can be operated independently or in conjunction with the main processor 121 . , a sensor hub processor, or a communication processor). Additionally or alternatively, the auxiliary processor 123 may be configured to use less power than the main processor 121 or to be specialized for a designated function. The auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .

The auxiliary processor 123 may be, for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or when the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display device 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to an embodiment, the coprocessor 123 (eg, an image signal processor or a communication processor) may be implemented as part of another functionally related component (eg, the camera module 180 or the communication module 190). there is.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176 ) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input device 150 may receive a command or data to be used by a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 . The input device 150 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (eg, a stylus pen).

The sound output device 155 may output a sound signal to the outside of the electronic device 101 . The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback, and the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.

The display device 160 may visually provide information to the outside (eg, a user) of the electronic device 101 . The display device 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the corresponding device. According to an embodiment, the display device 160 may include a touch circuitry configured to sense a touch or a sensor circuit (eg, a pressure sensor) configured to measure the intensity of a force generated by the touch. there is.

The audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input device 150 , or an external electronic device (eg, a sound output device 155 ) connected directly or wirelessly with the electronic device 101 . The electronic device 102) (eg, a speaker or headphones) may output a sound.

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, user state), and generates an electrical signal or data value corresponding to the sensed state. can do. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more specified protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication through the established communication channel. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, WiFi direct or IrDA (infrared data association)) or a second network 199 (eg, a cellular network, the Internet, Alternatively, it may communicate with the external electronic device 104 through a computer network (eg, a telecommunication network such as a LAN or WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other. The wireless communication module 192 uses the subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 . The electronic device 101 may be identified and authenticated.

The antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module 197 may include one antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 197 may include a plurality of antennas. In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, RFIC) other than the radiator may be additionally formed as a part of the antenna module 197 .

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and a signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external electronic devices 102 and 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or a part of operations executed in the electronic device 101 may be executed in one or more of the external electronic devices 102 , 104 , or 108 . For example, when the electronic device 101 needs to perform a function or service automatically or in response to a request from a user or other device, the electronic device 101 may perform the function or service itself instead of executing the function or service itself. Alternatively or additionally, one or more external electronic devices may be requested to perform at least a part of the function or the service. The one or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 . The electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request. For this purpose, for example, cloud computing, distributed computing, or client-server computing technology may be used.

2 is a front perspective view 200 of an electronic device (eg, the electronic device 101 of FIG. 1 ) according to an exemplary embodiment. 3 is a rear perspective view 300 of the electronic device 101 according to an embodiment.

2 and 3 , the electronic device 101 according to an embodiment includes a first surface (or front) 210A, a second surface (or rear) 210B, and a first surface 210A and The housing 210 may include a side surface 210C surrounding the space between the 22nd surfaces 210B. In another embodiment (not shown), the housing 210 may refer to a structure that forms part of the first surface 210A, the second surface 210B, and the side surface 210C of FIG. 2 . According to one embodiment, the first surface 210A may be formed by a front plate 202 (eg, a glass plate including various coating layers, or a polymer plate) at least a portion of which is substantially transparent. The second surface 210B may be formed by the substantially opaque back plate 211 . The back plate 211 is formed by, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. can be The side surface 210C is coupled to the front plate 202 and the rear plate 211 and may be formed by a side bezel structure (or “side member”) 218 including a metal and/or a polymer. In some embodiments, the back plate 211 and the side bezel structure 218 are integrally formed and may include the same material (eg, a metal material such as aluminum).

In the illustrated embodiment, the front plate 202 includes two first regions 210D that extend seamlessly from the first surface 210A toward the rear plate 211 by bending the front plate. It can include both ends of the long edge (long edge) of (202). In the illustrated embodiment (refer to FIG. 3 ), the rear plate 211 has two 22nd regions 210E that extend seamlessly by bending from the second surface 210B toward the front plate 202 with long edges. It can be included at both ends. In some embodiments, the front plate 202 (or the back plate 211 ) may include only one of the first regions 210D (or the second regions 210E). In another embodiment, some of the first regions 210D or the second regions 210E may not be included. In the above embodiments, when viewed from the side of the electronic device 101 , the side bezel structure 218 has a side surface that does not include the first regions 210D or the second regions 210E. It may have a first thickness (or width) and a second thickness that is thinner than the first thickness on the side surface including the first regions 210D or the second regions 210E.

According to an embodiment, the electronic device 101 includes a display 201 , audio modules 203 , 207 , 214 , sensor modules 204 and 219 , camera modules 205 , 212 , 213 , and a key input device ( It may include at least one of 215 , 216 , 217 , an indicator 206 , and connector holes 208 and 209 . In some embodiments, the electronic device 101 may omit at least one of the components (eg, the key input device 215 , 216 , 217 , or the indicator 206 ) or additionally include other components. there is.

The display 201 may be exposed through a substantial portion of the front plate 202 , for example. In some embodiments, at least a portion of the display 201 may be exposed through the front plate 202 forming the first areas 210D of the first surface 210A and the side surface 210C. The display 201 may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field type stylus pen. In some embodiments, at least a portion of the sensor module 204 , 219 , and/or at least a portion of a key input device 215 , 216 , 217 may include the first regions 210D, and/or the second may be disposed in the regions 210E.

The audio modules 203 , 207 , and 214 may include a microphone hole 203 and speaker holes 207 and 214 . In the microphone hole 203, a microphone for acquiring an external sound may be disposed therein, and in some embodiments, a plurality of microphones may be disposed to detect the direction of the sound. The speaker holes 207 and 214 may include an external speaker hole 207 and a receiver hole 214 for a call. In some embodiments, the speaker holes 207 and 214 and the microphone hole 203 may be implemented as a single hole, or a speaker may be included without the speaker holes 207 and 214 (eg, a piezo speaker).

The sensor modules 204 and 219 may generate an electrical signal or data value corresponding to an internal operating state of the electronic device 101 or an external environmental state. The sensor modules 204 and 219 include, for example, a first sensor module 204 (eg, a proximity sensor) and/or a second sensor module (not shown) disposed on the first surface 210A of the housing 210 . ) (eg, a fingerprint sensor), and/or a third sensor module 219 (eg, an HRM sensor) disposed on the second surface 210B of the housing 210 . The fingerprint sensor may be disposed on the second surface 210B as well as the first surface 210A (eg, the home key button 215) of the housing 210 . The electronic device 101 may include a sensor module not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, It may further include at least one of a humidity sensor and an illuminance sensor 204 .

The camera modules 205 , 212 , and 213 include a first camera device 205 disposed on the first surface 210A of the electronic device 101 , and a second camera device 212 disposed on the second surface 210B of the electronic device 101 . ), and/or a flash 213 . The camera devices 205 and 212 may include one or more lenses, an image sensor, and/or an image signal processor. The flash 213 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared cameras, wide angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 101 .

The key input device 215 , 216 , 217 includes a home key button 215 disposed on the first surface 210A of the housing 210 , a touch pad 216 disposed around the home key button 215 , and / or it may include a side key button 217 disposed on the side 210C of the housing 210 . In another embodiment, the electronic device 101 may not include some or all of the aforementioned key input devices 215 , 216 , 217 and the non-included key input devices 215 , 216 , 217 may display a display. It may be implemented in another form, such as a soft key on the 201 .

The indicator 206 may be disposed, for example, on the first side 210A of the housing 210 . The indicator 206 may provide status information of the electronic device 101 in the form of light, for example, and may include an LED.

The connector holes 208 and 209 include a first connector hole 208 capable of receiving a connector (eg, a USB connector) for transmitting and receiving power and/or data to and from an external electronic device, and/or an external electronic device. and a second connector hole (eg, earphone jack) 209 capable of accommodating a connector for transmitting and receiving audio signals.

4 is an exploded perspective view 400 of an electronic device (eg, the electronic device 101 of FIG. 1 ) according to an embodiment.

Referring to FIG. 4 , the electronic device 101 includes a side bezel structure 410 , a first support member 411 (eg, a bracket), a front plate 420 , a display 430 , and a printed circuit board 440 . , a battery 450 , a second support member 460 (eg, a rear case), an antenna 470 , and a rear plate 480 . In some embodiments, the electronic device 101 may omit at least one of the components (eg, the first support member 411 or the second support member 460 ) or additionally include other components. . At least one of the components of the electronic device 101 may be the same as or similar to at least one of the components of the electronic device 101 of FIG. 2 or 3 , and overlapping descriptions will be omitted below.

The first support member 411 may be disposed inside the electronic device 101 and connected to the side bezel structure 410 , or may be integrally formed with the side bezel structure 410 . The first support member 411 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material. The first support member 411 may have a display 430 coupled to one surface and a printed circuit board 440 coupled to the other surface. The printed circuit board 440 may be equipped with a processor, memory, and/or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. Memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may, for example, electrically or physically connect the electronic device 101 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.

The battery 450 is a device for supplying power to at least one component of the electronic device 101 and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. . At least a portion of the battery 450 may be disposed substantially on the same plane as the printed circuit board 440 , for example. The battery 450 may be integrally disposed inside the electronic device 101 , or may be disposed detachably from the electronic device 101 .

The antenna 470 may be disposed between the rear plate 480 and the battery 450 . The antenna 470 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. The antenna 470 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging. In another embodiment, an antenna structure may be formed by a part of the side bezel structure 410 and/or the first support member 411 or a combination thereof.

5 illustrates a first substrate 510 , a second substrate 520 , a plurality of antenna modules 531 , 532 , 533 , and a plurality of flexible devices of an electronic device (eg, the electronic device of FIG. 1 ) according to an embodiment. It is a view showing the substrates 541 , 542 , 543 , 544 , and a plurality of connectors 551 , 552 , 553 , 554 , 555 , 556 , 557 , 558 .

In an embodiment, the first substrate 510 may be disposed adjacent to the first side of the battery 450 . The first side surface may be a side facing the +Y-axis direction among side surfaces of the battery 450 . The first substrate 510 may be a main printed circuit board. The first substrate 510 may be a rigid printed circuit board (rigid PCB). The first substrate 510 may include a first communication circuit 511 . The first communication circuit 511 may generate and/or process the first signal to transmit/receive the first signal belonging to the first frequency band. The first frequency band may be a 5G mmWave (5G mmWave) band. The first frequency band may be a signal of about 20 GHz or more and about 60 GHz or less.

In an embodiment, the second substrate 520 may be disposed so that the first substrate 510 is adjacent to a second side opposite to the first side of the battery 450 . The second side surface may be a surface facing the -Y axis direction among the side surfaces of the battery 450 . The second board 520 may be a sub printed circuit board. The second substrate 520 may be a rigid printed circuit board. The second substrate 520 may include a second communication circuit 522 . The second communication circuit 522 may generate and/or process a second signal to transmit/receive a second signal belonging to the second frequency band. The second frequency band may be a lower frequency band than the first frequency band. For example, the second frequency band may be a 4G legacy band. As another example, the second frequency band may be an intermediate frequency (IF) band. The second frequency band may be a signal of about 2 GHz or more and about 18 GHz or less.

In an embodiment, the plurality of antenna modules 531 , 532 , and 533 may include a first antenna module 531 , a second antenna module 532 , and a third antenna module 533 . The first antenna module 531 may be disposed adjacent to the first side surface of the first substrate 510 . The first side surface may be a side facing the +Y-axis direction among side surfaces of the first substrate 510 . The second antenna module 532 may be disposed adjacent to the second side surface of the first substrate 510 . The second side surface may be a surface facing the -X-axis direction among side surfaces of the first substrate 510 . The third antenna module 533 may be disposed adjacent to the third side surface of the first substrate 510 . The third side surface may be a surface facing the +X-axis direction among side surfaces of the first substrate 510 . The first antenna module 531 , the second antenna module 532 , and the third antenna module 533 may transmit/receive a first signal belonging to a first frequency band. The first antenna module 531 , the second antenna module 532 , and the third antenna module 533 may include an antenna array for transmitting and receiving 5G millimeter waves.

In an embodiment, the plurality of flexible substrates 541 , 542 , 543 , and 544 include a first flexible substrate 541 , a second flexible substrate 542 , a third flexible substrate 543 , and a second flexible substrate 543 . 4 may include a flexible substrate 544 . The first flexible substrate 541 may connect the first substrate 510 to the first antenna module 531 . The second flexible substrate 542 may connect the first substrate 510 to the second antenna module 532 . The third flexible substrate 543 may connect the first substrate 510 to the third antenna module 533 . The fourth flexible substrate 544 may connect the first substrate 510 to the second substrate 520 . The first flexible substrate 541 , the second flexible substrate 542 , the third flexible substrate 543 , and the fourth flexible substrate 544 are flexible printed circuit boards (FPCBs). can The first flexible substrate 541 , the second flexible substrate 542 , the third flexible substrate 543 , and the fourth flexible substrate 544 may transmit a signal of a first frequency band.

Hereinafter, the first flexible substrate 541 , the second flexible substrate 542 , the third flexible substrate 543 , and the fourth flexible substrate 544 are the first printed circuit boards 541 , 542 , 543, 544). The first substrate 510 may be defined as a second printed circuit board 510 . The second board 520 may be defined as a third printed circuit board 520 .

In one embodiment, the plurality of connectors 551 , 552 , 553 , 554 , 555 , 556 , 557 , 558 includes a first printed circuit board 541 , 542 , 543 , 544 and a second printed circuit board 510 . can be connected to each other. The first printed circuit boards 541 , 542 , 543 , and 544 and the third printed circuit board 530 may be connected to each other. The plurality of connectors 551 , 552 , 553 , 554 , 555 , 556 , 557 , 558 are connected to the first printed circuit board 541 , 542 , 543 , 544 and the plurality of antenna modules 531 , 532 , 533 . can connect The plurality of connectors 551 , 552 , 553 , 554 , 555 , 556 , 557 , and 558 is a Board to board connector for transferring signals of a first frequency band and/or a second frequency band between boards. , BtoB connector).

6 is a diagram illustrating a first connector 600 of a connector (eg, a plurality of connectors 551 , 552 , 553 , 554 , 555 , 556 , 557 , 558 of FIG. 5 ) according to an embodiment. 7 is a view 700 illustrating a ground terminal 610 and a plurality of signal terminals 620 of the first connector 600 according to an embodiment. 8 illustrates that the first connector 600 is disposed on the first printed circuit board 810 (eg, the first printed circuit boards 541 , 542 , 543 , 544 of FIG. 5 ) according to an embodiment. Figure 800.

In one embodiment, the connectors 551 , 552 , 553 , 554 , 555 , 556 , 557 , and 558 have a plug structure inserted into the other structure and a receptacle structure including a hole for accommodating the other structure. may have a structure in which they are coupled to each other. The first connector 600 may have a plug structure. The first connector 600 may enter the +Z-axis direction to be coupled with other structures.

In an embodiment, the first connector 600 may include a ground terminal 610 , a plurality of signal terminals 620 , and a first housing 630 . The first housing 630 may include a first surface 631 and a second surface 632 . The first surface 631 may be a surface facing the Z-axis direction, which is the first direction. The first surface 631 may be defined as a bottom surface of the first connector 600 or a base of the first housing 630 . The second surface 632 may be a surface facing the X-axis direction and/or the Y-axis direction, which is the second direction. The second surface 632 may be defined as a side surface of the first connector 600 or a short wall of the first housing 630 .

In an embodiment, the ground terminal 610 may be formed on at least a portion of the first surface 631 and at least a portion of the second surface 632 of the first housing 630 . The ground terminal 610 may be made of a conductive material. The ground terminal 610 may be positioned over the end wall and the base of the first housing 630 .

In an embodiment, the ground terminal 610 may be integrally formed. The ground terminal 610 may include a first portion 611 , a second portion 613 , and a first end 612 . The first part 611 , the second part 613 , and the first end 612 may have a single connected structure.

In an embodiment, the first portion 611 may be formed in a corner portion of the second surface 632 of the first housing 630 . The corner portion of the second surface 632 may be a portion in which the second surface 632 is bent. The corner portion of the second surface 632 may be a portion in which the second surface 640 is bent from the X-axis direction to the Y-axis direction or from the Y-axis direction to the X-axis direction. The first portion 611 may be formed to face the -X-axis direction and/or the +X-axis direction. The first portion 611 may be made of a conductive material such as metal.

In an embodiment, the second portion 613 may be formed in a corner portion of the second surface 632 of the first housing 630 . The corner portion of the second surface 640 may be a portion extending while the second surface 632 is bent in the X-axis direction. The second portion 613 may be formed along a shorter edge of the edge portions of the second surface 632 . The second portion 613 may be formed to face the +Y-axis direction and/or the -Y-axis direction. The second portion 613 may be made of a conductive material such as metal.

In one embodiment, the first end 612 may be a free end. The first end 612 may have a structure that is not supported and/or constrained. The first end 612 may be in space without being attached to other components or connections. The first stage 612 may swing up and down in space. The first end 612 may have a specified elastic force. The first end 612 may be bent in the Z-axis direction, which is the first direction.

In an embodiment, the plurality of signal terminals 620 may be formed along an XY plane that is a cross-section of the first connector 600 . The plurality of signal terminals 620 may be disposed inside the cross-section of the first connector 600 . Each of the plurality of signal terminals 620 may be divided by a non-conductive member of the first surface 631 and/or the second surface 632 of the first housing 630 .

In an embodiment, at least a portion of the first housing 630 may include a ground terminal 610 made of a conductive material. The ground terminal 610 may be formed to cross the inside and/or outside of the first housing 630 . The first end 612 of the ground terminal 610 may be at least partially formed in the -Z axis direction before facing the +Z direction using the opening formed on the first surface 631 of the first housing 630 . .

In an embodiment, the ground terminal 610 may be disposed on edges of the first surface 631 and the second surface 632 of the first housing 630 . A non-conductive member of the first housing 630 may be disposed to surround a portion of the ground terminal 610 and expose the remainder of the ground terminal 610 when viewed in the first direction, the Z-axis direction.

In an embodiment, the first connector 600 may be disposed on the first printed circuit board 810 . The first printed circuit board 810 may be a flexible board. The first connector 600 may transmit at least one signal belonging to the first frequency band and/or the second frequency band.

9 is a diagram illustrating a second connector 900 of a connector (eg, a plurality of connectors 551 , 552 , 553 , 554 , 555 , 556 , 557 , 558 of FIG. 5 ) according to an exemplary embodiment. 10 is a view 1000 illustrating the second housing 910 and the shielding member 920 of the second connector 900 according to an exemplary embodiment. 11 illustrates a second connector 900 on a second printed circuit board 1110 (eg, the second printed circuit board 510 and/or the third printed circuit board 520 of FIG. 5 ) according to an embodiment. It is a drawing 1100 showing what is disposed in.

In one embodiment, the second connector 900 may have a receptacle structure. The second connector 900 has a recessed structure oriented in the +Z-axis direction to accommodate a structure entering the second connector 900 from the +Z-axis direction.

In an embodiment, the second connector 900 may include a second housing 910 , a shielding member 920 , a third surface 930 , and a fourth surface 940 .

In one embodiment, the second housing 910 has a third surface 930 facing the Z-axis direction, which is a first direction, and at least one fourth surface ( 940) may be included. The third surface 930 may form a bottom surface of the second housing 910 . The fourth surface 940 may form a sidewall of the second housing 910 .

In an embodiment, the second housing 910 may include a side portion 911 , a protrusion 912 , and a plurality of signal terminals 913 .

In an embodiment, the side portion 911 may be formed at a corner portion of the fourth surface 940 of the second housing 910 . The corner portion of the fourth surface 940 may be a portion in which the fourth surface 940 extends in a straight line. The side part 911 may be formed along a shorter edge among the edge parts of the fourth surface 940 . The side portion 911 may be made of a conductive material.

In an embodiment, the protrusion 912 may be formed in the center of the cross-section of the second connector 900 . The protrusion 912 may be defined as a central island of the second connector 900 . The protrusion 912 may protrude more than the third surface 930 of the second housing 910 in the Z-axis direction, which is the first direction. The protrusion 912 may form an inner shield 914 of the second connector 900 . The inner shield 914 may block interference between signals transmitted through the plurality of signal terminals 913 . The inner shield 914 may be made of a conductive material.

In an embodiment, the shielding member 920 may constitute at least a portion of the fourth surface 940 . The shielding member 920 may be made of a conductive material. The shielding member 920 may block electromagnetic effects applied to the outside of the second connector 900 by signals transmitted through the plurality of signal terminals 913 . The shielding member 920 may include an outer shield 921 and a contact portion 922 .

In an embodiment, the outer shield 921 may extend along the fourth surface 940 . The outer shield 921 may extend in the Y-axis direction along a long edge of the fourth surface 940 .

In an embodiment, the contact portion 922 may extend from both ends of the outer shield 921 . The contact portion 922 may extend in the X-axis direction along the short edge of the fourth surface 940 . The contact portion 922 may extend toward the protrusion 912 .

In an embodiment, the second connector 900 may be disposed on the second printed circuit board 1110 . The second printed circuit board 1110 may be a rigid board. The second connector 900 may transmit at least one signal belonging to the first frequency band and/or the second frequency band.

12 is a connector in which the first connector 600 and the second connector 900 are coupled according to an embodiment (eg, a plurality of connectors 551 , 552 , 553 , 554 , 555 , 556 , 557 of FIG. 5 , 558)) is a diagram 1200 .

In an embodiment, the ground terminal 610 may contact the protrusion 912 and the shielding member 920 . The ground terminal 610 may enter the -Z-axis direction to be coupled to the protrusion 912 and the shielding member 920 . When the plug-in first connector 600 and the second connector 900 serving as a receptacle are coupled, the ground terminal 610 on the plug side may contact the outer shield 921 and the protrusion 912 serving as the inner shield on the receptacle side.

In an embodiment, the first end 612 of the ground terminal 610 may be bent in the -Z-axis direction, which is the first direction, to contact the protrusion 912 . When the plug-in first connector 600 and the second connector 900 that is a receptacle are coupled, the first end 612 has a free end structure, so that it can be easily combined with the protrusion 912 .

In an embodiment, the edge of the second surface 640 of the ground terminal 610 may be in contact with the shielding member 920 of the fourth surface 940 . When the plug-in first connector 600 and the second connector 900, which is a receptacle, are coupled to each other, a ground terminal to prevent a gap from occurring between the short edge of the second surface 640 and the short edge of the fourth surface 940 The 610 and the shielding member 920 may be coupled.

In an embodiment, the contact portion 922 may be formed on the shielding member 920 of the fourth surface 940 . The contact portion 922 may be coupled to the ground terminal 610 . The outer shield 210 on the receptacle side may be coupled to the ground terminal 610 by the contact portion 922 .

13 shows a first printed circuit board 810 using a connector 1310 (eg, connectors 551 , 552 , 553 , 554 , 555 , 556 , 557 , 558 of FIG. 5 ) according to an embodiment. 2 is a diagram 1300 showing the combination with the printed circuit board 1110.

In an embodiment, the first printed circuit board 810 that is an FPCB may be coupled to a board-to-board using the second printed circuit board 1110 that is a PCB and a connector 1310 . The first printed circuit board 810 connects the second printed circuit board 1110 with other printed circuit boards and/or antenna modules (eg, the first to third antenna modules 531 , 532 , 533 of FIG. 5 ). can do it A signal of the first frequency band of the 5G mmWave band and/or the second frequency band of the 4G legacy or IF band may be transmitted to the second printed circuit board 1110 through the first printed circuit board 810 .

14 is a view 1400 illustrating a plurality of regions 1410 , 1420 , 1430 , and 1440 included in a cross section of a connector (eg, the connector 1310 of FIG. 13 ) according to an exemplary embodiment.

In an embodiment, a cross-section of the connector 1310 may be an XY-axis plane. The cross-section may be divided into a plurality of regions 1410 , 1420 , 1430 , and 1440 . The plurality of regions 1410 , 1420 , 1430 , and 1440 may include a first region 1410 , a second region 1420 , a third region 1430 , and a fourth region 1440 .

In an embodiment, the first region 1410 , the second region 1420 , the third region 1430 , and the fourth region 1440 may transmit different signals. Each of the first region 1410 , the second region 1420 , the third region 1430 , and the fourth region 1440 may transmit signals of different frequency bands. For example, the first region 1410 transmits a signal of a 5G mmWave band, the second region 1420 transmits a signal of an 11ay frequency band, and the third region 1430 is a signal of a 4G legacy frequency band. can be transmitted

In an embodiment, a plurality of signal lines for transmitting signals may be disposed inside the connector 1310 . The connector 1310 including the first connector 600 and the second connector 900 according to an embodiment has a first area 1410 , a second area 1420 , and a third area inside the connector 1310 . A shielding structure that separates the 1430 and the fourth region 1440 from each other may be implemented. The connector 1310 including the first connector 600 and the second connector 900 can reduce crosstalk that one signal line has on an adjacent signal line and/or interference between signal lines. there is.

In an embodiment, when the inside of the connector 1310 is shielded for each of the first region 1410 , the second region 1420 , the third region 1430 , and the fourth region 1440 , signals of different frequency bands may be transferred to the second printed circuit board (eg, the second printed circuit board 1110 of FIG. 11 ) through a single connector 1310 . Accordingly, it is possible to reduce the number of connectors 1310 required by the type of frequency band transmitted to the second printed circuit board 1110 . Also, an area in which the connector 1310 inside the second printed circuit board 1110 is mounted can be reduced.

15 illustrates a plurality of ports (Port 1, Port 2, Port 3, Port 4, Port 5, Port 6, Port 7, and Port included in a connector (eg, the connector 1310 of FIG. 13 ) according to an embodiment. 8, Port 9, Port 10, Port 11, Port 12, Port 13, Port 14, Port 15, Port 16) is a drawing 1500. 16 is a view 1600 showing transmittance according to frequency of the connector 1310 according to an embodiment.

In one embodiment, a plug 1520 may be coupled to the receptacle 1510 . The receptacle 1510 may have first to eighth ports (Port 1, Port 2, Port 3, Port 4, Port 5, Port 6, Port 7, and Port 8). The plug 1520 may have ninth to sixteenth ports (Port 9, Port 10, Port 11, Port 12, Port 13, Port 14, Port 15, and Port 16).

In an embodiment, the ports of the receptacle 1510 and the plug 1520 may be coupled to each other in a one-to-one correspondence with ports corresponding to each other. For example, the first port Port 1 of the receptacle 1510 may be coupled to the ninth port Port 9 of the plug 1520 . As another example, the second port Port 2 of the receptacle 1510 may be coupled to the tenth port Port 10 of the plug 1520 .

In an embodiment, transmittance between adjacent ports among ports of the receptacle 1510 and the plug 1520 may be measured for each frequency band. For example, the first port Port 1 of the receptacle 1510 and the thirteenth port Port 13 of the plug 1520 may belong to adjacent ports. When the transmittance between adjacent ports decreases, isolation performance may increase.

In one embodiment, in the case of the comparative example 1610, it can be confirmed that the transmittance is in the range of about -50 dB or more to about -40 dB or less in a frequency band of 10 GHz or more. On the other hand, in the case of the embodiment 1620 described in conjunction with FIGS. 6 to 13 , it can be confirmed that the transmittance is in the range of about -60 dB or more and about -50 dB or less in a frequency band of 10 GHz or more. In the case of the embodiment 1620, the isolation performance increases in a frequency band of 10 GHz or more, so that interference of a high-frequency band signal may be reduced.

17 is a diagram illustrating a first connector 1700 of a connector (eg, the connector 1310 of FIG. 13 ) according to another exemplary embodiment. 18 is a view 1800 illustrating a ground terminal 1710 and a plurality of signal terminals 620 of the first connector 1700 according to another exemplary embodiment.

In an embodiment, the first connector 1700 of the connector 1310 may have a plug structure. The first connector 1700 may enter in the +Z-axis direction to be combined with other structures.

In an embodiment, the first connector 1700 may include a ground terminal 1710 , a plurality of signal terminals 620 , and a first housing 1730 . The first housing 1730 may include a first surface 1731 and a second surface 1732 . The first surface 1731 may be a surface facing the Z-axis direction, which is the first direction. The second surface 1732 may be a surface facing the X-axis direction and/or the Y-axis direction, which is a second direction perpendicular to the first direction.

In an embodiment, the ground terminal 1710 may be formed on at least a portion of the first surface 1731 and at least a portion of the second surface 1732 of the first housing 1730 . The ground terminal 1710 may be made of a conductive material. The ground terminal 610 may include a first portion 611 , a second portion 613 , a third portion 1711 , and a fourth portion 1712 .

In an embodiment, the first portion 611 may be formed in a corner portion of the second surface 1732 of the first housing 1730 . The second portion 613 may be formed at a corner portion of the second surface 1732 of the first housing 1730 .

In an embodiment, the third portion 1711 may be formed on a long side of the first housing 1730 . The fourth portion 1712 may be formed on the long side of the first housing 1730 . The third portion 1711 and the fourth portion 1712 may be formed to face each other in the X-axis direction.

In an embodiment, the third portion 1711 and the fourth portion 1712 may be formed to electrically divide the first surface 1731 of the first housing 1730 . The third portion 1711 and the fourth portion 1712 may be formed to divide the first surface 1731 of the first housing 1730 in the X-axis direction.

In an embodiment, the plurality of signal terminals 620 may be formed along an XY plane that is a cross-section of the first connector 1700 . The plurality of signal terminals 620 may be distinguished from each other by the non-conductive member disposed on the second surface 1732 of the first housing 1730 .

In an embodiment, at least a portion of the second surface 1732 of the first housing 1730 may include a ground terminal 610 made of a conductive material. The ground terminal 610 may be disposed at an edge of the second surface 1732 of the first housing 1730 . A non-conductive member of the first housing 1730 may be disposed to surround a portion of the ground terminal 1710 and expose the remainder of the ground terminal 1710 when viewed in the first direction, the Z-axis direction.

In an embodiment, the first connector 1700 may be disposed on a first printed circuit board (eg, the first printed circuit board 810 of FIG. 8 ). The first printed circuit board 810 may be a flexible board. The first connector 1700 may transmit at least one signal belonging to the first frequency band and/or the second frequency band.

19 is a diagram illustrating a second connector 1900 of a connector (eg, the connector 1310 of FIG. 13 ) according to another embodiment. 20 is a view 2000 illustrating the second housing 910 and the shielding members 920 and 1910 of the second connector 1900 according to another exemplary embodiment.

In an embodiment, the second connector 1900 may have a receptacle structure. The second connector 900 has a groove structure oriented in the +Z-axis direction, and thus can accommodate a structure entering the second connector 1900 from the +Z-axis direction. The second connector 900 may include a second housing 910 and shielding members 920 and 1910 .

In one embodiment, the second housing 910 has a third surface 930 facing the Z-axis direction, which is a first direction, and at least one fourth surface ( 940) may be included. The third surface 930 may form a bottom surface of the second housing 910 . The fourth surface 940 may form a sidewall of the second housing 910 .

In an embodiment, the second housing 910 may include a side portion 911 , a protrusion 912 , and a plurality of signal terminals 913 .

In an embodiment, the side portion 911 may be formed at a corner portion of the fourth surface 940 of the second housing 910 . The protrusion 912 may be formed in the center of the cross-section of the second connector 1900 . The protrusion 912 may form an inner shield 914 of the second connector 900 . The inner shield 914 may block interference between signals transmitted through the plurality of signal terminals 913 . The inner shield 914 may be made of a conductive material.

In an embodiment, the shielding members 920 and 1910 may constitute at least a portion of the fourth surface 940 . The shielding members 920 and 1910 may be made of a conductive material. The shielding member 920 may block electromagnetic effects applied to the outside of the second connector 1900 by signals transmitted through the plurality of signal terminals 913 . The shielding members 920 and 1910 may include an outer shield 921 and contact portions 922 , 1911 and 1912 .

In an embodiment, the outer shield 921 may extend along the fourth surface 940 . The outer shield 921 may extend in the Y-axis direction along a long edge of the fourth surface 940 .

In an embodiment, the contact portions 922 , 1911 , and 1912 may extend from the inside of the fourth surface 940 of the second housing 910 forming the outer shield 921 . The contact portions 922 , 1911 , and 1912 may extend in the -X-axis direction from the longest edge among the inner sides of the fourth surface 940 . The contact portions 922 , 1911 , and 1912 may extend toward the center of the third surface of the second housing 910 .

In an embodiment, the second connector 1900 may be disposed on the second printed circuit board 1110 . The second printed circuit board 1110 may be a rigid board. The second connector 1900 may transmit at least one signal belonging to the first frequency band and/or the second frequency band.

21 is a view 2100 illustrating a connector (eg, the connector 1310 of FIG. 13 ) to which the first connector 1700 and the second connector 1900 are coupled according to another embodiment.

In an embodiment, the ground terminal 1710 may contact the shielding members 920 and 1910 . The ground terminal 1710 may enter the -Z-axis direction to be coupled to the shielding members 920 and 1910 . When the plug-in first connector 1700 and the second connector 1900 that is a receptacle are coupled, the ground terminal 1710 on the plug side may contact the outer shield 921 and the contact portions 922 , 1911 , and 1912 on the receptacle side. .

In an embodiment, the at least one ground terminal 1710 may be formed symmetrically with respect to the protrusion 912 . When the plug-in first connector 1700 and the second connector 1900 serving as a receptacle are coupled, the at least one first ground terminal 1710 may be coupled to correspond to the contact portions 922 , 1911 , and 1912 .

22 is a diagram 2200 illustrating transmittance according to frequency of a connector (eg, the connector 1310 of FIG. 13 ) according to an embodiment.

In an embodiment, a plug (eg, the plug 1520 of FIG. 15 ) may be coupled to a receptacle (eg, the receptacle 1510 of FIG. 15 ). The receptacle 1510 may have first to eighth ports (Port 1, Port 2, Port 3, Port 4, Port 5, Port 6, Port 7, and Port 8). The plug 1520 may have ninth to sixteenth ports (Port 9, Port 10, Port 11, Port 12, Port 13, Port 14, Port 15, and Port 16).

In an embodiment, the ports of the receptacle 1510 and the plug 1520 may be coupled to each other in a one-to-one correspondence with ports corresponding to each other. For example, the third port Port 3 of the receptacle 1510 may be coupled to the eleventh port Port 11 of the plug 1520 . As another example, the second port Port 2 of the receptacle 1510 may be coupled to the tenth port Port 10 of the plug 1520 .

In an embodiment, transmittance between adjacent ports among ports of the receptacle 1510 and the plug 1520 may be measured for each frequency band. For example, the third port Port 3 of the receptacle 1510 and the tenth port Port 10 of the plug 1520 may belong to adjacent ports. When the transmittance between adjacent ports decreases, isolation performance may increase.

In one embodiment, in the case of the comparative example 2210, it can be confirmed that the transmittance is in the range of about -40 dB or more to about -30 dB or less in a frequency band of 10 GHz or more. On the other hand, in the case of the embodiment 2220 described in conjunction with FIGS. 17 to 21 , it can be confirmed that the transmittance is in the range of about -50 dB or more to about -40 dB or less in a frequency band of 10 GHz or more. In the case of the embodiment 2220, the isolation performance increases in a frequency band of 10 GHz or more, so that interference of a high-frequency band signal may be reduced.

The electronic device according to various embodiments disclosed in this document may have various types of devices. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to the embodiment of the present document is not limited to the above-described devices.

It should be understood that the various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. As used herein, “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C” and “A, Each of the phrases "at least one of B, or C" may include any one of, or all possible combinations of, items listed together in the corresponding one of the phrases. Terms such as “first”, “second”, or “first” or “second” may simply be used to distinguish the component from other such components, and refer to those components in other aspects (e.g., importance or order) is not limited. that one (eg first) component is “coupled” or “connected” to another (eg, second) component with or without the terms “functionally” or “communicatively” When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.

As used herein, the term “module” may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as, for example, logic, logic block, component, or circuit. A module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document include one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101). may be implemented as software (eg, the program 140) including For example, the processor (eg, the processor 120 ) of the device (eg, the electronic device 101 ) may call at least one of one or more instructions stored from a storage medium and execute it. This makes it possible for the device to be operated to perform at least one function according to the at least one command called. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (eg, electromagnetic wave), and this term refers to the case where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.

According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. Computer program products may be traded between sellers and buyers as commodities. The computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play Store™) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly, online between smartphones (eg: smartphones). In the case of online distribution, at least a part of the computer program product may be temporarily stored or temporarily created in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.

According to various embodiments, each component (eg, a module or a program) of the above-described components may include a singular or a plurality of entities. According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. or one or more other operations may be added.

Claims (20)

In an electronic device,
a first printed circuit board transmitting a first signal belonging to a first frequency band that is a designated frequency band;
a second printed circuit board including a first communication circuit for processing the first signal; and
a connector connecting the first printed circuit board and the second printed circuit board, wherein the connector comprises:
a first connector disposed on the first printed circuit board and including a first housing including a first surface facing a first direction and at least one second surface facing a second direction perpendicular to the first direction ; and
a second housing disposed on the second printed circuit board, the second housing including a third surface facing the first direction and at least one fourth surface facing the second direction, at least a portion of the third surface includes a second connector that faces the first direction and includes a protrusion made of a conductive material, and at least a portion of the fourth surface includes a shielding member made of a conductive material,
a ground terminal made of a conductive material is integrally formed on at least a portion of the first surface and at least a portion of the second surface;
The ground terminal is in contact with the protrusion and the shielding member. The method according to claim 1,
The first printed circuit board is a flexible printed circuit board that connects the antenna for transmitting and receiving the one or more signals and the second printed circuit board,
The second printed circuit board is a rigid printed circuit board. The method according to claim 1,
The first frequency band is about 20 GHz or more and about 60 GHz or less. The method according to claim 1,
Further comprising a third printed circuit board comprising a second communication circuit for processing a signal of a second frequency band different from the first frequency band,
The first printed circuit board connects the second printed circuit board and the third printed circuit board to each other,
The connector connects between the first printed circuit board and the third circuit board. 5. The method according to claim 4,
The second frequency band is greater than or equal to about 2 GHz and less than or equal to about 18 GHz. The method according to claim 1,
the first connector is a plug,
and the second connector is a receptacle. The method according to claim 1,
The ground terminal includes a first portion formed in a corner portion of the second surface and a second portion formed in a corner portion of the second surface,
The first part and the second part are integrally formed in an electronic device. The method according to claim 1,
The ground terminal includes a first end formed on the first surface, and the first end is a free end bent in the first direction to contact the protrusion of the second connector. A connector for connecting a first printed circuit board and a second printed circuit board of an electronic device, the connector comprising:
A first housing including a first surface facing a first direction and at least one second surface facing a second direction perpendicular to the first direction, wherein at least a portion of the first housing is a ground made of a conductive material a first connector including a terminal; and
a second housing including a third surface facing the first direction and at least one fourth surface facing the second direction, wherein at least a portion of the third surface faces the first direction and is made of a conductive material a second connector including a protrusion and at least a portion of the fourth surface including a shielding member made of a conductive material;
The ground terminal of the first connector is in contact with the protrusion and the shielding member of the second connector. 10. The method of claim 9,
The ground terminal includes a first portion formed on at least a portion of the first surface and a second portion formed on at least a portion of the second surface,
The first part and the second part are integrally formed with a connector. 10. The method of claim 9,
The ground terminal includes a first end formed on the first surface, and the first end is a free end bent in the first direction to contact the protrusion of the second connector. 10. The method of claim 9,
the ground terminal is disposed on edges of the first surface and the second surface;
and a non-conductive member of the first housing is disposed so as to surround a portion of the ground terminal and expose the remainder of the ground terminal when viewed from the first direction. 10. The method of claim 9,
The protrusion of the second connector is a ground layer protruding from the third surface of the second housing in the first direction. 10. The method of claim 9,
an edge of the second surface of the ground terminal is in contact with the shielding member of the fourth surface. 10. The method of claim 9,
A contact portion for coupling with the ground terminal is formed on the shielding member of the fourth surface. A connector for connecting a first printed circuit board and a second printed circuit board of an electronic device, the connector comprising:
a first housing including a first surface facing a first direction and at least one second surface facing a second direction perpendicular to the first direction, wherein at least a portion of the second surface is made of a conductive material a first connector including one ground terminal; and
a second housing including a third surface facing the first direction and at least one fourth surface facing the second direction, wherein at least a portion of the fourth surface includes a shielding member made of a conductive material 2 connectors,
the shielding member includes at least one contact portion at a position corresponding to the at least one ground terminal of the first connector in the first direction;
The at least one ground terminal of the first connector is in contact with the at least one contact portion of the second connector. 17. The method of claim 16,
At least a portion of the third surface includes a protrusion facing the first direction,
The at least one ground terminal is formed symmetrically with respect to the protrusion. 17. The method of claim 16,
The at least one ground terminal is formed to electrically divide the first surface. 17. The method of claim 16,
The at least one contact portion protrudes inwardly of the fourth surface of the connector. 17. The method of claim 16,
The at least one contact portion is formed to face the center of the third surface.

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