CN206559719U - It is a kind of to increase the pcb board structure of Surface Mount welding disking area impedance - Google Patents
It is a kind of to increase the pcb board structure of Surface Mount welding disking area impedance Download PDFInfo
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- CN206559719U CN206559719U CN201720138002.6U CN201720138002U CN206559719U CN 206559719 U CN206559719 U CN 206559719U CN 201720138002 U CN201720138002 U CN 201720138002U CN 206559719 U CN206559719 U CN 206559719U
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- knockout
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- pad
- pcb board
- impedance
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Abstract
The utility model discloses a kind of pcb board structure of increase Surface Mount welding disking area impedance in field of circuit boards, pcb board includes some signals layers, signals layer is provided with some pads, and pad connection HW High Way, the signals layer adjacent with pad is provided with adjacent layer area of knockout.The utility model adds the impedance of pad position, is close to the impedance of signal wire, so that the problem of reducing the various signal integrities brought due to impedance mismatch.
Description
Technical field
The utility model is related to circuit board technology field, specifically, is to be related to a kind of increase Surface Mount welding disking area impedance
Pcb board structure.
Background technology
Printed circuit board（Printed Circuit Board, pcb board）Also known as printed circuit board (PCB).Printed substrate is electricity
The important component of physical support and the signal transmission of sub- product.Because high speed 10G or 20G signal are more sensitive in itself,
So impedance mismatch can have a huge impact to high speed, and then produce the various signal integrities brought due to impedance mismatch
Sex chromosome mosaicism.It is what is be connected by the pad on pcb that HW High Way is connected with device on pcb.Because high speed signal signal
It is that impedance is consistent on the path of signal wire, but has arrived the position of pad, because pad is relatively wide, but reference planes and letter
The reference planes of number line are consistent, and the position impedance that so may result in high-speed line in pad is relatively low, and resistance thus occurs
Resist unmatched problem, influence can be produced on HW High Way, and then influence the integrality of signal.
Drawbacks described above, is worth improving.
The content of the invention
In order to overcome the shortcomings of existing technology, the utility model provides a kind of PCB of increase Surface Mount welding disking area impedance
Hardened structure.
Technical solutions of the utility model are as described below：
It is a kind of to increase the pcb board structure of Surface Mount welding disking area impedance, it is characterised in that pcb board includes some signals layers, institute
Signals layer is stated provided with some pads, the pad is connected to be set on HW High Way, the signals layer adjacent with the pad
There is adjacent layer area of knockout.
According to the utility model of such scheme, it is characterised in that the size of the adjacent layer area of knockout and the weldering
The size of disk is identical.
According to the utility model of such scheme, it is characterised in that the letter of the adjacent layer area of knockout opposite side
Number floor is provided with phase interlayer area of knockout, is spaced the adjacent layer between the phase interlayer area of knockout and the pad and hollows out area
Domain.
Further, the size of the phase interlayer area of knockout and the size of the adjacent layer area of knockout with the weldering
The size of disk is identical.
According to the utility model of such scheme, its advantage is, the utility model adds pad position
Impedance, the impedance of signal wire is close to, so as to reduce asking due to the various signal integrities that impedance mismatch is brought
Topic.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
In figure, 1, pad；2nd, adjacent layer area of knockout；3rd, HW High Way；4th, adjacent layer reference planes.
Embodiment
Below in conjunction with the accompanying drawings and the utility model is further described embodiment：
As shown in figure 1, a kind of increase the pcb board structure of Surface Mount welding disking area impedance, pcb board includes some signals layers, letter
Number floor is provided with some pads 1, and the connection HW High Way 3 of pad 1, the signals layer adjacent with pad 1 is hollowed out provided with adjacent layer
Region 2, allows the position of pad 1 to go to refer to adjacent layer reference planes 4, the impedance of such position of pad 1 will be uprised, is more nearly
The impedance of HW High Way 3, so that the problem of reducing the various signal integrities brought due to impedance mismatch.
It is preferred that, the size of adjacent layer area of knockout 2 is identical with the size of pad.
In other embodiments, the signals layer of the opposite side of adjacent layer area of knockout 2 is provided with phase interlayer area of knockout（In figure
It is not shown, similarly hereinafter）, adjacent layer area of knockout 2 is spaced between phase interlayer area of knockout and pad 1, allows the position of pad 1 to go reference
Phase interlayer reference planes.
It is preferred that, the size phase of the size of phase interlayer area of knockout and the size of adjacent layer area of knockout 2 with pad 1
Together.
It should be appreciated that for those of ordinary skills, can according to the above description be improved or converted,
And all these modifications and variations should all belong to the protection domain of the utility model appended claims.
Exemplary description is carried out to the utility model patent above in conjunction with accompanying drawing, it is clear that the reality of the utility model patent
Now it is not subject to the restrictions described above, as long as the method for employing the utility model patent conceives various with technical scheme progress
Improve, or it is not improved the design of the utility model patent and technical scheme are directly applied into other occasions, in this reality
With in new protection domain.
Claims (4)
1. a kind of increase the pcb board structure of Surface Mount welding disking area impedance, it is characterised in that pcb board includes some signals layers, described
Signals layer is provided with some pads, and the pad connects HW High Way, and the signals layer adjacent with the pad is provided with
Adjacent layer area of knockout.
2. the pcb board structure of increase Surface Mount welding disking area impedance according to claim 1, it is characterised in that described adjacent
The size of layer area of knockout is identical with the size of the pad.
3. the pcb board structure of increase Surface Mount welding disking area impedance according to claim 1, it is characterised in that described adjacent
The signals layer of layer area of knockout opposite side is provided with phase interlayer area of knockout, the phase interlayer area of knockout and the pad
Between be spaced the adjacent layer area of knockout.
4. the pcb board structure of increase Surface Mount welding disking area impedance according to claim 3, it is characterised in that described to be separated by
The size of layer area of knockout and the size of the adjacent layer area of knockout are identical with the size of the pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720138002.6U CN206559719U (en) | 2017-02-16 | 2017-02-16 | It is a kind of to increase the pcb board structure of Surface Mount welding disking area impedance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720138002.6U CN206559719U (en) | 2017-02-16 | 2017-02-16 | It is a kind of to increase the pcb board structure of Surface Mount welding disking area impedance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206559719U true CN206559719U (en) | 2017-10-13 |
Family
ID=60011148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720138002.6U Active CN206559719U (en) | 2017-02-16 | 2017-02-16 | It is a kind of to increase the pcb board structure of Surface Mount welding disking area impedance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206559719U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108549756A (en) * | 2018-04-02 | 2018-09-18 | 郑州云海信息技术有限公司 | Checked in a kind of placement-and-routing high-speed line across island method and system |
| WO2020078432A1 (en) * | 2018-10-17 | 2020-04-23 | 青岛海信宽带多媒体技术有限公司 | Circuit board and optical module |
| CN114364142A (en) * | 2021-12-17 | 2022-04-15 | 苏州浪潮智能科技有限公司 | PCB design method and device for increasing surface impedance and PCB |
-
2017
- 2017-02-16 CN CN201720138002.6U patent/CN206559719U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108549756A (en) * | 2018-04-02 | 2018-09-18 | 郑州云海信息技术有限公司 | Checked in a kind of placement-and-routing high-speed line across island method and system |
| WO2020078432A1 (en) * | 2018-10-17 | 2020-04-23 | 青岛海信宽带多媒体技术有限公司 | Circuit board and optical module |
| US11589458B2 (en) | 2018-10-17 | 2023-02-21 | Hisense Broadband Multimedia Technologies Co., Ltd. | Circuit board and optical module |
| CN114364142A (en) * | 2021-12-17 | 2022-04-15 | 苏州浪潮智能科技有限公司 | PCB design method and device for increasing surface impedance and PCB |
| CN114364142B (en) * | 2021-12-17 | 2023-08-11 | 苏州浪潮智能科技有限公司 | PCB design method and device for increasing surface impedance and PCB |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information |
Inventor after: Qu Haiyu Inventor after: Li Qinghai Inventor after: Wang Canzhong Inventor before: Qu Haipeng Inventor before: Li Qinghai Inventor before: Wang Canzhong |
|
| CB03 | Change of inventor or designer information | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000, 12H-12I, 12th Floor, Kangjia Research Building, 28 Science and Technology South 12 Road, Nanshan District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Yibo Science and Technology Co., Ltd. Address before: 518000, 12H-12I, 12th Floor, Kangjia Research Building, 28 Science and Technology South 12 Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Yi Bo Science and Technology Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: 11F, Metro financial technology building, 9819 Shennan Avenue, Shenda community, Yuehai street, Nanshan District, Shenzhen, Guangdong 518000 Patentee after: EDADOC Co.,Ltd. Address before: 518000, 12H-12I, 12th Floor, Kangjia Research Building, 28 Science and Technology South 12 Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: EDADOC Co.,Ltd. |
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| CP02 | Change in the address of a patent holder |