CN203722923U - Pcb - Google Patents
Pcb Download PDFInfo
- Publication number
- CN203722923U CN203722923U CN201420073776.1U CN201420073776U CN203722923U CN 203722923 U CN203722923 U CN 203722923U CN 201420073776 U CN201420073776 U CN 201420073776U CN 203722923 U CN203722923 U CN 203722923U
- Authority
- CN
- China
- Prior art keywords
- pcb board
- pcb
- copper layer
- hole
- layer pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052802 copper Inorganic materials 0.000 claims abstract description 64
- 239000010949 copper Substances 0.000 claims abstract description 64
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 63
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 238000001465 metallisation Methods 0.000 claims description 11
- 230000005855 radiation Effects 0.000 claims description 7
- 238000005553 drilling Methods 0.000 abstract description 18
- 238000000034 method Methods 0.000 abstract description 6
- 230000007547 defect Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 12
- 238000005516 engineering process Methods 0.000 description 8
- 238000013461 design Methods 0.000 description 7
- 230000001055 chewing effect Effects 0.000 description 5
- 230000002950 deficient Effects 0.000 description 5
- 235000015111 chews Nutrition 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 241001074085 Scophthalmus aquosus Species 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010358 mechanical oscillation Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
Abstract
The utility model discloses a PCB comprising a PCB substrate. The PCB substrate is provided with drilled metallized via holes and undrilled unmetallized via holes. The PCB is characterized in that the PCB substrate further comprises a copper layer bonding pad, wherein the copper layer bonding pad covers the surface of the PCB substrate at positions of the undrilled unmetallized via holes. According to the utility model, through the unmetallized via hole copper covering method, the secondary drilling hole popping and hole edge defect phenomenons can be eliminated without reducing the heat resistance of the PCB substrate.
Description
Technical field
The utility model relates to circuit connecting mechanism, especially, relates to a kind of pcb board.
Background technology
Printed circuit board (PCB) (Printed Circuit Board, hereafter is PCB) is one of vitals of electronics industry, for electronic devices and components are electrical connected.The scope of application of PCB is extensive, and nearly all electronic equipment that comprises the electronic devices and components such as integrated circuit all will use pcb board.In electronic product, the design of pcb board and the level of manufacture are the basic reasons that determines its Product Level, and its Design and manufacture quality directly determines quality and the cost of product.
The developing direction of pcb board is to multiple stratification, multifunction at present, and multi-layer PCB board needs repeatedly reprocessabilty under hot environment, and this makes the baseplate material of pcb board should have better thermal endurance.With surface group subsides technology (Surface Mount Technology, referred to as SMT), cold metal transfer solder technology (Cold Metal Transfer, referred to as CMT) be appearance and the development of the high-density installation technology of representative, make PCB in small-bore, the more support of high-fire resistance of the further demand substrate of technology of the aspect such as circuit becomes more meticulous, slimming.The solution of currently available technology is by changing PCB baseplate material, improving the thermogravimetric value of PCB substrate, thereby improves the heat resistance of pcb board.
In the process that PCB produces, need to hole to pcb board, the hole of boring for connecting circuit between layers, locate electricity piece, locate components and parts to be installed, heat radiation etc.Via hole is divided into needs metallization and does not need to metallize two kinds, for not needing metallized hole (as screw hole, location hole, heat radiation slotted eye), the mode of use metallization via hole together brill can make non-metallic via hole together metallize, and may cause accidental short circuit; Metallize the cost of via hole on the other hand far above non-metallic via hole.The mode of taking in prior art is for after metallized hole drilling and metallization, and non-metallic via hole is bored in boring for the second time again.
Yet along with the thermogravimetric value of PCB substrate improves, the mechanical elasticity of baseplate material and ductility can reduce along with reprocessabilty, are embodied in substrate and become fragile.Add man-hour pcb board is carried out to secondary drilling, probably cause the damaged phenomenon of blast hole and limit, hole of secondary drilling, caused the percent defective of producing to improve, also increased the design and manufacture difficulty of pcb board simultaneously.
For pcb board, carry out secondary drilling and add the damaged problem of blast hole and limit, hole that causes secondary drilling man-hour, not yet have at present effective solution.
Utility model content
For pcb board in correlation technique, carry out secondary drilling and add the damaged problem of blast hole and limit, hole that causes secondary drilling man-hour, the purpose of this utility model is to propose a kind of pcb board, this pcb board is adding man-hour, can not reduce under the stable on heating condition of PCB substrate, eliminate the damaged phenomenon of blast hole and limit, hole of secondary drilling, effectively reduce the percent defective in production, also reduced design and the manufacture difficulty of pcb board.
Based on above-mentioned purpose, the technical scheme that the utility model provides is as follows:
According to an aspect of the present utility model, a kind of pcb board is provided, comprise PCB substrate, on PCB substrate, have and complete the metallization via hole of boring and the non-metallic via hole of not yet holing, on PCB substrate, also comprise copper layer pad, copper layer pad is overlying on PCB substrate surface, not yet the non-metallic hole site of crossing of boring.
Wherein, the flat shape of copper layer pad is circle or rectangle.
And the flat shape of copper layer pad is circular.
And the diameter of copper layer pad is less than the diameter of non-metallic via hole, the absolute value of the difference of the two is less than or equal to 4mil.
Wherein, the copper thickness that covers of copper layer pad is at least 1/3 ounce.
The non-metallic via hole of above-mentioned PCB substrate can be one or more in location hole, heat radiation slotted eye, counterbore.
Above-mentioned PCB substrate can be one or more in common thermogravimetric value substrate, middle thermogravimetric value substrate, high thermogravimetric value substrate.
Above-mentioned pcb board can be individual layer pcb board, double-layer PCB board or multi-layer PCB board.
Also there is prebored hole in the non-metallic via hole place that not yet completes boring on above-mentioned PCB substrate.
The flat shape of aforementioned prebored hole and copper layer pad is circle, and prebored hole diameter is less than copper layer pad diameter, and copper layer pad diameter is less than the intended diameter of non-metallic via hole
As can be seen from above, the technical scheme that the utility model provides is by covering the mode of copper to non-metallic via hole, can not reduce under the stable on heating condition of PCB substrate, eliminate the damaged phenomenon of blast hole and limit, hole of secondary drilling, effectively reduce the percent defective in production, also reduced the problem of the design and manufacture difficulty of pcb board.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to the accompanying drawing of required use in embodiment be briefly described below, apparently, accompanying drawing in the following describes is only embodiment more of the present utility model, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the planar structure graph of a relation according to the pcb board of the utility model embodiment;
Fig. 2 is the non-metallic via hole distribution schematic diagram of pcb board in prior art;
Fig. 3 is for to cover copper position view according to the non-metallic via hole of the pcb board of the utility model embodiment;
Fig. 4 is according to the planar structure graph of a relation of the pcb board that has prebored hole of the utility model embodiment;
Fig. 5 is for to cover copper and prebored hole position view according to the non-metallic via hole of the pcb board that has prebored hole of the utility model embodiment.
Embodiment
For making the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with the accompanying drawing in the utility model embodiment, to the technical scheme in the utility model embodiment further carry out clear, complete, describe in detail, obviously, described embodiment is only the utility model part embodiment, rather than whole embodiment.Embodiment based in the utility model, the every other embodiment that those of ordinary skills obtain, belongs to the scope that the utility model is protected.
According to embodiment of the present utility model, a kind of pcb board is provided, comprise PCB substrate 10, as shown in Figure 1, on PCB substrate 10, there are the metallization via hole 11 and the non-metallic via hole 12 of not yet holing that complete boring.
Pcb board illustrated in fig. 1 is characterised in that, also comprises copper layer pad 13 on PCB substrate 10, and copper layer pad 13 is overlying on PCB substrate 10 surfaces, not yet non-metallic via hole 12 positions of boring.When the existence of copper layer pad 13 makes secondary drilling, boring the lower cutter point of chewing is copper layer pad 13 surfaces with thermal conductive resin, does not directly contact PCB baseplate material 10.This technological means effectively reduces to bore chews mechanical oscillation and the impact of frictional heat on PCB baseplate material 10 physical propertys in the course of the work, reduce the damage of secondary drilling to PCB baseplate material 10, and then eliminated the damaged phenomenon of blast hole and limit, hole of secondary drilling.
Shown in Fig. 2 is the non-metallic via hole distribution map of pcb board in prior art.As previously mentioned, in prior art, non-metallic via hole is not carried out to more technological means processing.And carried out covering copper according to the non-metallic via hole of the pcb board of the utility model embodiment, process, as contrasting with the pore size distribution of crossing shown in Fig. 2, the covering copper position and can illustrate as shown in Figure 3 of its correspondence.
Wherein, the flat shape of copper layer pad should be consistent with the flat shape of non-metallic via hole to be bored, the flat shape of non-metallic via hole can be circle or rectangle, therefore the flat shape of copper layer pad can be also circle or rectangle.Especially, consider that general non-metallic via hole mostly is the circular ports such as location hole, heat radiation slotted eye, counterbore, and for function is not subject to non-metallic via hole that its shape affects, shape should be advisable with the circle of optimum processing, therefore the flat shape of copper layer pad can be circular for wanting.
Copper layer pad should have and meet size need of production, that determine scope.With circular copper layer pad, its diameter l should be less than the diameter l of non-metallic via hole
0, the absolute value of the difference of two diameters should be less than or equal to 4mil, that is, and and l ∈ (l
0-4mil, l
0).The too small coverage density that can reduce copper layer pad of l, reduces to bore and chews the probability that lower cutter touches copper layer pad, has improved technology difficulty and percent defective; The excessive copper layer pad that can make of l still left over to some extent after boring, and this leaving over may cause pcb board partial circuit to occur short circuit phenomenon, cannot normally use.The conclusion drawing in actual production is, l ∈ (l
0-4mil, l
0) be between the optimal zone of copper layer pad diameter.
The copper thickness that covers of copper layer pad is at least 1/3 ounce.Copper layer pad must guarantee that the thickness of at least 1/3 ounce completely cuts off brill and chews the baseplate material with PCB, and excessively thin copper layer pad do not have physically to alleviate and bore the effect of chewing longitudinal vibrations, lacks heat-sinking capability yet, cannot reach the object of protection.It is pointed out that owing to covering copper thickness and have minimum value, copper layer pad and PCB baseplate material have local height drop, and this drop may cause boring the job insecurity of chewing; Should before secondary drilling, to copper layer pad, carry out smooth processing, make that copper layer bond pad surface is smooth is easy to lower cutter, copper layer pad edge and PCB baseplate material are smooth, improve the stability of boring the work of chewing.
This copper layer pad can directly be outpoured with the form of pad in when design by PCB, and the corrosion step of producing at pcb board retains, and does not need again to cover copper, can save production cost and complexity.
The non-metallic via hole of above-mentioned PCB substrate comprises one or more in location hole, heat radiation slotted eye, counterbore.Location hole, heat radiation slotted eye, counterbore all do not need to electrically conduct, therefore do not need metallization, at secondary drilling, cross into middle boring.
Above-mentioned PCB substrate comprises one or more in common thermogravimetric value substrate, middle thermogravimetric value substrate, high thermogravimetric value substrate.
Above-mentioned pcb board comprises one or more in individual layer pcb board, double-layer PCB board, multi-layer PCB board.
Also there is prebored hole in the non-metallic via hole place that not yet completes boring on above-mentioned PCB substrate.
The flat shape of aforementioned prebored hole and copper layer pad is circle, and prebored hole diameter is less than copper layer pad diameter, and copper layer pad diameter is less than the intended diameter of non-metallic via hole
As shown in Figure 4, on PCB substrate 10, there is the metallization via hole 11 and the non-metallic via hole 12 of not yet holing that completes boring.Pcb board illustrated in fig. 4 is characterised in that, there is prebored hole 14 in non-metallic via hole 12 places that not yet complete boring on PCB substrate 10, wherein, on PCB substrate 10, also comprise copper layer pad 13, copper layer pad 13 is overlying on PCB substrate 10 surfaces, non-metallic via hole 12 positions of holing not yet completely, and prebored hole 14 is circle with the flat shape of copper layer pad 13, prebored hole 14 diameters are less than copper layer pad 13 diameters, and copper layer pad 13 diameters are less than the intended diameter of non-metallic via hole 12.
Non-metallic via hole covers prebored hole position view after copper as shown in Figure 5.This pcb board is except completing the boring of metallization via hole when once holing, and the while has also been carried out prebored hole at the bore position of non-metallic via hole.First, in once holing, prebored hole is regarded as metallizing via hole and holes, and metallization via hole does not exist and bores the phenomenon of chewing damage PCB substrate in boring; Secondly, prebored hole and the same metalized of having passed through of metallization via hole, when secondary drilling, existing copper layer pad in the hole of PCB substrate, does not need again to cover copper.
In sum, by means of technique scheme of the present utility model, by using copper layer pad to cover the non-metallic hole surface of crossing that PCB baseplate material is not yet holed, make to bore to chew to be reduced in the impact on the physical vibration of PCB baseplate material and heat generation in secondary drilling process, reduce the damage effect of PCB baseplate material, do not reducing under the stable on heating condition of PCB substrate, eliminated the damaged phenomenon of blast hole and limit, hole of secondary drilling, effectively reduce the percent defective in production, also reduced the problem of the design and manufacture difficulty of pcb board.
Those of ordinary skill in the field are to be understood that: the foregoing is only specific embodiment of the utility model; be not limited to the utility model; all within spirit of the present utility model and principle; any modification of making, be equal to replacement, improvement etc., within all should being included in protection range of the present utility model.
Claims (10)
1. a pcb board, comprises PCB substrate, has and complete the metallization via hole of boring and the non-metallic via hole of not yet holing on PCB substrate, it is characterized in that, on described PCB substrate, also comprise copper layer pad, described copper layer pad is overlying on PCB substrate surface, not yet the non-metallic hole site of crossing of boring.
2. a kind of pcb board according to claim 1, is characterized in that, the flat shape of described copper layer pad is circle or rectangle.
3. a kind of pcb board according to claim 2, is characterized in that, the flat shape of described copper layer pad is circular.
4. a kind of pcb board according to claim 3, is characterized in that, the diameter of described copper layer pad is less than the diameter of described non-metallic via hole, and the absolute value of the difference of the two is less than or equal to 4mil.
5. a kind of pcb board according to claim 1, is characterized in that, the copper thickness that covers of described copper layer pad is more than or equal to 1/3 ounce.
6. according to a kind of pcb board described in any one in claim 1-5, it is characterized in that, the non-metallic via hole of described PCB substrate comprise following one of at least: location hole, heat radiation slotted eye, counterbore.
7. according to a kind of pcb board described in any one in claim 1-5, it is characterized in that, described PCB substrate is for below one of at least: common thermogravimetric value substrate, middle thermogravimetric value substrate, high thermogravimetric value substrate.
8. according to a kind of pcb board described in any one in claim 1-5, it is characterized in that, described pcb board is for below one of at least: individual layer pcb board, double-layer PCB board, multi-layer PCB board.
9. according to a kind of pcb board described in any one in claim 1-5, it is characterized in that, also there is prebored hole in the non-metallic via hole place that not yet completes boring on described PCB substrate.
10. a kind of pcb board according to claim 9, is characterized in that, the flat shape of described prebored hole and copper layer pad is circle, and prebored hole diameter is less than copper layer pad diameter, and copper layer pad diameter is less than the intended diameter of non-metallic via hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420073776.1U CN203722923U (en) | 2014-02-20 | 2014-02-20 | Pcb |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420073776.1U CN203722923U (en) | 2014-02-20 | 2014-02-20 | Pcb |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203722923U true CN203722923U (en) | 2014-07-16 |
Family
ID=51162039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420073776.1U Expired - Lifetime CN203722923U (en) | 2014-02-20 | 2014-02-20 | Pcb |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203722923U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108541139A (en) * | 2018-03-31 | 2018-09-14 | 深圳市实锐泰科技有限公司 | A kind of PCB via holes production method and PCB |
| CN113099613A (en) * | 2021-03-29 | 2021-07-09 | 福建福强精密印制线路板有限公司 | Secondary drilling explosion-proof method for circuit board |
| CN116997083A (en) * | 2023-08-02 | 2023-11-03 | 清远市富盈电子有限公司 | Manufacturing method of special-shaped board edge PCB and PCB manufactured by manufacturing method |
-
2014
- 2014-02-20 CN CN201420073776.1U patent/CN203722923U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108541139A (en) * | 2018-03-31 | 2018-09-14 | 深圳市实锐泰科技有限公司 | A kind of PCB via holes production method and PCB |
| CN108541139B (en) * | 2018-03-31 | 2020-04-17 | 深圳市实锐泰科技有限公司 | PCB (printed circuit board) via hole manufacturing method and PCB |
| CN113099613A (en) * | 2021-03-29 | 2021-07-09 | 福建福强精密印制线路板有限公司 | Secondary drilling explosion-proof method for circuit board |
| CN116997083A (en) * | 2023-08-02 | 2023-11-03 | 清远市富盈电子有限公司 | Manufacturing method of special-shaped board edge PCB and PCB manufactured by manufacturing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140716 |
|
| CX01 | Expiry of patent term |