CN107787129A - Printed circuit board (PCB) metallized semi processing method of through holes - Google Patents
Printed circuit board (PCB) metallized semi processing method of through holes Download PDFInfo
- Publication number
- CN107787129A CN107787129A CN201610789465.9A CN201610789465A CN107787129A CN 107787129 A CN107787129 A CN 107787129A CN 201610789465 A CN201610789465 A CN 201610789465A CN 107787129 A CN107787129 A CN 107787129A
- Authority
- CN
- China
- Prior art keywords
- hole
- pcb
- circuit board
- printed circuit
- intersection point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention provides a kind of printed circuit board (PCB) metallized semi processing method of through holes.Printed circuit board (PCB) metallized semi processing method of through holes provided by the invention discloses a kind of method for processing half-via by secondary positive back-drilling, PCB reverse side are first placed the first intersection point layers of copper of cut-out by methods described, again by PCB front place cut-out the second intersection point layers of copper, after to PCB through row gong profile.This method can effectively remove half bore peak, improve the problem of half bore peak is brought, and improve product yield.
Description
Technical field
The present invention relates to printed circuit board (PCB) (Printed Circuit Board, PCB) manufacturing field, especially, it is related to one
The printed circuit board (PCB) metallized semi processing method of through holes that kind passes through secondary positive and negative drill method.
Background technology
With flourishing for electronic industry, electronic product is constantly toward light, thin, short, small development, and PCB is i.e. towards highly dense
Degree wiring interconnection (HDI：Hihg Density Interconnection) process-technology-evolutions so that can be smaller in PCB
Space in more functions are provided.
Via hole, refer to the hole that conductive interconnection purposes between layers is only used as on multilayer circuit board, be typically no longer used to
The slotting weldering of component pins.This pores, last layer copper is plated in hole by " heavy copper " process, to conduction.The via hole has through complete
" all-pass hole " (the Through Via Hole) of plate, there are " blind via hole " (the Blind Via for directly passing to plate face and not extending completely through
Hole), have and do not connected " burying through hole " (Buried Via Hole) for being but imbedded in inside sheet material etc. with plate face.It is such complicated
Local through hole, completed with gradually connecting made by pressing method.
The one kind of half-via as via hole, not only retained the conducting function of foramen primum but also be welded and fixed with half bore hole wall,
The effect of realizing the structure higher intensity retaining element by straightforward procedure, current many wiring boards need some semi-metals
Hole and U-shaped plated through-hole.Welding of the copper wire and burr that hole wall after half-via shaping is remained in hole in the SMT producers in downstream
During, easily occur solder joint loosely, rosin joint, bridge joint it is short-circuit the problems such as, therefore semi-metal hole copper sheet tilt and burr one
As do not received by the IQC of most SMT producers.
The content of the invention
The copper wire and the technical problem of burr that hole wall is remained in hole when being processed for prior art half-via, the present invention carry
For a kind of printed circuit board (PCB) metallized semi processing method of through holes, comprise the following steps：The printing electricity for the trim line that completes is provided
Road plate, on the trim line of the printed circuit board (PCB) carry out first time drilling, formed first through hole, the first through hole with it is described
Trim line includes the first intersection point and the second intersection point；
To carrying out heavy copper in the hole of the first through hole；
The printed circuit board (PCB) reverse side is placed and second of drilling is carried out to it, forms the second through hole, described first hands over
Point is in the range of the second through hole bore position；
Printed circuit board (PCB) front is placed and third time drilling is carried out to it, forms third through-hole, described second hands over
Point is in the range of the third through-hole bore position；
Go out the profile of the printed circuit board (PCB) along the trim line gong, complete the metallized semi through hole of the first through hole
Processing.
In the preferred embodiment of the present invention, the bore position of second through hole is cut close into the first intersection point 2-4
Ear, the bore position of the third through-hole are cut into the second intersection point 2-4 mils.
In the preferred embodiment of the present invention, second through hole cuts off inwall of the first through hole in the first intersection point
Layers of copper.
In the preferred embodiment of the present invention, the third through-hole cuts off inwall of the first through hole in the second intersection point
Layers of copper.
In the preferred embodiment of the present invention, the printed circuit board (PCB) is carried out outside gong by gong machine to the first through hole
Shape.
In the preferred embodiment of the present invention, the printed circuit board (PCB) is drilled using the numerically controlled drill.
In the preferred embodiment of the present invention, the first through hole includes semi-metal hole or U-shaped plated through-hole.
Compared to prior art, printed circuit board (PCB) metallized semi processing method of through holes provided by the invention discloses a kind of logical
PCB reverse side are first placed the first intersection point layers of copper of cut-out by the method for crossing secondary positive back-drilling processing half-via, methods described, then by PCB
Front place cut-out the second intersection point layers of copper, after to PCB through row gong profile.This method can effectively remove half bore peak, improve half
The problem of hole peak is brought, improve product yield.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, make required in being described below to embodiment
Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for
For those of ordinary skill in the art, on the premise of not paying creative work, it can also be obtained according to these accompanying drawings other
Accompanying drawing, wherein：
Fig. 1 is the step flow chart of printed circuit board (PCB) metallized semi processing method of through holes provided by the invention；
Fig. 2 a-2d are the operation principle schematic diagrams of the printed circuit board (PCB) metallized semi processing method of through holes shown in Fig. 1.
Embodiment
The technical scheme in the embodiment of the present invention will be clearly and completely described below, it is clear that described implementation
Example is only the part of the embodiment of the present invention, rather than whole embodiments.It is common based on the embodiment in the present invention, this area
All other embodiment that technical staff is obtained under the premise of creative work is not made, belong to the model that the present invention protects
Enclose.
The present invention discloses a kind of printed circuit board (PCB) metallized semi processing method of through holes, refers to Fig. 1 and Fig. 2, Fig. 1 is this hair
The step flow chart of the printed circuit board (PCB) metallized semi processing method of through holes of bright offer；Fig. 2 is the printed circuit sheet metal shown in Fig. 1
The operation principle schematic diagram of categoryization half-via processing method.The printed circuit board (PCB) metallized semi processing method of through holes includes as follows
Step：
Step S1, refer to Fig. 2 a, there is provided the printed circuit board (PCB) 1 for the trim line that completes, to the printed circuit board (PCB)
First time drilling is carried out on trim line 10, forms first through hole 11, the first through hole 11 includes first with the trim line 10
The intersection point 14 of intersection point 13 and second；
The first through hole 11 includes semi-metal hole or U-shaped plated through-hole, and in the present embodiment, the half-via is half
Plated through-hole；
Step S2, to carrying out heavy copper in the hole of the first through hole 11；
Step S3, Fig. 2 b are referred to, the reverse side of printed circuit board (PCB) 1 is placed and second of drilling is carried out to it, formed
Second through hole 21, first intersection point 13 is in the range of the bore position of the second through hole 21；
The bore position of second through hole 21 is cut to be cut into the mil of the first intersection point 13 two to four, second through hole 21
Inwall layers of copper of the first through hole 11 of breaking in the first intersection point 13；
Step S4, Fig. 2 c are referred to, the front of printed circuit board (PCB) 1 is placed and third time drilling is carried out to it, is formed
Third through-hole 31, second intersection point 14 is in the range of the bore position of third through-hole 31；
The bore position of the third through-hole 31 is cut to be cut into the mil of the second intersection point 14 two to four, the third through-hole 31
Inwall layers of copper of the first through hole 11 of breaking in the second intersection point 14.
Step S5, Fig. 2 d are referred to, go out the profile of the printed circuit board (PCB) 1 along the gong of trim line 10, complete described the
The processing of the metallized semi through hole of one through hole 11.
In process, the printed circuit board (PCB) 1 is drilled using the numerically controlled drill, the printed circuit board (PCB)
1 carries out gong profile by gong machine to the first through hole 11.
In summary, printed circuit board (PCB) metallized semi processing method of through holes provided by the invention discloses one kind by secondary
The method of positive back-drilling processing half-via, PCB reverse side are first placed the first intersection point layers of copper of cut-out by methods described, then PCB fronts are put
Put cut-out the second intersection point layers of copper, after to PCB through row gong profile.This method can effectively remove half bore peak, improve half bore peak
The problem of bringing, improve product yield.
Embodiments of the invention are the foregoing is only, are not intended to limit the scope of the invention, it is every to utilize this hair
The equivalent structure or equivalent flow conversion that bright description is made, or directly or indirectly it is used in other related technology necks
Domain, it is included within the scope of the present invention.
Claims (6)
1. a kind of printed circuit board (PCB) metallized semi processing method of through holes, it is characterised in that comprise the following steps：
The printed circuit board (PCB) for the trim line that completes is provided, to carrying out first time drilling on the trim line of the printed circuit board (PCB),
First through hole is formed, the first through hole includes the first intersection point and the second intersection point, the brill of second through hole with the trim line
Hole site is cut cuts into the second intersection point 2-4 mils into the first intersection point 2-4 mils, the bore position of the third through-hole；
To carrying out heavy copper in the hole of the first through hole；
The printed circuit board (PCB) reverse side is placed and second of drilling is carried out to it, forms the second through hole, first intersection point exists
In the range of the second through hole bore position；
Printed circuit board (PCB) front is placed and third time drilling is carried out to it, forms third through-hole, second intersection point exists
In the range of the third through-hole bore position；
Go out the profile of the printed circuit board (PCB) along the trim line gong, complete the first through hole metallized semi through hole plus
Work.
2. printed circuit board (PCB) metallized semi processing method of through holes according to claim 1, it is characterised in that described second is logical
Hole cuts off inwall layers of copper of the first through hole in the first intersection point.
3. printed circuit board (PCB) metallized semi processing method of through holes according to claim 1, it is characterised in that the threeway
Hole cuts off inwall layers of copper of the first through hole in the second intersection point.
4. printed circuit board (PCB) metallized semi processing method of through holes according to claim 1, it is characterised in that the printing electricity
Road plate carries out gong profile by gong machine to the first through hole.
5. printed circuit board (PCB) metallized semi processing method of through holes according to claim 1, it is characterised in that use the number
Control rig drills to the printed circuit board (PCB).
6. printed circuit board (PCB) metallized semi processing method of through holes according to claim 1, it is characterised in that described first is logical
Hole includes semi-metal hole or U-shaped plated through-hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610789465.9A CN107787129A (en) | 2016-08-31 | 2016-08-31 | Printed circuit board (PCB) metallized semi processing method of through holes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610789465.9A CN107787129A (en) | 2016-08-31 | 2016-08-31 | Printed circuit board (PCB) metallized semi processing method of through holes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107787129A true CN107787129A (en) | 2018-03-09 |
Family
ID=61450380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610789465.9A Pending CN107787129A (en) | 2016-08-31 | 2016-08-31 | Printed circuit board (PCB) metallized semi processing method of through holes |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107787129A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110121239A (en) * | 2019-04-10 | 2019-08-13 | 江门崇达电路技术有限公司 | A kind of production method of mechanical blind hole half bore |
| CN111712041A (en) * | 2020-06-02 | 2020-09-25 | 昆山飞繁电子有限公司 | Circuit board half-hole machining process |
| CN111867278A (en) * | 2020-07-29 | 2020-10-30 | 惠州市协昌电子有限公司 | PCB semi-metallized hole machining process |
| CN114466530A (en) * | 2021-12-30 | 2022-05-10 | 鹤山市中富兴业电路有限公司 | Method for improving PCB metallized semi-hole flash |
| WO2023045640A1 (en) * | 2021-09-27 | 2023-03-30 | 荣耀终端有限公司 | Flexible printed circuit, circuit board assembly and electronic device |
| TWI827128B (en) * | 2022-06-16 | 2023-12-21 | 大陸商鵬鼎控股（深圳）股份有限公司 | Circuit board with semi-through hole structure and manufacturing method thereof |
-
2016
- 2016-08-31 CN CN201610789465.9A patent/CN107787129A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110121239A (en) * | 2019-04-10 | 2019-08-13 | 江门崇达电路技术有限公司 | A kind of production method of mechanical blind hole half bore |
| CN110121239B (en) * | 2019-04-10 | 2021-06-04 | 江门崇达电路技术有限公司 | Manufacturing method of mechanical blind hole and half hole |
| CN111712041A (en) * | 2020-06-02 | 2020-09-25 | 昆山飞繁电子有限公司 | Circuit board half-hole machining process |
| CN111867278A (en) * | 2020-07-29 | 2020-10-30 | 惠州市协昌电子有限公司 | PCB semi-metallized hole machining process |
| CN111867278B (en) * | 2020-07-29 | 2024-02-02 | 惠州市协昌电子有限公司 | PCB semi-metallized hole processing technology |
| WO2023045640A1 (en) * | 2021-09-27 | 2023-03-30 | 荣耀终端有限公司 | Flexible printed circuit, circuit board assembly and electronic device |
| CN114466530A (en) * | 2021-12-30 | 2022-05-10 | 鹤山市中富兴业电路有限公司 | Method for improving PCB metallized semi-hole flash |
| TWI827128B (en) * | 2022-06-16 | 2023-12-21 | 大陸商鵬鼎控股（深圳）股份有限公司 | Circuit board with semi-through hole structure and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180309 |
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| WD01 | Invention patent application deemed withdrawn after publication |