CN109511225A - A kind of semi-metal hole Wiring board processing method - Google Patents
A kind of semi-metal hole Wiring board processing method Download PDFInfo
- Publication number
- CN109511225A CN109511225A CN201811113185.1A CN201811113185A CN109511225A CN 109511225 A CN109511225 A CN 109511225A CN 201811113185 A CN201811113185 A CN 201811113185A CN 109511225 A CN109511225 A CN 109511225A
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- Prior art keywords
- wiring board
- hole
- semi
- metal hole
- laser cutting
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0346—Deburring, rounding, bevelling or smoothing conductor edges
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a kind of semi-metal hole Wiring board processing methods, comprising: wiring board is placed on station by the first step, wiring board；Second step, drilling, drills out several through-holes, including edges of boards through-hole to be processed in the circuit board；Third step, plated through-hole carry out hole metallization to the through-hole drilled out；4th step, pattern transfer process carry out pattern transfer, etching to the outer layer of wiring board；5th step, laser cutting, cuts the plated through-hole of edges of boards, forms semi-metal hole；6th step, photosensitive solder resist carry out welding resistance processing to wiring board using photosensitive solder resist ink；7th step, character printing, in the circuit board by character printing；8th step, surface treatment, handles the surface of wiring board；9th step, gong shape, the sharp processing of wiring board at the shape of needs；Above-mentioned processing method, is cut by laser process, can eliminate the burr residual in semi-metal hole, avoid the trouble of manual repair, shorten and manufacture the period.
Description
Technical field
The present invention relates to printed wiring board manufacture technology field, specially a kind of semi-metal hole Wiring board processing method.
Background technique
Hole wall copper sheet after semi-metal hole forming tilts, burr residue problem is always in the machining of pcb board part
One problem.Remain in the copper wire in semi-metal hole and burr in the welding process of the SMT producer in downstream, is easy to cause weldering
Point loosely, rosin joint, bridge joint short circuit the problems such as.Therefore the copper sheet in semi-metal hole tilts and burr is not generally most SMT producer
IQC received.Hole wall copper sheet after how controlling semi-metal hole forming tilts, remaining generate of burr is always pcb board
A problem in part machining.
The way for remaining burr in the elimination hole of processing semi-metal hole comparative maturity at present is: with secondary drilling+etching
Method.Its guiding theory is exactly using the tin plating technique protection circuit in graphic plating process, and then passing through increase secondary drilling will
Semi-metal hole drills out, and the burr tin for only having drill hole to generate after secondary drilling is drilled, exposed copper face, then uses alkali etching
Method by the burr in semi-metal hole to being etched away.There is tin protection not to be etched elsewhere.
Production procedure:
Wiring board → primary drilling → PTH → outer graphics transfer → graphic plating → move back film → secondary drilling → alkali etching →
Move back tin → photosensitive solder resist → character printing → surface treatment → gong shape；
But it because to guarantee plus drill effectively to cut off hole copper, needs using special flute profile bit and drilling parameter needs
Adjustment, the folded number that drills are also impossible to more, to increase secondary drilling process, extend the fabrication cycle of production, drilling cost
Also it is multiplied.Influence of the secondary brill method to process below simultaneously is also very important.It will be residual in half edge PTH hole after brill secondary first
Stay part plate powder, it is necessary to it is removed using the method for high-pressure washing, in order to avoid detrimental effect is brought to surface treatment.It is right simultaneously
For welding resistance process, is adding bore position to have to the green oil windowing for adding unilateral 2mil bigger than hole or so, preventing ink from remaining in
In semi-metal hole.
Summary of the invention
Based on this, the present invention provides a kind of semi-metal hole Wiring board processing methods.
A kind of semi-metal hole Wiring board processing method, comprising:
Wiring board is placed on station by the first step, wiring board；
Second step, drilling, drills out several through-holes, including edges of boards through-hole to be processed in the circuit board；
Third step, plated through-hole carry out hole metallization to the through-hole drilled out；
4th step, pattern transfer process carry out pattern transfer, etching to the outer layer of wiring board；
5th step, laser cutting, cuts the plated through-hole of edges of boards, forms semi-metal hole；
6th step, photosensitive solder resist carry out welding resistance processing to wiring board using photosensitive solder resist ink；
7th step, character printing, in the circuit board by character printing；
8th step, surface treatment, handles the surface of wiring board；
9th step, gong shape, the sharp processing of wiring board at the shape of needs；
One of embodiment is that the pattern transfer process includes the following steps:
2.1, outer graphics transfer will be in film bottom plate pattern transfer to wiring board；
2.2, the figure on wiring board is done electroplating processes by graphic plating；
2.3, film is moved back, the uncured protective film of previous exposure is returned；
2.4, alkali etching passes through the copper face without resist layer protection on alkaline solution etching off wiring board.
One of embodiment is that the pattern transfer process includes the following steps:
3.1, the full plate of wiring board is electroplated in whole plate plating；
3.2, outer graphics transfer will be in film bottom plate pattern transfer to wiring board；
3.3, acid etching is etched wiring board by acid solution, forms required circuitous pattern.
One of embodiment is that the laser cutting includes the following steps:
4.1, semi-metal hole cutting data is called in equipment computer and converts forming apparatus executable format by data typing；
4.2, upper plate lies in wiring board on laser cutting machine workbench face, and work top bottom vacuumizes；
4.3, contraposition, the camera lens of graphics controller automatically grabs figure loci on wiring board, realizes automatic aligning；
4.4, cutting, according to the material of wiring board, the pulse frequency and laser power of thickness adjustment cutting machine, to the gold of wiring board
Categoryization hole carries out trial cut, forms semi-metal hole, formal to produce after confirmation quality is qualified；
4.5, work top bottom is let out vacuum, plate is taken out by lower plate；
4.6, cleaning, first with polish-brush to wiring board nog plate, then pickling processes.
One of embodiment is that the laser cutting machine is ultraviolet laser cutting machine tool or picosecond laser cutting machine or femtosecond
One kind of laser cutting machine.
Process production semi-metal hole is cut by laser in a kind of above-mentioned semi-metal hole Wiring board processing method, can be with
Thoroughly eliminate the burr residual in semi-metal hole, it is entirely avoided the trouble of manual repair, while from the angle of cost of manufacture
From the point of view of, secondary drilling process is eliminated, the fabrication cycle of production is shortened, reduces drilling cost.Because eliminating secondary brill
Hole process, so just boring residual part scoreboard powder in later half edge PTH hole there is no secondary and bore position being added to have to plus unilateral
2mil bigger than hole or so green oil windowing the problem of, make whole flow process it is simpler efficiently, avoid wicking it is bad or thickness
Not enough, fail the good route of effective protection and hole copper；Again or tin layers are blocked up, cause to move back the not clean problem of tin.
Detailed description of the invention
Fig. 1 is a kind of flow diagram of semi-metal hole of the invention Wiring board processing method.
Specific embodiment
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, with reference to the accompanying drawing to the present invention
Specific embodiment be described in detail.Many details are explained in the following description in order to fully understand this hair
It is bright.But the invention can be embodied in many other ways as described herein, those skilled in the art can be not
Similar improvement is done in the case where violating intension of the present invention, therefore the present invention is not limited by the specific embodiments disclosed below.
It should be noted that it can be directly another when element is referred to as " being fixed on " or " being set to " another element
On one element or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be with
It is directly to another element or may be simultaneously present centering elements.Term as used herein " vertically ", " level
", "left", "right" and similar statement for illustrative purposes only, be not meant to be the only embodiment.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term as used herein "and/or" includes one or more
Any and all combinations of relevant listed item.
As shown in Figure 1, a kind of semi-metal hole Wiring board processing method, comprising:
Wiring board is placed on station by the first step, wiring board；
Second step, drilling, drills out several through-holes, including edges of boards through-hole to be processed in the circuit board；
Third step, plated through-hole carry out hole metallization to the through-hole drilled out；
4th step, pattern transfer process carry out pattern transfer, etching to the outer layer of wiring board；
5th step, laser cutting, cuts the plated through-hole of edges of boards, forms semi-metal hole；
6th step, photosensitive solder resist carry out welding resistance processing to wiring board using photosensitive solder resist ink；
7th step, character printing, in the circuit board by character printing；
8th step, surface treatment, handles the surface of wiring board；
9th step, gong shape, the sharp processing of wiring board at the shape of needs；
In this way, a kind of semi-metal hole Wiring board processing method, is cut by laser process production semi-metal hole, it can be thorough
Elimination semi-metal hole burr residual, it is entirely avoided the trouble of manual repair, while from the perspective of cost of manufacture,
Secondary drilling process is eliminated, the fabrication cycle of production is shortened, reduces drilling cost.Because eliminating secondary drilling stream
Journey, so just boring residual part scoreboard powder in later half edge PTH hole there is no secondary and adding bore position to have to plus unilateral comparing hole
The problem of green oil windowing of big 2mil or so, keeps whole flow process simpler efficiently, avoid wicking it is bad or thickness low LCL,
Fail the good route of effective protection and hole copper；Again or tin layers are blocked up, cause to move back the not clean problem of tin.
Surface treatment i.e. PCB surface is cleaned, is cleaned, deburring, degreasing, descale processing, keep line
Road plate is not oxidized for a long time, moisture-proof, keeps good electric conductivity, and common PCB surface treatment process has: hot air leveling has
Machine coating, chemical nickel plating/leaching gold, leaching silver, wicking etc..
Further, in order to improve processing procedure flexibility and being widely used property, the pattern transfer process includes the following steps,
One of embodiment are as follows:
Wiring board is placed on station by the first step, wiring board；
Second step, drilling, drills out several through-holes, including edges of boards through-hole to be processed in the circuit board；
Third step, plated through-hole carry out hole metallization to the through-hole drilled out；
4th step, outer graphics transfer, will be in film bottom plate pattern transfer to wiring board；
Figure on wiring board is done electroplating processes by the 5th step, graphic plating；
6th step, moves back film, and the uncured protective film of previous exposure is returned；
7th step, alkali etching pass through the copper face without resist layer protection on alkaline solution etching off wiring board；
8th step, laser cutting, cuts according to plated through-hole of the figure on wiring board to edges of boards, forms semi-metal hole；
9th step, photosensitive solder resist carry out welding resistance processing to wiring board using photosensitive solder resist ink；
Tenth step, character printing will mark the character printing of component in the circuit board；
11st step, surface treatment, handles the surface of wiring board；
12nd step, gong shape, using gong machine the sharp processing of wiring board at the shape of needs.
Another one embodiment is,
Wiring board is placed on station by the first step, wiring board；
Second step, drilling, drills out several through-holes, including edges of boards through-hole to be processed in the circuit board；
Third step, plated through-hole carry out hole metallization to the through-hole drilled out；
4th step, whole plate plating, is electroplated the full plate of wiring board；
5th step, outer graphics transfer, will be in film bottom plate pattern transfer to wiring board；
6th step, acid etching are etched wiring board by acid solution, form required circuitous pattern；
7th step is cut by laser, and laser cutting is cut according to plated through-hole of the figure on wiring board to edges of boards, forms half
Plated through-hole；
8th step, photosensitive solder resist carry out welding resistance processing to wiring board using photosensitive solder resist ink；
9th step, character printing will mark the character printing of component in the circuit board；
Tenth step, surface treatment, handles the surface of wiring board；
11st step, gong shape, using gong machine the sharp processing of wiring board at the shape of needs.
In this way, above two processing method is respectively alkali etching method and acid etching method, wiring board can be according to plate
Feature is reasonably selected using acid etching method either alkali etching method, improves processing procedure flexibility and being widely used property.
Further, in order to which the burr for preferably removing producing circuit board metallized hole remains, the laser cutting includes as follows
Step:
4.1, semi-metal hole cutting data is called in equipment computer and converts forming apparatus executable format by data typing；
4.2, upper plate lies in wiring board on laser cutting machine workbench face, and work top bottom vacuumizes；
4.3, contraposition, the camera lens of graphics controller automatically grabs figure loci on wiring board, realizes automatic aligning；
4.4, cutting, according to the material of wiring board, the pulse frequency and laser power of thickness adjustment cutting machine, to the gold of wiring board
Categoryization hole carries out trial cut, forms semi-metal hole, formal to produce after confirmation quality is qualified；
4.5, work top bottom is let out vacuum, plate is taken out by lower plate；
4.6, cleaning, first with polish-brush to wiring board nog plate, then pickling processes.
When being cut to wiring board,
Semi-metal hole cutting data is called in equipment computer and is turned using special-purpose software by data by the first step, data typing
Change equipment executable format into；
Second step, upper plate lie in wiring board on laser cutting machine workbench face, and work top bottom vacuumizes, and make route
The smooth no warpage of plate；
Third step, contraposition, the camera lens of graphics controller automatically grab figure loci on wiring board, make graphics controller and route
Image hotpoint automatic aligning on plate, facilitates cutting；
4th step, cutting, according to the material of wiring board, the pulse frequency and laser power of thickness adjustment cutting machine, to wiring board
Plated through-hole carry out trial cut, form semi-metal hole, it is formal to produce after confirmation quality is qualified；
Work top bottom is let out vacuum, plate is taken out by the 5th step, lower plate；
6th step, cleaning, first with polish-brush to wiring board nog plate, then pickling processes, the carbonization for removing edges of boards after being cut by laser are residual
Stay object.
In this way, process is cut by laser, wiring board semi-metal hole can be quickly completed, can thoroughly eliminate half gold medal
The burr in categoryization hole remains, it is entirely avoided the trouble of manual repair, while secondary drilling process is eliminated, cost has been saved,
It improves work efficiency.
Further, in order to guarantee the effect being cut by laser, the laser cutting machine is ultraviolet laser cutting machine tool or skin
One kind of second laser cutting machine or femtosecond laser cutting machine.
In this way, high energy will not be generated using laser cutting machine, cold ablation can be carried out to wiring board, reduce cutting
After generate carbonization phenomenon, and machining accuracy is high.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (5)
1. a kind of semi-metal hole Wiring board processing method, it is characterised in that: include:
Wiring board is placed on station by the first step, wiring board；
Second step, drilling, drills out several through-holes, including edges of boards through-hole to be processed in the circuit board；
Third step, plated through-hole carry out hole metallization to the through-hole drilled out；
4th step, pattern transfer process carry out pattern transfer, etching to the outer layer of wiring board；
5th step, laser cutting, cuts the plated through-hole of edges of boards, forms semi-metal hole；
6th step, photosensitive solder resist carry out welding resistance processing to wiring board using photosensitive solder resist ink；
7th step, character printing, in the circuit board by character printing；
8th step, surface treatment, handles the surface of wiring board；
9th step, gong shape, the sharp processing of wiring board at the shape of needs.
2. a kind of semi-metal hole Wiring board processing method according to claim 1, it is characterised in that: the pattern transfer
Process includes the following steps:
2.1, outer graphics transfer will be in film bottom plate pattern transfer to wiring board；
2.2, the figure on wiring board is done electroplating processes by graphic plating；
2.3, film is moved back, the uncured protective film of previous exposure is returned；
2.4, alkali etching passes through the copper face without resist layer protection on alkaline solution etching off wiring board.
3. a kind of semi-metal hole Wiring board processing method according to claim 1, it is characterised in that: the pattern transfer
Process includes the following steps:
3.1, the full plate of wiring board is electroplated in whole plate plating；
3.2, outer graphics transfer will be in film bottom plate pattern transfer to wiring board；
3.3, acid etching is etched wiring board by acid solution, forms required circuitous pattern.
4. a kind of semi-metal hole Wiring board processing method according to claim 1, it is characterised in that: the laser cutting
Include the following steps:
4.1, semi-metal hole cutting data is called in equipment computer and converts forming apparatus executable format by data typing；
4.2, upper plate lies in wiring board on laser cutting machine workbench face, and work top bottom vacuumizes；
4.3, contraposition, the camera lens of graphics controller automatically grabs figure loci on wiring board, realizes automatic aligning；
4.4, cutting, according to the material of wiring board, the pulse frequency and laser power of thickness adjustment cutting machine, to the gold of wiring board
Categoryization hole carries out trial cut, forms semi-metal hole, formal to produce after confirmation quality is qualified；
4.5, work top bottom is let out vacuum, plate is taken out by lower plate；
4.6, cleaning, first with polish-brush to wiring board nog plate, then pickling processes.
5. a kind of semi-metal hole Wiring board processing method according to claim 4, it is characterised in that: the laser cutting
Machine is one kind of ultraviolet laser cutting machine tool or picosecond laser cutting machine or femtosecond laser cutting machine.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811113185.1A CN109511225B (en) | 2018-09-25 | 2018-09-25 | Semi-metallized hole circuit board processing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811113185.1A CN109511225B (en) | 2018-09-25 | 2018-09-25 | Semi-metallized hole circuit board processing method |
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| CN109511225A true CN109511225A (en) | 2019-03-22 |
| CN109511225B CN109511225B (en) | 2021-01-08 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111867278A (en) * | 2020-07-29 | 2020-10-30 | 惠州市协昌电子有限公司 | PCB semi-metallized hole machining process |
| CN113478107A (en) * | 2021-08-08 | 2021-10-08 | 西安瑞特三维科技有限公司 | Method for cutting electronic additive circuit board by femtosecond laser |
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| JPH11150369A (en) * | 1997-11-17 | 1999-06-02 | Hitachi Chem Co Ltd | Manufacture of multilayer printed wiring board |
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| CN101951736A (en) * | 2010-09-17 | 2011-01-19 | 深圳市集锦线路板科技有限公司 | Process for producing circuit board metallized semi-holes |
| CN104270888A (en) * | 2014-09-28 | 2015-01-07 | 广州兴森快捷电路科技有限公司 | High-density package substrate on-hole disk product and preparation method thereof |
| CN106102351A (en) * | 2016-07-05 | 2016-11-09 | 惠州市金百泽电路科技有限公司 | A kind of manufacture method of coverlay protection electromagnetic shielding film rigid-flex combined board |
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| JPH11150369A (en) * | 1997-11-17 | 1999-06-02 | Hitachi Chem Co Ltd | Manufacture of multilayer printed wiring board |
| CN101695218A (en) * | 2009-09-30 | 2010-04-14 | 深圳市金百泽电路板技术有限公司 | Method for manufacturing printed circuit board with half-edge hole |
| CN101951736A (en) * | 2010-09-17 | 2011-01-19 | 深圳市集锦线路板科技有限公司 | Process for producing circuit board metallized semi-holes |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111867278A (en) * | 2020-07-29 | 2020-10-30 | 惠州市协昌电子有限公司 | PCB semi-metallized hole machining process |
| CN111867278B (en) * | 2020-07-29 | 2024-02-02 | 惠州市协昌电子有限公司 | PCB semi-metallized hole processing technology |
| CN113478107A (en) * | 2021-08-08 | 2021-10-08 | 西安瑞特三维科技有限公司 | Method for cutting electronic additive circuit board by femtosecond laser |
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| CN109511225B (en) | 2021-01-08 |
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Effective date of registration: 20220906 Address after: 516000 building e, No. 31, Dongsheng Avenue South, Shuikou Town, Huicheng District, Huizhou City, Guangdong Province Patentee after: Guangdong Tongyuan precision circuit Co.,Ltd. Address before: 516000 Dongjiang Industrial Zone, Shuikou Town, Huicheng District, Huizhou City, Guangdong Province Patentee before: TONGYUAN TECHNOLOGY (HUIZHOU) CO.,LTD. |