CN109511225A - A kind of semi-metal hole Wiring board processing method - Google Patents

A kind of semi-metal hole Wiring board processing method Download PDF

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Publication number
CN109511225A
CN109511225A CN201811113185.1A CN201811113185A CN109511225A CN 109511225 A CN109511225 A CN 109511225A CN 201811113185 A CN201811113185 A CN 201811113185A CN 109511225 A CN109511225 A CN 109511225A
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CN
China
Prior art keywords
wiring board
hole
semi
metal hole
laser cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201811113185.1A
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Chinese (zh)
Other versions
CN109511225B (en
Inventor
陈志宇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Tongyuan Precision Circuit Co ltd
Original Assignee
Tongjiang (Huiyang) Electronics Co Ltd
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Priority to CN201811113185.1A priority Critical patent/CN109511225B/en
Publication of CN109511225A publication Critical patent/CN109511225A/en
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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047Drilling of holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0055After-treatment, e.g. cleaning or desmearing of holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03Metal processing
    • H05K2203/0346Deburring, rounding, bevelling or smoothing conductor edges
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107Using laser light

Abstract

The invention discloses a kind of semi-metal hole Wiring board processing methods, comprising: wiring board is placed on station by the first step, wiring board;Second step, drilling, drills out several through-holes, including edges of boards through-hole to be processed in the circuit board;Third step, plated through-hole carry out hole metallization to the through-hole drilled out;4th step, pattern transfer process carry out pattern transfer, etching to the outer layer of wiring board;5th step, laser cutting, cuts the plated through-hole of edges of boards, forms semi-metal hole;6th step, photosensitive solder resist carry out welding resistance processing to wiring board using photosensitive solder resist ink;7th step, character printing, in the circuit board by character printing;8th step, surface treatment, handles the surface of wiring board;9th step, gong shape, the sharp processing of wiring board at the shape of needs;Above-mentioned processing method, is cut by laser process, can eliminate the burr residual in semi-metal hole, avoid the trouble of manual repair, shorten and manufacture the period.

Description

A kind of semi-metal hole Wiring board processing method
Technical field
The present invention relates to printed wiring board manufacture technology field, specially a kind of semi-metal hole Wiring board processing method.
Background technique
Hole wall copper sheet after semi-metal hole forming tilts, burr residue problem is always in the machining of pcb board part One problem.Remain in the copper wire in semi-metal hole and burr in the welding process of the SMT producer in downstream, is easy to cause weldering Point loosely, rosin joint, bridge joint short circuit the problems such as.Therefore the copper sheet in semi-metal hole tilts and burr is not generally most SMT producer IQC received.Hole wall copper sheet after how controlling semi-metal hole forming tilts, remaining generate of burr is always pcb board A problem in part machining.
The way for remaining burr in the elimination hole of processing semi-metal hole comparative maturity at present is: with secondary drilling+etching Method.Its guiding theory is exactly using the tin plating technique protection circuit in graphic plating process, and then passing through increase secondary drilling will Semi-metal hole drills out, and the burr tin for only having drill hole to generate after secondary drilling is drilled, exposed copper face, then uses alkali etching Method by the burr in semi-metal hole to being etched away.There is tin protection not to be etched elsewhere.
Production procedure:
Wiring board → primary drilling → PTH → outer graphics transfer → graphic plating → move back film → secondary drilling → alkali etching → Move back tin → photosensitive solder resist → character printing → surface treatment → gong shape;
But it because to guarantee plus drill effectively to cut off hole copper, needs using special flute profile bit and drilling parameter needs Adjustment, the folded number that drills are also impossible to more, to increase secondary drilling process, extend the fabrication cycle of production, drilling cost Also it is multiplied.Influence of the secondary brill method to process below simultaneously is also very important.It will be residual in half edge PTH hole after brill secondary first Stay part plate powder, it is necessary to it is removed using the method for high-pressure washing, in order to avoid detrimental effect is brought to surface treatment.It is right simultaneously For welding resistance process, is adding bore position to have to the green oil windowing for adding unilateral 2mil bigger than hole or so, preventing ink from remaining in In semi-metal hole.
Summary of the invention
Based on this, the present invention provides a kind of semi-metal hole Wiring board processing methods.
A kind of semi-metal hole Wiring board processing method, comprising:
Wiring board is placed on station by the first step, wiring board;
Second step, drilling, drills out several through-holes, including edges of boards through-hole to be processed in the circuit board;
Third step, plated through-hole carry out hole metallization to the through-hole drilled out;
4th step, pattern transfer process carry out pattern transfer, etching to the outer layer of wiring board;
5th step, laser cutting, cuts the plated through-hole of edges of boards, forms semi-metal hole;
6th step, photosensitive solder resist carry out welding resistance processing to wiring board using photosensitive solder resist ink;
7th step, character printing, in the circuit board by character printing;
8th step, surface treatment, handles the surface of wiring board;
9th step, gong shape, the sharp processing of wiring board at the shape of needs;
One of embodiment is that the pattern transfer process includes the following steps:
2.1, outer graphics transfer will be in film bottom plate pattern transfer to wiring board;
2.2, the figure on wiring board is done electroplating processes by graphic plating;
2.3, film is moved back, the uncured protective film of previous exposure is returned;
2.4, alkali etching passes through the copper face without resist layer protection on alkaline solution etching off wiring board.
One of embodiment is that the pattern transfer process includes the following steps:
3.1, the full plate of wiring board is electroplated in whole plate plating;
3.2, outer graphics transfer will be in film bottom plate pattern transfer to wiring board;
3.3, acid etching is etched wiring board by acid solution, forms required circuitous pattern.
One of embodiment is that the laser cutting includes the following steps:
4.1, semi-metal hole cutting data is called in equipment computer and converts forming apparatus executable format by data typing;
4.2, upper plate lies in wiring board on laser cutting machine workbench face, and work top bottom vacuumizes;
4.3, contraposition, the camera lens of graphics controller automatically grabs figure loci on wiring board, realizes automatic aligning;
4.4, cutting, according to the material of wiring board, the pulse frequency and laser power of thickness adjustment cutting machine, to the gold of wiring board Categoryization hole carries out trial cut, forms semi-metal hole, formal to produce after confirmation quality is qualified;
4.5, work top bottom is let out vacuum, plate is taken out by lower plate;
4.6, cleaning, first with polish-brush to wiring board nog plate, then pickling processes.
One of embodiment is that the laser cutting machine is ultraviolet laser cutting machine tool or picosecond laser cutting machine or femtosecond One kind of laser cutting machine.
Process production semi-metal hole is cut by laser in a kind of above-mentioned semi-metal hole Wiring board processing method, can be with Thoroughly eliminate the burr residual in semi-metal hole, it is entirely avoided the trouble of manual repair, while from the angle of cost of manufacture From the point of view of, secondary drilling process is eliminated, the fabrication cycle of production is shortened, reduces drilling cost.Because eliminating secondary brill Hole process, so just boring residual part scoreboard powder in later half edge PTH hole there is no secondary and bore position being added to have to plus unilateral 2mil bigger than hole or so green oil windowing the problem of, make whole flow process it is simpler efficiently, avoid wicking it is bad or thickness Not enough, fail the good route of effective protection and hole copper;Again or tin layers are blocked up, cause to move back the not clean problem of tin.
Detailed description of the invention
Fig. 1 is a kind of flow diagram of semi-metal hole of the invention Wiring board processing method.
Specific embodiment
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, with reference to the accompanying drawing to the present invention Specific embodiment be described in detail.Many details are explained in the following description in order to fully understand this hair It is bright.But the invention can be embodied in many other ways as described herein, those skilled in the art can be not Similar improvement is done in the case where violating intension of the present invention, therefore the present invention is not limited by the specific embodiments disclosed below.
It should be noted that it can be directly another when element is referred to as " being fixed on " or " being set to " another element On one element or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be with It is directly to another element or may be simultaneously present centering elements.Term as used herein " vertically ", " level ", "left", "right" and similar statement for illustrative purposes only, be not meant to be the only embodiment.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term as used herein "and/or" includes one or more Any and all combinations of relevant listed item.
As shown in Figure 1, a kind of semi-metal hole Wiring board processing method, comprising:
Wiring board is placed on station by the first step, wiring board;
Second step, drilling, drills out several through-holes, including edges of boards through-hole to be processed in the circuit board;
Third step, plated through-hole carry out hole metallization to the through-hole drilled out;
4th step, pattern transfer process carry out pattern transfer, etching to the outer layer of wiring board;
5th step, laser cutting, cuts the plated through-hole of edges of boards, forms semi-metal hole;
6th step, photosensitive solder resist carry out welding resistance processing to wiring board using photosensitive solder resist ink;
7th step, character printing, in the circuit board by character printing;
8th step, surface treatment, handles the surface of wiring board;
9th step, gong shape, the sharp processing of wiring board at the shape of needs;
In this way, a kind of semi-metal hole Wiring board processing method, is cut by laser process production semi-metal hole, it can be thorough Elimination semi-metal hole burr residual, it is entirely avoided the trouble of manual repair, while from the perspective of cost of manufacture, Secondary drilling process is eliminated, the fabrication cycle of production is shortened, reduces drilling cost.Because eliminating secondary drilling stream Journey, so just boring residual part scoreboard powder in later half edge PTH hole there is no secondary and adding bore position to have to plus unilateral comparing hole The problem of green oil windowing of big 2mil or so, keeps whole flow process simpler efficiently, avoid wicking it is bad or thickness low LCL, Fail the good route of effective protection and hole copper;Again or tin layers are blocked up, cause to move back the not clean problem of tin.
Surface treatment i.e. PCB surface is cleaned, is cleaned, deburring, degreasing, descale processing, keep line Road plate is not oxidized for a long time, moisture-proof, keeps good electric conductivity, and common PCB surface treatment process has: hot air leveling has Machine coating, chemical nickel plating/leaching gold, leaching silver, wicking etc..
Further, in order to improve processing procedure flexibility and being widely used property, the pattern transfer process includes the following steps, One of embodiment are as follows:
Wiring board is placed on station by the first step, wiring board;
Second step, drilling, drills out several through-holes, including edges of boards through-hole to be processed in the circuit board;
Third step, plated through-hole carry out hole metallization to the through-hole drilled out;
4th step, outer graphics transfer, will be in film bottom plate pattern transfer to wiring board;
Figure on wiring board is done electroplating processes by the 5th step, graphic plating;
6th step, moves back film, and the uncured protective film of previous exposure is returned;
7th step, alkali etching pass through the copper face without resist layer protection on alkaline solution etching off wiring board;
8th step, laser cutting, cuts according to plated through-hole of the figure on wiring board to edges of boards, forms semi-metal hole;
9th step, photosensitive solder resist carry out welding resistance processing to wiring board using photosensitive solder resist ink;
Tenth step, character printing will mark the character printing of component in the circuit board;
11st step, surface treatment, handles the surface of wiring board;
12nd step, gong shape, using gong machine the sharp processing of wiring board at the shape of needs.
Another one embodiment is,
Wiring board is placed on station by the first step, wiring board;
Second step, drilling, drills out several through-holes, including edges of boards through-hole to be processed in the circuit board;
Third step, plated through-hole carry out hole metallization to the through-hole drilled out;
4th step, whole plate plating, is electroplated the full plate of wiring board;
5th step, outer graphics transfer, will be in film bottom plate pattern transfer to wiring board;
6th step, acid etching are etched wiring board by acid solution, form required circuitous pattern;
7th step is cut by laser, and laser cutting is cut according to plated through-hole of the figure on wiring board to edges of boards, forms half Plated through-hole;
8th step, photosensitive solder resist carry out welding resistance processing to wiring board using photosensitive solder resist ink;
9th step, character printing will mark the character printing of component in the circuit board;
Tenth step, surface treatment, handles the surface of wiring board;
11st step, gong shape, using gong machine the sharp processing of wiring board at the shape of needs.
In this way, above two processing method is respectively alkali etching method and acid etching method, wiring board can be according to plate Feature is reasonably selected using acid etching method either alkali etching method, improves processing procedure flexibility and being widely used property.
Further, in order to which the burr for preferably removing producing circuit board metallized hole remains, the laser cutting includes as follows Step:
4.1, semi-metal hole cutting data is called in equipment computer and converts forming apparatus executable format by data typing;
4.2, upper plate lies in wiring board on laser cutting machine workbench face, and work top bottom vacuumizes;
4.3, contraposition, the camera lens of graphics controller automatically grabs figure loci on wiring board, realizes automatic aligning;
4.4, cutting, according to the material of wiring board, the pulse frequency and laser power of thickness adjustment cutting machine, to the gold of wiring board Categoryization hole carries out trial cut, forms semi-metal hole, formal to produce after confirmation quality is qualified;
4.5, work top bottom is let out vacuum, plate is taken out by lower plate;
4.6, cleaning, first with polish-brush to wiring board nog plate, then pickling processes.
When being cut to wiring board,
Semi-metal hole cutting data is called in equipment computer and is turned using special-purpose software by data by the first step, data typing Change equipment executable format into;
Second step, upper plate lie in wiring board on laser cutting machine workbench face, and work top bottom vacuumizes, and make route The smooth no warpage of plate;
Third step, contraposition, the camera lens of graphics controller automatically grab figure loci on wiring board, make graphics controller and route Image hotpoint automatic aligning on plate, facilitates cutting;
4th step, cutting, according to the material of wiring board, the pulse frequency and laser power of thickness adjustment cutting machine, to wiring board Plated through-hole carry out trial cut, form semi-metal hole, it is formal to produce after confirmation quality is qualified;
Work top bottom is let out vacuum, plate is taken out by the 5th step, lower plate;
6th step, cleaning, first with polish-brush to wiring board nog plate, then pickling processes, the carbonization for removing edges of boards after being cut by laser are residual Stay object.
In this way, process is cut by laser, wiring board semi-metal hole can be quickly completed, can thoroughly eliminate half gold medal The burr in categoryization hole remains, it is entirely avoided the trouble of manual repair, while secondary drilling process is eliminated, cost has been saved, It improves work efficiency.
Further, in order to guarantee the effect being cut by laser, the laser cutting machine is ultraviolet laser cutting machine tool or skin One kind of second laser cutting machine or femtosecond laser cutting machine.
In this way, high energy will not be generated using laser cutting machine, cold ablation can be carried out to wiring board, reduce cutting After generate carbonization phenomenon, and machining accuracy is high.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.

Claims (5)

1. a kind of semi-metal hole Wiring board processing method, it is characterised in that: include:
Wiring board is placed on station by the first step, wiring board;
Second step, drilling, drills out several through-holes, including edges of boards through-hole to be processed in the circuit board;
Third step, plated through-hole carry out hole metallization to the through-hole drilled out;
4th step, pattern transfer process carry out pattern transfer, etching to the outer layer of wiring board;
5th step, laser cutting, cuts the plated through-hole of edges of boards, forms semi-metal hole;
6th step, photosensitive solder resist carry out welding resistance processing to wiring board using photosensitive solder resist ink;
7th step, character printing, in the circuit board by character printing;
8th step, surface treatment, handles the surface of wiring board;
9th step, gong shape, the sharp processing of wiring board at the shape of needs.
2. a kind of semi-metal hole Wiring board processing method according to claim 1, it is characterised in that: the pattern transfer Process includes the following steps:
2.1, outer graphics transfer will be in film bottom plate pattern transfer to wiring board;
2.2, the figure on wiring board is done electroplating processes by graphic plating;
2.3, film is moved back, the uncured protective film of previous exposure is returned;
2.4, alkali etching passes through the copper face without resist layer protection on alkaline solution etching off wiring board.
3. a kind of semi-metal hole Wiring board processing method according to claim 1, it is characterised in that: the pattern transfer Process includes the following steps:
3.1, the full plate of wiring board is electroplated in whole plate plating;
3.2, outer graphics transfer will be in film bottom plate pattern transfer to wiring board;
3.3, acid etching is etched wiring board by acid solution, forms required circuitous pattern.
4. a kind of semi-metal hole Wiring board processing method according to claim 1, it is characterised in that: the laser cutting Include the following steps:
4.1, semi-metal hole cutting data is called in equipment computer and converts forming apparatus executable format by data typing;
4.2, upper plate lies in wiring board on laser cutting machine workbench face, and work top bottom vacuumizes;
4.3, contraposition, the camera lens of graphics controller automatically grabs figure loci on wiring board, realizes automatic aligning;
4.4, cutting, according to the material of wiring board, the pulse frequency and laser power of thickness adjustment cutting machine, to the gold of wiring board Categoryization hole carries out trial cut, forms semi-metal hole, formal to produce after confirmation quality is qualified;
4.5, work top bottom is let out vacuum, plate is taken out by lower plate;
4.6, cleaning, first with polish-brush to wiring board nog plate, then pickling processes.
5. a kind of semi-metal hole Wiring board processing method according to claim 4, it is characterised in that: the laser cutting Machine is one kind of ultraviolet laser cutting machine tool or picosecond laser cutting machine or femtosecond laser cutting machine.
CN201811113185.1A 2018-09-25 2018-09-25 Semi-metallized hole circuit board processing method Active CN109511225B (en)

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Application Number Priority Date Filing Date Title
CN201811113185.1A CN109511225B (en) 2018-09-25 2018-09-25 Semi-metallized hole circuit board processing method

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CN109511225B CN109511225B (en) 2021-01-08

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111867278A (en) * 2020-07-29 2020-10-30 惠州市协昌电子有限公司 PCB semi-metallized hole machining process
CN113478107A (en) * 2021-08-08 2021-10-08 西安瑞特三维科技有限公司 Method for cutting electronic additive circuit board by femtosecond laser

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11150369A (en) * 1997-11-17 1999-06-02 Hitachi Chem Co Ltd Manufacture of multilayer printed wiring board
CN101695218A (en) * 2009-09-30 2010-04-14 深圳市金百泽电路板技术有限公司 Method for manufacturing printed circuit board with half-edge hole
CN101951736A (en) * 2010-09-17 2011-01-19 深圳市集锦线路板科技有限公司 Process for producing circuit board metallized semi-holes
CN104270888A (en) * 2014-09-28 2015-01-07 广州兴森快捷电路科技有限公司 High-density package substrate on-hole disk product and preparation method thereof
CN106102351A (en) * 2016-07-05 2016-11-09 惠州市金百泽电路科技有限公司 A kind of manufacture method of coverlay protection electromagnetic shielding film rigid-flex combined board

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11150369A (en) * 1997-11-17 1999-06-02 Hitachi Chem Co Ltd Manufacture of multilayer printed wiring board
CN101695218A (en) * 2009-09-30 2010-04-14 深圳市金百泽电路板技术有限公司 Method for manufacturing printed circuit board with half-edge hole
CN101951736A (en) * 2010-09-17 2011-01-19 深圳市集锦线路板科技有限公司 Process for producing circuit board metallized semi-holes
CN104270888A (en) * 2014-09-28 2015-01-07 广州兴森快捷电路科技有限公司 High-density package substrate on-hole disk product and preparation method thereof
CN106102351A (en) * 2016-07-05 2016-11-09 惠州市金百泽电路科技有限公司 A kind of manufacture method of coverlay protection electromagnetic shielding film rigid-flex combined board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111867278A (en) * 2020-07-29 2020-10-30 惠州市协昌电子有限公司 PCB semi-metallized hole machining process
CN111867278B (en) * 2020-07-29 2024-02-02 惠州市协昌电子有限公司 PCB semi-metallized hole processing technology
CN113478107A (en) * 2021-08-08 2021-10-08 西安瑞特三维科技有限公司 Method for cutting electronic additive circuit board by femtosecond laser

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Effective date of registration: 20220906

Address after: 516000 building e, No. 31, Dongsheng Avenue South, Shuikou Town, Huicheng District, Huizhou City, Guangdong Province

Patentee after: Guangdong Tongyuan precision circuit Co.,Ltd.

Address before: 516000 Dongjiang Industrial Zone, Shuikou Town, Huicheng District, Huizhou City, Guangdong Province

Patentee before: TONGYUAN TECHNOLOGY (HUIZHOU) CO.,LTD.