CN104703397B - A kind of method of flexible circuitry board blind hole processing - Google Patents
A kind of method of flexible circuitry board blind hole processing Download PDFInfo
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- CN104703397B CN104703397B CN201510142267.9A CN201510142267A CN104703397B CN 104703397 B CN104703397 B CN 104703397B CN 201510142267 A CN201510142267 A CN 201510142267A CN 104703397 B CN104703397 B CN 104703397B
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- blind hole
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Abstract
The present invention is applied to FPC manufacture field, provide a kind of method of flexible circuitry board blind hole processing, the FPC includes downwards first layer copper foil, base material and second layer copper foil successively, including the laser with the first setting energy, the blind hole is at least processed corresponding to the part on the first layer copper foil；With the laser of the second setting energy, correspond to remaining part processing on the base material to the blind hole after having carried out coordinate compensation in a manner of defocus, according to spiral trajectory or concentric circular tracks.The embodiment of the present invention is processed by way of defocus to base material, prevents from injuring second layer copper foil, while can improve machining energy so that and it is high in machining efficiency, while carry out coordinate compensation so that the precision of processing is higher.
Description
Technical field
The invention belongs to FPC manufacture field, more particularly to a kind of method of flexible circuitry board blind hole processing.
Background technology
Blind hole processing is an important process in wiring board manufacturing process, the species of conventional holes divided by conducting in wiring board
Outside whether simply distinguishing, still divided with the difference of function：Hole in piece part, tooling hole, through hole (Via), blind hole (Blind hole),
Buried via hole (Buried hole), wherein blind hole primarily serve conducting effect.Due to the hair at full speed recently as microelectric technique
Exhibition, extensive and super large-scale integration extensive use, the progress of Micro-package technique, make the manufacture of printed circuit board towards
Lamination, multifunction direction are developed, make the wire of printed circuit figure more granular, via hole processing also increasingly
It is small, its difficulty also more and more higher that drills.
Common bore mode has machine drilling, laser drill, photosensitive pore-forming etc., and distinct device technology is applied to different layers
Secondary plank, the mechanical drilling process technology employed in Drilling operation can not meet the requirement of such a high-end line plate, can win
The technology for appointing this capillary processing mode is exactly laser drilling processes.The advantage of laser drill is to process relatively small
Micro through hole, blind hole, aperture can be processed in 50um -200um, it might even be possible to it is smaller, and it is processing the cost of micropore with respect to other
Pore-forming mode has larger advantage.
Multilayer circuit board is typically alternately rolled by multilayer layers of copper and multi-layer insulation (base material) and formed, top layer and the bottom
It is layers of copper.When the flexible circuitry board blind hole being such as made up of two-sided copper foil and the base material between the two-sided copper foil is processed,
The copper foil and base material of removing top layer are needed, retains the copper foil of bottom, but laser drill of the prior art is being removed inside blind hole
It is easier to hinder bottom copper during base material, so can only go to process with smaller energy and speed, therefore causes blind hole processing efficiency
It is very low, and can cause when laser energy slightly fluctuates to hinder bottom copper or bottom hole drawback sordid clearly.
The content of the invention
The purpose of the embodiment of the present invention is to provide a kind of method of flexible circuitry board blind hole processing, existing sharp to solve
The problem of light processing blind hole efficiency is low, crudy is poor.
The embodiment of the present invention is achieved in that a kind of method of flexible circuitry board blind hole processing, the FPC
Include first layer copper foil, base material and second layer copper foil, including step downwards successively：
With the laser of the first setting energy, the blind hole is at least processed corresponding to the part on the first layer copper foil；
With second setting energy laser, to having entered in a manner of defocus, according to spiral trajectory or concentric circular tracks
The blind hole after the compensation of row coordinate corresponds to remaining part processing on the base material.
Further, with the laser of the first setting energy, the blind hole is at least processed corresponding on the first layer copper foil
Part the step of using it is positive it is burnt by the way of, process according to Circular test.
Further, the method for the coordinate compensation is：Under positive coke-like state and out-of-focus appearance, process respectively same by son
Graphic array forms test pattern, and the coordinate value of the spirte after record processing respectively；By under positive coke-like state and out-of-focus appearance
Coordinate value be compared, obtain deviation, then by the deviation compensate to the blind hole correspond to the base material on remain
Corresponding to remaining part in graphics processing.
Further, machining center of the test pattern under positive coke-like state overlaps with the machining center of the blind hole.
Further, the coordinate value under positive the coke-like state and out-of-focus appearance is all captured by ccd cameras.
Further, the spirte is standard cross figure.
Further, the method for the coordinate compensation includes repeatedly correction, every time subgraph in the test pattern of correction processing
The increased number of shape.
The invention provides a kind of method of flexible circuitry board blind hole processing, base material is added by way of defocus
Work, prevent from injuring second layer copper foil, while machining energy can be improved so that it is high in machining efficiency, while coordinate compensation is carried out, make
The precision that must be processed is higher.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, below will be to embodiment or description of the prior art
In the required accompanying drawing used be briefly described, it should be apparent that, drawings in the following description be only the present invention some
Embodiment, for those of ordinary skill in the art, without having to pay creative labor, can also be according to these
Accompanying drawing obtains other accompanying drawings.
Fig. 1 is FPC schematic diagram provided in an embodiment of the present invention；
Fig. 2 is the schematic diagram of the flexible circuitry board blind hole provided in an embodiment of the present invention not cut through；
Fig. 3 is the method flow diagram that the embodiment of the present invention provides the processing of flexible circuitry board blind hole；
Fig. 4 is the method S110 step machining sketch charts that the embodiment of the present invention provides the processing of flexible circuitry board blind hole；
Fig. 5 is the method S120 step machining sketch charts that the embodiment of the present invention provides the processing of flexible circuitry board blind hole；
Fig. 6 is that the embodiment of the present invention provides process data contrast schematic diagram under sharp positive coke-like state and out-of-focus appearance.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
As shown in Figure 1, 2, FPC 10 at least includes first layer copper foil 11, base material 12 and second layer copper downwards successively
Paper tinsel 13.When carrying out blind hole processing to the FPC 10, it is necessary to cut off first layer copper foil 11 and base material 12, but it is existing
In technology, often the bad size for grasping laser energy or process time, cause the Z parts of base material 12 as shown in Figure 2 not complete
Clear all, or after base material 12 is fully erased, and second layer copper foil 13 machined；Or in the base material 12 close to described
The part of two copper foils 13 can only use less energy and speed to process.
As shown in figure 3, in order to prevent from not cutting through base material 12 or injure second layer copper foil 13, the embodiment of the present invention provides a kind of
The method of flexible circuitry board blind hole processing, comprises the following steps：
S110, with the laser of the first setting energy, the blind hole is at least processed corresponding on the first layer copper foil 11
Part；
As shown in figure 4, processed in the present embodiment by the way of positive Jiao.Specifically, the focus of the laser is positioned at described
The surface of first layer copper foil 11, the blind hole is cut through corresponding to the part on first layer copper foil 11 using 3W laser energy.By
Need to cut off in the blind hole is first layer copper foil 11 and base material 12, so, base material 12 can be worked into the present embodiment
Sub-fraction, i.e., at V.
S120, with second setting energy laser, in a manner of defocus, according to spiral trajectory or concentric circular tracks
The blind hole after carrying out coordinate defocusing compensation corresponds to remaining part processing on the base material 12.
As shown in figure 5, in the present embodiment, the certain height of the upward defocus of laser spot is added to the base material 12
Work, because laser energy is in Gaussian Profile, the energy among hot spot is big, and the energy at edge is small, after laser spot is adjusted up,
The energy of laser can be increased, realize rapid processing.Specifically, the height of the laser spot defocus is 1-2mm, described second
Energy is set as 3-4W.
In the present embodiment, can be processed by the way of spiral trajectory or concentric circular tracks, when the laser spot to
After upper regulation, the diameter of hot spot will become big so that the number of turns of spiral or concentric circles is reduced, so as to realize the further of process velocity
Lifting.
The general diameter of flexible circuitry board blind hole is smaller, and the required precision of processing is high, in order to improve machining accuracy,
It is preceding, it is necessary to carry out coordinate to processed file corresponding to the blind hole on the base material that defocus processing is carried out to the blind hole on the base material
Compensation, that is, need to process defocus progress coordinate compensation, make spiral or concentric circular tracks that the circle of positive burnt processing is processed with defocus
Center superposition.
The step of coordinate compensation, includes：
S210, under positive coke-like state, the test pattern formed by spirte array is processed, and record processing after
The coordinate value Amn (X, Y) of spirte, using the coordinate value Amn as standard value, wherein, m >=1, n >=1；
Further, the spirte is standard cross figure, during coordinate offset is sought, uses standard cross figure
Shape, the standard cross figure of positive burnt processing is set to be overlapped with the standard cross centre of figure that defocus is processed.
Such as the process data contrast after Fig. 6 laser spot defocus, graphics processing in the present embodiment is 50*50mm's
In the range of process 11*11 matrix cross figures, the coordinates of all standard cross figures in the range of work from center to surrounding by
Gradually offset, as B0101 and B1111 respectively be located at A0101 and A1111 outside, specifically, the coordinate of out-of-focus appearance is relative to just
The coordinate layer concentric circles trend of coke-like state is outwards offset.
S220, under out-of-focus appearance, process same test pattern, and record processing after spirte coordinate value Bgi (X,
Y)；
S230, by the coordinate value Bgi compared with the coordinate value Amn, obtain deviation；
S240, deviation compensation is corresponded into manuscript corresponding to remaining part on the base material to the blind hole
In shape.
Wherein, machining center of the test pattern under positive coke-like state to the flexible circuitry board blind hole processing with adding
Work center superposition；The height of defocus and the defocus in S120 steps are highly identical in the coordinate compensation.
Specifically, the coordinate value Amn and coordinate value Bgi are captured by ccd cameras respectively.
Further, the method for the coordinate defocusing compensation includes repeatedly correction, increases spirte in test pattern every time
Quantity.The standard cross matrix that 5*5 can be such as processed in the range of 50*50mm carries out thick school, then is being stepped up marking
The quantity of quasi- cross matrix, is further corrected, and the quantity of the standard cross figure is more, and the range of work is bigger, school
Positive precision is higher.
Above content is to combine specific preferred embodiment further description made for the present invention, it is impossible to is assert
The specific implementation of the present invention is confined to these explanations.For general technical staff of the technical field of the invention,
Some equivalent substitutes or obvious modification are made on the premise of not departing from present inventive concept, and performance or purposes are identical, all should
It is considered as belonging to the scope of patent protection that the present invention is determined by the claims submitted.
Claims (6)
1. a kind of method of flexible circuitry board blind hole processing, the FPC comprise at least downwards successively first layer copper foil,
Base material and second layer copper foil, it is characterised in that including step：
With the laser of the first setting energy, the blind hole is at least processed corresponding to the part on the first layer copper foil；
With second setting energy laser, to having sat in a manner of defocus, according to spiral trajectory or concentric circular tracks
The blind hole after mark compensation corresponds to remaining part processing on the base material；
The method of coordinate compensation is：Under positive coke-like state and out-of-focus appearance, process same formed by spirte array respectively
Test pattern, and the coordinate value of the spirte after record processing respectively；Coordinate value under positive coke-like state and out-of-focus appearance is carried out
Compare, obtain deviation, then compensate the deviation corresponding corresponding to remaining part on the base material to the blind hole
Graphics processing on.
2. the method for flexible circuitry board blind hole processing as claimed in claim 1, it is characterised in that with swashing for the first setting energy
Light, at least process the step of blind hole is corresponding to part on the first layer copper foil using it is positive it is burnt by the way of, according to circle rail
Mark is processed.
3. the method for flexible circuitry board blind hole processing as claimed in claim 1, it is characterised in that the test pattern is positive burnt
Machining center under state overlaps with the machining center of the blind hole.
4. the method for flexible circuitry board blind hole processing as claimed in claim 1, it is characterised in that the positive coke-like state and defocus
Coordinate value under state is all captured by ccd cameras.
5. the method for flexible circuitry board blind hole processing as claimed in claim 1, it is characterised in that the spirte is standard ten
Word figure.
6. the method for flexible circuitry board blind hole processing as claimed in claim 1, it is characterised in that the method for the coordinate compensation
Including repeatedly correction, the increased number of spirte in the test pattern that correction is processed every time.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510142267.9A CN104703397B (en) | 2015-03-27 | 2015-03-27 | A kind of method of flexible circuitry board blind hole processing |
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| CN201510142267.9A CN104703397B (en) | 2015-03-27 | 2015-03-27 | A kind of method of flexible circuitry board blind hole processing |
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| CN104703397B true CN104703397B (en) | 2018-03-09 |
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Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105263266A (en) * | 2015-10-30 | 2016-01-20 | 江苏博敏电子有限公司 | Laser processing method of blind drilling |
| CN105867297B (en) * | 2016-03-30 | 2018-10-23 | 维嘉数控科技（苏州）有限公司 | The coordinate compensation method of mechanical platform and device |
| CN109068491B (en) * | 2018-09-30 | 2021-02-23 | 东莞联桥电子有限公司 | Aluminum substrate machining process |
| CN109922601B (en) * | 2019-03-14 | 2021-12-07 | 深圳市大族数控科技股份有限公司 | Processing method of blind hole of circuit board |
| CN110831324A (en) * | 2019-06-17 | 2020-02-21 | 江西比亚迪电子部品件有限公司 | Novel blind hole and processing method thereof |
| CN111215754A (en) * | 2020-02-26 | 2020-06-02 | 武汉铱科赛科技有限公司 | Method, system, device and equipment for etching non-uniform insulating medium |
| CN114425653A (en) * | 2020-10-29 | 2022-05-03 | 大族激光科技产业集团股份有限公司 | Laser processing method and laser processing system for packaging substrate |
| CN112589296A (en) * | 2020-12-13 | 2021-04-02 | 珠海市镭通激光科技有限公司 | Laser light path system and method for processing flexible circuit board by using same |
| CN113280737B (en) * | 2021-05-14 | 2023-08-29 | 惠州中京电子科技有限公司 | Blind hole offset detection method for high-order HDI printed circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1511433A (en) * | 2001-05-23 | 2004-07-07 | 西门子公司 | Method for drilling microholes using laser beam |
| CN101011780A (en) * | 2005-12-21 | 2007-08-08 | Eo技术株式会社 | Method of forming via hole using laser beam |
| CN101829850A (en) * | 2010-04-01 | 2010-09-15 | 深圳市大族激光科技股份有限公司 | Method for processing blind hole |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3066659B2 (en) * | 1991-05-31 | 2000-07-17 | 日立ビアメカニクス株式会社 | Processing point correction method and device for laser processing machine |
| JP2003101188A (en) * | 2001-09-26 | 2003-04-04 | Nitto Denko Corp | Method for forming via hole, flexible wiring board using the same, and production method therefor |
-
2015
- 2015-03-27 CN CN201510142267.9A patent/CN104703397B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1511433A (en) * | 2001-05-23 | 2004-07-07 | 西门子公司 | Method for drilling microholes using laser beam |
| CN101011780A (en) * | 2005-12-21 | 2007-08-08 | Eo技术株式会社 | Method of forming via hole using laser beam |
| CN101829850A (en) * | 2010-04-01 | 2010-09-15 | 深圳市大族激光科技股份有限公司 | Method for processing blind hole |
Non-Patent Citations (1)
| Title |
|---|
| 紫外激光盲孔钻孔扫描方法研究;李喜琪等;《印制电路信息》;20130410;全文 * |
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Effective date of registration: 20200630 Address after: 518000 workshop 5 / F, 1 / 2 / F, 14 / F, 17 / F, antuoshan hi tech Industrial Park, Xinsha Road, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd. Address before: 518000 No. 9988 Shennan Avenue, Shenzhen, Guangdong, Nanshan District Co-patentee before: SHENZHEN HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd. Patentee before: HAN'S LASER TECHNOLOGY INDUSTRY GROUP Co.,Ltd. |
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Address after: 518000 5 / F, 1 / 2 / F, 14 / F, 17 / F, No.3 Factory building, antuoshan hi tech Industrial Park, Xinsha Road, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Han's CNC Technology Co.,Ltd. Address before: 518000 5 / F, 1 / 2 / F, 14 / F, 17 / F, No.3 Factory building, antuoshan hi tech Industrial Park, Xinsha Road, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd. |